EP1114345A1 - Corps microstructure et son procede de production - Google Patents

Corps microstructure et son procede de production

Info

Publication number
EP1114345A1
EP1114345A1 EP99948779A EP99948779A EP1114345A1 EP 1114345 A1 EP1114345 A1 EP 1114345A1 EP 99948779 A EP99948779 A EP 99948779A EP 99948779 A EP99948779 A EP 99948779A EP 1114345 A1 EP1114345 A1 EP 1114345A1
Authority
EP
European Patent Office
Prior art keywords
substrate
microstructured
coating
cover
body according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99948779A
Other languages
German (de)
English (en)
Inventor
Hans Kragl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harting Elecktro Optische Bauteile GmbH and Co KG
Original Assignee
Harting Elecktro Optische Bauteile GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harting Elecktro Optische Bauteile GmbH and Co KG filed Critical Harting Elecktro Optische Bauteile GmbH and Co KG
Publication of EP1114345A1 publication Critical patent/EP1114345A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3696—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier by moulding, e.g. injection moulding, casting, embossing, stamping, stenciling, printing, or with metallic mould insert manufacturing using LIGA or MIGA techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N21/03—Cuvette constructions
    • G01N21/05—Flow-through cuvettes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N21/03—Cuvette constructions
    • G01N2021/0346—Capillary cells; Microcells
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures

Definitions

  • the invention relates to a microstructured body with a substrate and at least one cured coating applied to the substrate, which is microstructured and precisely positioned relative to the surface of the substrate.
  • the invention further relates to a method for producing such a microstructured body.
  • a microstructured body of this type can be produced in particular by means of impression techniques.
  • LIGA so-called LIGA
  • Impression molding is made with a geometrically inverse surface. From this molding tool, a plastic part can then be obtained with a plastic molding step, which is of the same shape as the microstructured master structure. To this
  • Manufacture plastic parts which are referred to below as the substrate.
  • microstructures can be produced, namely those structures which are formed by molding a suitably microstructured tool can be achieved in a single homogeneous material. In this way, for example, no forms with undercuts can be obtained.
  • the object of the invention is therefore to create a microstructured body in which the structures can be designed in a wide variety of ways, so that the most varied areas of application open up.
  • a further coating can be applied to the microstructured coating, which cooperates with the first coating and the microstructures molded in it in order to realize special functions.
  • This further coating can be precisely aligned relative to the substrate by means of a microstructured cover, which is positioned by means of the adjustment designs, so that a microstructured design can also be formed in the further coating, which is precisely aligned relative to the substrate.
  • micro-structured designs can now be formed which cannot be produced by structuring the substrate alone, since, for example, an undercut on the tool would be required.
  • the adjustment designs can also serve to precisely align further components relative to the substrate, for example a microchip.
  • the adjustment designs which can consist, for example, of the precisely cut outer edges of the substrate or of a groove which is formed in the surface of the substrate, serve for the precise positioning of the cover relative to the substrate and can optionally be used for the further adjustment of the finished component.
  • a microstructured surface or coating is understood here to mean a design which consists of different, flat or curved surfaces which are arranged three-dimensionally and at precise intervals and arrangements relative to one another, for example grooves, trenches, channels, cutouts, etc.
  • the coating consists of a material which differs in at least one physical property from the material of the substrate.
  • a waveguide can be formed.
  • the waveguide can be formed in that the surface of the substrate is coated with the suitable material in the liquid state and in that a micro-structured cover is then placed on the substrate.
  • This cover is pressed mechanically against the substrate and ensures that the microstructured designs which are to form the waveguide and which are formed on the substrate and / or the cover are molded in the coating.
  • the cover must be positioned precisely relative to the microstructured substrate so that the applied material is in the required places after the cover has been pressed on.
  • the still liquid material is then cured, for example by irradiation. Now the lid can be removed and the substrate with the applied, now hardened material remains, which in turn is microstructured. It is then possible, in further processing steps, to form further coatings on the microstructures obtained from the first coating.
  • the coating forms a waveguide, the waveguide at least / 17688 rL
  • the waveguide has a trapezoidal cross section and is arranged entirely on the surface of the substrate.
  • a waveguide with a trapezoidal cross section can be shaped particularly well, since on the one hand the liquid material displaced into the design, which is also microstructured with a trapezoidal cross section, fills this cross section better than a rectangular cross section, for example, and on the other hand there is no danger when the cover is lifted off that the side surfaces and edges of the
  • the waveguide can be damaged because the inclined side surfaces of the waveguide easily detach from the cover in the manner of bevels.
  • Waveguides are formed with a circular cross-section, with one half of the cross-section recessed in the substrate and the other half raised above the surrounding surface of the substrate. In this way, microstructured designs can be obtained, if only by a corresponding one
  • Design of the substrate would have to be preserved, would lead to undercuts that could not be molded. Only when a part of the cross section of the waveguide is molded in the coating does the undercuts disappear, so that a circular cross section can also be achieved, for example.
  • a groove is formed in the coating.
  • This groove can, for example, be a guide groove for an element to be coupled to the body.
  • This element for example a semiconductor chip designed as an optical transmitter or receiver, serves to supply signals to the microstructured body or to take signals from it. It is not necessary according to the invention to To take a picture of a groove serving to be coupled to the microstructured body during the manufacture of the substrate; the groove can later be formed at the desired location in a single step, for example simultaneously with the production of waveguides on the substrate.
  • the adjustment designs are arranged at least partially in spatial proximity to the microstructured coating. This results in increased accuracy in the production of the molded microstructures.
  • the position of the microstructures in the coating is in fact more precise relative to the microstructures of the substrate, the smaller the distances between the structures to be molded and the adjustment designs, since then any tolerances or possible material distortion are only very small
  • a method according to the invention for producing microstructured bodies contains the following steps: First, a substrate is produced which has alignment configurations. Then the
  • a lid with a microstructured surface is then placed on the substrate, the lid being provided with positioning configurations which are complementary to the adjustment configurations, so that the lid is arranged in a precisely defined position on the substrate, and with configurations by means of which the coating is microstructured.
  • the cover is then mechanically pressed onto the substrate, the microstructured surface of the cover being molded into the coating at least in some areas. Then the applied material is cured. Finally, the lid is removed from the substrate. This process opens up the possibility of obtaining microstructured designs that are adapted to the respective application.
  • the adjustment configurations together with the positioning configurations, enable the cover to be arranged precisely relative to the substrate, so that micro-structured configurations can be formed in the coating, which can lie precisely relative to micro-structures in the substrate.
  • the accuracy obtained thereby makes it possible to microstructures obtained in subsequent work steps to build up further microstructures.
  • the cover is microstructured in such a way that the applied coating is displaced from the areas to be structured when the cover is pressed on. In this way, recessed structures in particular can be molded. Then, in a further step, a second coating could be applied, which can be microstructured with a second lid.
  • the cover is microstructured in such a way that the applied coating is forced into the areas to be structured when the cover is pressed on. In this way, especially sublime
  • Structures are molded. With the required precision, these can also be formed on a substrate whose surface has certain unevenness. This lowers the cost of manufacturing the substrate, which does not have to be manufactured in all surface areas with the precision required for microstructured areas.
  • the body is formed by the hardened coating which is lifted off the substrate. This enables a microstructured
  • Material for the substrate nickel and as a coating material plastic is used. If additional microstructures are formed on the film in further work steps, this then in turn serves as a substrate.
  • FIG. 1 shows a substrate before coating with a material
  • FIG. 2 shows the substrate from FIG. 1 with an applied waveguide and a formed guide groove for an optical fiber that can be coupled to the waveguide;
  • FIG. 3 shows a substrate with a structured surface
  • FIG. 4 shows the substrate from FIG. 3 and a microstructured cover which can be placed thereon;
  • FIG. 5 shows a substrate and a lid similar to that of Figure 4, but with additional positioning and adjustment designs
  • FIGS. 6a to 6c a substrate and a cover, various materials being applied to the substrate;
  • FIGS. 7a and 7b show a substrate and a cover, a raised and recessed waveguide being formed on the substrate;
  • FIGS. 8a and 8b show a substrate and a cover similar to that of FIG. 7, an only raised waveguide being formed
  • FIGS. 9a to 9e a substrate and a cover, a shielded high-frequency conductor being formed;
  • FIGS. 10a and 10b show a substrate with a receiving opening for a chip;
  • FIGS. 11a to 11c show a substrate and a cover, by means of which a microstructured film can be produced
  • FIGS. 12a to 12d show a substrate and a cover, partial metallization being achieved on a material applied to the substrate;
  • FIG. 13 shows an electro-optical component that can be produced by partial metallization of a substrate
  • FIG. 14 shows an electro-optical component which is provided with a hollow channel through which a medium can flow
  • FIG. 15 is an optical component that can be used as a transceiver.
  • a substrate 10 is made. This can be done in particular by molding from a microstructured tool using a plastic material.
  • the substrate 10 can be provided with trenches 12 and grooves 14 (see FIG. 3) on its structured surface. Furthermore, the outer edges of the substrate 10 can be microstructured, for example precisely cut, in order to serve as adjustment designs 16.
  • An optical material 20 is applied in a liquid state to the structured surface of the substrate 10.
  • a cover 30 is then placed on the substrate 10 and the material 20 applied to it.
  • the cover 30 is also provided with a microstructured surface, for example with projections 32 which protrude into the trenches 12 of the substrate, and with edges 34 which form positioning designs and with the Adjustment designs 16 cooperate such that the cover 30 is precisely adjusted and positioned relative to the substrate 10.
  • the cover 30 is applied to the substrate 10 in the correct position, it is pressed mechanically against the latter.
  • the applied liquid material 20 is displaced from all the areas in which it is not desired.
  • the liquid material 20 is cured, for example by means of radiation.
  • the cover 30 is removed from the substrate 10.
  • the lid is often referred to as the "StripOff lid". After lifting the lid are the
  • Adjustment designs of the substrate are accessible again since they have not been contaminated with the liquid material.
  • microstructures contain, in particular, a waveguide 40 (see FIG. 2) and receptacles 42 for a schematically illustrated optical fiber 5, in each of which a guide groove 44 for the optical fiber 5 is formed.
  • optical fibers can now be arranged in the guide grooves 44 and glued there, so that they are coupled to the waveguide 40.
  • the guide groove for the optical fiber is only produced in the work step with which the material applied to the substrate is also microstructured; in this way, contamination or damage to the guide groove for the optical fiber is prevented.
  • the guide groove can in particular be produced with the same material that is also used for the waveguide and that is applied to the rest of the surface of the substrate. In this way, for example, a waveguide is produced in the structured surface of the body and a guide groove for an optical fiber that can be coupled to this waveguide in a single work step.
  • the positioning of the guide groove for the optical fiber relative to the waveguide takes place with high accuracy, since the structure for forming the guide groove is located in the material on the cover, by means of which the waveguide is also formed on the substrate.
  • FIG. 5 shows a substrate 10 with a microstructured surface, as is largely known from FIGS. 1 to 4.
  • an adjustment design 18 in the form of a groove with a V-shaped cross section is provided. This is near the grooves 14 for the formation of
  • the V-shaped groove 18 interacts with a positioning design 36 on the cover 30, which is designed as a projection with a V-shaped cross section. In this way, the accuracy of the positioning and adjustment of the cover 30 relative to the substrate 10 is increased. It is particularly advantageous if the
  • Adjustment design 18 and the positioning design 36 are arranged in the vicinity of surface structures of the substrate 10 and the cover 30, since tolerances due to material distortion etc. are reduced in this way. This makes it possible to precisely position functional elements, which are inserted into the recesses formed by means of the projections 32, relative to the waveguides.
  • a substrate 10 and a cover 30 are shown in FIGS. 6a to 6c, with the adjustment and positioning configurations 18, 36 making it possible to arrange the cover 30 in such a precise manner relative to the substrate 10 that in a first work step a first applied material is included Precise microstructures can be arranged and then a second material can be microstructured on the first material with the same accuracy.
  • first cover 30 which is provided with a projection 32
  • the first material 20 applied to the substrate 10 is microstructured in the trench 12 in such a way that a waveguide 40 with a precisely structured trench 46 is formed.
  • a second material 22 is applied, which is optical
  • This enables the construction of asymmetrical Waveguide systems, ie waveguide systems made of waveguides with different phase velocities, or waveguide structures for a taper arrangement.
  • the adjustment and positioning designs 18, 36 which are arranged much closer to the waveguides 40, 41 than the adjustment and positioning designs 16, 34, lead to particularly high accuracy.
  • Waveguide 40 with a circular cross section can be achieved.
  • a diameter of e.g. 0.5 mm still very filigree waveguide core is not self-supporting and therefore mechanically unstable, but is firmly glued to the substrate. This is a mechanically stable optical
  • a raised waveguide 40 with any undercut-free cross-section can also be achieved on the surface of the substrate.
  • Waveguides and the guide grooves for the optical fiber are designed as raised structures on the cover.
  • FIGS. 9a to 9e show how a shielded high-frequency conductor can be produced.
  • a metallic coating 50 is then applied to the microstructured surface of the substrate 10, which coating can optionally be reinforced galvanically or chemically.
  • a layer 48 which acts as a dielectric, is then formed in the trench 12 from a suitable first material by attaching the cover 30.
  • This layer is created using a Projection 32 on the cover 30 microstructured.
  • a renewed metallic coating 52 is applied, which is polished on the surface in a last working step, so that the second metallic coating 52 only remains in the area of the trench 12.
  • This coating can be galvanically or chemically reinforced in the same way as described above.
  • FIGS. 10a and 10b show a substrate 10, in which a waveguide 40 and a receiving opening 60 for an edge emitter laser diode 62 are formed by means of a microstructured cover. This is attached “up side down” to a heat sink 64.
  • the receiving opening 60 and the waveguide 40 can be produced by means of a suitably shaped cover so precisely in a microstructured coating applied to the substrate 10 that the laser diode 62 after insertion into the
  • Receiving opening 60 is exactly coupled to the waveguide 40. After the adjustment has been made, all components must be connected using a polymer adhesive correctly selected in the index in order to achieve a long-term stable construction.
  • FIGS. 11a to 11c show how a microstructured film 70 can be produced by means of a substrate 10 and a cover 30.
  • the substrate 10 and the cover 30 are provided with a microstructured surface such that a material 20 applied to the substrate 10 is shaped such that it contains, for example, optical lenses with bilateral lens curvature, Fresnell lenses or alignment structures.
  • a microstructured film 70 results, in which these components are realized.
  • Micro-structured mirrors can also be produced by metallic coating of certain surfaces. Local openings 72 in the otherwise continuous film are also possible.
  • FIGS. 12a to 12d show how a substrate 10, which is partially provided with the hardened, microstructured material 20, can be provided with a metallic coating.
  • a continuous metallic coating 80 is first applied.
  • the surface of the substrate 10 is then polished, so that the metallic coating 80 is removed at all those places where it is not below this polished surface. Since the polishing is also carried out on the material which is arranged in the grooves 14 and is later to serve as a waveguide, it must be carried out with the finest grain.
  • the metallic coating is very thin, so this is not a major problem.
  • the waveguide is later covered with a material of a very similar index, which reduces the influence of surface roughness.
  • the remaining metallic coating can be reinforced, for example galvanically, so that sufficiently high currents can flow in the electrical conductors 80.
  • the metallic partial surfaces are electrically contacted and placed in an electroplating bath.
  • the layer thickness of the galvanic reinforcement can be adjusted.
  • FIG. 12d it can be seen that the right partial coating surface 80 has a greater wall thickness than the left partial coating surface 80.
  • thermo-optically switchable Mach-Zehnder interferometer can be formed. This is shown in Figure 13.
  • a waveguide 40 is formed in the substrate 10 and branches into two interferometer arms 40 ′, 40 ′′.
  • a metallic coating with a thin wall serves as a heating conductor 82, while a metallic coating with a thick wall serves as a heat sink 84.
  • FIG. 14 shows a substrate 10 in which a schematically illustrated hollow groove 90 is formed.
  • a groove can be achieved, for example, by means of a suitably designed projection, which is provided on the cover and is molded as a microstructure in a material applied to the substrate.
  • the hollow groove extends very close to an optical waveguide 40 which is curved.
  • a closure member must be attached to the substrate 10 to create the hollow groove 90.
  • the material of the closure part must have a refractive index which is smaller than that of the waveguides 40, 41 in order not to interfere with the optical field guidance.
  • An optical sensor for the refractive index of the medium flowing in the hollow groove 90 is thus achieved.
  • the composition of a gas or a liquid mixture that flows continuously through the hollow groove 90 can be technically monitored. If a change in the composition of the flowing medium leads to a change in the index of the medium, the radiation from the continuous waveguide increases or decreases. The measurement of the light intensities in the optical fibers thus gives a measure of the refractive index of the medium.
  • an actuator function of the component is also possible.
  • Applying an electric field can change their index, for example liquid crystals, so can by an electric one
  • Output can be effected.
  • the component then functions as an optical one Switch.
  • Reflective liquids for example mercury, can also be used in the hollow groove 90.
  • FIG. 15 shows a substrate 10 in which a raised waveguide 40 with a large cross-section and a waveguide 41 with a smaller cross-section arranged in a recess are formed. Almost 100% of a light output coupled into the component by the optical fiber 5 is guided by means of the raised waveguide 40 to a photodetector symbolized by the arrow 97. At the same time, a light output that is emitted by a laser diode symbolized by arrow 98 can be coupled in via the thin waveguide 41 with little loss. In this way, a transceiver is formed which, despite the splitter design for incoming and outgoing signals, has less than 50% splinter loss.
  • the waveguide 40 can be designed as a raised and recessed microstructure or as only a raised microstructure, while the waveguide 41 is recessed, for example, in the manner of the waveguide shown in FIG.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un corps microstructuré comprenant un substrat (10) et au moins un revêtement qui est appliqué sur le substrat, durci, microstructuré et positionné avec précision par rapport à la surface du substrat (10). L'invention est caractérisée en ce que le substrat (10) est pourvu de formations d'ajustage (16, 18) destinées à un couvercle microstructuré (30) pouvant être posé sur le substrat (10). Après durcissement du revêtement, le couvercle est accessible de l'extérieur. Un procédé de production d'un tel corps microstructuré consiste tout d'abord à produire un substrat (10) qui présente des formations d'ajustage (16, 18), puis à recouvrir la surface du substrat (10) au moins partiellement d'une matière liquide (20). Ensuite, on pose sur le substrat (10) un couvercle (30) doté d'une surface microstructurée. Le couvercle (30) est pourvu de formations de positionnement (34, 36) qui sont complémentaires des formations d'ajustage (16, 18), ce qui permet de poser de façon exacte le couvercle sur le substrat (10). Le couvercle (30) est également pourvu de formations microstructurées à l'aide desquelles le revêtement est microstructuré. Ensuite, le couvercle (30) est mécaniquement pressé sur le substrat (10), la surface microstructurée du couvercle (30) étant au moins partiellement moulée dans le revêtement. Enfin, la matière appliquée (20) est durcie et le couvercle (30) est retiré du substrat (10).-
EP99948779A 1998-09-17 1999-09-16 Corps microstructure et son procede de production Withdrawn EP1114345A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE1998142694 DE19842694A1 (de) 1998-09-17 1998-09-17 Mikrostrukturierter Körper sowie Verfahren zu seiner Herstellung
DE19842694 1998-09-17
PCT/EP1999/006903 WO2000017688A1 (fr) 1998-09-17 1999-09-16 Corps microstructure et son procede de production

Publications (1)

Publication Number Publication Date
EP1114345A1 true EP1114345A1 (fr) 2001-07-11

Family

ID=7881337

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99948779A Withdrawn EP1114345A1 (fr) 1998-09-17 1999-09-16 Corps microstructure et son procede de production

Country Status (5)

Country Link
EP (1) EP1114345A1 (fr)
JP (1) JP2002525674A (fr)
CA (1) CA2344455A1 (fr)
DE (1) DE19842694A1 (fr)
WO (1) WO2000017688A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009120218A1 (fr) 2008-03-28 2009-10-01 Hewlett-Packard Development Company, L.P. Interconnexion optique flexible

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JPH049808A (ja) * 1990-04-27 1992-01-14 Omron Corp 光導波路と光ファイバとの結合構造およびその製造方法
DE4232608C2 (de) * 1992-09-29 1994-10-06 Bosch Gmbh Robert Verfahren zum Herstellen eines Deckels für eine integriert optische Schaltung
EP0598966B1 (fr) * 1992-11-24 1999-02-10 International Business Machines Corporation Isolateur optique pour guide d'onde
DE4300652C1 (de) * 1993-01-13 1994-03-31 Bosch Gmbh Robert Verfahren zur Herstellung einer hybrid integrierten optischen Schaltung und Vorrichtung zur Emission von Lichtwellen
US5343544A (en) * 1993-07-02 1994-08-30 Minnesota Mining And Manufacturing Company Integrated optical fiber coupler and method of making same
DE4410740A1 (de) * 1994-03-28 1995-10-05 Bosch Gmbh Robert Integriert optische Schaltung
DE4411860C2 (de) * 1994-04-06 1998-04-23 Fraunhofer Ges Forschung Verfahren zur Herstellung von dreidimensionalen Wellenleiterstrukturen
TW323341B (fr) * 1995-01-09 1997-12-21 Minnesota Mining & Mfg
DE19602232A1 (de) * 1996-01-23 1997-07-24 Bosch Gmbh Robert Integriert optische Schaltung und Verfahren zur Herstellung derselben
DE19606537A1 (de) * 1996-02-22 1997-08-28 Bosch Gmbh Robert Verfahren zur Herstellung einer Masterstruktur
JPH09243841A (ja) * 1996-03-14 1997-09-19 Yazaki Corp 光ジャンクションブロック
DE19619353A1 (de) * 1996-05-14 1997-11-20 Bosch Gmbh Robert Verfahren zur Herstellung eines integriert optischen Wellenleiterbauteiles sowie Anordnung

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Title
See references of WO0017688A1 *

Also Published As

Publication number Publication date
JP2002525674A (ja) 2002-08-13
DE19842694A1 (de) 2000-04-20
CA2344455A1 (fr) 2000-03-30
WO2000017688A1 (fr) 2000-03-30

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