EP1036427A1 - Procede de reduction d'un couplage de signaux haute frequence entre des paires de conducteurs dans un connecteur et connecteur de transfert de signaux differentiels - Google Patents

Procede de reduction d'un couplage de signaux haute frequence entre des paires de conducteurs dans un connecteur et connecteur de transfert de signaux differentiels

Info

Publication number
EP1036427A1
EP1036427A1 EP98958827A EP98958827A EP1036427A1 EP 1036427 A1 EP1036427 A1 EP 1036427A1 EP 98958827 A EP98958827 A EP 98958827A EP 98958827 A EP98958827 A EP 98958827A EP 1036427 A1 EP1036427 A1 EP 1036427A1
Authority
EP
European Patent Office
Prior art keywords
conductors
dielectric
connector
pairs
connecting conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98958827A
Other languages
German (de)
English (en)
Inventor
Masud Bolouri-Saransar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LK AS
Original Assignee
LK AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LK AS filed Critical LK AS
Publication of EP1036427A1 publication Critical patent/EP1036427A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H01R13/6477—Impedance matching by variation of dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout

Definitions

  • the invention relates to a method of reducing undesired high frequency signal coupling in a connector which is used for the transfer of balanced signals through several conductors in pairs, said connector having connecting conductors to connect contact springs and terminals, said pairs of connecting conductors being arranged in a dielectric.
  • Connectors of the above-mentioned type are usually used in the transmission of data at high rates. These connectors consist of terminals at one end which may be connected to a cable, a printed circuit board or the like.
  • a connecting element extends from the terminals, consisting of a number of conductors in pairs which may be arranged in a dielectric.
  • a plurality of contact springs corresponding to the plurality of connecting conductors is arranged at the opposite end of the conductors. The contact springs are intended to make contact with another connector.
  • an object of the invention is to provide a method and a connector by means of which the reduction of crosstalk between pairs of conductors in a connector is even stronger than the reduction obtainable by the prior art.
  • the object of the invention is achieved by a method of the type defined in the introductory portion of claim 1 which is characterized in that at least some of the pairs of contact springs are coated by a dielectric, and that the dielectric is coated with a shielding material.
  • Noise contributions from other pairs of the conductors in the connector will hereby be reduced optimally.
  • the method may be characterized in that all free surfaces of the contact springs are coated with 2 layers consisting of a layer of dielectric material on whose surfaces a layer of electrically shielding material is applied, as stated in claim 2.
  • an electrical shield is provided on each side of a pair of connecting conductors in substitution for a portion of the dielectric.
  • shield/dielectric gives a better re-duction of undesirable signal transfer between the pairs of conductors than if there is just a dielectric around the connecting conductors.
  • the invention also relates to a connector which, as stated in claim 5, may be of the male or female plug type for the transfer of differential signals through several conductors in pairs, said connector having connecting conductors to connect contact springs and terminals, said connecting conductors being arranged in a dielectric.
  • the connector is characterized in that a dielectric layer is provided on the upper side of at least some of the contact springs, and that an electrical shield is addi- tionally provided on the upper side of the dielectric layer.
  • all the sides of the contact springs which do not make electrical contact with a connected connector may be coated with a dielectric, which is additionally coated with a conductive shield, as stated in claim 6.
  • the elec- trical conductors are embedded on each side of the dielectric of a pair of the connecting conductors.
  • This provides the maximum reduction in crosstalk between the pairs of electrical conductors and reduction in in- terference from external signals.
  • fig. 1 shows an ordinary plug connection in which two connectors are connected to their respective cables
  • fig. 2 shows a typical structure of conductors in pairs in a connector, e.g. a connector as shown in fig. 1,
  • fig. 3 shows an equivalent circuit diagram of the electrical conditions in the reduction of crosstalk in a connector
  • fig. 4 schematically shows the conductors whose crosstalk is preferably to be reduced most
  • fig. 5 shows the connecting conductor constructed with the constructive features according to the invention
  • FIG. 6 in more detail shows another embodiment of the connecting conductor in cross-section constructed with the constructive features according to the invention
  • fig. 7 shows the contact springs with the constructive features according to the invention.
  • fig. 8 shows an alternative embodiment of the structure of the contact spring part.
  • Fig. 1 shows two connectors which are designated 1 and 2, respectively. These connectors 1, 2 each have a cable 3 connected at their ends, and contact springs are provided at their opposite ends for connection of the two connectors 1 and 2.
  • Fig. 2 shows a connector 1 having eight conductors which consist of four pairs of conductors. These pairs of conductors are used for transferring balanced differential signals.
  • the two poles of the pair of conductors A are designated A + and A- in fig. 2.
  • the other pairs of conductors are designated B+, B-, C+, C, and D + , D_. It is noted that the pair of conductors D is spaced more from each other than the other pairs of conductors, as the pair of conductors B has poles which are positioned within the two poles of the pair of conductors D.
  • Fig. 3 shows an equivalent circuit diagram, with the measures which have been taken in order to reduce cross- talk between pairs of conductors.
  • 6 designates an area which schematically shows how terminals, which may e.g. be terminals for connection to a printed circuit board, are interconnected by capacitors 9 with a view to reducing crosstalk between the individual conductors in the terminal area. This is shown by a technique known per se, which will therefore not be explained more fully here.
  • Fig. 3 additionally shows an area 8 which illustrates how reduction of crosstalk between the individual conductors in a connector in the contact spring area is provided, here shown schematically by the reference numeral 13.
  • Fig. 4 shows the structure of pairs of connectors in a connector as shown in figs. 1 and 2. These pairs of connectors are intended to transfer data at high rates. The rates are not necessarily the same for all the pairs of conductors .
  • Fig. 5 shows the connecting conductors which are embedded in a dielectric designated 14.
  • 13 designates electrical shields which, as shown in the figure, are arranged between the pairs of conductors as well as on the upper side and the lower side of the dielectric positioned above and below the conductors. This results in a strong shielding in the connecting conductor area by means of common earth between the conductors in pairs.
  • 15 designates a dielectric in a connecting conductor area in a connector. As will be seen, the pairs of conductors A+, A_..., D + , D_ recur in this figure.
  • the dielectric 15 is divided and defined by several metallized surfaces, shown at the reference numeral 18.
  • a co-extensive metal foil 16 is provided on the outer side of the surface 18, and may also be provided on the lower side, but not shown in fig. 6.
  • the subareas of the divided dielectric are shown in fig. 6 at the reference numerals 15A, 15B, 15C, 15D and 15E.
  • the pair of conductors A + , A is defined by a metallized subarea 15A, except at the small areas shown at 21 and 22, which are necessary to avoid short-circuits be- tween the metallized surfaces 15B, etc., of the respective areas, since short-circuits may cause an increase in crosstalk.
  • a conductor or a pair of conductors is arranged in each of the areas 15A, 15B, 15C, 15D and 15E, and this conductor or pair of con- ductors is protected against mutual interference in the form of crosstalk because of the provision of the metallized surfaces.
  • the crosstalk between e.g. the pair of conductors B + , B_ and D_ or D + is reduced.
  • Fig. 7 schematically shows how the pairs of conductors in the contact spring area are shielded. This takes place by coating one side of the conductor with a dielectric 14 on whose surface a conductor material 13 has additionally been applied.
  • the opposite end of the connector is used for making contact with a conductor in another connector.
  • Fig. 8 shows an alternative embodiment for the implementation of the principles of the invention according to fig. 7, the difference with respect to the embodiment in fig. 7 being that also a shield 13 is arranged on the sides of the dielectric which adjoins the conductors A-D.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Afin de réduire le couplage de signaux haute fréquence entre des conducteurs par paires dans des connecteurs (1, 2), lesdits conducteurs étant constitués de conducteurs de connexion par paires (A+, A-; B+, B-; C+, C-; D+, D-) noyés dans un diélectrique (14) et des ressorts de contact, on applique deux couches sur les côtés des ressorts de contact qui ne doivent pas toucher d'autres ressorts de contact, la première couche étant un diélectrique et la seconde couche étant un écran (13) électriquement conducteur. Le diélectrique entourant les conducteurs de connexion est partiellement remplacé par des écrans électriquement conducteurs. On peut ainsi réduire le couplage de signaux entre deux ensembles de conducteurs par paires.
EP98958827A 1997-12-05 1998-12-04 Procede de reduction d'un couplage de signaux haute frequence entre des paires de conducteurs dans un connecteur et connecteur de transfert de signaux differentiels Withdrawn EP1036427A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DK141097 1997-12-05
DK141097 1997-12-05
PCT/DK1998/000528 WO1999030388A1 (fr) 1997-12-05 1998-12-04 Procede de reduction d'un couplage de signaux haute frequence entre des paires de conducteurs dans un connecteur et connecteur de transfert de signaux differentiels

Publications (1)

Publication Number Publication Date
EP1036427A1 true EP1036427A1 (fr) 2000-09-20

Family

ID=8104536

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98958827A Withdrawn EP1036427A1 (fr) 1997-12-05 1998-12-04 Procede de reduction d'un couplage de signaux haute frequence entre des paires de conducteurs dans un connecteur et connecteur de transfert de signaux differentiels

Country Status (4)

Country Link
EP (1) EP1036427A1 (fr)
AU (1) AU1483199A (fr)
CA (1) CA2311802A1 (fr)
WO (1) WO1999030388A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001008268A1 (fr) * 1999-07-27 2001-02-01 The Siemon Company Connecteur blinde de telecommmunications
US6506077B2 (en) 2000-07-21 2003-01-14 The Siemon Company Shielded telecommunications connector
DE20105207U1 (de) 2001-03-20 2001-08-23 Albert Ackermann GmbH & Co. KG, 51643 Gummersbach Elektrischer Steckverbinder für die Nachrichten- und Datentechnik
US7182649B2 (en) 2003-12-22 2007-02-27 Panduit Corp. Inductive and capacitive coupling balancing electrical connector
US7179131B2 (en) 2004-02-12 2007-02-20 Panduit Corp. Methods and apparatus for reducing crosstalk in electrical connectors
CN102082367B (zh) 2004-03-12 2013-11-20 泛达公司 减小电连接器中串扰的方法及装置
US7153168B2 (en) 2004-04-06 2006-12-26 Panduit Corp. Electrical connector with improved crosstalk compensation
US7281957B2 (en) 2004-07-13 2007-10-16 Panduit Corp. Communications connector with flexible printed circuit board
US7866337B2 (en) * 2005-07-08 2011-01-11 Entegris, Inc. Chemically inert flow controller with non-contaminating body
EP1987569A1 (fr) 2006-02-13 2008-11-05 Panduit Corp. Connecteur a compensation de diaphonie
US7874878B2 (en) 2007-03-20 2011-01-25 Panduit Corp. Plug/jack system having PCB with lattice network
EP3387715B1 (fr) 2015-12-08 2021-05-12 Panduit Corp. Connecteur à obturateur rj45 et systèmes de communication associés

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Publication number Priority date Publication date Assignee Title
DE3664832D1 (en) * 1985-03-04 1989-09-07 Amp Inc High performance flat cable
US5094623A (en) * 1991-04-30 1992-03-10 Thomas & Betts Corporation Controlled impedance electrical connector
US5262353A (en) * 1992-02-03 1993-11-16 Motorola, Inc. Process for forming a structure which electrically shields conductors
US5186647A (en) * 1992-02-24 1993-02-16 At&T Bell Laboratories High frequency electrical connector
US5296651A (en) * 1993-02-09 1994-03-22 Hewlett-Packard Company Flexible circuit with ground plane
US5470244A (en) * 1993-10-05 1995-11-28 Thomas & Betts Corporation Electrical connector having reduced cross-talk
US5628647A (en) * 1995-02-22 1997-05-13 Stewart Connector Systems, Inc. High frequency modular plug and cable assembly

Non-Patent Citations (1)

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Title
See references of WO9930388A1 *

Also Published As

Publication number Publication date
WO1999030388A1 (fr) 1999-06-17
AU1483199A (en) 1999-06-28
CA2311802A1 (fr) 1999-06-17

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