EP1182007A1 - Trägerplatte mit elastischem Ringelement - Google Patents

Trägerplatte mit elastischem Ringelement Download PDF

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Publication number
EP1182007A1
EP1182007A1 EP00307093A EP00307093A EP1182007A1 EP 1182007 A1 EP1182007 A1 EP 1182007A1 EP 00307093 A EP00307093 A EP 00307093A EP 00307093 A EP00307093 A EP 00307093A EP 1182007 A1 EP1182007 A1 EP 1182007A1
Authority
EP
European Patent Office
Prior art keywords
ring
abrasive
elastic ring
elastic
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00307093A
Other languages
English (en)
French (fr)
Inventor
Yasuhide c/o Fujikoshi Machinery Corp. Denda
Yoshio c/o Fujikoshi Machinery Corp. Nakamura
Yoshinobu c/o Fujikoshi Machinery Corp Nishimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Machinery Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp filed Critical Fujikoshi Machinery Corp
Priority to EP00307093A priority Critical patent/EP1182007A1/de
Publication of EP1182007A1 publication Critical patent/EP1182007A1/de
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies

Definitions

  • the present invention relates to an abrasive machine, more precisely relates to an abrasive machine, which includes: an abrasive plate having an abrasive face for abrading a work piece; a top ring mounted on a carrier plate, in which the work piece is adhered on a lower face, so as to press the work piece onto the abrasive face of the abrasive plate; a driving mechanism relatively moving the abrasive plate with respect to the top ring so as to abrade the surface of the work piece by the abrasive face of the abrasive plate.
  • an O-ring is provided on a lower face of the top ring, and a weight load is applied to the top ring so as to press the carrier plate onto the abrasive plate.
  • the inventor of the present invention invented an improved polishing machine.
  • the improved machine was disclosed in the Japanese Utility Model Gazette No. 4-40848.
  • the improved machine is shown in Fig. 4.
  • Fig. 4 wafers 20 are adhered on a lower face of a carrier plate 24.
  • the carrier plate 24 is pressed onto an upper polishing (abrasive) face of a polishing (abrasive) plate 10 by a top ring 30 so as to polish (abrade) lower faces of the wafers 20.
  • a circular contact section 31 is formed in the lower face of the top ring 30.
  • the contact section 31 is capable of pressing an outer edge of the carrier plate 24.
  • a pressing member 80 is provided to an inner center part of the top ring 30 so as to press a center part of the carrier plate 24.
  • the pressing member 80 can be relatively moved close to and away from the top ring 30 by a cylinder chamber 82, which is formed between the top ring 30 and the pressing member 80.
  • the pressing member 30 cannot be detached from the top ring 30.
  • a plurality of weights 40 are mounted on the top ring 30.
  • a fluid supplying unit 84 supplies a fluid to the chamber 82 so as to press the pressing member 80 toward the carrier plate 24.
  • weight loads which are applied to the outer edge and the center part of the carrier plate 24, can be adjusted and balanced while polishing the wafers 20. Namely, the weight load applying to the outer edge or the center part of the carrier plate 24 can be selectively made greater. Even if inner parts or outer parts of the wafers 20 are polished more, the wafers 20 can be uniformly polished by adjusting fluid pressure in the chamber 82. By adjusting the fluid pressure, the wafers 20 can be polished with high polishing accuracy.
  • a ring groove 86 is formed in a lower face of the circular contact section 31.
  • An O-ring 88 is fitted in the ring groove 86.
  • the O-ring 88 directly contacts an upper face of the carrier plate 24, and the weight load of the top ring 30 is applied to the carrier plate 24.
  • Ring grooves 87 are formed in a lower face of the pressing member 80, and O-rings 89 are respectively fitted in the ring grooves 87.
  • the O-rings 89 too directly contact the upper face of the carrier plate 24, and the weight load of the top ring 30 is applied to the carrier plate 24 via the pressing member 80.
  • the cylindrical chamber 82 is formed in the top ring 30 and the pressing member 80 can be slid. Namely, the structure must be complex.
  • the pressing member 80 is moved by a piston which is slid in the cylindrical chamber 82, so frictional resistance badly influences the action of the pressing member 80.
  • the O-ring 88 is fitted in the ring groove 86 of the contact section 81 of the top ring 30, but the O-ring 88 cannot actively adjust the weight load from the top ring 30.
  • the abrasive machine of the present invention comprises:
  • the fluid is supplied to the ring chamber.
  • the whole surface of the carrier plate can be uniformly pressed by the top ring and the elastic ring member. Therefore the surface of the work piece can be uniformly pressed onto the abrasive face of the abrasive plate, so that the surface of the work piece can be uniformly abraded and the abrading accuracy can be increased.
  • the fluid pressure in the chambers can be respectively adjusted.
  • the weight load applying to the carrier plate can be partially controlled, so that the abrading accuracy can be further increased.
  • the elastic ring member may be fixed by screws. With this structure, the elastic ring member, which has a simple shape, can seal securely.
  • the elastic ring member may have first fitting sections, which are formed along an inner edge and an outer edge, and the elastic ring member may be fixed by fitting the first fitting sections to second fitting sections, which are formed in the lower face of the top ring.
  • a plurality of the carrier plates may be provided on the abrasive plate with regular angular separations, and a plurality of the work pieces may be adhered on the lower face of each carrier plate with regular angular separations.
  • a couple of the elastic ring members may be coaxially provided, wherein the outer elastic ring member corresponds to outermost parts of the work pieces and the inner elastic ring member corresponds to innermost parts of the work pieces.
  • Fig. 1 is a sectional view of the abrasive machine of an embodiment of the present invention
  • Figs. 2A and 2B are partial sectional views showing actions of the abrasive machine.
  • the abrasive machine shown in Fig. 1 is a polishing machine, which is capable of simultaneously polishing a plurality of silicon wafers, which will be substrates of semiconductor devices.
  • An upper face of a polishing plate (abrasive plate) 10 is a polishing face (abrasive face) 12, which polishes wafers 20.
  • a polishing cloth is adhered on the upper face of the polishing plate 10 so as to form the polishing face 12.
  • the wafers 20 are adhered on a lower face 26 of a carrier plate 24. Lower faces 22 of the wafers 20 are pressed onto the polishing face 12 of the polishing plate 10. In the present embodiment, the wafers 20 are adhered on the lower face 26 of the carrier plate 24 by adhesive. Note that, the carrier plate 24 must have high flatness and hardness, so it is made of glass or ceramic.
  • a top ring 30 is mounted on the carrier plate 24 so as to apply weight load thereto.
  • the wafers 20, which have been adhered on the lower face 26 of the carrier plate 24 can be pressed onto the polishing face 12 of the polishing plate 10.
  • a plurality of weights 40 are piled on the top ring 30 so as to apply the weight load to the carrier plate 24 via the top ring 30.
  • a driving mechanism 80 relatively moves the polishing plate 10 with respect to the top ring 30, so that the lower faces 26 of the wafers 20 are polished by the polishing face 12 of the polishing plate 10.
  • the driving mechanism 80 includes: a rotary unit for rotating the polishing plate 10; and a holding unit for rotatably holding the top ring 30.
  • the relative movement is not limited to the rotation, it may be swing motion, reciprocative motion, orbital motion, etc..
  • a plurality of ring grooves 32 and 34 are coaxially formed in a lower face 31 of the top ring 30, which will contact an upper face 25 of the carrier plate 24.
  • the inner ring groove 32 and the outer ring groove 34 are formed, but number of the ring grooves is not limited to two. Three or more ring grooves may be formed.
  • a plurality of elastic ring members 52 and 54 are made of an elastic material.
  • the elastic ring members 52 and 54 are fixed on the lower face 31 of the top ring 30.
  • the elastic ring members 52 and 54 respectively cover and seal the ring grooves 32 and 34.
  • the elastic ring members 52 and 54 are capable of contacting the upper face 25 of the carrier plate 24.
  • the inner elastic ring member 52 covers and seals the inner ring groove 32;
  • the outer elastic ring member 54 covers and seals the outer ring groove 34.
  • the elastic ring members 52 and 54 are capable of expanding toward the upper face 25 of the carrier plate 24.
  • Contact sections 55 of the elastic ring members 52 and 54 contact the upper face 25 of the carrier plate 24.
  • the elastic ring members 52 and 54 are made of synthetic rubber. Further, other elastic materials and metallic bellows, which are capable of expanding toward the carrier plate 24, can be employed.
  • the elastic ring members 52 and 54 are fixed on the lower face 31 of the top ring 30 by fixing means 82, e.g., screws. By employing the fixing means 82, the elastic ring members 52 and 54 can securely seal the ring grooves 32 and 34 without being formed into specific forms.
  • shapes and structures of the elastic ring members 52 and 54 are not limited to the present embodiment. They are required to air-tightly or liquid-tightly seal the ring grooves 32 and 34 and be capable of expanding toward the carrier plate 24. Of course they must be fixed so as not to detach from the top ring 30.
  • the elastic ring members 52 and 54 respectively have first fitting sections 56 and 57.
  • the first fitting sections 56 and 57 are extended from an inner edge and an outer edge of each elastic ring member.
  • the first fitting sections 56 and 57 of each elastic ring member are capable of fitting into second fitting sections 36 and 37, which are formed in the lower face 31 of the top ring 30.
  • the elastic ring members 52 and 54 can be fixed to the lower face 31 of the top ring 30.
  • sectional shapes of the first fitting sections 56 and 57 are formed into dove tails; sectional shapes of the second fitting sections 36 and 37 are formed into dove tail grooves. With this structure, the first fitting sections 56 and 57 can be easily fitted into the second fitting sections 36 and 37 without detaching therefrom. Manufacturing efficiency and maintenance efficiency can be improved.
  • the elastic ring members 52 and 54 are formed into thin plates.
  • Tubular elastic rings whose outer faces can contact the upper face 25 of the carrier plate 24, may be employed as the elastic ring members.
  • inner spaces of the tubular elastic rings act as air bags.
  • a plurality of communicating paths 66 and 68 are respectively communicated to ring chambers 62 and 64.
  • the ring chamber 62 is formed between the ring groove 32 and the elastic ring member 52; the ring chamber 64 is formed between the ring groove 34 and the elastic ring member 54.
  • a plurality of fluid supplying units 72 and 74 are respectively communicated to the communicating paths 66 and 68 so as to respectively control fluid pressure in the ring chambers 62 and 64.
  • a distributor 70 is connected to mid parts of the communicating paths 62 and 64. By employing the distributor 70, fluid can be continuously supplied to the ring chambers 62 and 64 even if the top ring 30 is rotated.
  • the fluid supplying units 72 and 74 respectively include means for adjusting the fluid pressure.
  • the adjusting means may be provided to compressors of the fluid supplying units 72 and 74. Further, regulators may be respectively provided to the communicating paths 66 and 68 as the adjusting means.
  • air is used as the fluid, but liquid, e.g., water, oil, may be used as the fluid.
  • liquid e.g., water, oil
  • the abrasive machine is a so-called batch-type polishing machine.
  • a couple of the elastic ring members 52 and 54 are coaxially provided.
  • the outer elastic ring member 54 is provided to correspond to outermost parts of the wafers 20, which have been circularly provided on the carrier plate 24;
  • the inner elastic ring member 52 is provided to correspond to innermost parts of said wafers 20.
  • diameters of the elastic ring members 52 and 54 are defined on the basis of positions of the outermost parts and the innermost parts of the circularly arranged wafers 20.
  • the polishing machine further has: an elevator unit (not shown), which is capable of vertically moving the top ring 30 so as to feed and discharge the carrier plates 24, which hold the wafers 20 on the lower faces 26; the weights 40 for pressing the wafers 20 onto the polishing plate 10; and a slurry supplying unit (not shown).
  • an elevator unit (not shown), which is capable of vertically moving the top ring 30 so as to feed and discharge the carrier plates 24, which hold the wafers 20 on the lower faces 26; the weights 40 for pressing the wafers 20 onto the polishing plate 10; and a slurry supplying unit (not shown).
  • the load is applied to the wafers 20 via the top ring 30 and the carrier plates 24, but the means for applying load is not limited to the weights 40.
  • a hydraulic unit may be employed to press the top ring 30 toward the carrier plates 24.
  • the polishing machine of the present embodiment is the batch-type machine. But the present invention can be applied to abrasive machine for abrading one work piece.
  • Fig. 2A the carrier plate 24 is moved to the position shown so as to locate the wafers 20 at prescribed positions on the polishing face 12.
  • the top ring 30, on which the weights 40 are piled, is mounted on the carrier plate 24.
  • the pressurized fluid (the compressed air) is supplied to the ring chambers 62 and 64 by the fluid supplying units 72 and 74.
  • the fluid pressure is controlled on the basis of the weight of the top ring 30 and the weights 40.
  • the fluid pressure slightly expands the elastic ring members 52 and 54 toward the carrier plate 24, and the top ring 30 presses the carrier plate 24 via the elastic ring members 52 and 54.
  • the lower face 31 of the top ring 30 is slightly moved away from the polishing face 12 of the polishing plate 10. Namely, the fluid pressure in the ring chambers 62 and 64 are controlled to slightly move the top ring 30 upward.
  • the weight load is uniformly transmitted to every point of the elastic ring members 52 and 54 due to the Pascal's law.
  • the elastic ring members 52 and 54 can wholly uniformly press the carrier plates 24.
  • the elastic ring members 52 and 54 are usually made of synthetic rubber, so their frictional coefficient are great and the top ring 30 is rotated together with the carrier plates 24. On the other hand, friction between the lower faces 22 of the wafers 20 and the polishing face 12 of the polishing plate 10 are small, so that they are relatively slipped and the lower faces 22 of the wafers 20 can be polished.
  • the top ring 30 is not suspended.
  • the top ring 30 is merely mounted on the carrier plates 24. Therefore, the top ring 30 can be moved onto the polishing face 12 of the polishing plate 10 together with the carrier plates 24.
  • the top ring 30 is capable of wholly uniformly pressing the carrier plates 24 with the fluid and the elastic ring members 52 and 54, so that the lower faces 22 of the wafers 20 can be uniformly pressed onto the polishing face 12 of the polishing plate 10. Therefore, in spite of the simple structure, the wafers 20 can be uniformly polished with high polishing accuracy.
  • the elastic ring members 52 and 54 are provided to cover over the ring grooves 32 and 34, so they can be easily attached without ununiformly expanding.
  • the elastic ring members 52 and 54 are fixed on the lower face 31 of the top ring 30 by fixing the inner edges and the outer edges. With this structure, shift of the elastic ring members 52 and 54 can be prevented, so that the surfaces 22 of the wafers 20 can be stably polished.
  • Capacity of the ring chambers 62 and 64 can be small, so desired fluid pressure can be easily gained by supplying small amount of fluid to the ring chamber 62 and 64. Therefore, a quick responsible machine can be realized. Variation of the fluid pressure can be absorbed, so that the carrier plates 24 can be uniformly pressed.
  • the communicating paths 66 and 68 are respectively connected to the ring chambers 62 and 64, and the fluid supplying units 72 and 74 are respectively communicated to the communicating paths 66 and 68, so that the fluid pressure in the ring chambers 62 and 64 can be respectively controlled.
  • two ring chambers 62 and 64 are coaxially formed, so the fluid pressure in the inner ring chamber 62 and the fluid pressure in the outer ring chamber 64 can be independently controlled. Therefore, the weight load applying to the wafers 20 can be partially varied, and abrading conditions can be precisely controlled. Since the fluid pressure in the inner ring chamber 62 and the outer ring chamber 64 can be mutually differed, uneven polishing can be prevented.
  • the fluid pressure in the ring chambers 62 and 64 are controlled on the basis of various polishing conditions, e.g., temperature, so as to polish the wafers 20 with high flatness, high polishing accuracy, etc..
  • the wafers 20 are adhered onto the carrier plates 24 by an adhesive, e.g., wax, but they may be fixed onto the carrier plates 24 by water, vacuum means, etc..
  • an adhesive e.g., wax
  • the wafers 20 are polished as the work pieces, but the abrasive machine of the present invention may abrade other wafer-formed work pieces, e.g., glass wafers, crystal wafers.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP00307093A 2000-08-18 2000-08-18 Trägerplatte mit elastischem Ringelement Withdrawn EP1182007A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP00307093A EP1182007A1 (de) 2000-08-18 2000-08-18 Trägerplatte mit elastischem Ringelement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00307093A EP1182007A1 (de) 2000-08-18 2000-08-18 Trägerplatte mit elastischem Ringelement

Publications (1)

Publication Number Publication Date
EP1182007A1 true EP1182007A1 (de) 2002-02-27

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ID=8173198

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00307093A Withdrawn EP1182007A1 (de) 2000-08-18 2000-08-18 Trägerplatte mit elastischem Ringelement

Country Status (1)

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EP (1) EP1182007A1 (de)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4918869A (en) * 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
EP0847835A1 (de) * 1996-12-12 1998-06-17 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4918869A (en) * 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
EP0847835A1 (de) * 1996-12-12 1998-06-17 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben

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