EP1081759A3 - Kühleinheit - Google Patents

Kühleinheit Download PDF

Info

Publication number
EP1081759A3
EP1081759A3 EP00303110A EP00303110A EP1081759A3 EP 1081759 A3 EP1081759 A3 EP 1081759A3 EP 00303110 A EP00303110 A EP 00303110A EP 00303110 A EP00303110 A EP 00303110A EP 1081759 A3 EP1081759 A3 EP 1081759A3
Authority
EP
European Patent Office
Prior art keywords
heat
receiving unit
radiator
liquid coolant
heat receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00303110A
Other languages
English (en)
French (fr)
Other versions
EP1081759A2 (de
Inventor
Ryuuji Miyazaki
Masumi Suzuki
Minoru Hirano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of EP1081759A2 publication Critical patent/EP1081759A2/de
Publication of EP1081759A3 publication Critical patent/EP1081759A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Projection Apparatus (AREA)
EP00303110A 1999-09-03 2000-04-13 Kühleinheit Withdrawn EP1081759A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25079699A JP3964580B2 (ja) 1999-09-03 1999-09-03 冷却ユニット
JP25079699 1999-09-03

Publications (2)

Publication Number Publication Date
EP1081759A2 EP1081759A2 (de) 2001-03-07
EP1081759A3 true EP1081759A3 (de) 2003-08-27

Family

ID=17213185

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00303110A Withdrawn EP1081759A3 (de) 1999-09-03 2000-04-13 Kühleinheit

Country Status (3)

Country Link
US (3) US6564861B1 (de)
EP (1) EP1081759A3 (de)
JP (1) JP3964580B2 (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3964580B2 (ja) * 1999-09-03 2007-08-22 富士通株式会社 冷却ユニット
JP2002198675A (ja) * 2000-12-26 2002-07-12 Fujitsu Ltd 電子機器
GB2389174B (en) * 2002-05-01 2005-10-26 Rolls Royce Plc Cooling systems
US7209355B2 (en) 2002-05-15 2007-04-24 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
JP4032954B2 (ja) * 2002-07-05 2008-01-16 ソニー株式会社 冷却装置、電子機器装置、音響装置及び冷却装置の製造方法
JP4214881B2 (ja) * 2003-01-21 2009-01-28 三菱電機株式会社 気泡ポンプ型熱輸送機器
CN1326237C (zh) * 2003-09-04 2007-07-11 珍通科技股份有限公司 圆管型散热器结构
DE20314532U1 (de) * 2003-09-16 2004-02-19 Pries, Wulf H. Vorrichtung zur Ableitung von Wärme von elektronischen und elektrischen Bauelementen
US7941993B2 (en) * 2003-10-14 2011-05-17 Rolls-Royce Plc Engine cooling
GB0323993D0 (en) * 2003-10-14 2003-11-19 Rolls Royce Plc Engine cooling
CN1902754B (zh) * 2003-12-08 2010-05-26 诺伊斯利米特公司 带有气泡泵的冷却系统
EP1607707A1 (de) * 2004-06-18 2005-12-21 Ecole Polytechnique Federale De Lausanne (Epfl) Blasengenerator und Wärmetauschervorrichtung
EP1836449A1 (de) * 2005-01-03 2007-09-26 Noise Limit ApS Mehrausrichtungskühlsystem mit einer blasenpumpe
US20070119572A1 (en) 2005-11-30 2007-05-31 Raytheon Company System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements
US20070119568A1 (en) 2005-11-30 2007-05-31 Raytheon Company System and method of enhanced boiling heat transfer using pin fins
JPWO2007086418A1 (ja) * 2006-01-26 2009-06-18 株式会社小松製作所 流体の冷却装置
US20080283221A1 (en) * 2007-05-15 2008-11-20 Christian Blicher Terp Direct Air Contact Liquid Cooling System Heat Exchanger Assembly
US9074825B2 (en) 2007-09-28 2015-07-07 Panasonic Intellectual Property Management Co., Ltd. Heatsink apparatus and electronic device having the same
US20090323276A1 (en) * 2008-06-25 2009-12-31 Mongia Rajiv K High performance spreader for lid cooling applications
JP5757086B2 (ja) 2008-10-29 2015-07-29 日本電気株式会社 冷却構造及び電子機器並びに冷却方法
JP5412815B2 (ja) * 2008-12-04 2014-02-12 富士通株式会社 冷却ジャケット、冷却ユニット、冷却システム及び電子機器
ATE554643T1 (de) * 2009-08-05 2012-05-15 Abb Research Ltd Verdampfer und kühlkreis
CN102869943A (zh) * 2010-05-19 2013-01-09 日本电气株式会社 沸腾冷却装置
WO2012060461A1 (ja) * 2010-11-02 2012-05-10 日本電気株式会社 冷却装置及びその製造方法
WO2012115214A1 (ja) * 2011-02-22 2012-08-30 日本電気株式会社 冷却装置及びその製造方法
JP5809835B2 (ja) 2011-04-14 2015-11-11 ニチアス株式会社 切断装置
JP5618419B2 (ja) 2011-06-13 2014-11-05 株式会社日立製作所 沸騰冷却システム
JP5252059B2 (ja) * 2011-10-11 2013-07-31 パナソニック株式会社 冷却装置
US20130118715A1 (en) * 2011-11-10 2013-05-16 Troy W. Livingston Heat transfer system applying boundary later penetration
JP2013247148A (ja) * 2012-05-23 2013-12-09 Toshiba Corp 自然循環型冷却装置
US20160377356A1 (en) * 2015-06-25 2016-12-29 Asia Vital Components Co., Ltd. Flexible and transformable water-cooling device
CA2998897C (en) * 2017-03-24 2021-02-23 James W. Dobson Passive heat recovery or defrosting device using a closed loop heat transfer circuit
US10966348B2 (en) * 2017-04-04 2021-03-30 Mitsubishi Electric Corporation Semiconductor cooling device, power control system and travelling body including a semiconductor colling device with microbubble generator
US10813246B2 (en) * 2017-10-23 2020-10-20 Asia Vital Components (China) Co., Ltd. Chassis heat dissipation structure
TWI685638B (zh) * 2018-09-14 2020-02-21 財團法人工業技術研究院 立體脈衝式熱管、立體脈衝式熱管組和散熱模組
CN109378301B (zh) * 2018-10-10 2020-08-25 江门市久欣光电有限公司 一种芯片封装体及制备方法
CN115087300A (zh) 2021-03-12 2022-09-20 华为技术有限公司 一种集气装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1028363A (en) * 1962-01-17 1966-05-04 Chausson Usines Sa The cooling of semi-conductor devices
FR2547906A1 (fr) * 1983-03-24 1984-12-28 Uop Inc Bande a surface amelioree d'ebullition germinee et dispositif de refroidissement de composants electroniques
EP0298372A2 (de) * 1987-07-10 1989-01-11 Hitachi, Ltd. Halbleiter-Kühlungsapparat
EP0456508A2 (de) * 1990-05-11 1991-11-13 Fujitsu Limited Kühlungsmittel vom Eintauchungstyp und elektronische Anordnung mit diesem Kühlungsmittel
US5106451A (en) * 1990-11-15 1992-04-21 International Business Machines Corporation Heat sink and method of attachment
US5203399A (en) * 1990-05-16 1993-04-20 Kabushiki Kaisha Toshiba Heat transfer apparatus
US5394936A (en) * 1993-03-12 1995-03-07 Intel Corporation High efficiency heat removal system for electric devices and the like
US5871043A (en) * 1994-09-06 1999-02-16 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant

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US3609991A (en) * 1969-10-13 1971-10-05 Ibm Cooling system having thermally induced circulation
JPS5723194B2 (de) * 1973-08-17 1982-05-17
JPS5512740B2 (de) * 1974-03-15 1980-04-03
JPS5241193B2 (de) * 1974-03-16 1977-10-17
JPS5812509B2 (ja) * 1975-09-20 1983-03-08 株式会社日立製作所 カイホウガタフツトウレイキヤクソウチ
JPS54128286A (en) * 1978-03-29 1979-10-04 Hitachi Ltd Boiling cooler
JPS5563397A (en) 1978-10-31 1980-05-13 Mitsubishi Electric Corp Manufacture of bolling heat transmission surface
JPS55118561A (en) * 1979-03-05 1980-09-11 Hitachi Ltd Constant pressure type boiling cooler
JPS6011838B2 (ja) 1980-03-13 1985-03-28 株式会社東芝 沸騰冷却装置
JPS5994445A (ja) * 1982-11-20 1984-05-31 Mitsubishi Electric Corp 自然循環式沸騰冷却装置
JPS60148588U (ja) * 1984-03-14 1985-10-02 株式会社東芝 冷蔵庫
JPS6131884A (ja) * 1984-07-24 1986-02-14 Kenji Okayasu 熱伝達装置
JPH02122554A (ja) 1988-10-31 1990-05-10 Mitsubishi Electric Corp 沸騰冷却装置
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US5219020A (en) * 1990-11-22 1993-06-15 Actronics Kabushiki Kaisha Structure of micro-heat pipe
US5289869A (en) * 1992-12-17 1994-03-01 Klein John F Closed loop feedback control variable conductance heat pipe
US5458189A (en) * 1993-09-10 1995-10-17 Aavid Laboratories Two-phase component cooler
JPH07127982A (ja) 1993-11-04 1995-05-19 Nippon Telegr & Teleph Corp <Ntt> 熱輸送パイプ
JP3385482B2 (ja) * 1993-11-15 2003-03-10 株式会社日立製作所 電子機器
US5634351A (en) * 1994-03-24 1997-06-03 Aavid Laboratories, Inc. Two-phase cooling system for a laptop computer lid
SE503322C2 (sv) 1995-03-17 1996-05-28 Ericsson Telefon Ab L M Kylsystem för elektronik
US5606341A (en) * 1995-10-02 1997-02-25 Ncr Corporation Passive CPU cooling and LCD heating for a laptop computer
US6104611A (en) * 1995-10-05 2000-08-15 Nortel Networks Corporation Packaging system for thermally controlling the temperature of electronic equipment
JPH09246411A (ja) 1996-03-04 1997-09-19 Iwate Toshiba Electron Kk 半導体マーキング方法及び半導体マーキング装置
JP3810119B2 (ja) 1996-03-07 2006-08-16 株式会社デンソー 沸騰冷却装置
US6173761B1 (en) * 1996-05-16 2001-01-16 Kabushiki Kaisha Toshiba Cryogenic heat pipe
JP3210261B2 (ja) 1996-12-06 2001-09-17 株式会社東芝 沸騰冷却装置及びその製造方法
US6005772A (en) * 1997-05-20 1999-12-21 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
TW331586B (en) * 1997-08-22 1998-05-11 Biing-Jiun Hwang Network-type heat pipe device
JP2911441B1 (ja) * 1998-04-03 1999-06-23 伊藤 さとみ ヒートパイプ及びその製造方法とそれを用いた放熱構造
JP3964580B2 (ja) * 1999-09-03 2007-08-22 富士通株式会社 冷却ユニット
US6820683B1 (en) * 2000-01-04 2004-11-23 Li Jia Hao Bubble cycling heat exchanger

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1028363A (en) * 1962-01-17 1966-05-04 Chausson Usines Sa The cooling of semi-conductor devices
FR2547906A1 (fr) * 1983-03-24 1984-12-28 Uop Inc Bande a surface amelioree d'ebullition germinee et dispositif de refroidissement de composants electroniques
EP0298372A2 (de) * 1987-07-10 1989-01-11 Hitachi, Ltd. Halbleiter-Kühlungsapparat
EP0456508A2 (de) * 1990-05-11 1991-11-13 Fujitsu Limited Kühlungsmittel vom Eintauchungstyp und elektronische Anordnung mit diesem Kühlungsmittel
US5203399A (en) * 1990-05-16 1993-04-20 Kabushiki Kaisha Toshiba Heat transfer apparatus
US5106451A (en) * 1990-11-15 1992-04-21 International Business Machines Corporation Heat sink and method of attachment
US5394936A (en) * 1993-03-12 1995-03-07 Intel Corporation High efficiency heat removal system for electric devices and the like
US5871043A (en) * 1994-09-06 1999-02-16 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant

Also Published As

Publication number Publication date
JP3964580B2 (ja) 2007-08-22
US7337829B2 (en) 2008-03-04
EP1081759A2 (de) 2001-03-07
US20030188858A1 (en) 2003-10-09
JP2001077256A (ja) 2001-03-23
US6564861B1 (en) 2003-05-20
US20080236797A1 (en) 2008-10-02
US7828047B2 (en) 2010-11-09

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