EP1164574A1 - Transducteur lectroacoustique et procede de fabrication - Google Patents

Transducteur lectroacoustique et procede de fabrication Download PDF

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Publication number
EP1164574A1
EP1164574A1 EP00971825A EP00971825A EP1164574A1 EP 1164574 A1 EP1164574 A1 EP 1164574A1 EP 00971825 A EP00971825 A EP 00971825A EP 00971825 A EP00971825 A EP 00971825A EP 1164574 A1 EP1164574 A1 EP 1164574A1
Authority
EP
European Patent Office
Prior art keywords
curing
adhesive
magnet
frame
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00971825A
Other languages
German (de)
English (en)
Other versions
EP1164574A4 (fr
Inventor
Kazuro Okuzawa
Akira Fukushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of EP1164574A1 publication Critical patent/EP1164574A1/fr
Publication of EP1164574A4 publication Critical patent/EP1164574A4/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R13/00—Transducers having an acoustic diaphragm of magnetisable material directly co-acting with electromagnet
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K9/00—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers
    • G10K9/12—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated
    • G10K9/13—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers electrically operated using electromagnetic driving means
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K9/00—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers
    • G10K9/18—Details, e.g. bulbs, pumps, pistons, switches or casings
    • G10K9/22—Mountings; Casings

Definitions

  • the present invention relates to an electro-acoustic transducer for use in cellular phones and the like devices to make call sounds, etc.
  • a method of manufacturing the transducers is also contained in the invention.
  • FIG. 3 is a cross sectional view of a conventional electromagnetic type electro-acoustic transducer.
  • a conventional electro-acoustic transducer comprises:
  • the adhesive 6 is an epoxy resin.
  • the above described electromagnetic type electro-acoustic transducer generates sounds with the diaphragm 7, which vibrates when electric current is applied to a coil 3 from an external power supply source (not shown) via a terminal section (not shown).
  • An epoxy resin is used for the adhesive 6 as recited above.
  • epoxy resin adhesive 6 needs a long curing time to provide a sufficient adhesive strength. Therefore, during a production of the electro-acoustic transducers, the semi-assembled units have to be stored in an oven or the like heating apparatus for a duration of approximately one hour or more in order to heat-cure the epoxy resin.
  • the heat-curing process is a necking factor in automating a production line for the conventional electromagnetic type electro-acoustic transducers.
  • the manufacturing productivity could be improved by raising a heating temperature.
  • the adhesive 6 may evaporate and scatter in the high temperature.
  • the evaporation and scattering of adhesive 6 leads to a deteriorated adhesive strength.
  • the evaporated adhesive 6 scattered and deposited on the diaphragm 7 decreases a sound pressure.
  • the high temperature curing has not been employed in most of the manufacturing process.
  • the present invention relates to an electro-acoustic transducer for use in cellular phones and the like devices to make call sounds, etc.
  • the present invention also provides a method of manufacturing the electro-acoustic transducers.
  • the present invention aims to provide an electro-acoustic transducer with a stable quality and high productivity.
  • An electro-acoustic transducer of the present invention comprises:
  • the heat-curing and UV-curing adhesive used in the above-configured electro-acoustic transducer is processed with,
  • Another electro-acoustic transducer of the present invention comprises:
  • the UV-curing resin layer is cured by a UV irradiation, before the heat-curing adhesive is cured. This prevents the upward evaporation and scattering of the heat-curing adhesive that could occur during a later heat-curing process. As a result, a magnet can be bonded on a frame within a short time, and the manufacturing productivity is improved.
  • FIG. 1 is a cross sectional side view of an electromagnetic type electro-acoustic transducer in accordance with a first exemplary embodiment of the present invention.
  • an adhesive 6a coated in the form of a layer is a heat-curing and UV-curing adhesive that cures by heat within a shorter period of time as compared with an epoxy resin.
  • a frame 2 is integrally molded with a case 1 at the bottom.
  • a magnet 5 is provided on the frame 2 via the heat-curing and UV-curing adhesive 6a.
  • the heat-curing and UV-curing adhesive 6a is applied on at least one of the joining faces of the frame 2 and the magnet 5.
  • a diaphragm 7 is provided above the magnet 5, and a resonance case 8 is bonded on the case 1.
  • the above electro-acoustic transducer is assembled in following processes:
  • the electro-acoustic transducer of the first exemplary embodiment is assembled.
  • the crept out adhesive 6a is cured in the first step. Then, when it is heated at a high temperature, the adhesive 6a staying between the magnet 5 and the frame 2 is heat-cured bringing the two components into a firmly bonded state.
  • the crept out portion of the heat-curing and UV-curing adhesive 6a exposed out of the magnet 5 and the case 1 is cured in the first place by the UV light irradiation.
  • the cured portion works to suppress evaporation and scattering of the adhesive 6a during the heat-curing process.
  • the magnet 5 can be firmly bonded on the frame 2 within a short time, without inviting a deterioration in the adhesive strength.
  • the experiment compares the adhesive strength of the electro-acoustic transducer samples using the adhesive in the first embodiment and that of the electro-acoustic transducer samples using a conventional adhesive.
  • the samples in the first embodiment and the conventional samples were manufactured using adhesives of different type. After the magnet 5 is placed on the frame 2, UV light irradiation was applied on the samples in the first embodiment, while no UV light irradiation was applied on the conventional samples.
  • the adhesive strength was measured by pushing the magnet 5 from behind the bottom through a small hole provided in the frame 2, and a force when the magnet 5 separates from the frame 2 was recorded.
  • the method of measuring the adhesive strength remains the same for both of the samples, the first embodiment and the conventional.
  • Electro-acoustic transducer samples in embodiment 1 Conventional electro-acoustic transducer samples Adhesive strength 100N - 130N 90N - 110N
  • the adhesive strength with the electro-acoustic transducer samples in accordance with the first embodiment of the present invention is not inferior to that of the sample pieces of conventional electro-acoustic transducers in which a conventional epoxy resin was used.
  • the adhesive strength with the samples in the first embodiment is on a slight higher level, as compared with that of the samples using a conventional epoxy resin.
  • the higher adhesive strength seems to have been brought about by the adhesive 6a that has been entirely staying, without being scattered, in a gap between the magnet 5 and the case 1 to be cured.
  • the samples of electro-acoustic transducer manufactured in accordance with the present invention used in the above experiment 1 have been completed as the finished transducer samples by adding a diaphragm 7 and a resonance case 8 thereon.
  • the resonance case 8 is attached to the case 1 through an ultrasonic welding.
  • the conventional sample pieces were added with a diaphragm 7 and a resonance case 8 to be completed as the finished transducer samples.
  • Both of the sample transducers were measured with respect to the sound pressure characteristic, and then heated in an atmosphere of 260°C for 5 min.
  • the heating conditions, 260°C, 5 min. are based on a simulated reflow soldering of electro-acoustic transducers mounted on a circuit board of an appliance.
  • Electro-acoustic transducer samples in embodiment 1 Conventional electro-acoustic transducer samples Adhesive strength 60N - 80N 5N - 10N Change in sound pressure characteristic No change observed Changed due to the adhesive sputtered on the diaphragm (decreased by 10db - 15db)
  • the conventional adhesive 6 cured at a relatively low temperature in the conventional samples partly remains uncured, because of the low temperature applied thereto.
  • the uncured portion of adhesive 6 undergoes a high temperature, the portion evaporates to become a gas.
  • the evaporated gas escapes through the gaps between the magnet 5 and the case 1 as well as cracks and voids existing within the magnet 5, and it is deposited on the diaphragm 7 from the above.
  • An assumption with the adhesive 6a used in the sample electro-acoustic transducers in the first embodiment is that:
  • the exposed portion of adhesive 6a is cured in the first place by the UV light irradiation, sealing the gaps and the cracks and voids. This prevents the adhesive components from sticking on the surface of diaphragm 7. So, the adhesive can be cured at a high temperature, which was not allowed for the conventional electro-acoustic transducers. The high temperature curing shortens the curing time to an improved productivity in the production. This makes it possible to manufacture the electro-acoustic transducers on an automatic (mechanized) assembly line.
  • the electro-acoustic transducer in accordance with the first embodiment of the present invention where a heat-curing and UV-curing adhesive 6a is applied in between the magnet 5 and the frame 2, provides a new device structure that is suitable to the production at a high manufacturing efficiency. At the same time, a new method of manufacturing the transducers is provided by the present invention.
  • FIG. 2 is a cross sectional side view of an electromagnetic type electro-acoustic transducer in accordance with a second exemplary embodiment of the present invention.
  • the second embodiment is a modification of the electromagnetic type electro-acoustic transducer in the first embodiment.
  • the components identical to those in the conventional technology and to the first embodiment are represented by using the same reference numerals, and description on which are omitted.
  • a magnet 5 is placed on a frame 2 via a heat-curing adhesive 6b.
  • the heat-curing adhesive 6b is applied on at least one of the joining faces of the frame 2 and the magnet 5.
  • a UV-curing adhesive 6c is provided from above a case 1 including frame 2 and magnet 5.
  • a diaphragm 7 is placed on the UV-curing adhesive 6c provided on magnet 5, and a resonance case 8 is bonded on the case 1.
  • the electromagnetic type electro-acoustic transducers in the second embodiment have the above-described configuration, and are assembled according to the above processes.
  • the curing time can be made shorter with the above structure.
  • the electro-acoustic transducers in the second embodiment can be manufactured on an automatic (mechanized) assembly line, like those in the first embodiment.
  • a heat-curing adhesive 6b is used for bonding magnet 5 onto frame 2.
  • a self-curing adhesive for example an acrylic adhesive using a primer including a polymerization initiator, may be used instead for the purpose.
  • the electro-acoustic transducers in the second embodiment have the same advantage as that in the first embodiment, in that the sound generating characteristic in the present invention is hardly ill-affected by the heat of a reflow solder bath, which is used when mounting a transducer on a circuit board of an appliance.
  • the surface, the gaps and voids of the case and magnet among them are filled with UV-curing adhesive, and it is cured. Therefore, a possible evaporation and gas generation of the adhesive existing between the frame and the magnet to be caused by a heat applied in a later stage can be suppressed; hence, the influence therefrom on the diaphragm is eliminated. Furthermore, the curing time can be made shorter for an improved productivity.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Multimedia (AREA)
  • Electromagnetism (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
EP00971825A 1999-12-20 2000-11-07 Transducteur lectroacoustique et procede de fabrication Withdrawn EP1164574A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP36025599A JP2001177898A (ja) 1999-12-20 1999-12-20 電気音響変換器およびその製造方法
JP36025599 1999-12-20
PCT/JP2000/007813 WO2001046943A1 (fr) 1999-12-20 2000-11-07 Transducteur électroacoustique et procédé de fabrication

Publications (2)

Publication Number Publication Date
EP1164574A1 true EP1164574A1 (fr) 2001-12-19
EP1164574A4 EP1164574A4 (fr) 2006-07-19

Family

ID=18468598

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00971825A Withdrawn EP1164574A4 (fr) 1999-12-20 2000-11-07 Transducteur lectroacoustique et procede de fabrication

Country Status (5)

Country Link
EP (1) EP1164574A4 (fr)
JP (1) JP2001177898A (fr)
CN (1) CN1168067C (fr)
NO (1) NO20014027L (fr)
WO (1) WO2001046943A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100418215B1 (ko) * 2001-08-21 2004-02-11 주식회사 삼부커뮤닉스 박판 부저의 프레임 접착방법
KR101061226B1 (ko) 2009-07-01 2011-08-31 한국표준과학연구원 유도초음파 변환용 자기변형 트랜스듀서 모듈
CN112165680B (zh) * 2020-10-15 2021-12-28 梅州国威电子有限公司 一种固化均匀节能环保的受话器制造用紫外线固化装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5446032A (en) * 1977-09-19 1979-04-11 Matsushita Electric Ind Co Ltd Production of speaker
CA1194637A (fr) * 1982-04-26 1985-10-01 Charles R. Morgan Compositions a teneur de matiere thermoplastique durcissables a l'ultraviolet ou a chaud
EP0790752A4 (fr) * 1995-09-04 2004-10-06 Matsushita Electric Industrial Co Ltd Bruiteur
JPH09215091A (ja) * 1996-01-31 1997-08-15 Kyocera Corp 電磁型発音体
DE19705027C2 (de) * 1997-02-10 2002-09-19 Infineon Technologies Ag Verfahren zum Verkleben eines Bauelements mit einer Oberfläche
JP3470025B2 (ja) * 1997-11-27 2003-11-25 京セラ株式会社 発音体

Also Published As

Publication number Publication date
CN1168067C (zh) 2004-09-22
EP1164574A4 (fr) 2006-07-19
CN1341254A (zh) 2002-03-20
WO2001046943A1 (fr) 2001-06-28
NO20014027L (no) 2001-10-19
NO20014027D0 (no) 2001-08-17
JP2001177898A (ja) 2001-06-29

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