Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
  • B29D11/00—Producing optical elements, e.g. lenses or prisms
  • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
  • B29D11/00769—Producing diffraction gratings
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
  • B29D11/00—Producing optical elements, e.g. lenses or prisms
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
  • B29D17/00—Producing carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records; Producing record discs from master stencils
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
  • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
  • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
  • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers

Definitions

• the present invention relates to a method of manufacturing a master disc unit, starting from a microstructure substrate disc of a first diameter, said master disc unit being intended for the manufacture of a disc-shaped matrix of a second, larger diameter for reproduction of micromechanical products, kinoforms or the like.
• micromechanical products such as e.g. valveless micro- fluid pumps, and kinoforms and other microoptical-like conductors and lenses, so- called DOE (Diffractive Optical Elements) and the like.
• DOE diffractive Optical Elements
• These processes normally start with a disc substrate in the form of a round disc of silicon, quarts or glass, coated with a layer sensitive to light or radiation, which layer is given the desired form-structure by exposure to light or electron beams or by etching.
• Such discs typically have a standard diameter of 4 inches (101,6 mm) and a thickness of ca. 0,5-1,5 mm.
• the depth of the cavities formed (the structure depth) in the silicon disc or the disc layer can vary from a few ⁇ m in kinoforms up to ca. 500 ⁇ m in micromechanical applications.
• the structured side of the disc substrate is coated in a known manner with a metal layer, for example by spraying or steaming on a thin layer of nickel, to make the structured surface electrically conducting in a subsequent plating phase, in which a matrix is manufactured by nickel-plating, for example, against the metallized, structured disc substrate.
• the matrix can then be used as a press matrix in an injection moulding machine to manufacture, by known injection moulding technology, plastic discs.
• the products can be made in multiples on each extruded disc and then be cut out as finished products or components.
• the matrix can be used as an original or father matrix for further matrix production, i.e. for manufacturing mirror copies thereof, which are in turn used for manufacturing a number of press matrices.
• existing plating equipment for ordinary CD- press matrices has often been used, and existing machines for moulding CDs have often been used for injection moulding.
• One purpose of the present invention is to suggest a process which makes it possible to easily adapt the dimensions of structured disc substrates of a certain smaller diameter when manufacturing flat master disc units to a diameter which is larger than the diameter of the disc substrate.
• the process of the type described by way of introduction is characterized by laying the micro-structured substrate disc with its structured side against a flat supporting surface, laying a flat, annular element, having a hole with an inner diameter somewhat exceeding the diameter of the substrate disc and which has an outer diameter which corresponds to or exceeds the diameter of the press matrix which is to be manufactured by the master disc unit, on the flat supporting surface with the annular element coaxially surrounding the substrate disc so as to form an annular slot between the annular element and the substrate disc, introducing adhesive into the slot, and causing the adhesive to cure into an adhesive joint between the annular element and the substrate disc to form a raw master disc unit.
• the invention also relates to an adapter ring for manufacturing a master disc unit intended for the manufacture of a disc-shaped matrix for reproduction of micro- mechanical products, kinoforms or the like, characterized by having flat opposite surfaces, an outer diameter corresponding to or exceeding the outer diameter of the matrix which is to be manufactured by the master disc unit, and a hole diameter somewhat exceeding the diameter of a structured substrate disc which is to be concentrically surrounded by and joined to the adapter ring.
• Fig. 1 is a cross sectional view through an adapter ring according to the invention for use in manufacturing a master disc unit for a press matrix for reproduction of micromechanical products, kinoforms or the like; and Fig. 2 shows on an enlarged scale a partial section through the adapter ring of
• Fig. 1 joined to a structured substrate disc.
• 10 generally designates an adapter ring which has flat surfaces 12 and 14, and an outer diameter of e.g. 200 mm and a thickness of 6 mm.
• the ring 10 has a central, cylindrical hole 16 with an inner diameter which exceeds, by one or a few tenths of a millimeter, the outer diameter of a structured substrate disc 18 (Fig. 2) which is to be joined to the ring 10.
• the depth d of the hole 16 corresponds essentially to the thickness of the substrate disc 18 (e.g. 1,5 mm).
• the hole 16 opens upwards in a widened hole portion 20, which is defined by a conical hole wall 22, which can have an inclination of for example ca. 45° relative to the plane of the ring 10.
• the substrate disc 18 which can consist of a silicon disc or a quartz or glass disc of standard format (diameter ca. 100 mm), which is coated with a layer which is sensitive to light or radiation, carries on one side a structuring 24 with a configuration corresponding to the product which is to be reproduced with the aid of a press matrix manufactured in accordance with the invention, in an injection moulding machine of standard type for CD-discs.
• a process according to the invention for manufacturing a master disc unit, intended for the manufacture of a disc-shaped matrix for reproduction of micromechanical products, kinoforms or mirror copies of the matrix, will now be described.
• a structured substrate disc 18 is laid on a flat supporting surface 26 with its structured surface 24 facing the supporting surface 26.
• the supporting surface 26 can have a surface of silicon rubber or consist of another solid material and be coated with e.g. a plastic film of Teflon ® (not shown) to obtain suitable sealing and release proper- ties.
• the adapter ring 10 is then placed concentrically over the substrate disc 18 so that a narrow annular slot (ca. 0,1-0,3 mm) is formed between the outer periphery of the substrate disc 18 and the hole 16 in the ring 10.
• the ring 10 and the substrate disc 18 are caused to be in intimate contact with the silicon rubber surface 26 (or the plastic film), in order to prevent the adhesive 28, which in a subsequent step is introduced into the annular slot, penetrates to the undersurface 12 of the ring 10 and the substrate disc 18 and adheres to the supporting surface.
• the adhesive 28 After application of the adhesive 28, it is cured by means of UV-light, for example.
• the "raw" master disc unit thus formed is transferred to a metallization station (not shown), where a thin (ca. 10- 100 nm) metal layer of nickel, for example, is sputtered or steamed over the structured surface of the substrate disc and over the adhesive joint surface and the underside 12 of the ring 10.
• a fmished master disc unit is obtained with a dimension suited to electroplating in existing plating equipment for making press matrices for CD-discs.
• the finished, metallized master disc units After manufacturing the finished, metallized master disc units, they can be trans- ferred to or be mounted in an electroplating plant with standard holders, where matrices of nickel, for example, are mounted against the structured side of the master disc unit, whereafter the matrices in a subsequent step are surface-treated on their reversed sides to a smoothness of preferably Ra ⁇ 0,1 urn and are provided with a centre hole of standard format and are edge-cut at the outer periphery to the desired standard diameter for injection moulding machines intended for CD- production.
• the substrate disc has relatively deep (up to ca. 500 ⁇ m), depressions in its structured surface, one can expect with present plating methods relatively large variations on the reverse side of the matrix produced.
• it can be suitable to fill the entire widened hole portion 20 with adhesive or other material, up to the surface 14 of the ring 10.

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Health & Medical Sciences (AREA)
• Manufacturing & Machinery (AREA)
• Ophthalmology & Optometry (AREA)
• Moulds For Moulding Plastics Or The Like (AREA)
• Manufacturing Optical Record Carriers (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=20407561

Family Applications (1)

Country Status (4)

Families Citing this family (1)

Citations (6)

Family Cites Families (4)

• 1997
  • 1997-06-27 SE SE9702491A patent/SE512483C2/sv not_active IP Right Cessation
• 1998
  • 1998-06-23 AU AU79503/98A patent/AU7950398A/en not_active Abandoned
  • 1998-06-23 EP EP98930022A patent/EP0992035A1/de not_active Withdrawn
  • 1998-06-23 WO PCT/SE1998/001215 patent/WO1999003100A1/en not_active Ceased

Patent Citations (6)

Non-Patent Citations (1)

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