EP1116603A2 - Procédé de fabrication pour un matériau composite revêtu de métal - Google Patents
Procédé de fabrication pour un matériau composite revêtu de métal Download PDFInfo
- Publication number
- EP1116603A2 EP1116603A2 EP20010100585 EP01100585A EP1116603A2 EP 1116603 A2 EP1116603 A2 EP 1116603A2 EP 20010100585 EP20010100585 EP 20010100585 EP 01100585 A EP01100585 A EP 01100585A EP 1116603 A2 EP1116603 A2 EP 1116603A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- resin
- paper
- metal foil
- decorative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 51
- 239000002184 metal Substances 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000002131 composite material Substances 0.000 title claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000003825 pressing Methods 0.000 claims abstract description 14
- 239000002245 particle Substances 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 67
- 239000000123 paper Substances 0.000 claims description 40
- 239000011888 foil Substances 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 239000002023 wood Substances 0.000 claims description 22
- 239000011093 chipboard Substances 0.000 claims description 20
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 15
- 229920002678 cellulose Polymers 0.000 claims description 8
- 239000001913 cellulose Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 6
- 230000036961 partial effect Effects 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 2
- 229920006395 saturated elastomer Polymers 0.000 abstract 2
- 229920001187 thermosetting polymer Polymers 0.000 description 14
- 229920000877 Melamine resin Polymers 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 229920001568 phenolic resin Polymers 0.000 description 8
- 238000000576 coating method Methods 0.000 description 6
- 239000002655 kraft paper Substances 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 6
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 239000004640 Melamine resin Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 229920001807 Urea-formaldehyde Polymers 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000011120 plywood Substances 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 description 2
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- ZRYCRPNCXLQHPN-UHFFFAOYSA-N 3-hydroxy-2-methylbenzaldehyde Chemical compound CC1=C(O)C=CC=C1C=O ZRYCRPNCXLQHPN-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 241001136792 Alle Species 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229920002522 Wood fibre Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- -1 copper Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 230000019612 pigmentation Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000033458 reproduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002025 wood fiber Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C5/00—Processes for producing special ornamental bodies
- B44C5/04—Ornamental plaques, e.g. decorative panels, decorative veneers
- B44C5/0415—Ornamental plaques, e.g. decorative panels, decorative veneers containing metallic elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C5/00—Processes for producing special ornamental bodies
- B44C5/04—Ornamental plaques, e.g. decorative panels, decorative veneers
- B44C5/043—Ornamental plaques, e.g. decorative panels, decorative veneers containing wooden elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C5/00—Processes for producing special ornamental bodies
- B44C5/04—Ornamental plaques, e.g. decorative panels, decorative veneers
- B44C5/0469—Ornamental plaques, e.g. decorative panels, decorative veneers comprising a decorative sheet and a core formed by one or more resin impregnated sheets of paper
Definitions
- the intention can be immediately a paintable one To get product that no longer shows the typical particle board structure and therefore no longer needs to be processed before painting.
- the layer structure of the surface achieved in this way corresponds in principle to that a classic laminate, but because of the inherent rigidity of the Wood material is the substructure familiar from the laminate (mostly phenolic resin-soaked Kraft papers) kept weaker or, for low demands, can also be omitted.
- tempered plates can therefore be obtained by one in turn Base material obtained by a pressing process, i.e. Support body from wood raw materials (it can also be a blockboard, for example) or Wood fibers instead of gluing with a prefabricated laminate with the resin-impregnated, i.e., used in the manufacture of such a laminate. not hardened papers and put the whole thing again in a heatable Plate press brings and connects in one go.
- Base material obtained by a pressing process i.e. Support body from wood raw materials (it can also be a blockboard, for example) or Wood fibers instead of gluing with a prefabricated laminate with the resin-impregnated, i.e., used in the manufacture of such a laminate. not hardened papers and put the whole thing again in a heatable Plate press brings and connects in one go.
- the materials used to produce a layer structure usually exist one or more layers one with a thermosetting Resin-soaked carrier made of cellulose-containing material - usually paper, especially so-called kraft paper - and finally a resin-soaked decor carrier, which is usually also made of paper and either through the Pigmentation works alone or additionally printed with any pattern is. Phototechnical reproductions of wood grain are particularly popular as patterns.
- the coated wood materials obtained are, especially if they are are thin and the body is made of plywood, e.g. under the label Laminates commercially available.
- coated wood materials especially tempered Chipboards basically have the same structure as a laminate, but are made directly on the wood-based surface. They exist from a basic body from one or more layers of synthetic resin soaked carrier and an overlying decorative layer. Basic body and decorative layer are due to the joint curing under the influence of pressure and heat connected with each other.
- thermosetting curable phenol-formaldehyde (pre) condensate phenolic resin
- other thermosetting curable are purely technically Formaldehyde (pre) condensates such as melamine or urea resins are suitable.
- the decorative layer located above the base body generally consists of at least one layer of a support impregnated with light colored resin, wherein one mainly uses thermosetting as a binder because of the desired durability curable melamine resins or produced with the use of melamine Formaldehyde condensate used.
- Urea resins can also be used be, however, not very resistant to external influences such as moisture are.
- condensates and Pre-condensates refers to the formaldehyde resins used for impregnation already be produced by a condensation process that but is incomplete, so that a chemical is irreversible only during the pressing process networked three-dimensional network, i.e. a so-called thermoset.
- the Pre-condensation usually takes place with the escape of water and has with nothing to do with the production of the coating materials under consideration.
- the bumps are first processed by grinding, as with any commercially available chipboard.
- leveling layer namely the above-mentioned layer consisting of a base body made of one or more layers of a backing impregnated with synthetic resin and only then the decorative or metal foil, since otherwise even with a carefully sanded layer Chipboard the surface, as experts say "through telegraphed", ie the structure of the surface can be seen on the metal surface in the form of unevenness and possibly even a granular structure.
- the production of wood-based panels with metal surfaces by pressing in the heat is problematic because of the fundamental difference in material between the substructure and the metal foil.
- wood-based materials must always be coated with the same material on both surfaces so that they do not deform later should not be considered further, because this is common for all types of surface coating of a wooden body, as is already known from classic veneer technology .
- a cause could play a role that metal films neither moisture can still let through and therefore the moisture balance of the wood-based material together with the layer of condensable resin on top the coating with metal foils or films is disturbed.
- This explanation is meant to but in no way limit the invention.
- this is achieved by placing a support body on Wood base, especially a particle board, initially under pressure and heat a layer of one or more layers of resin-soaked compensating paper as well as optionally a resin-impregnated decorative paper and apply a metal foil provided with an adhesive to the plate thus coated and, again under pressure and heat, connects to the plate.
- Immediate subject matter of the invention is a method for producing metal-coated Composite materials with a supporting body made of a wooden material, in particular a chipboard, by pressing the support body under pressure and heat with a leveling layer based at least a resin-soaked compensating paper and at least one partial area the plate covering metal foil, which is characterized in that in in a first step the leveling layer and in a second step the metal foil in each case preferably without re-cooling under pressure and Heat can be applied.
- Recooling becomes an intentional one for the purposes of describing the invention Cooling of the entire plate press, i.e. the printing plates and the Allowances understood (especially of the press plates) between the individual work steps, e.g. by means of cooling water; the inevitable and slight cooling the press and its parts between the individual inventive Operations through the indoor air are not to be understood here.
- the compensation paper is usually one with a thermosetting curable Formaldehyde condensate (phenolic or melamine resin) impregnated paper, e.g. a kraft paper, but it can also be a so-called decorative paper act when less stringent requirements are placed on material quality become. Of course, on the other hand, you can use it to make a leveling layer multiple layers of resin-soaked paper can also be used.
- a thermosetting curable Formaldehyde condensate phenolic or melamine resin impregnated paper
- thermosetting resin impregnated decor paper over a leveling layer from a cheaper one Material is applied, e.g. if the metal foil is only a partial area of the total Surface covered and the uncovered part for reasons of the intended aesthetic effect remains visible.
- thermosetting Resin for the decorative paper is usually a melamine resin or a melamine containing urea resin used.
- the paper material can e.g. a cellulose paper but also ordinary, printable paper qualities are suitable.
- the decorative film and the metal foil can be stored temporarily outside the press, e.g. in the stack, whereby the heat is retained for a long time, but that is not required according to the invention.
- existing ones e.g. provided with a decorative layer or a machinable barrier layer Subsequently coat the chipboard with a metal foil.
- the heat / pressure treatment when applying the compensation paper and / or The decor paper can be broken off as soon as partial hardening takes place is, i.e. that an incompletely hardened leveling or decorative layer is already sufficient to carry out the invention, since when the metal foil is applied and their gluing to the substrate in any case further heating takes place, which may be an incomplete hardening cured resin in the leveling layer.
- Decorative laminate panels are known from DE-GBM 295 06 391, whose surface shows different effects side by side, i.e. the both Partial surfaces with a plastic surface as well as partial surfaces with a metallic Have surface. According to the teaching of the GBM script, this can Layer structure can also be part of a coated chipboard.
- Such special chipboard, metal-clad in parts, is very large Interest and are preferably produced according to the invention, which is a wide one Application can be safe, as already designed decorative Laminate panels together with appropriate particle board supports or similar e.g. in shop fitting and for representative rooms such as theater foyers, meeting rooms, Counter and check-in halls, restaurants, etc. processed become.
- a plate is obtained in the resin-bound plate Layer the metal foil so far that a superficial completely flat body results from the decorative elements side by side resin-bonded cellulose products and metallic surface.
- thermosetting phenolic resins which are in the form of (generally solvent-based) coatings applied to one side of the metal foil have been. After removing the solvent, they can be painted Metal foils are easily used according to the invention.
- thermosetting Adhesives are e.g. Pre-products that harden through exposure to heat and give polyurethane or epoxy after curing. It seems to be important that these are products that are in the curing process (Crosslinking) do not split off any water, as this may possibly result in the invention would affect desired success. From the specialist literature are for the permanent gluing of metals suitable means known to be Execution of the invention are suitable.
- At least one of the layers P and D is therefore present.
- the area ratio and the shape is determined only by aesthetic, not by technical reasons and can therefore take any values; e.g. between 50 and 100 percent of the surface metal and correspondingly 0 to 50 percent of the Surface be plastic.
- an overlay paper i.e. at least one layer of a cellulose-containing, also resin-bound, in essential transparent cover layer is applied, you get a special durable and color-intensive decorative surface, whereby the metal foil can be seen M not directly in the decor carrier D, but first in the overlay O is pressed.
- metal foils foils or thin sheets are practically all suitable for decorative purposes Suitable metals, e.g. copper, aluminum, Iron or its alloys, such as brass or stainless steel. They can be metallic bright or, depending on the decorative intent, also matt, galvanic with others Metals covered or otherwise superficially changed. Depending on the type of the metal used, the metal foil may be advantageous or even necessary to be provided with a protective layer. With aluminum, for example the oxide layer obtainable by anodic oxidation or a phosphate layer his. It may be appropriate to have surface-treated from the outset To use metal foils, which also have a decorative pattern (e.g. printed) or an otherwise processed - e.g. ground, have a brushed or etched surface. Furthermore, the entire surface the laminate, i.e. both the metal parts and the plastic parts, subsequently with a top layer, protective layer or similar be covered.
- a decorative pattern e.g. printed
- an otherwise processed - e.g. ground have a brushed or etched surface
- the metal-coated wood-based panel according to the invention is generally on its underside also provided with a layer structure, which in the structure of the Face side corresponds, but generally have no decorative layer and only serves as a so-called counter-pull layer, i.e. the inevitable Counteracts tensions caused by the coating of the face.
- the structure according to the invention can be according to the attached figure can be easily determined by looking at the molding in question cuts perpendicular to the surface, grinds if necessary and adds the layer structure appropriate magnification e.g. viewed with a magnifying glass.
- a particle board is generally used as the supporting body for the production of material boards according to the invention.
- urea resin-bonded, phenol resin-bonded or polyisocyanate-bonded chipboard can be used.
- Plywood panels, blockboards, hardboard and other wood-based materials are also suitable as support bodies, provided that they resist processing in a heatable panel press.
- leveling layer As a base material for the leveling layer, i.a. so-called Kraft paper used; Incidentally, paper is meant here in the broadest sense - others, paper-like, suitable carriers such as nonwovens, Fabrics or the like can be used.
- resins for the production of the leveling layer are generally Phenol formaldehyde condensates used. These resins are in the form of resin-soaked paper, initially as so-called pre-condensates present (called “resols” in the case of phenolic resins) which are flowable, i.e. thermoplastic are deformable and in the heat (above about 100 ° C), after which classical classification of the hardening states gradually into the insoluble and infusible "resitol" - and finally "resit" state.
- the paper backing for the decor layer and overlay are usually pure cellulose papers.
- a synthetic resin for the decorative layer is primarily melamine resin, i.e. a melamine-formaldehyde precondensate is suitable, that hardens in the heat like the phenolic resin with crosslinking.
- Suitable but are also other thermosetting resins such as urea resins (if it on e.g. Weather resistance is less important) as well as epoxy resins, polyester resins, Polyurethane resins or thermosetting acrylic resins.
- Funds can melt adhesive (thermoplastically processable Glue based e.g. of vinyl polymers) or thermosetting (heat-reactive) adhesives are used, the one have sufficient affinity for the metal surface (e.g. commercially available metal glue based on cresol formaldehyde condensates, which are in the form of paint films can be applied).
- adhesives are also largely customary.
- the compensation layer is applied to the chipboard in a conventional manner Plate press.
- the pressing pressure can e.g. be between 10 and 200 bar, which also depends on the performance of the press and is not specific to the invention is.
- the pressing temperature is generally between 100 and 200 ° C. For economic or technical reasons, it may be advisable during the The temperature and / or pressure decrease or increase during the hardening process allow. Because of the different reactivity of the commercially available resins a general time requirement for curing cannot be specified; if necessary to determine the best hardening time by a preliminary test.
- a layer of a kraft paper impregnated with 100% melamine resin (resin weight based on paper weight) with a paper weight of 80 g / m 2 is placed on a loading device of appropriate size, the ground and carefully dedusted particle board is placed on top of it, and then again Layer of kraft paper soaked with 100% melamine resin.
- the resulting stack is introduced into a press heated by pressurized water and exposed to a pressure of 30 bar for 30 seconds at a temperature of 1800C. The plate is then removed without recooling.
- the plate thus produced is fed to the press a second time.
- an aluminum foil with a layer of glue is placed, then the chipboard produced and finally an aluminum foil.
- This stack is fed back to the press and 30 seconds at 160 ° C and 30 bar pressed and removed without recooling. It has no surface defects on.
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2000101585 DE10001585A1 (de) | 2000-01-12 | 2000-01-12 | Verfahren zur Herstellung metallbeschichteter Verbundwerkstoffe |
| DE10001585 | 2000-01-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1116603A2 true EP1116603A2 (fr) | 2001-07-18 |
Family
ID=7627683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP20010100585 Withdrawn EP1116603A2 (fr) | 2000-01-12 | 2001-01-10 | Procédé de fabrication pour un matériau composite revêtu de métal |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP1116603A2 (fr) |
| DE (1) | DE10001585A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10252866B3 (de) | 2002-11-12 | 2004-04-29 | Kronotec Ag | Paneel und Verfahren zur Herstellung eines Paneels |
-
2000
- 2000-01-12 DE DE2000101585 patent/DE10001585A1/de not_active Ceased
-
2001
- 2001-01-10 EP EP20010100585 patent/EP1116603A2/fr not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| DE10001585A1 (de) | 2001-07-19 |
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| 18D | Application deemed to be withdrawn |
Effective date: 20030801 |