EP1120860B1 - Socle pour courant électrique - Google Patents

Socle pour courant électrique Download PDF

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Publication number
EP1120860B1
EP1120860B1 EP01100746A EP01100746A EP1120860B1 EP 1120860 B1 EP1120860 B1 EP 1120860B1 EP 01100746 A EP01100746 A EP 01100746A EP 01100746 A EP01100746 A EP 01100746A EP 1120860 B1 EP1120860 B1 EP 1120860B1
Authority
EP
European Patent Office
Prior art keywords
power semiconductor
contact area
semiconductor module
area
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP01100746A
Other languages
German (de)
English (en)
Other versions
EP1120860B8 (fr
EP1120860A3 (fr
EP1120860A2 (fr
Inventor
Gottfried Ferber
Reimund Pelmer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Europaische Gesellschaft fur Leistungshalbleiter mbH
Original Assignee
EUPEC GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUPEC GmbH filed Critical EUPEC GmbH
Publication of EP1120860A2 publication Critical patent/EP1120860A2/fr
Publication of EP1120860A3 publication Critical patent/EP1120860A3/fr
Application granted granted Critical
Publication of EP1120860B1 publication Critical patent/EP1120860B1/fr
Publication of EP1120860B8 publication Critical patent/EP1120860B8/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/515—Terminal blocks providing connections to wires or cables

Definitions

  • the invention relates to a power semiconductor module with a circuit arrangement on a substrate of a Base plate, at least one provided on the substrate Acceptance device for electric current and a Housing element.
  • an electrical variable preferably one Electricity, as far as possible loss and / or trouble-free to tap or transmit. Furthermore, should with her electrical quality also a good mechanical Be assured handling and stability.
  • band, area or plate-like prepared power take-off devices used.
  • These known current collection devices e.g. in Shape of a band, surface or plate-like terminal lug or tab, are also used to seal them e.g. to a To contact current and / or -abstagedes substrate.
  • To have these known acceptance devices for electrical Strom a first contact area, with which the Take-off device to a stromzu- or stromablocationder Area is mechanically and electrically contacted.
  • a second contact area which is then in use, i. also in the finished product, is electrically connected to a power source or sink.
  • For transmitting the electric current between the first Contact area and the second contact area is on Transmission range in the known acceptance devices designed for electric power.
  • Switching, transmission or acceptance modules - which hereinafter simply referred to as modules and also So-called diode modules or uncontrolled modules include should - for high currents known Acceptance devices on a flat and planar formed conductor substrate, in particular a DCB / AlN substrate, so soldered that they are essentially project vertically from the conductor substrate.
  • the appropriate housing must be suitable Having slots through which the known Threaded electrical power takeoff devices become. Due to its band or plate-like structure can damage the case when the case is slipped on Arrangement of the band or area-like acceptance devices for electric power of the conventional form e.g. by Kink or cancel.
  • US-A-5,984,692 discloses a compound chip for stacked circuit boards described which inserted between metallizations of these circuit boards is.
  • This connection chip is in its to the level of Circuit boards vertical direction slightly curved so as to intervene between the circuit boards to be provided that a reliable electrical Contact with the metallization is guaranteed.
  • the invention has for its object to provide a power semiconductor module, which can be used for the transmission and switching of high currents or load currents and which thereby has an increased mechanical stability.
  • the first and second contact areas can each as primary contact areas for current consumption and / or each as secondary contact areas for delivering electrical Current or an electrical size serve.
  • Acceptance device for electric current are in Transmission area at least a first conductor and a second conductor provided. It is very special Advantage that the at least two conductors of the Transmission range substantially the same geometric Have properties.
  • To the Others become one by the division of the current path Reduction of the self-inductance at the current tap or a reduction of the so-called module inductance in Installation of the current tap in a corresponding module causes.
  • the head of the Transfer area substantially plate-shaped and are formed in particular planar. Also with these Properties are particularly favorable Production conditions, but again on special Circumstances can be taken into account, what then one Deviation from planarity or training in Can make plate shape necessary.
  • a particularly simple arrangement results when the Head of the transmission area substantially rectangular are formed, each having a top edge area and / or a lower edge area provided on the ladders can be. It is also manufacturing technology too prefer that the head of the transmission area over their course a substantially constant Have strength. This also causes that in the Conductor course with regard to the conductor cross section None Ohmic vulnerabilities arise.
  • the second Contact area as a substantially plate-shaped, in particular planar, ladder is formed.
  • this has turn manufacturing advantages, also here on the standard techniques for forming and shaping more planar or partially planar or plate-shaped conductor can be used.
  • a particularly advantageous embodiment of the present acceptance device for electricity The fact that the top edge areas of the head of the Transmission area in each case with one of the Side edge regions of the conductor of the second contact region are connected to the head of the transmission area each side walls and the head of the second Contact area a cover plate or a top wall of a form jointly formed hollow profile. That's it particularly advantageous if the head of the Transmission area arranged in a given direction and the conductors of the second contact area are in one too this direction substantially vertical direction is arranged so that through the transmission area and the second contact area formed essentially a U-profile becomes.
  • the conductors of the transmission area can also be arranged in this way be that results in a total of a different profile shape, e.g. the profile of an O, or even such that the gap in the O or U profile still further, under circumstances parallel, heads of the transmission area and / or replenished.
  • the first Contact area conductor elements through which the Acceptance device with a conductor, in particular a Printed circuit board, on a substrate, in particular a DCB / ALN substrate, or the like, is contactable.
  • the Ladder elements formed resiliently or elastically deformable, by e.g. thermal expansion or mechanical Stresses during assembly, e.g. when putting on a Housing or to collect when contacting.
  • This can advantageousously, by providing expansion bends, be realized by folding or the like.
  • the symmetry of the electric power take-off device including the symmetry of the conductor elements of the first Contact area may have u.U. manufacturing advantages, because, especially when using a symmetric Acceptance device for electric current in the above mentioned switching or transmission modules, then also correspondingly symmetrical power supply or current-draining base substrates, e.g. in the form of appropriate Floor plates are carried out with a DCB / AlN substrate can. It is then only one type of Final inspection facilities or current collection to manufacture and on To keep camp.
  • the acceptance device for electric current in particular so the whole first contact area, transmission area and second Contact area, in one piece and in particular of one made of uniform material. Then you can in a prefabrication process, a corresponding number of Punching devices for electricity stamped out, prebent and preassembled, so that in this way and also a process that can be fed to the automation results.
  • Surface areas of the acceptance device in particular the first contact area and / or the second contact area, completely or selectively surface-finished, especially with silver, nickel, tin, tin-lead or like.
  • FIG. 1A shows a schematic side view of a Embodiment of the acceptance device 10 for electricity.
  • first contact area 1 which of a Conductor element 14a, b with multiple expansion or Contact sheets 15a, b formed include one of Ladders 3a, b formed transmission area 3 and then a second contact area 2.
  • the first Contact area 1 is connected to the transmission area 3 at the first end portion 4 connected, which of the lower edge thereof 12 is formed.
  • the second contact region 2 is connected to the Transmission area at the upper end portion of the fifth contacted, which is formed by the upper edges 11a, b.
  • FIG. 1B shows the embodiment of FIG. 1A in FIG Front view. From this view it can be seen that the lower end portions 4 and the upper end portions 5 of Transmission area 3 and accordingly the Bottom edge portions 12a, b and the top edge portions 11a, b the transmission area 3 bent or curved in the first contact area and the corresponding conductor elements 14a, b or in the second contact area 2 transition.
  • Fig. 1B From Fig. 1B it is also clear that the conductors 3a and 3b of the Transmission area 3 parallel and plate-shaped to each other are arranged and together with the head of the Transmission area 2 a hollow profile-like arrangement 6 with form a hollow profile interior 6a, which is not filled is.
  • the conductor elements 14a and 14b are symmetrical formed to each other and extend in one direction, which is approximately perpendicular to the surface of the conductors 3a and 3b of the Transmission area 3 are. Also essentially perpendicular to the surfaces of the conductors 3a and 3b of the Transmission area 3 is the conductor of the second Contact area 2 arranged.
  • the arrangement of the Embodiment of Fig. 1A - C is thus mirror-symmetrical to that shown in Fig. 1B Cutting plane Z.
  • Fig. 1C shows a plan view of the embodiment of Fig. 1A and 1B. Visible here are the side edges or Side edge portions 13a and 13b of the conductor of the second Contact area 2, which with the upper edges 11a and 11b of Head 3a and 3b of the transmission area 3 are connected. Centrally located in the head of the second transmission area 2 a circular bore 16 through which at a Mounting in a housing a fixture or a connection can be introduced.
  • Fig. 2A shows a partially sectioned side view, in which three electrical power takeoff devices 10 in a preliminary stage of a module 20 with its first Contact areas 1 on a substrate on a base plate 21 are pre-assembled by means of soldering.
  • the corresponding Substrate may be a DCB / AlN substrate or the like.
  • FIG. 2B shows the corresponding front view of FIG Pre-stage of the module 20 of Fig. 2A. Clearly visible the U-profile arrangement of the acceptance devices 10 on the substrate 22 and the base plate 21 of the module 20th
  • FIGS. 2C and 2D the arrangement of FIGS Acceptance devices 10 for electrical current in the module 20 as shown in FIGS. 2A and 2B also in schematic and partially cut side and front view shown but now on the arrangement of Figs. 2A and 2B a Housing element 23 has been placed so that the Inventive acceptance devices 10 for electrical Electricity except for the second contact areas 2 covered and thus mechanically protected.
  • FIG. 2C a sliding cover 24 is shown in FIG. 2C, which in the direction of arrow 25 in the housing 23 in such a way can be inserted, that the threaded portions 26 of the Thrust cover 24 just below the holes 16 (see Fig. 1C) in the second contact regions 2 of the acceptance devices 10 for electrical power come to the plant.
  • Fig. 2E shows the state of the module 20 after the Push cover 24 in the direction of arrow 25 of FIG. 2C in the housing 23 has been inserted and the threaded portions 26 below the holes 16 of the second contact areas 2 of Acceptance facilities 10 have come to the plant.
  • FIGS. 2C, 2E and 2F each a section in the housing 23 of the module 20 denotes in which are connections for control lines for receiving of control signals and corresponding tax and Switching elements for switching the routes between the various acceptance devices 10 are located.
  • the information in the range 27 contained control device depending on the appended Control signals a load current, which via the 1 in Fig. 2F designated module 10, depending on Switching state in area 27 either via the with 2 designated or designated by the 3 Acceptance device 10 for electric power output.
  • FIGS. 3A and B show analogies to FIGS. 1A and B.
  • FIG Example a conventional acceptance device 30 for Electric current from the prior art.
  • a first contact region 31 with resilient conductor elements 34a and 34b This is followed by Transmission area 33, which only one has single Stromleitweg formed on a single surface is.
  • Transmission area 33 which only one has single Stromleitweg formed on a single surface is.
  • a second closes Contact area 32 To the transmission area 33 of this conventional Current collection device 30, a second closes Contact area 32, wherein in the transition between Transmission area 33 and second contact area 32 a Material recess 35 is provided, through which the second Contact area 32 in the final assembly in a simplified way and Way can be bent into its final position, which by 90 ° rotated to that shown in Figs. 3A and B. Pre-assembly is formed.
  • the present acceptance device 10 for electric current a kinking or angling or Bending second contact areas during final assembly not necessary, and it is just another aspect by designing the acceptance device for electrical Power to facilitate simplified final assembly steps.
  • the geometric configuration of the present Acceptance device 10 for electricity allows a Interaction with housing elements, in particular with a so-called sliding cover 24 or the like, that - as the in Figures 2c to 2f is shown - an anchoring of hollow profile-like acceptance devices 10 for electrical Power in the sliding cover 24 after insertion of the sliding cover 24th can be done by simply snapping.
  • the present finished bent Power take-off devices with hollow profile provide massive Zu effetsquerroughe ready, so that an increased Current consumption with simultaneously reduced module inductance is possible.
  • the hollow profile or U-profile form realized by the Furthermore, a substantially elastic connection corresponding module substrates. Intended housing or Toppers prepare due to the corresponding large Openings in the housing facilitate assembly at the same time practical filling for appropriate Casting compounds.

Landscapes

  • Power Conversion In General (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Inverter Devices (AREA)

Claims (17)

  1. Module de puissance à semi-conducteurs comprenant :
    un agencement de circuits sur un substrat (22) d'une plaque de base (21),
    au moins un dispositif de réception (10) de courant électrique, prévu sur le substrat (22) et
    un élément de boítier (23),
    dans lequel le dispositif de réception (10) de courant électrique a respectivement une première et une deuxième zone de contact (1, 2), pour absorber et / ou délivrer du courant électrique et une zone de transmission (3), pour transmettre du courant électrique entre la première et la deuxième zone de contact (1, 2) avec une première et une deuxième zone d'extrémité (4, 5), lesquelles sont reliées avec la première ou avec la deuxième zone de contact (1, 2),
    dans lequel la deuxième zone de contact (2) forme à cet effet une plaque de recouvrement et la zone de transmission (3) des parois latérales, de telle sorte qu'un agencement (6) essentiellement de type à profil creux en forme de U est ainsi formé,
    dans lequel l'élément de boítier (23) est constitué, de sorte que le dispositif de réception (10) de courant électrique est recouvert et protégé à l'exception des deuxièmes zones de contact (2) et
    dans lequel l'élément de boítier (23) présente un couvercle à pousser (24), qui peut y être enfiché et par lequel des zones filetées (26) du couvercle à pousser (24), prévues à l'état inséré, prennent appui sous des trous (16), pratiqués dans la deuxième zone de contact (2).
  2. Module de puissance à semi-conducteurs selon la revendication 1, caractérisé en ce qu'un premier conducteur (3a) et un deuxième conducteur (3b) sont prévus dans la zone de transmission (3).
  3. Module de puissance à semi-conducteurs selon la revendication 2, caractérisé en ce que les conducteurs (3a, 3b) sont orientés essentiellement parallèlement entre eux.
  4. Module de puissance à semi-conducteurs selon l'une des revendications 2 ou 3, caractérisé en ce que les conducteurs (3a, 3b) présentent des propriétés géométriques essentiellement concordantes.
  5. Module de puissance à semi-conducteurs selon l'une des revendications 2 à 4, caractérisé en ce que les conducteurs (3a, 3b) sont constitués essentiellement sous forme de plaque et de manière plane.
  6. Module de puissance à semi-conducteurs selon l'une des revendications 2 à 5, caractérisé en ce que les conducteurs (3a, 3b) sont constitués essentiellement de manière rectangulaire avec respectivement une zone de bordure supérieure (11a, 11b) et une zone de bordure inférieure (12a, 12b).
  7. Module de puissance à semi-conducteurs selon l'une des revendications 2 à 6, caractérisé en ce que les conducteurs (3a, 3b) de la zone de transmission (3) présentent une épaisseur essentiellement constante sur leur tracé.
  8. Module de puissance à semi-conducteurs selon l'une des revendications précédentes, caractérisé en ce que la deuxième zone de contact (2) est constituée en tant que conducteur essentiellement en forme de plaque et plan.
  9. Module de puissance à semi-conducteurs selon la revendication 8, caractérisé en ce que le conducteur de la deuxième zone de contact (2) est constitué essentiellement en forme de rectangle, avec des zones de bordure latérales (13a, 13b).
  10. Module de puissance à semi-conducteurs selon l'une des revendications 2 à 9, en liaison avec la revendication 8, caractérisé en ce que les zones de bordure supérieures (11a, 11b) des conducteurs (3a, 3b) de la zone de transmission (3) sont reliées respectivement avec l'une des zones de bordure latérales (13a, 13b) du conducteur de la deuxième zone de contact (2), de telle sorte que les conducteurs (3a, 3b) de la zone de transmission (3) forment les parois latérales et les conducteurs de la deuxième zone de contact (2) : la plaque de recouvrement du profil creux.
  11. Module de puissance à semi-conducteurs selon l'une des revendications 2 à 10, en liaison avec la revendication 8, caractérisé en ce que les conducteurs (3a, 3b) de la zone de transmission (3) sont disposés dans une première direction et que le conducteur de la deuxième zone de contact (2) est disposé dans une direction essentiellement verticale par rapport à cette première direction, de sorte qu'un profil en U est formé essentiellement, par la zone de transmission (3) et par la deuxième zone de contact (2).
  12. Module de puissance à semi-conducteurs selon l'une des revendications précédentes, caractérisé en ce que la première zone de contact (1) présente des éléments conducteurs (14a, 14b), par lesquels le module de puissance à semi-conducteurs peut être mis en contact sur un conducteur, une carte à circuits imprimés, un substrat ou un substrat DCB / AlN.
  13. Module de puissance à semi-conducteurs selon la revendication 12, caractérisé en ce que les éléments conducteurs (14a, 14b) de la première zone de contact (1) sont constitués pour l'établissement mécanique d'un contact par brasage ou soudage.
  14. Module de puissance à semi-conducteurs selon l'une des revendications 12 ou 13, caractérisé en ce que les éléments conducteurs (14a, 14b) sont constitués, par le biais de coudes de dilatation, de manière déformable : à ressort ou élastique.
  15. Module de puissance à semi-conducteurs selon l'une des revendications 12 à 14, en liaison avec la revendication 2, caractérisé en ce qu'il est prévu respectivement dans la zone de bordure inférieure (12a, 12b) des conducteurs (3a, 3b) de la zone de transmission (3), respectivement au moins un élément conducteur (14a, 14b) de la première zone de contact (1).
  16. Module de puissance à semi-conducteurs selon l'une des revendications précédentes, caractérisé en ce que la première zone de contact (1), la zone de transmission (3) et la deuxième zone de contact (2) sont constituées en commun d'un seul tenant.
  17. Module de puissance à semi-conducteurs selon l'une des revendications précédentes, caractérisé en ce que les zones de surface de la première zone de contact (1) et / ou de la deuxième zone de contact (2) du module de puissance à semi-conducteurs, subissent une finition de surface complète ou sélective avec de l'argent, du nickel, de l'étain ou un alliage étain - plomb.
EP01100746A 2000-01-28 2001-01-12 Socle pour courant électrique Expired - Lifetime EP1120860B8 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10003696 2000-01-28
DE10003696A DE10003696A1 (de) 2000-01-28 2000-01-28 Abnahmeeinrichtung für elektrischen Strom

Publications (4)

Publication Number Publication Date
EP1120860A2 EP1120860A2 (fr) 2001-08-01
EP1120860A3 EP1120860A3 (fr) 2003-04-09
EP1120860B1 true EP1120860B1 (fr) 2005-04-13
EP1120860B8 EP1120860B8 (fr) 2005-06-08

Family

ID=7629023

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01100746A Expired - Lifetime EP1120860B8 (fr) 2000-01-28 2001-01-12 Socle pour courant électrique

Country Status (2)

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EP (1) EP1120860B8 (fr)
DE (2) DE10003696A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10255414B4 (de) 2002-11-28 2013-05-08 Zf Friedrichshafen Ag Proportional-Druckregelventil zur Regelung des Druckniveaus in einem Hydraulikkreis

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5588848A (en) * 1994-09-08 1996-12-31 Lucent Technologies Inc. Low inductance surface-mount connectors for interconnecting circuit devices and method for using same
DE29512634U1 (de) * 1995-08-05 1996-12-05 AEG Hausgeräte GmbH, 90429 Nürnberg Metallisches Stanzbiegeteil
KR0163707B1 (ko) * 1996-04-22 1998-12-15 김광호 고정구를 가진 컴퓨터 본체
DE19734306C1 (de) * 1997-08-08 1999-02-04 Mannesmann Vdo Ag Hochstromkontakteinrichtung
US6149443A (en) * 1997-09-26 2000-11-21 Qualcomm Incorporated Ground connection apparatus
JP4025885B2 (ja) * 1998-02-06 2007-12-26 協伸工業株式会社 コネクタチップ及びテーピングコネクタチップ

Also Published As

Publication number Publication date
DE50105869D1 (de) 2005-05-19
EP1120860B8 (fr) 2005-06-08
EP1120860A3 (fr) 2003-04-09
EP1120860A2 (fr) 2001-08-01
DE10003696A1 (de) 2001-08-09

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