EP1053076A4 - Poliervorrichtung und polierplatte dafür - Google Patents

Poliervorrichtung und polierplatte dafür

Info

Publication number
EP1053076A4
EP1053076A4 EP19990901202 EP99901202A EP1053076A4 EP 1053076 A4 EP1053076 A4 EP 1053076A4 EP 19990901202 EP19990901202 EP 19990901202 EP 99901202 A EP99901202 A EP 99901202A EP 1053076 A4 EP1053076 A4 EP 1053076A4
Authority
EP
European Patent Office
Prior art keywords
polishing apparatus
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP19990901202
Other languages
English (en)
French (fr)
Other versions
EP1053076A1 (de
Inventor
Norio Kimura
Yu Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of EP1053076A1 publication Critical patent/EP1053076A1/de
Publication of EP1053076A4 publication Critical patent/EP1053076A4/de
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
EP19990901202 1998-01-30 1999-02-01 Poliervorrichtung und polierplatte dafür Ceased EP1053076A4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP3434898A JP3693483B2 (ja) 1998-01-30 1998-01-30 研磨装置
JP3434898 1998-01-30
PCT/JP1999/000410 WO1999038651A1 (en) 1998-01-30 1999-02-01 Polishing apparatus and polishing table therefor

Publications (2)

Publication Number Publication Date
EP1053076A1 EP1053076A1 (de) 2000-11-22
EP1053076A4 true EP1053076A4 (de) 2001-03-06

Family

ID=12411651

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19990901202 Ceased EP1053076A4 (de) 1998-01-30 1999-02-01 Poliervorrichtung und polierplatte dafür

Country Status (5)

Country Link
US (1) US6544111B1 (de)
EP (1) EP1053076A4 (de)
JP (1) JP3693483B2 (de)
KR (1) KR100540774B1 (de)
WO (1) WO1999038651A1 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1238755B1 (de) * 1999-06-15 2010-11-10 Ibiden Co., Ltd. Wafer poliermaschinentisch, wafer polierverfahren und halbleiterschleife herstellungsverfahren
US6832948B1 (en) * 1999-12-03 2004-12-21 Applied Materials Inc. Thermal preconditioning fixed abrasive articles
JP2003077993A (ja) * 2001-08-30 2003-03-14 Nec Yamagata Ltd ウェーハ用ホルダ、及び、ウェーハの吸着解放方法
US6896586B2 (en) * 2002-03-29 2005-05-24 Lam Research Corporation Method and apparatus for heating polishing pad
JP2004042217A (ja) * 2002-07-12 2004-02-12 Ebara Corp 研磨方法、研磨装置および研磨工具の製造方法
US7169014B2 (en) * 2002-07-18 2007-01-30 Micron Technology, Inc. Apparatuses for controlling the temperature of polishing pads used in planarizing micro-device workpieces
US6913515B2 (en) * 2003-09-30 2005-07-05 Hitachi Global Storage Technologies Netherlands B.V. System and apparatus for achieving very high crown-to-camber ratios on magnetic sliders
US6942544B2 (en) * 2003-09-30 2005-09-13 Hitachi Global Storage Technologies Netherlands B.V. Method of achieving very high crown-to-camber ratios on magnetic sliders
USD559064S1 (en) 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
USD559063S1 (en) * 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
DE102004040429B4 (de) * 2004-08-20 2009-12-17 Peter Wolters Gmbh Doppelseiten-Poliermaschine
TWD111897S1 (zh) * 2004-10-05 2006-07-11 股份有限公司 研磨用墊片
USD559648S1 (en) * 2004-10-05 2008-01-15 Jsr Corporation Polishing pad
USD560457S1 (en) * 2004-10-05 2008-01-29 Jsr Corporation Polishing pad
JP4787063B2 (ja) * 2005-12-09 2011-10-05 株式会社荏原製作所 研磨装置及び研磨方法
US20070227901A1 (en) * 2006-03-30 2007-10-04 Applied Materials, Inc. Temperature control for ECMP process
JP4943800B2 (ja) * 2006-10-06 2012-05-30 ニッタ・ハース株式会社 研磨状況モニタシステム
DE102007011880A1 (de) * 2007-03-13 2008-09-18 Peter Wolters Gmbh Bearbeitungsmaschine mit Mitteln zur Erfassung von Bearbeitungsparametern
DE102007063232B4 (de) * 2007-12-31 2023-06-22 Advanced Micro Devices, Inc. Verfahren zum Polieren eines Substrats
US8149256B2 (en) * 2008-06-04 2012-04-03 Varian Semiconductor Equipment Associates, Inc. Techniques for changing temperature of a platen
CN101758420B (zh) * 2008-12-08 2016-04-20 香港科技大学 一种提供冷却的系统、装置及方法
JP2010183037A (ja) * 2009-02-09 2010-08-19 Toshiba Corp 半導体製造装置
JP5844673B2 (ja) * 2012-03-29 2016-01-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2014065088A (ja) * 2012-09-24 2014-04-17 Disco Abrasive Syst Ltd 研磨装置
US9550270B2 (en) * 2013-07-31 2017-01-24 Taiwan Semiconductor Manufacturing Company Limited Temperature modification for chemical mechanical polishing
JP6161999B2 (ja) * 2013-08-27 2017-07-12 株式会社荏原製作所 研磨方法および研磨装置
KR102569631B1 (ko) * 2015-12-18 2023-08-24 주식회사 케이씨텍 화학 기계적 연마장치 및 그 제어방법
CN108015661A (zh) * 2017-12-15 2018-05-11 浙江工业大学 一种集成有温控装置的抛光盘夹具
CN109877699A (zh) * 2019-03-01 2019-06-14 长江存储科技有限责任公司 一种化学机械研磨装置及方法
CN111843832B (zh) * 2020-07-30 2021-09-07 广东汉岂工业技术研发有限公司 一种化学机械研磨的水冷式研磨头
US20230256561A1 (en) * 2022-02-17 2023-08-17 Taiwan Semiconductor Manufacturing Company Ltd. Method of chemical mechanical polish operation and chemical mechanical polishing system
CN115922534A (zh) * 2022-07-25 2023-04-07 华海清科股份有限公司 一种具有温度调节功能的抛光转台和化学机械抛光设备
JP2026056054A (ja) * 2024-09-19 2026-04-01 住友重機械工業株式会社 加工装置及び加工方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3128880C2 (de) * 1981-07-22 1987-03-19 Fa. Peter Wolters, 2370 Rendsburg Maschine zum Läppen oder Polieren
JPH0659624B2 (ja) * 1985-05-17 1994-08-10 株式会社日立製作所 研磨装置
US5036630A (en) * 1990-04-13 1991-08-06 International Business Machines Corporation Radial uniformity control of semiconductor wafer polishing
JP2985490B2 (ja) * 1992-02-28 1999-11-29 信越半導体株式会社 研磨機の除熱方法
US5658183A (en) * 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
JP3749305B2 (ja) 1996-04-25 2006-02-22 不二越機械工業株式会社 ウェーハの研磨装置
US5873769A (en) * 1997-05-30 1999-02-23 Industrial Technology Research Institute Temperature compensated chemical mechanical polishing to achieve uniform removal rates
JP3741523B2 (ja) 1997-07-30 2006-02-01 株式会社荏原製作所 研磨装置
DE19748020A1 (de) * 1997-10-30 1999-05-06 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
JPH11347935A (ja) 1998-06-10 1999-12-21 Ebara Corp 研磨装置

Also Published As

Publication number Publication date
JPH11216664A (ja) 1999-08-10
EP1053076A1 (de) 2000-11-22
JP3693483B2 (ja) 2005-09-07
WO1999038651A1 (en) 1999-08-05
KR100540774B1 (ko) 2006-01-10
KR20010022946A (ko) 2001-03-26
US6544111B1 (en) 2003-04-08

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Legal Events

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