EP1116552A3 - Machine de polissage avec dispositif de mesure d'épaisseur - Google Patents

Machine de polissage avec dispositif de mesure d'épaisseur Download PDF

Info

Publication number
EP1116552A3
EP1116552A3 EP01100187A EP01100187A EP1116552A3 EP 1116552 A3 EP1116552 A3 EP 1116552A3 EP 01100187 A EP01100187 A EP 01100187A EP 01100187 A EP01100187 A EP 01100187A EP 1116552 A3 EP1116552 A3 EP 1116552A3
Authority
EP
European Patent Office
Prior art keywords
polishing
substrate
polishing apparatus
measuring means
thickness measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP01100187A
Other languages
German (de)
English (en)
Other versions
EP1116552A2 (fr
EP1116552B1 (fr
Inventor
Norio Kimura
Hideji Isobe
Kazuo Shimizu
Hiroyuki Osawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of EP1116552A2 publication Critical patent/EP1116552A2/fr
Publication of EP1116552A3 publication Critical patent/EP1116552A3/fr
Application granted granted Critical
Publication of EP1116552B1 publication Critical patent/EP1116552B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP01100187A 2000-01-17 2001-01-17 Machine de polissage avec dispositif de mesure d'épaisseur Expired - Lifetime EP1116552B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000008393 2000-01-17
JP2000008393 2000-01-17

Publications (3)

Publication Number Publication Date
EP1116552A2 EP1116552A2 (fr) 2001-07-18
EP1116552A3 true EP1116552A3 (fr) 2004-01-02
EP1116552B1 EP1116552B1 (fr) 2007-04-18

Family

ID=18536670

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01100187A Expired - Lifetime EP1116552B1 (fr) 2000-01-17 2001-01-17 Machine de polissage avec dispositif de mesure d'épaisseur

Country Status (5)

Country Link
US (3) US6558229B2 (fr)
EP (1) EP1116552B1 (fr)
KR (1) KR100718737B1 (fr)
DE (1) DE60127884T2 (fr)
TW (1) TW471993B (fr)

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US6924641B1 (en) * 2000-05-19 2005-08-02 Applied Materials, Inc. Method and apparatus for monitoring a metal layer during chemical mechanical polishing
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US7025658B2 (en) * 2003-08-18 2006-04-11 Applied Materials, Inc. Platen and head rotation rates for monitoring chemical mechanical polishing
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JP2009129970A (ja) * 2007-11-20 2009-06-11 Ebara Corp 研磨装置及び研磨方法
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JP5615831B2 (ja) 2008-11-14 2014-10-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 縁部分解能強化渦電流センサ
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JP6033751B2 (ja) * 2013-10-07 2016-11-30 株式会社荏原製作所 研磨方法
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WO2018080764A1 (fr) 2016-10-28 2018-05-03 Applied Materials, Inc. Configuration de noyau à montants alternés pour système de surveillance d'induction électromagnétique in situ
TWI816620B (zh) 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
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EP3691830A4 (fr) * 2017-10-04 2021-11-17 Saint-Gobain Abrasives, Inc. Article abrasif et son procédé de formation
TWI845444B (zh) 2018-04-03 2024-06-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
TWI828706B (zh) 2018-06-20 2024-01-11 美商應用材料股份有限公司 用於原位電磁感應監控的基板摻雜補償的方法、電腦程式產品及研磨系統
CN111886686B (zh) 2018-09-26 2024-08-02 应用材料公司 针对原位电磁感应监测的边缘重建中的基板掺杂的补偿
EP3948702A4 (fr) 2019-03-29 2023-07-26 Saint-Gobain Abrasives, Inc. Solutions de meulage de performance
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KR102732531B1 (ko) 2020-06-24 2024-11-21 어플라이드 머티어리얼스, 인코포레이티드 연마 패드 마모 보상을 이용한 기판 층 두께의 결정
WO2022010687A1 (fr) * 2020-07-08 2022-01-13 Applied Materials, Inc. Bague de retenue à commande magnétique à plusieurs dents
US11794302B2 (en) 2020-12-15 2023-10-24 Applied Materials, Inc. Compensation for slurry composition in in-situ electromagnetic inductive monitoring
CN115741448A (zh) * 2022-12-15 2023-03-07 安徽富乐德长江半导体材料股份有限公司 一种晶圆研磨厚度控制装置及系统

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Also Published As

Publication number Publication date
US6764381B2 (en) 2004-07-20
EP1116552A2 (fr) 2001-07-18
KR100718737B1 (ko) 2007-05-15
KR20010076286A (ko) 2001-08-11
US6984164B2 (en) 2006-01-10
DE60127884T2 (de) 2008-01-17
DE60127884D1 (de) 2007-05-31
US20010008827A1 (en) 2001-07-19
TW471993B (en) 2002-01-11
US20030171071A1 (en) 2003-09-11
US6558229B2 (en) 2003-05-06
US20040224613A1 (en) 2004-11-11
EP1116552B1 (fr) 2007-04-18

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