EP0995808A4 - Kupfer-legierung und daraus bestehendes dünnes blech mit verbessertem verschleiss für eine rohumform-kokille - Google Patents

Kupfer-legierung und daraus bestehendes dünnes blech mit verbessertem verschleiss für eine rohumform-kokille

Info

Publication number
EP0995808A4
EP0995808A4 EP99939202A EP99939202A EP0995808A4 EP 0995808 A4 EP0995808 A4 EP 0995808A4 EP 99939202 A EP99939202 A EP 99939202A EP 99939202 A EP99939202 A EP 99939202A EP 0995808 A4 EP0995808 A4 EP 0995808A4
Authority
EP
European Patent Office
Prior art keywords
copper alloy
wear resistance
thin sheet
metal stamping
improved wear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP99939202A
Other languages
English (en)
French (fr)
Other versions
EP0995808B1 (de
EP0995808A1 (de
Inventor
Akihito Mori
Takeshi Suzuki
Tadao Sakakibara
Yoshiharu Mae
Keishi Nogami
Yutaka Koshiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Shindoh Co Ltd
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP15454598A external-priority patent/JP4186199B2/ja
Priority claimed from JP04432299A external-priority patent/JP4186201B2/ja
Application filed by Mitsubishi Shindoh Co Ltd, Mitsubishi Materials Corp filed Critical Mitsubishi Shindoh Co Ltd
Publication of EP0995808A1 publication Critical patent/EP0995808A1/de
Publication of EP0995808A4 publication Critical patent/EP0995808A4/de
Application granted granted Critical
Publication of EP0995808B1 publication Critical patent/EP0995808B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Laminated Bodies (AREA)
EP99939202A 1998-03-10 1999-03-09 Kupfer-legierung und daraus bestehendes dünnes blech mit verbessertem verschleiss für eine rohumform-kokille Expired - Lifetime EP0995808B1 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP5798998 1998-03-10
JP5798998 1998-03-10
JP15454598 1998-06-03
JP15454598A JP4186199B2 (ja) 1998-06-03 1998-06-03 耐打抜き金型摩耗性、耐繰り返し曲げ疲労特性およびはんだ付け性に優れた銅合金
JP04432299A JP4186201B2 (ja) 1998-03-10 1999-02-23 耐打抜き金型摩耗性および樹脂密着性に優れた銅合金および銅合金薄板
JP4432299 1999-02-23
PCT/JP1999/001116 WO1999046415A1 (fr) 1998-03-10 1999-03-09 Alliage de cuivre et feuille mince en alliage de cuivre possedant une resistance a l'usure amelioree en tant que moule metallique d'estampage

Publications (3)

Publication Number Publication Date
EP0995808A1 EP0995808A1 (de) 2000-04-26
EP0995808A4 true EP0995808A4 (de) 2006-04-12
EP0995808B1 EP0995808B1 (de) 2009-08-26

Family

ID=27291858

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99939202A Expired - Lifetime EP0995808B1 (de) 1998-03-10 1999-03-09 Kupfer-legierung und daraus bestehendes dünnes blech mit verbessertem verschleiss für eine rohumform-kokille

Country Status (6)

Country Link
EP (1) EP0995808B1 (de)
KR (1) KR100562790B1 (de)
CN (1) CN1102177C (de)
DE (1) DE19980583T1 (de)
TW (1) TW442576B (de)
WO (1) WO1999046415A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2783336B1 (fr) 1998-09-11 2001-10-12 Schlumberger Ind Sa Procede de transmission de donnees et carte pour une telle transmission
JP3918397B2 (ja) 2000-04-11 2007-05-23 三菱マテリアル株式会社 耐密着性無酸素銅荒引線、その製造方法及び製造装置
TW527427B (en) 2000-03-14 2003-04-11 Nippon Mining Co Copper-alloy foil to be used for suspension member of hard-disc drive
DE10240777A1 (de) * 2002-08-30 2004-03-11 Röhm GmbH & Co. KG Wasserkalibrator
JP3999676B2 (ja) * 2003-01-22 2007-10-31 Ｄｏｗａホールディングス株式会社 銅基合金およびその製造方法
JP5866410B2 (ja) * 2013-08-09 2016-02-17 三菱マテリアル株式会社 銅合金薄板および銅合金薄板の製造方法
JP5866411B2 (ja) * 2013-08-09 2016-02-17 三菱マテリアル株式会社 銅合金薄板および銅合金薄板の製造方法
CN103952587B (zh) * 2014-04-30 2016-02-03 北京科技大学 一种复相铜合金材料及其制备方法
CN104481420B (zh) * 2014-09-22 2016-08-03 铁岭米勒石油新材料有限公司 一种新型抽油杆接箍及其制备工艺
CN105400988A (zh) * 2015-11-10 2016-03-16 太仓捷公精密金属材料有限公司 一种铜合金金属材料
CN105543538A (zh) * 2015-12-23 2016-05-04 常熟市三荣装饰材料有限公司 货架
CN105908008A (zh) * 2016-06-25 2016-08-31 聂超 一种船用螺旋桨高强度铸造材料及其铸造工艺
CN106244949A (zh) * 2016-08-01 2016-12-21 宁波达尔机械科技有限公司 一种滚动轴承内圈用合金材料及其制备方法
CN106381417A (zh) * 2016-11-15 2017-02-08 扬州丰泽轨道交通科技有限公司 一种高铁用碳刷架及其制备方法
CN107805731A (zh) * 2017-10-23 2018-03-16 江苏都盛科技发展有限公司 一种用于电加热器的新型合金材料
CN115747558A (zh) * 2022-11-17 2023-03-07 安徽鑫科铜业有限公司 一种集成电路引线框架用铜合金带及其制造方法和应用

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1180893A (en) * 1967-06-26 1970-02-11 Olin Mathieson Copper Base Alloy.
US3522039A (en) * 1967-06-26 1970-07-28 Olin Mathieson Copper base alloy
US3522038A (en) * 1967-06-26 1970-07-28 Olin Corp Copper base alloy
US4668471A (en) * 1985-05-08 1987-05-26 Mitsubishi Shindoh Co., Ltd. Copper alloy lead material for leads of a semiconductor device
US4749548A (en) * 1985-09-13 1988-06-07 Mitsubishi Kinzoku Kabushiki Kaisha Copper alloy lead material for use in semiconductor device
JPH02111850A (ja) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金の製造方法
JPH02111829A (ja) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金
JPH02111828A (ja) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金の製造方法
EP0384260A1 (de) * 1989-02-21 1990-08-29 Mitsubishi Shindoh Co., Ltd. Kupferlegierung mit hervorragender Warmwälzbarkeit und sehr guter Beständigkeit gegen Abblättern einer plattierten Oberfläche während der Heizung derselben
JPH0441631A (ja) * 1990-06-04 1992-02-12 Mitsubishi Shindoh Co Ltd 半導体装置のリードフレーム用高強度Ｃｕ合金
JPH07242965A (ja) * 1994-03-03 1995-09-19 Mitsubishi Materials Corp メッキ性および導電性に優れた銅合金およびこの銅合金からなる薄板または条
EP0767244A1 (de) * 1995-08-10 1997-04-09 Mitsubishi Shindoh Co., Ltd. Hochfeste Kupferlegierungen verschmutzen-frei während der Vorbehandlung für Metallisierungen
JPH1017956A (ja) * 1996-06-27 1998-01-20 Mitsubishi Materials Corp Ｆｅ含有銅合金溶湯にＣを接種する方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6270541A (ja) * 1985-09-20 1987-04-01 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金リ−ド素材
JPS6293325A (ja) * 1985-10-18 1987-04-28 Mitsubishi Shindo Kk 半導体装置用Ｃｕ合金リ−ド素材

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1180893A (en) * 1967-06-26 1970-02-11 Olin Mathieson Copper Base Alloy.
US3522039A (en) * 1967-06-26 1970-07-28 Olin Mathieson Copper base alloy
US3522038A (en) * 1967-06-26 1970-07-28 Olin Corp Copper base alloy
US4668471A (en) * 1985-05-08 1987-05-26 Mitsubishi Shindoh Co., Ltd. Copper alloy lead material for leads of a semiconductor device
US4749548A (en) * 1985-09-13 1988-06-07 Mitsubishi Kinzoku Kabushiki Kaisha Copper alloy lead material for use in semiconductor device
JPH02111850A (ja) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金の製造方法
JPH02111829A (ja) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金
JPH02111828A (ja) * 1988-10-20 1990-04-24 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金の製造方法
EP0384260A1 (de) * 1989-02-21 1990-08-29 Mitsubishi Shindoh Co., Ltd. Kupferlegierung mit hervorragender Warmwälzbarkeit und sehr guter Beständigkeit gegen Abblättern einer plattierten Oberfläche während der Heizung derselben
JPH0441631A (ja) * 1990-06-04 1992-02-12 Mitsubishi Shindoh Co Ltd 半導体装置のリードフレーム用高強度Ｃｕ合金
JPH07242965A (ja) * 1994-03-03 1995-09-19 Mitsubishi Materials Corp メッキ性および導電性に優れた銅合金およびこの銅合金からなる薄板または条
EP0767244A1 (de) * 1995-08-10 1997-04-09 Mitsubishi Shindoh Co., Ltd. Hochfeste Kupferlegierungen verschmutzen-frei während der Vorbehandlung für Metallisierungen
JPH1017956A (ja) * 1996-06-27 1998-01-20 Mitsubishi Materials Corp Ｆｅ含有銅合金溶湯にＣを接種する方法

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 318 (C - 0738) 9 July 1990 (1990-07-09) *
PATENT ABSTRACTS OF JAPAN vol. 016, no. 219 (C - 0943) 22 May 1992 (1992-05-22) *
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 01 31 January 1996 (1996-01-31) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 05 30 April 1998 (1998-04-30) *
See also references of WO9946415A1 *

Also Published As

Publication number Publication date
KR100562790B1 (ko) 2006-03-21
CN1102177C (zh) 2003-02-26
KR20010012450A (ko) 2001-02-15
DE19980583T1 (de) 2000-04-13
TW442576B (en) 2001-06-23
CN1256715A (zh) 2000-06-14
HK1028425A1 (en) 2001-02-16
EP0995808B1 (de) 2009-08-26
EP0995808A1 (de) 2000-04-26
WO1999046415A1 (fr) 1999-09-16

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