EP1051886A2 - Dispositif de traitement electrolytique de carte de circuits et de feuilles conductrices - Google Patents

Dispositif de traitement electrolytique de carte de circuits et de feuilles conductrices

Info

Publication number
EP1051886A2
EP1051886A2 EP98931898A EP98931898A EP1051886A2 EP 1051886 A2 EP1051886 A2 EP 1051886A2 EP 98931898 A EP98931898 A EP 98931898A EP 98931898 A EP98931898 A EP 98931898A EP 1051886 A2 EP1051886 A2 EP 1051886A2
Authority
EP
European Patent Office
Prior art keywords
electrolyte
printed circuit
circuit boards
counter electrodes
foils
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98931898A
Other languages
German (de)
English (en)
Inventor
Jens Geissler
Thomas Rydlewski
Lorenz Kopp
Ralf-Peter WÄCHTER
Reinhard Schneider
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of EP1051886A2 publication Critical patent/EP1051886A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

Definitions

  • the invention relates to a device for the electrolytic treatment of printed circuit boards and foils in horizontal or vertical continuous galvanizing systems using direct current or pulse current.
  • the device is particularly suitable for the uniform electrolytic deposition of metal layers with optimized metal-physical properties.
  • electrolyte liquid must be brought up to the surface of the material to be treated in order to counteract the consumption of the required metal ions.
  • a liquid flow directed against the surface of the material to be treated is used according to known methods in order to reduce the diffusion layer thickness lying on the surface and thus to accelerate the transport of metal ions to the surface of the material to be treated.
  • limits to the flow to the surfaces which are determined by the design of the galvano-equipment and the nature of the material to be treated. For example, thin and thus mechanically insufficiently stable conductor foils cannot be treated with arbitrarily sharp liquid jets.
  • Treatment liquid can reach all surface points of the material to be treated, which is located in the electroplating system, as evenly as possible.
  • DE 42 12 567 A1 describes an electroplating device for printed circuit boards in which the printed circuit boards are guided through a treatment chamber on a horizontal continuous path by providing contacting means which are arranged in the region of the continuous path and grip the printed circuit boards in their continuous path at the front edge .
  • Soluble anodes are provided opposite the transport plane in which the printed circuit boards are guided. It is also specified that surge nozzles are arranged between the individual anodes, which direct the treatment liquid against the circuit board surfaces.
  • a system of this type is not suitable for metal deposition with high current densities and to achieve high quality requirements.
  • DE 43 44 387 C2 describes, among other things, a horizontal continuous system for the electrolytic treatment of printed circuit boards, in which the printed circuit boards are guided through the system in a horizontal transport plane and transport direction and insoluble anodes are provided opposite the transport plane. Suitable contacting means are used in the treatment chamber for power supply.
  • the treatment liquid is conveyed through the system via flood pipes against their surfaces during the transport of the printed circuit boards.
  • the flood pipes and the supply lines for the flood pipes are made of plastic according to the information in this publication in order to minimize any influence on the electrical field between the anode and cathode.
  • DE 42 29 403 C2 describes a continuous system for the metal coating of plastic films.
  • the material to be treated is drawn through chambers which can be charged with electrolyte, anodes being arranged opposite the film.
  • the treatment liquid is conveyed through bores in the anodes, which lead to the film and run obliquely in the transport direction, and are directed onto the film surfaces.
  • An open-pore plastic is also provided within the chamber and is brought into contact with the solid film.
  • squeeze rollers for sealing off the chamber are provided in the publication to prevent treatment liquid from flowing out and to be arranged at the inlet and outlet of the film.
  • DE 44 02 596 A1 also specifies a horizontal continuous system for the treatment of printed circuit boards.
  • electrolyte is conveyed up close to the circuit board surface by using a rotating flood electrode that is located on the circuit board Rolls surface and from which the electrolyte emerges under pressure. At the same time, this electrode also serves as a counter electrode. Alternatively, the electrolyte can also be sucked off via the flood electrode. This also creates a strong flow on the PCB surfaces.
  • the rotating flood electrodes are used, high-quality metal layers cannot be deposited with a high average current density.
  • the flood electrode does not roll on the printed circuit board surfaces without slippage. Rather, the flood electrode is wiped over the printed circuit board surface, so that the diffusion layer thickness is additionally disturbed with the possibility of a further increase in the limit current density.
  • this device has other disadvantages. For example, the wiping movement leads to increased wear of the wiping agent on the electrode circumference, so that the electrolyte and thus the material to be treated are easily contaminated. As a result, the frequent replacement of the wiping agent is required, so that the device has to be serviced with increased effort. In this case too, it was found that metal layers could not be deposited with high quality when working with a high average current density.
  • JP-A-58123898 describes a system for the electrolytic coating of steel strip with metals, in which the steel strip is continuously passed through an electrolyte chamber and is closely guided past anodes. Electrolyte is conducted via pipes in anode chambers, which are arranged on the side of the anodes facing away from the steel strip. The electrolyte is conveyed from the chambers onto the steel belt via slots in the anodes.
  • the present invention is therefore based on the problem of avoiding the disadvantages of the prior art and, in particular, of finding a suitable device for the electrolytic treatment of printed circuit boards and foil, in particular for electrolytic metallization.
  • metal layers with very good metal-physical properties. ten, for example with great elongation at break and ductility, very good gloss, uniform layer thickness, sufficient leveling and high scattering behavior when depositing layers in fine drill holes in the printed circuit boards, for example holes with a diameter of 0.3 mm and less, and if necessary a plate thickness of 3.5 mm and more.
  • These properties should in particular also be achievable if the metal layers are deposited on the surfaces with a current density of at least 4 A / dm 2 .
  • the circuit boards or circuit foils are treated with an electrolyte liquid, the circuit boards or circuit foils being continuously guided through the device in a transport plane in a substantially horizontal transport direction.
  • the device has the following features:
  • counter electrodes are arranged on at least one side, so that electrolyte spaces are formed between opposing counter electrodes or the counter electrodes and the transport plane, the counter electrodes each forming essentially gapless electrode surfaces.
  • Guide elements for the printed circuit boards and printed foils are arranged in the electrolyte compartment.
  • Contact elements are provided for electrical contacting of the circuit boards and conductor foils.
  • electrolyte spraying devices and devices such as pumps and pipelines, are provided for conveying the electrolyte liquid against the surfaces of the printed circuit boards and foil, e. Breakthroughs are provided in the counter electrodes. f.
  • the electrolyte spraying devices outside the electrolyte spaces on the sides of the counter electrodes facing away from the transport plane are arranged in such a way that the electrolyte liquid emerging from the electrolyte spraying devices can pass through the counter electrodes essentially unimpeded at the locations of the openings and reach the surfaces of the printed circuit boards and foil.
  • the printed circuit boards or conductor foils are preferably guided in a substantially horizontal or vertical orientation (horizontally or vertically oriented transport plane).
  • copper can be deposited on the surfaces of printed circuit boards or foils, or metal can be electrolytically etched away from metal surfaces.
  • the counter electrodes are polarized as anodes and in the second case as cathodes.
  • the openings in the counter electrodes are preferably cylindrical, but can also have a square or rectangular cross section, for example.
  • the axes of the openings are essentially aligned with the liquid jets emerging from the electrolyte spraying devices, it being possible for the axes to be oriented essentially perpendicular to the transport plane.
  • a plurality of electrolyte spray devices can be provided in the device according to the invention.
  • several such devices can be arranged both perpendicularly and parallel to the transport direction.
  • the electrolyte spraying devices are offset from one another in the direction of transport in order to achieve the most extensive possible coverage of the surfaces of the printed circuit boards or printed circuit foils.
  • the electrolyte liquid is conveyed on the horizontally oriented surfaces of printed circuit boards guided in a horizontal transport plane, the liquid can only flow off at the lateral edges of the printed circuit boards and therefore builds up in the middle area of the plates. Therefore, without further optimization of the device, an uneven speed profile of the electrolyte liquid conveyed on the upper side of the printed circuit board forms transversely to the transport direction: the speed is low in the middle of the printed circuit board, but high on the lateral edge of the printed circuit board. This effect does not occur with printed circuit boards routed in a vertically aligned transport plane.
  • the distance between the electrolyte spraying devices should be dimensioned such that the flow rate of the electrolyte liquid in the transport plane is essentially the same at all points.
  • the distance between the electrolyte spraying devices is expediently chosen to be smaller in the middle than at the lateral edge of the printed circuit boards.
  • the guide elements arranged in the electrolyte space can be offset from one another in the direction of transport in order to minimize interference with the metal deposition at certain surface locations.
  • the guide elements are preferably designed as disks which are arranged on axes. The axes extend perpendicular to the transport direction and parallel to the transport plane.
  • the dimensions and the material of the panes should be chosen so that they do not significantly influence the electrical field line distribution in the electrolyte compartments.
  • plastic washers are particularly suitable insofar as they are resistant to the electrolyte liquid.
  • the disks should be made as thin as possible and have as many openings as possible in order to disturb the electrical field line distribution in the vicinity of the transport plane as little as possible.
  • a lower limit for the dimensioning of the panes is set by their necessary mechanical stability.
  • sealants are provided for the printed circuit boards and printed circuit films at the inlet and the outlet of the device.
  • squeeze rollers can be used as sealants, each of which is mounted above or below the transport plane and is firmly in contact with the plates or foils when they pass through.
  • the counter electrodes are composed of several individual parts for design reasons. In this case, suitable spacer strips and / or seals must be provided between the individual electrodes in order to isolate the electrodes from one another.
  • Figure 1 Schematic longitudinal section of a section of an inventive horizontal continuous system
  • FIG. 2a Schematic cross section of a flow-through arrangement with contacting of the material to be treated in clamps
  • Figure 2b Schematic cross section of a continuous system with roller contacting the material to be treated.
  • FIG. It is the entrance area of the system with the transport direction running from left to right in the direction of the arrow.
  • only four upper and four lower insoluble anodes 2 are shown as counter electrodes.
  • such a system comprises, for example, twenty-five upper anodes 1 and twenty-five lower anodes 2.
  • the total length of the active region of such a system ie the region in which electrolytic treatment takes place by applying an electrical voltage to the counter electrodes and the material to be treated six me- ter.
  • the anodes are shown as partial anodes of the entire upper electrolytic cell, which is formed by the upper anodes 1, the printed circuit boards or conductor foils 3 and the upper electrolyte space 4 lying between them.
  • the partial anodes 2 of the lower electrolytic cell are also shown. This allows the individual connection of each anode 1, 2 when the material to be treated 3 is being moved into the system and likewise the individual switching off of the anodes when the material is being moved out of the system. Switching the anodes on and off is described in particular in DE 39 39 681 C2. Reference is made to this publication.
  • the bath current connection to the anodes 1, 2 is not shown in FIG. 1 for the sake of simplifying the drawing.
  • anodes 1, 2 Electrically insulating spacer strips and / or seals 6 are inserted between the anodes 1, 2. These are so narrow in the transport direction that the partial anodes 1, 2 taken together with respect to the material to be treated 3 act like a continuous large-area anode 1, 2. A drop in current density on the surface of the material to be treated, which could be caused by these anode distances, cannot be determined.
  • the anodes 1, 2 extend essentially over the entire width of the material 3 to be treated, but at least 80% of this width, in order to avoid an edge effect during the metal deposition. With less differentiated connection and disconnection of the anodes, the length of the individual anodes in the transport direction can be increased. The only limits are set by manufacturing considerations.
  • Suitable material for the insoluble anodes 1, 2, for example, is titanium, which is coated with a protective coating, for example made of iridium oxide, in order to reduce the overvoltage during deposition to a minimum. To increase the effective anode surface, it can be structured. This reduces the anodic current density. Single or multi-layer expanded metal grids are preferably used for this purpose.
  • the device according to the invention is also suitable for the use of soluble anodes. For example, so-called pellets or balls made of the metal to be deposited, which are filled into corresponding insoluble anode baskets, or anode plates made of the metal to be deposited can be used.
  • circuit boards and conductor foils 3 to be treated are preferably guided in the center by upper guide elements 7 and lower guide elements 8 between the upper anodes 1 and the lower anodes 2 and are conveyed in the transport direction by clips, not shown in FIG. 1, which also serve as electrical contact elements.
  • the driven or non-driven guide elements 7, 8 are generally electrically insulated thin axes 9 with perforated disks 10 made of electrically non-conductive plastic that are attached.
  • the axes 9 and the disks 10 are dimensioned such that there is no electrically disruptive bending of the material 3 to be treated.
  • the axle diameter is about ten millimeters, for example.
  • the perforated disks 10 can have a thickness of approximately four millimeters, for example.
  • the disks 10 are preferably arranged offset from axis to axis 9 in the transport direction of the material 3 to be treated.
  • the mutual center distance is usually, for example, about 250 millimeters and the disk distance on one axis, for example, about 100 millimeters.
  • the upper guide elements 7 can be dispensed with entirely. This is shown in more detail in the exemplary embodiment in FIG. 2a.
  • the material to be treated 3 must be electrically contacted and connected to a bath power source.
  • contacting clips 11, which grip the material 3 to be treated on the edge, or other contact elements are used.
  • the electrical connection from the clamps 11 running with the material to be treated 3 to the bath current source is mediated by sliding contacts, not shown in the figures.
  • the linearly driven contacting clamps 11 take on the transport function for the printed circuit boards or foil. The firmly gripped plates or foils are safely transported through the electroplating system even when the guide elements 7, 8 are not driven are.
  • FIG. 2b shows the contacting of the material to be treated 3 via electrically conductive roller contacts 12. Since the material to be treated cannot be transported with roller contacts, the guide elements 7, 8 must in this case be driven and arranged on both sides of the transport plane.
  • the electrolyte spraying devices in the case of the figures designed as electrolyte spray tubes 13, are in all cases arranged outside the electrolyte spaces 4, 5 on the sides of the counter electrodes 1, 2 facing away from the transport plane.
  • the surfaces of the material to be treated with the selected arrangement are therefore not flowed from as close as possible to the electrolyte liquid, so that it could be expected that high-quality borehole electroplating would not be achievable with the selected device if a high current density was set. Surprisingly, this expectation has not been confirmed.
  • the selected device achieves the highest possible performance in relation to the desired quality of the metal layer, the layer thickness distribution on the surface and the deposition rate.
  • the disadvantages of local fluctuations in current density along the transport path which occur in conventional electroplating systems, are considerably greater than the disadvantage which arises due to the loss of the maximum flow rate of the electrolyte liquid on the surface of the material to be treated.
  • the composition of the electrolyte liquid can be optimally adjusted to this current density. This also has an advantage over conventional devices, since a varying current density distribution was obtained in these devices and the composition of the electrolyte liquid could only be optimized approximately to an average current density value.
  • the treatment liquid is conveyed from a storage container into the spray tubes 13 in the direction of the arrow with at least one pump.
  • the spray tubes have holes or nozzles 14 which are oriented perpendicularly or obliquely to the surface of the material to be treated.
  • the holes or nozzles 14 are preferably located below the bath level 16 in the treatment chamber.
  • the hole diameter is expediently somewhat larger than the diameter of the spray tube holes. In practice, it is about four to about twelve millimeters. Especially with diagonal ones
  • the electrolyte passes through the holes 15 in the anodes 1, 2 more uniformly to a larger surface area of the material to be treated.
  • the distance between the holes or nozzles 14 of a spray tube 13 and the spray tube distance in the transport direction are preferably selected so that an almost uniform electrolyte flow pattern results on the surface of the material to be treated in the entire transport plane, ie transversely to the transport direction and also longitudinally to it.
  • the distance between the spray pipe and the surface of the crop is around 40 millimeters to 120 millimeters.
  • the holes or nozzles 14 are expediently displaced from the spray pipe to the spray pipe transversely to the transport direction in the case of large hole and spray pipe distances.
  • a flow pattern obtained with these measures shows that the uniformity of the flow surprisingly gives significantly better electroplating results, also in the case of the metallization of the boreholes, than with those along the transport path.
  • alternating maximum and minimum flows which are obtained with electrolyte spray tubes arranged very close to the surface of the material to be treated in conventional systems.
  • different measures are taken to ensure that the electrolyte liquid can pass through the anodes unhindered.
  • tubes are guided through the anode baskets from each hole or nozzle 14 in order to keep the jet path for the treatment liquid free of anode material.
  • the tubes are attached to the respective anode basket. They are positioned in such a way that the electrolyte from each nozzle passes unhindered into the electrolyte spaces 4, 5.
  • soluble anode plates corresponding openings in the plates ensure unhindered electrolyte penetration.
  • the electrolyte solution flowing into the electrolyte spaces 4, 5 runs laterally through openings that are caused by the design along the transport path and arrives in a storage container. Openings can also be provided which are additionally provided in order to allow the liquid to flow away.
  • the outlet area of the continuous system corresponds to the inlet area shown in FIG. 1 in mirror image.
  • Sealing walls 17 and one or more sealing rollers 18 are provided at the inlet and at the outlet for the printed circuit boards or foils 3. These serve to largely retain the electrolyte liquid in the system and prevent it from escaping while the printed circuit boards or foil are being moved into or out of the system. As a result, the bath level 16 is maintained in the system.
  • the sealing means are at a greater distance from the nearest anodes. This has the advantage that a local current density prevails on the first sealing line 19, despite the edge effect occurring there, which is only about as large as the current density within the electroplating system.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un dispositif de traitement électrolytique de carte de circuits (3), à travers lequel les cartes de circuits peuvent être guidées en continu dans un plan de transport dans une direction de transport pratiquement horizontale. Ce dispositif présente les caractéristiques suivantes: des contre-électrodes (1, 2) sont montées, au moins sur un côté, face au plan de transport et pratiquement parallèlement à celui-ci, de façon à former des chambres d'électrolyte (4, 5) entre les contre-électrodes se faisant face ou entre les contre-électrodes et le plan de transport. Les contre-électrodes forment chacune des surfaces d'électrodes pratiquement ininterrompues. Des éléments de guidage (7, 8) pour les cartes de circuits sont placés dans la chambre d'électrolyte. Des éléments de contact (11) sont prévus pour assurer le contact électrique des cartes de circuits. En outre, des unités de pulvérisation d'électrolyte (13) sont prévues pour transporter le liquide électrolytique contre les surfaces des cartes de circuits. Des ouvertures sont ménagées dans les contre-électrodes. Les unités de pulvérisation d'électrolyte sont placées sur les côtés des contre-électrodes, opposés au plan de transport, de sorte que le liquide électrolytique sortant desdites unités puisse passer pratiquement sans entrave par les contre-électrodes, à l'endroit des ouvertures, et puisse parvenir aux surfaces des cartes de circuits.
EP98931898A 1997-04-25 1998-04-07 Dispositif de traitement electrolytique de carte de circuits et de feuilles conductrices Withdrawn EP1051886A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE1997117512 DE19717512C3 (de) 1997-04-25 1997-04-25 Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
DE19717512 1997-04-25
PCT/DE1998/001034 WO1998049374A2 (fr) 1997-04-25 1998-04-07 Dispositif de traitement electrolytique de carte de circuits et de feuilles conductrices

Publications (1)

Publication Number Publication Date
EP1051886A2 true EP1051886A2 (fr) 2000-11-15

Family

ID=7827747

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98931898A Withdrawn EP1051886A2 (fr) 1997-04-25 1998-04-07 Dispositif de traitement electrolytique de carte de circuits et de feuilles conductrices

Country Status (6)

Country Link
US (1) US6238529B1 (fr)
EP (1) EP1051886A2 (fr)
JP (1) JP4210339B2 (fr)
CA (1) CA2287274A1 (fr)
DE (1) DE19717512C3 (fr)
WO (1) WO1998049374A2 (fr)

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DE19717512A1 (de) 1998-10-29
CA2287274A1 (fr) 1998-11-05
JP2002506483A (ja) 2002-02-26
DE19717512C3 (de) 2003-06-18
JP4210339B2 (ja) 2009-01-14
US6238529B1 (en) 2001-05-29
DE19717512C2 (de) 1999-03-11
WO1998049374A3 (fr) 2000-08-24
WO1998049374A2 (fr) 1998-11-05

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