EP0971009A3 - Klebstoffzusammensetzung zur Verklebung von Halbleiterchips - Google Patents

Klebstoffzusammensetzung zur Verklebung von Halbleiterchips Download PDF

Info

Publication number
EP0971009A3
EP0971009A3 EP99113152A EP99113152A EP0971009A3 EP 0971009 A3 EP0971009 A3 EP 0971009A3 EP 99113152 A EP99113152 A EP 99113152A EP 99113152 A EP99113152 A EP 99113152A EP 0971009 A3 EP0971009 A3 EP 0971009A3
Authority
EP
European Patent Office
Prior art keywords
ingredient
approximately
inorganic filler
semiconductor chips
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP99113152A
Other languages
English (en)
French (fr)
Other versions
EP0971009A2 (de
EP0971009B1 (de
Inventor
Jae-Sung Kwak
Byung-Hoon Moon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amkor Technology Korea Inc
National Starch and Chemical Investment Holding Corp
Amkor Technology Inc
Original Assignee
Anam Semiconductor Inc
National Starch and Chemical Investment Holding Corp
Amkor Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anam Semiconductor Inc, National Starch and Chemical Investment Holding Corp, Amkor Technology Inc filed Critical Anam Semiconductor Inc
Publication of EP0971009A2 publication Critical patent/EP0971009A2/de
Publication of EP0971009A3 publication Critical patent/EP0971009A3/de
Application granted granted Critical
Publication of EP0971009B1 publication Critical patent/EP0971009B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
EP99113152A 1998-07-07 1999-07-07 Klebstoffzusammensetzung zur Verklebung von Halbleiterchips Expired - Lifetime EP0971009B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019980027292A KR100260390B1 (ko) 1998-07-07 1998-07-07 반도체 칩 접착용 에폭시 수지 조성물
KR9827292 1998-07-07

Publications (3)

Publication Number Publication Date
EP0971009A2 EP0971009A2 (de) 2000-01-12
EP0971009A3 true EP0971009A3 (de) 2001-01-10
EP0971009B1 EP0971009B1 (de) 2003-09-17

Family

ID=19543346

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99113152A Expired - Lifetime EP0971009B1 (de) 1998-07-07 1999-07-07 Klebstoffzusammensetzung zur Verklebung von Halbleiterchips

Country Status (12)

Country Link
US (1) US6225379B1 (de)
EP (1) EP0971009B1 (de)
JP (1) JP4408484B2 (de)
KR (1) KR100260390B1 (de)
CN (1) CN1169902C (de)
DE (1) DE69911320T2 (de)
HK (1) HK1026334A2 (de)
ID (1) ID25968A (de)
MY (1) MY121395A (de)
PT (1) PT971009E (de)
SG (1) SG74150A1 (de)
TW (1) TW574338B (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3481117B2 (ja) * 1998-02-25 2003-12-22 富士通株式会社 半導体装置及びその製造方法
US5968534A (en) * 1998-03-04 1999-10-19 Campbell; John Compound for the amelioration of pseudofollicultis
JP3931855B2 (ja) 2003-08-08 2007-06-20 株式会社日立製作所 電子回路装置
JP5757625B2 (ja) 2008-04-25 2015-07-29 エルジー・ケム・リミテッド エポキシ系組成物、接着フィルム、ダイシングダイボンディングフィルム及び半導体装置
US7851930B1 (en) * 2008-06-04 2010-12-14 Henkel Corporation Conductive adhesive compositions containing an alloy filler material for better dispense and thermal properties
US8004078B1 (en) 2009-03-17 2011-08-23 Amkor Technology, Inc. Adhesive composition for semiconductor device
TWI608062B (zh) * 2011-05-31 2017-12-11 住友電木股份有限公司 樹脂組成物、使用它之半導體裝置及半導體裝置之製造方法
JP2015225913A (ja) * 2014-05-27 2015-12-14 信越化学工業株式会社 ダイボンド材樹脂組成物及び半導体装置
EP3093319A1 (de) * 2015-05-13 2016-11-16 Heraeus Deutschland GmbH & Co. KG Elektrisch leitfähige zusammensetzung
US10224255B2 (en) 2016-06-14 2019-03-05 Nxp Usa, Inc. Shielded and packaged electronic devices, electronic assemblies, and methods
HUE056044T2 (hu) * 2018-02-09 2022-01-28 Heraeus Deutschland Gmbh & Co Kg Elektromosan vezetõképes kompozíció
CN114203664B (zh) * 2021-12-06 2022-08-26 气派科技股份有限公司 一种高可靠性封装结构的制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5740572A (en) * 1980-08-23 1982-03-06 Nippon Dempa Kogyo Co Ltd Electrical conductive adhesive
JPS60178647A (ja) * 1984-02-27 1985-09-12 Toshiba Corp 半導体装置
US5582772A (en) * 1994-06-16 1996-12-10 Anam Industrial Co., Ltd. Copper oxide-filled polymer die attach adhesive composition for semiconductor package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5740572A (en) * 1980-08-23 1982-03-06 Nippon Dempa Kogyo Co Ltd Electrical conductive adhesive
JPS60178647A (ja) * 1984-02-27 1985-09-12 Toshiba Corp 半導体装置
US5582772A (en) * 1994-06-16 1996-12-10 Anam Industrial Co., Ltd. Copper oxide-filled polymer die attach adhesive composition for semiconductor package

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 006, no. 114 (C - 110) 25 June 1982 (1982-06-25) *
PATENT ABSTRACTS OF JAPAN vol. 010, no. 016 (E - 375) 22 January 1986 (1986-01-22) *

Also Published As

Publication number Publication date
HK1026334A2 (en) 2000-11-10
ID25968A (id) 2000-11-16
KR19990007508A (ko) 1999-01-25
DE69911320T2 (de) 2004-07-08
MY121395A (en) 2006-01-28
PT971009E (pt) 2004-02-27
EP0971009A2 (de) 2000-01-12
US6225379B1 (en) 2001-05-01
EP0971009B1 (de) 2003-09-17
CN1242404A (zh) 2000-01-26
KR100260390B1 (ko) 2000-07-01
CN1169902C (zh) 2004-10-06
JP4408484B2 (ja) 2010-02-03
TW574338B (en) 2004-02-01
JP2000119629A (ja) 2000-04-25
DE69911320D1 (de) 2003-10-23
SG74150A1 (en) 2000-07-18

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