EP0995808A4 - COPPER ALLOY AND THIN SHEET WITH COPPER ALLOY HAVING IMPROVED WEAR RESISTANCE AS A METAL STAMPING MOLD - Google Patents

COPPER ALLOY AND THIN SHEET WITH COPPER ALLOY HAVING IMPROVED WEAR RESISTANCE AS A METAL STAMPING MOLD

Info

Publication number
EP0995808A4
EP0995808A4 EP99939202A EP99939202A EP0995808A4 EP 0995808 A4 EP0995808 A4 EP 0995808A4 EP 99939202 A EP99939202 A EP 99939202A EP 99939202 A EP99939202 A EP 99939202A EP 0995808 A4 EP0995808 A4 EP 0995808A4
Authority
EP
European Patent Office
Prior art keywords
copper alloy
wear resistance
thin sheet
metal stamping
improved wear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP99939202A
Other languages
German (de)
French (fr)
Other versions
EP0995808B1 (en
EP0995808A1 (en
Inventor
Akihito Mori
Takeshi Suzuki
Tadao Sakakibara
Yoshiharu Mae
Keishi Nogami
Yutaka Koshiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Shindoh Co Ltd
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP15454598A external-priority patent/JP4186199B2/en
Priority claimed from JP04432299A external-priority patent/JP4186201B2/en
Application filed by Mitsubishi Shindoh Co Ltd, Mitsubishi Materials Corp filed Critical Mitsubishi Shindoh Co Ltd
Publication of EP0995808A1 publication Critical patent/EP0995808A1/en
Publication of EP0995808A4 publication Critical patent/EP0995808A4/en
Application granted granted Critical
Publication of EP0995808B1 publication Critical patent/EP0995808B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Laminated Bodies (AREA)
EP99939202A 1998-03-10 1999-03-09 Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold Expired - Lifetime EP0995808B1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP5798998 1998-03-10
JP5798998 1998-03-10
JP15454598 1998-06-03
JP15454598A JP4186199B2 (en) 1998-06-03 1998-06-03 Copper alloy with excellent die wear resistance, repeated bending fatigue resistance and solderability
JP04432299A JP4186201B2 (en) 1998-03-10 1999-02-23 Copper alloy and copper alloy thin plate with excellent die wear resistance and resin adhesion
JP4432299 1999-02-23
PCT/JP1999/001116 WO1999046415A1 (en) 1998-03-10 1999-03-09 Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold

Publications (3)

Publication Number Publication Date
EP0995808A1 EP0995808A1 (en) 2000-04-26
EP0995808A4 true EP0995808A4 (en) 2006-04-12
EP0995808B1 EP0995808B1 (en) 2009-08-26

Family

ID=27291858

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99939202A Expired - Lifetime EP0995808B1 (en) 1998-03-10 1999-03-09 Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold

Country Status (6)

Country Link
EP (1) EP0995808B1 (en)
KR (1) KR100562790B1 (en)
CN (1) CN1102177C (en)
DE (1) DE19980583T1 (en)
TW (1) TW442576B (en)
WO (1) WO1999046415A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2783336B1 (en) 1998-09-11 2001-10-12 Schlumberger Ind Sa DATA TRANSMISSION METHOD AND CARD FOR SUCH TRANSMISSION
JP3918397B2 (en) 2000-04-11 2007-05-23 三菱マテリアル株式会社 Adhesion-resistant oxygen-free copper rough wire, its manufacturing method and manufacturing apparatus
TW527427B (en) 2000-03-14 2003-04-11 Nippon Mining Co Copper-alloy foil to be used for suspension member of hard-disc drive
DE10240777A1 (en) * 2002-08-30 2004-03-11 Röhm GmbH & Co. KG Wasserkalibrator
JP3999676B2 (en) * 2003-01-22 2007-10-31 Ｄｏｗａホールディングス株式会社 Copper-based alloy and method for producing the same
JP5866410B2 (en) * 2013-08-09 2016-02-17 三菱マテリアル株式会社 Copper alloy sheet and method for producing copper alloy sheet
JP5866411B2 (en) * 2013-08-09 2016-02-17 三菱マテリアル株式会社 Copper alloy sheet and method for producing copper alloy sheet
CN103952587B (en) * 2014-04-30 2016-02-03 北京科技大学 A kind of complex phase Cu alloy material and preparation method thereof
CN104481420B (en) * 2014-09-22 2016-08-03 铁岭米勒石油新材料有限公司 A kind of Novel sucker rod box cupling and preparation technology thereof
CN105400988A (en) * 2015-11-10 2016-03-16 太仓捷公精密金属材料有限公司 Copper alloy metallic material
CN105543538A (en) * 2015-12-23 2016-05-04 常熟市三荣装饰材料有限公司 Goods shelf
CN105908008A (en) * 2016-06-25 2016-08-31 聂超 Ship propeller high-strength casting material and casting process thereof
CN106244949A (en) * 2016-08-01 2016-12-21 宁波达尔机械科技有限公司 A kind of rolling bearing inner ring alloy material and preparation method thereof
CN106381417A (en) * 2016-11-15 2017-02-08 扬州丰泽轨道交通科技有限公司 Carbon brush holder for high-speed railway and manufacturing method thereof
CN107805731A (en) * 2017-10-23 2018-03-16 江苏都盛科技发展有限公司 A kind of new alloy material for electric heater
CN115747558A (en) * 2022-11-17 2023-03-07 安徽鑫科铜业有限公司 Copper alloy strip for integrated circuit lead frame and manufacturing method and application thereof

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1180893A (en) * 1967-06-26 1970-02-11 Olin Mathieson Copper Base Alloy.
US3522039A (en) * 1967-06-26 1970-07-28 Olin Mathieson Copper base alloy
US3522038A (en) * 1967-06-26 1970-07-28 Olin Corp Copper base alloy
US4668471A (en) * 1985-05-08 1987-05-26 Mitsubishi Shindoh Co., Ltd. Copper alloy lead material for leads of a semiconductor device
US4749548A (en) * 1985-09-13 1988-06-07 Mitsubishi Kinzoku Kabushiki Kaisha Copper alloy lead material for use in semiconductor device
JPH02111850A (en) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd Manufacturing method of copper alloy for lead frame
JPH02111829A (en) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd Copper alloy for lead frame
JPH02111828A (en) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd Manufacturing method of copper alloy for lead frame
EP0384260A1 (en) * 1989-02-21 1990-08-29 Mitsubishi Shindoh Co., Ltd. Copper alloy having excellent hot rollability and excellent adhesion strength of plated surface thereof when heated
JPH0441631A (en) * 1990-06-04 1992-02-12 Mitsubishi Shindoh Co Ltd High strength cu alloy for lead frame of semiconductor device
JPH07242965A (en) * 1994-03-03 1995-09-19 Mitsubishi Materials Corp Copper alloy excellent in plating property and conductivity and thin plate or strip made of this copper alloy
EP0767244A1 (en) * 1995-08-10 1997-04-09 Mitsubishi Shindoh Co., Ltd. High-strength copper based alloy free from smutting during pretreatment for plating
JPH1017956A (en) * 1996-06-27 1998-01-20 Mitsubishi Materials Corp Method of inoculating C into molten Fe-containing copper alloy

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6270541A (en) * 1985-09-20 1987-04-01 Mitsubishi Metal Corp Cu-alloy lead material for semiconductor device
JPS6293325A (en) * 1985-10-18 1987-04-28 Mitsubishi Shindo Kk Cu alloy lead material for semiconductor device

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1180893A (en) * 1967-06-26 1970-02-11 Olin Mathieson Copper Base Alloy.
US3522039A (en) * 1967-06-26 1970-07-28 Olin Mathieson Copper base alloy
US3522038A (en) * 1967-06-26 1970-07-28 Olin Corp Copper base alloy
US4668471A (en) * 1985-05-08 1987-05-26 Mitsubishi Shindoh Co., Ltd. Copper alloy lead material for leads of a semiconductor device
US4749548A (en) * 1985-09-13 1988-06-07 Mitsubishi Kinzoku Kabushiki Kaisha Copper alloy lead material for use in semiconductor device
JPH02111850A (en) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd Manufacturing method of copper alloy for lead frame
JPH02111829A (en) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd Copper alloy for lead frame
JPH02111828A (en) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd Manufacturing method of copper alloy for lead frame
EP0384260A1 (en) * 1989-02-21 1990-08-29 Mitsubishi Shindoh Co., Ltd. Copper alloy having excellent hot rollability and excellent adhesion strength of plated surface thereof when heated
JPH0441631A (en) * 1990-06-04 1992-02-12 Mitsubishi Shindoh Co Ltd High strength cu alloy for lead frame of semiconductor device
JPH07242965A (en) * 1994-03-03 1995-09-19 Mitsubishi Materials Corp Copper alloy excellent in plating property and conductivity and thin plate or strip made of this copper alloy
EP0767244A1 (en) * 1995-08-10 1997-04-09 Mitsubishi Shindoh Co., Ltd. High-strength copper based alloy free from smutting during pretreatment for plating
JPH1017956A (en) * 1996-06-27 1998-01-20 Mitsubishi Materials Corp Method of inoculating C into molten Fe-containing copper alloy

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 318 (C - 0738) 9 July 1990 (1990-07-09) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 219 (C - 0943) 22 May 1992 (1992-05-22) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 01 31 January 1996 (1996-01-31) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 05 30 April 1998 (1998-04-30) *
See also references of WO9946415A1 *

Also Published As

Publication number Publication date
KR100562790B1 (en) 2006-03-21
CN1102177C (en) 2003-02-26
KR20010012450A (en) 2001-02-15
DE19980583T1 (en) 2000-04-13
TW442576B (en) 2001-06-23
CN1256715A (en) 2000-06-14
HK1028425A1 (en) 2001-02-16
EP0995808B1 (en) 2009-08-26
EP0995808A1 (en) 2000-04-26
WO1999046415A1 (en) 1999-09-16

Similar Documents

Publication Publication Date Title
EP0995808A4 (en) COPPER ALLOY AND THIN SHEET WITH COPPER ALLOY HAVING IMPROVED WEAR RESISTANCE AS A METAL STAMPING MOLD
FR2795316B1 (en) PERMANENT PROCESS COMPRISING THE PRELIMINARY APPLICATION OF A COMPOSITION COMPRISING AT LEAST ONE ANIONIC POLYMER
HUP0100615A3 (en) Substituted 2-(2,6-dioxo-3-fluoropiperidin-3-yl)-isoindolines and their use to reduce tnfalpha levels
PT1064256E (en) BICYCLE [2.2.1] HEPTANS AND RELATED COMPOUNDS
SG77235A1 (en) Disk drive with composite sheet metal and encapsulated plastic base
DE69620998D1 (en) OXIDATION RESISTANT MOLYBENE ALLOY
FR2731019B1 (en) WELDED CONSTRUCTION PRODUCT IN ALMGMN ALLOY WITH IMPROVED MECHANICAL RESISTANCE
DE69821015D1 (en) THERMOPLASTIC POLYMER ALLOY COMPOSITION
FR2744136B1 (en) THICK ALZNMGCU ALLOY PRODUCTS WITH IMPROVED PROPERTIES
DE69902383D1 (en) HARD SOLDER ALLOYS BASED ON COBALT CHROME PALLADIUM
FR2736126B1 (en) METAL GEAR COVERED WITH COMPOSITE MATERIAL
PL341477A1 (en) Metal sheet with through holes
KR960014723A (en) Copper alloy synchronizer ring with excellent wear resistance
DE69818282D1 (en) METAL SHAPING METHOD WITH SEMI-SOLID MATERIAL
FR2787494B1 (en) "SOFT" TYPE HINGE WITH BRAKE OPEN POSITION
EP1006210A4 (en) SLIDING MATERIAL BASED ON ALUMINUM ALLOY
DE69903176D1 (en) ALL-PURPOSE PRESS AND BENDING MACHINE
FR2755981B1 (en) WEAR RESISTANT METAL COMPOSITE
EP0680249A3 (en) Cooler made of a sheet of metal.
ATA36197A (en) DIE CASTING ALLOY
IS5630A (en) Magnesium alloy.
EP1205568A4 (en) CHROME-BASED ALLOY HAVING EXCELLENT BALANCED DUCTILITY RESISTANCE AT HIGH TEMPERATURE
FR2718501B1 (en) Synchronizer with force multiplier.
ATE318516T1 (en) CHLORACETAMIDE COMPOSITIONS WITH REPRESSED PRECIPITATION
PL325583A1 (en) Penetrometer's keyboard

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19991106

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): FR IT

RIC1 Information provided on ipc code assigned before grant

Ipc: 7C 22C 9/10 B

Ipc: 7C 22C 9/06 B

Ipc: 7C 22C 9/04 B

Ipc: 7C 22C 9/00 A

A4 Supplementary search report drawn up and despatched

Effective date: 20060224

17Q First examination report despatched

Effective date: 20060926

17Q First examination report despatched

Effective date: 20060926

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): FR IT

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20100527

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20110318

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20110329

Year of fee payment: 13

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20121130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120402

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120309