EP1108264A1 - Procede et dispositif de traitement de surface par plasma a pression atmospherique - Google Patents
Procede et dispositif de traitement de surface par plasma a pression atmospheriqueInfo
- Publication number
- EP1108264A1 EP1108264A1 EP99936688A EP99936688A EP1108264A1 EP 1108264 A1 EP1108264 A1 EP 1108264A1 EP 99936688 A EP99936688 A EP 99936688A EP 99936688 A EP99936688 A EP 99936688A EP 1108264 A1 EP1108264 A1 EP 1108264A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- gas
- treatment
- inter
- electrodes
- discharge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32018—Glow discharge
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/0203—Protection arrangements
- H01J2237/0206—Extinguishing, preventing or controlling unwanted discharges
Definitions
- the present invention relates to a method and a device for creating a homogeneous discharge at atmospheric pressure (non-filamentary) in a gas, in particular in nitrogen or in a nitrogen-based gas mixture, and its application in particular to surface treatment with plasma at atmospheric pressure or to the destruction of effluents.
- One of the applications is particularly interested in treatments making it possible to modify the surface characteristics of a polymer film, with a view for example to modifying its wettability or forming chemical bonds capable of improving the adhesion of a subsequent coating. .
- the surface to be treated is brought into contact with a plasma created by ionization of a treatment gas, so as to create excited chemical species and electrons, which can in particular collide with third-party species (especially neutral). These collisions can cause an energy transfer towards the species so as to form new chemically active species, in particular so-called “metastable” species, atomic species, radicals, ions and electrons. Long-lived chemically active species can in turn collide with third-party species, creating other active species and electrons.
- Active species can interact with the surface of a part in contact with the gas, which makes it possible to modify the surface characteristics of this part, on the one hand by creating new molecular structures capable of interacting with the molecules of a coating deposited subsequently, and on the other hand by modifying the morphology of the material and in particular the mobility of chains or chain segments in the case of polymers.
- the object of the invention is to overcome the drawbacks mentioned above, and to be able to propose a method for creating a homogeneous electric discharge in a gas, in particular in nitrogen or argon or else mixtures comprising l 'one of these gases or these gases, making it possible in particular to improve the surface treatment conditions by plasma at atmospheric pressure.
- the method according to the invention avoids the conditions of strong field and breakdown voltage typically characteristic of the filamentary mode, by making it possible to create and maintain between two discharges (ie between two alternations) sufficient quantities of metastable species and electrons, so that each discharge begins for a low value of the electric field (metastable species relaxing for example on contact with a third species by creating an electron and a ion of this third species itself or of the metastable species).
- the electrons are at the origin of avalanches which produce ions accelerated towards the cathode which cause the secondary emission of electrons at the cathode etc ...
- the process for creating a landfill according to the invention may also include one or more of the following characteristics, taken in isolation or in any technically possible combination:
- the supply voltage is between approximately 5 kV and 30 kV, with a more preferential implementation in the range from 10 kV to 25 kV, and the frequency of the voltage is between approximately 200 Hz and 35 kHz , with a preferential range less than or equal to 15 kHz;
- the initial gas is introduced into the inter-electrode space with a gas speed between 0 m / s and 10 m / s, with a preferred range less than or equal to 5m / s;
- the initial gas is introduced into the inter-electrode space with such a speed that on the inter-electrode path, the gas sees a number of discharges at least equal to 5, with a preferential range going from 5 to 300;
- the initial gas is introduced into the inter-electrode space with such a speed that on the inter-electrode path, the gas sees a number of discharges between 5 and 100;
- the initial gas is introduced into the inter-electrode space according to a substantially laminar gas regime
- the initial gas comprises one or more of the gases of the group consisting of nitrogen, the gaseous precursors of silicon, oxygen and the gases capable of releasing oxygen such as N 2 O, CO 2 , NO 2 , H 2 O
- the thickness of the gas space between the excitation electrodes is between approximately 0.5 and 5 mm;
- At least one of the electrodes is covered with a dielectric or semiconductor material (such as alumina, glass, polymer, etc.), the thickness of which is advantageously in the range from a few tens of microns to 1 cm, and preferably in the range from 500 microns to 2 mm;
- a dielectric or semiconductor material such as alumina, glass, polymer, etc.
- the dielectric or semiconductor material covering at least one of the electrodes being capable of generating species capable of de-energizing (relaxing) the active components (excited or unstable) of the gas, necessary for obtaining a homogeneous discharge, limits the proportion of said species capable of de-energizing the gas, by implementing one or more of the following measures: i) the initial gas comprises at least one component capable of interacting with said species capable of de-exciting, to neutralize their harmful action; j) controlling the power of the discharge, thus controlling the speed of generation of said species capable of de-excitation; k) the rate of renewal of the initial gas in the interelectrode space is controlled.
- the invention also relates to a device for creating an electrical discharge in a gas at atmospheric pressure, for the implementation of a method as defined above, comprising two excitation electrodes, a power source of the inter-electrode space into an initial gas and a voltage supply source connected to the excitation electrodes, characterized in that the voltage supply source is capable of delivering an alternating voltage adapted to cause the appearance of a discharge in the initial gas, and the amplitude and frequency of which are adapted to maintain at least a portion of the components of the gas in the excited state and / or the presence of electrons, between two successive alternations of the voltage.
- the invention also relates to a surface treatment process by plasma at atmospheric pressure, comprising the step of introducing a treatment gas into a treatment reactor in which is disposed a surface to be treated, between two excitation electrodes, and applying a supply voltage to the two electrodes so as to cause the appearance of an electric discharge in the treatment gas, this surface treatment method being characterized in that the supply voltage is an alternating voltage whose amplitude and the frequency are adapted to maintain at least a portion of the components of the treatment gas in the excited state and / or the presence of electrons, between two successive alternations of the supply voltage.
- the surface treatment method according to the invention may also include one or more of the following characteristics, taken in isolation or in any technically possible combination:
- the surface to be treated being capable of generating species capable of de-exciting (relaxing) the active components (excited or unstable) of the gas, necessary for obtaining a homogeneous discharge, the proportion of said species capable of de-exciting is limited gas, by the implementation of one or more of the following measures: i) the treatment gas comprises at least one component capable of interacting with said species capable of de-exciting, to neutralize their harmful action; j) controlling the power of the discharge, thus controlling the speed of generation of said species capable of de-excitation; k) the rate of renewal of the treatment gas in the inter-electrode space is controlled.
- the supply voltage is between approximately 5 kV and 30 kV, with a more preferential implementation in the range from 10 kV to 25 kV, and the frequency of the voltage is between approximately 200 Hz and 35 kHz , with a preferential range less than or equal to 15 kHz;
- the treatment gas is introduced into the inter-electrode space with a gas speed between 0 m / s and 10 m / s, with a preferred range less than or equal to 5m / s;
- the treatment gas is introduced into the inter-electrode space with such a speed that, on the inter-electrode path, the gas sees a number of discharges at least equal to 5, with a preferential range going from 5 to 300;
- the treatment gas is introduced into the inter-electrode space with such a speed that on the inter-electrode path, the gas sees a number of discharges between 5 and 100; - the treatment gas is introduced into the inter-electrode space according to a substantially laminar gas regime;
- the treatment gas comprises one or more gases from the group formed by nitrogen, the gaseous precursors of silicon, oxygen and the gases capable of releasing oxygen such as N 2 O, CO 2 , NO 2 , H 2 O - the thickness of the gas space between the excitation electrodes is between approximately 0.5 and 5 mm;
- At least one of the electrodes is covered with a dielectric or semiconductor material, the thickness of which is advantageously in the range from a few tens of microns to 1 cm, and preferably in the range from 500 microns to 2 mm;
- the dielectric or semiconductor material covering at least one of the electrodes being capable of generating species capable of de-energizing (relaxing) the active components (excited or unstable) of the gas, necessary for obtaining a homogeneous discharge, limits the proportion of said species capable of de-energizing the gas, by implementing one or more of the following measures: i) the treatment gas comprises at least one component capable of interacting with said species capable of de-energizing, to neutralize their harmful action; j) controlling the power of the discharge, thus controlling the speed of generation of said species capable of de-excitation; k) the rate of renewal of the treatment gas in the inter-electrode space is controlled.
- the invention also relates to a surface treatment device by plasma at atmospheric pressure, for the implementation of a surface treatment method as defined above, comprising a treatment reactor comprising two excitation electrodes between which may be arranged a part to be treated, a source of supply of the reactor with a treatment gas at atmospheric pressure, and a source of voltage supply connected to the excitation electrodes and being able to deliver a supply voltage to the latter, the device characterized in that the voltage supply source is capable of delivering an alternating voltage suitable for causing the appearance of a discharge in the treatment gas and the amplitude and frequency of which are capable of maintaining at least one portion of the components of the treatment gas in the excited state, and / or the presence of electrons, between two successive alternations of the supply voltage.
- the invention aims to be able to create, control, use homogeneous discharges, in particular in atmospheres based on nitrogen, or even argon, this at atmospheric pressure. It will of course be understood that it is possible, without departing from the scope of the present invention, to work at pressures of a few tens of millibars, or even a few hundred millibars around atmospheric pressure.
- FIG. 1 is a schematic sectional view of a surface treatment device according to the invention.
- FIG. 2 illustrates the variation of the maximum frequency and voltage to be supplied, depending on the speed of the process gas, to obtain a homogeneous discharge
- - Figure 3 shows the variation, as a function of time, of the current and of the supply voltage of the excitation electrodes, for a zero value of the speed of the treatment gas (absence of renewal of the atmosphere);
- - Figure 4 shows the variation, as a function of time, of the current and of the supply voltage of the excitation electrodes, for a gas speed equal to 1.5 m / s (with a gas space of 1 mm, an excitation frequency of 8 kHz and an amplitude of 12 kV);
- FIG. 6 shows curves illustrating the variation, as a function of the average power consumed in the discharge, of the angle formed by a drop of water in contact with a surface treated under nitrogen on the one hand by means of a process according to the invention and, on the other hand, by means of a filamentary discharge.
- FIG 1 there is shown schematically a surface treatment device by plasma at atmospheric pressure, designated by the general reference numeral 10. It is intended to generate a homogeneous discharge 12 by excitation of a treatment gas, in view of modifying the surface properties of a part to be treated 14.
- part to be treated 14 is constituted by a polymer film, for example polypropylene, but, of course, the invention also applies to the treatment of parts made of different materials.
- the reactor 16 is provided with a first orifice / injection system 18 in communication with a source of supply of process gas (not shown), as well as with an orifice gas exhaust 20.
- the treatment gas consists, for example, of nitrogen.
- the injection and evacuation orifices 18 are each provided with suitable means and of the conventional type making it possible to control the flow of gas inside the reactor 16.
- Two excitation electrodes, respectively 22 and 24, between which the part to be treated is disposed extend parallel to the interior of the reactor 16. They are for example each constituted by a metal disc, and are each connected to a source 26 of AC voltage supply, the applied voltage and excitation frequency of which can be adjusted within a predetermined range. They are also each carried by an adjustment bar, respectively 28 and 30, accessible from the outside of the reactor 16 so as to adjust the inter-electrode gas space according to a range of, for example, between approximately 0.5 and 5 mm. .
- Each electrode 22 and 24 is further covered with a layer, 32 and 34, of a dielectric or semiconductor material suitable for the intended use, for example alumina.
- the part 14 to be treated is, for the embodiment shown, placed on one of the excitation electrodes (i.e. on the material which covers one of the electrodes).
- the discharge 12 is obtained by excitation of the electrodes 22 and 24, by means of the power source 26.
- the supply voltage is fixed at a value between approximately 5 kV and 30 kV considered peak to peak, and the frequency of the excitation voltage supplied between the electrodes 22 and 24 is between approximately 200 Hz and 35 kHz, depending on the thickness the inter-electrode gas space, the flow of the treatment gas, as well as the composition of the treatment gas.
- the peak-to-peak value of the supply voltage adopted is advantageously close to 11 kV, the latter being advantageously equal to 24 kV when the inter-electrode distance is for example equal to 3 mm.
- the maximum value of the voltage V and of the excitation frequency F is defined as a function of the speed of the treatment gas.
- the part situated above the curves corresponds to an operation according to a filamentary discharge regime, while the part below each curve corresponds to an operating regime according to a homogeneous discharge.
- Curve A corresponds to the variation of the maximum frequency F as a function of the gas speed and curve B corresponds to the variation of the maximum supply voltage V as a function of the gas speed.
- the supply voltage is close to 11 kV.
- the maximum value of the excitation frequency is close to 11 kHz, while the supply voltage is close to 12.5 kV, always considered peak. crested.
- the curve of the current as a function of time has a single peak reflecting the existence of a unique transport of electrons and ions of one electrode to another. After the peak, the value of the current is very low but not zero, reflecting the maintenance in the excited state of at least a portion of the components of the gas. A new excitation, carried out under the action of the following alternation, takes place before the complete de-excitation of all the excited species contained in the gas.
- the metastable species relax for example in contact with a third species by creating an electron and an ion of this same third species or of the metastable species, and the electrons are at the origin of avalanches which produce ions accelerated towards the cathode thus causing the secondary emission of electrons to the cathode etc ...
- a treatment gas comprising nitrogen
- a treatment gas further comprising an oxidizing element, such as oxygen, or other element capable of releasing oxygen such as N 2 O, H 2 O, CO 2 , NO 2 , etc.
- an oxidizing element such as oxygen, or other element capable of releasing oxygen such as N 2 O, H 2 O, CO 2 , NO 2 , etc.
- FIGS. 3 and 4 having made it possible to visualize the spectacular result obtained according to the invention of a homogeneous discharge characterized by a single peak reflecting the existence of a unique transport of electrons and ions from an electrode to the 'other, we will note with satisfaction that in comparison, Figure 5 (comparative example) obtained under filamentary discharge conditions, presents unambiguously a current pattern corresponding to discharge micro-channels of a hundred microns in diameter developing randomly in space and time between the electrodes.
- FIG. 6 shows the variation, as a function of the average power consumed P in the discharge, of the contact angle ⁇ of a drop of water with the treated surface, characterizing the surface tension. Recall that the smaller the contact angle ⁇ , the more the drop of water spreads over the surface, and the greater the surface tension (we therefore generally look for small angles).
- the treatment gas consists of nitrogen, optionally mixed with an oxidizing element.
- a treatment gas comprising nitrogen or other carrier gas, and a gaseous precursor of silicon, for example monosilane (SiFL.), so as to create on the surface of the part chemical bonds suitable for depositing subsequent coatings, in particular of groups of the Si x O y or Si x O y H, type.
- a gaseous precursor of silicon for example monosilane (SiFL.)
- Such a treatment gas comprising a gaseous precursor of silicon could also advantageously comprise an oxidizing element so as not only to reduce the de-excitation of the excited species of the gas as mentioned above, but also to provide the oxygen necessary for the formation of Si x O y or Si x O y H t compounds containing oxygen atoms.
- the surface treatment method according to the invention can therefore aim to effect the deposition of a silicon-based material on the surface to be treated (deposit, moreover, continuous or not), the treatment gas then comprising a carrier gas such nitrogen or argon, a gaseous precursor of silicon, and oxygen or a gas capable of releasing oxygen.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9810814A FR2782837B1 (fr) | 1998-08-28 | 1998-08-28 | Procede et dispositif de traitement de surface par plasma a pression atmospherique |
| FR9810814 | 1998-08-28 | ||
| PCT/FR1999/001932 WO2000013202A1 (fr) | 1998-08-28 | 1999-08-04 | Procede et dispositif de traitement de surface par plasma a pression atmospherique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1108264A1 true EP1108264A1 (fr) | 2001-06-20 |
Family
ID=9529955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP99936688A Withdrawn EP1108264A1 (fr) | 1998-08-28 | 1999-08-04 | Procede et dispositif de traitement de surface par plasma a pression atmospherique |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6299948B1 (fr) |
| EP (1) | EP1108264A1 (fr) |
| JP (1) | JP2002524225A (fr) |
| AU (1) | AU5169699A (fr) |
| FR (1) | FR2782837B1 (fr) |
| WO (1) | WO2000013202A1 (fr) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW520453B (en) * | 1999-12-27 | 2003-02-11 | Seiko Epson Corp | A method to fabricate thin insulating films |
| FR2806324B1 (fr) * | 2000-03-15 | 2002-09-27 | Air Liquide | Procede et dispositif de mise en oeuvre d'une reaction chimique et procede de traitement de surface utilisant de tels procede et dispositif |
| EP1162646A3 (fr) * | 2000-06-06 | 2004-10-13 | Matsushita Electric Works, Ltd. | Appareil et méthode de traitement par plasma |
| US7510664B2 (en) | 2001-01-30 | 2009-03-31 | Rapt Industries, Inc. | Apparatus and method for atmospheric pressure reactive atom plasma processing for shaping of damage free surfaces |
| US7591957B2 (en) * | 2001-01-30 | 2009-09-22 | Rapt Industries, Inc. | Method for atmospheric pressure reactive atom plasma processing for surface modification |
| KR20030085017A (ko) * | 2001-03-21 | 2003-11-01 | 가부시키가이샤 브리지스톤 | 방오성도막의 형성방법 및 방오성도막을 구비한 방오재 |
| US6660177B2 (en) * | 2001-11-07 | 2003-12-09 | Rapt Industries Inc. | Apparatus and method for reactive atom plasma processing for material deposition |
| US6774569B2 (en) * | 2002-07-11 | 2004-08-10 | Fuji Photo Film B.V. | Apparatus for producing and sustaining a glow discharge plasma under atmospheric conditions |
| US7288204B2 (en) * | 2002-07-19 | 2007-10-30 | Fuji Photo Film B.V. | Method and arrangement for treating a substrate with an atmospheric pressure glow plasma (APG) |
| EP1403902A1 (fr) * | 2002-09-30 | 2004-03-31 | Fuji Photo Film B.V. | Procédé et dispositif de production d'un plasma de décharge luminescente sous pression atmosphérique |
| JP3973587B2 (ja) * | 2003-03-24 | 2007-09-12 | 俊夫 後藤 | 表面処理方法および表面処理装置 |
| FR2855322B1 (fr) * | 2003-05-21 | 2005-07-01 | Air Liquide | Dispositif de traitement de surface par zone d'un article |
| US7297892B2 (en) * | 2003-08-14 | 2007-11-20 | Rapt Industries, Inc. | Systems and methods for laser-assisted plasma processing |
| EP1548795A1 (fr) * | 2003-12-22 | 2005-06-29 | Fuji Photo Film B.V. | Verfahren und Vorrichtung zur Stabilisierung eines Glimmentladungsplasma unter atmosphärischen Bedingungen |
| JP4668208B2 (ja) * | 2003-12-22 | 2011-04-13 | フジフィルム マニュファクチャリング ユーロプ ビー.ブイ. | 大気圧グロープラズマを用いて基板表面から汚物を除去する方法及び装置 |
| WO2005105696A2 (fr) * | 2004-04-28 | 2005-11-10 | Saint-Gobain Vetrotex France | Procede de traitement de surface de fibres de renforcement |
| US8227051B1 (en) * | 2004-06-24 | 2012-07-24 | UT-Battle, LLC | Apparatus and method for carbon fiber surface treatment |
| US7313310B2 (en) * | 2005-05-25 | 2007-12-25 | Honeywell International Inc. | Plasma directing baffle and method of use |
| FR2893037B1 (fr) * | 2005-11-10 | 2012-11-09 | Saint Gobain Vetrotex | Procede de fonctionnalisation d'une portion de surface d'une fibre polymerique |
| JP4410771B2 (ja) * | 2006-04-28 | 2010-02-03 | パナソニック株式会社 | ベベルエッチング装置およびベベルエッチング方法 |
| US9288886B2 (en) | 2008-05-30 | 2016-03-15 | Colorado State University Research Foundation | Plasma-based chemical source device and method of use thereof |
| WO2009146439A1 (fr) | 2008-05-30 | 2009-12-03 | Colorado State University Research Foundation | Système, procédé et dispositif de formation de plasma |
| US8994270B2 (en) | 2008-05-30 | 2015-03-31 | Colorado State University Research Foundation | System and methods for plasma application |
| US9887069B2 (en) | 2008-12-19 | 2018-02-06 | Lam Research Corporation | Controlling ion energy distribution in plasma processing systems |
| GB2466664B (en) | 2009-01-06 | 2015-04-01 | Perlemax Ltd | Plasma microreactor apparatus, sterilisation unit and analyser |
| US8222822B2 (en) | 2009-10-27 | 2012-07-17 | Tyco Healthcare Group Lp | Inductively-coupled plasma device |
| EP2326151A1 (fr) * | 2009-11-24 | 2011-05-25 | AGC Glass Europe | Procédé et dispositif de polarisation d'une électrode DBD |
| JP2013529352A (ja) | 2010-03-31 | 2013-07-18 | コロラド ステート ユニバーシティー リサーチ ファウンデーション | 液体−気体界面プラズマデバイス |
| EP2552340A4 (fr) | 2010-03-31 | 2015-10-14 | Univ Colorado State Res Found | Dispositif à plasma à interface liquide-gaz |
| US9532826B2 (en) | 2013-03-06 | 2017-01-03 | Covidien Lp | System and method for sinus surgery |
| US9555145B2 (en) | 2013-03-13 | 2017-01-31 | Covidien Lp | System and method for biofilm remediation |
| US9831070B1 (en) | 2017-06-15 | 2017-11-28 | Enercon Industries Corporation | Surface treater with expansion electrode arrangement |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE68922244T2 (de) * | 1988-06-06 | 1995-09-14 | Japan Res Dev Corp | Verfahren zur Durchführung einer Plasmareaktion bei Atmosphärendruck. |
| JP2990608B2 (ja) * | 1989-12-13 | 1999-12-13 | 株式会社ブリヂストン | 表面処理方法 |
| JP3063769B2 (ja) * | 1990-07-17 | 2000-07-12 | イーシー化学株式会社 | 大気圧プラズマ表面処理法 |
| JP2840699B2 (ja) * | 1990-12-12 | 1998-12-24 | 株式会社 半導体エネルギー研究所 | 被膜形成装置及び被膜形成方法 |
| JP3149272B2 (ja) * | 1991-12-10 | 2001-03-26 | 幸子 岡崎 | 大気圧グロー放電プラズマのモニター方法 |
| FR2692598B1 (fr) * | 1992-06-17 | 1995-02-10 | Air Liquide | Procédé de dépôt d'un film contenant du silicium à la surface d'un substrat métallique et procédé de traitement anti-corrosion. |
| JP2572924B2 (ja) * | 1992-09-04 | 1997-01-16 | 醇 西脇 | 大気圧プラズマによる金属の表面処理法 |
| FR2704558B1 (fr) * | 1993-04-29 | 1995-06-23 | Air Liquide | Procede et dispositif pour creer un depot d'oxyde de silicium sur un substrat solide en defilement. |
| JPH08511898A (ja) * | 1993-05-28 | 1996-12-10 | ザ ユニバーシティ オブ テネシー リサーチ コーポレーション | ポリマー材の大気圧のグロー放電プラズマ処理方法および装置 |
-
1998
- 1998-08-28 FR FR9810814A patent/FR2782837B1/fr not_active Expired - Fee Related
-
1999
- 1999-04-09 US US09/288,610 patent/US6299948B1/en not_active Expired - Fee Related
- 1999-08-04 WO PCT/FR1999/001932 patent/WO2000013202A1/fr not_active Ceased
- 1999-08-04 AU AU51696/99A patent/AU5169699A/en not_active Abandoned
- 1999-08-04 JP JP2000568100A patent/JP2002524225A/ja not_active Withdrawn
- 1999-08-04 EP EP99936688A patent/EP1108264A1/fr not_active Withdrawn
-
2001
- 2001-09-18 US US09/954,040 patent/US20020037374A1/en not_active Abandoned
Non-Patent Citations (1)
| Title |
|---|
| See references of WO0013202A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US6299948B1 (en) | 2001-10-09 |
| WO2000013202A1 (fr) | 2000-03-09 |
| FR2782837B1 (fr) | 2000-09-29 |
| FR2782837A1 (fr) | 2000-03-03 |
| US20020037374A1 (en) | 2002-03-28 |
| AU5169699A (en) | 2000-03-21 |
| JP2002524225A (ja) | 2002-08-06 |
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