EP1209206A1 - Résine de liaison réticulable, diluable dans l'eau - Google Patents

Résine de liaison réticulable, diluable dans l'eau Download PDF

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Publication number
EP1209206A1
EP1209206A1 EP20010125468 EP01125468A EP1209206A1 EP 1209206 A1 EP1209206 A1 EP 1209206A1 EP 20010125468 EP20010125468 EP 20010125468 EP 01125468 A EP01125468 A EP 01125468A EP 1209206 A1 EP1209206 A1 EP 1209206A1
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EP
European Patent Office
Prior art keywords
formaldehyde
epoxy
compounds
amount
groups
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP20010125468
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German (de)
English (en)
Other versions
EP1209206B1 (fr
Inventor
Willibald Dr. Paar
Roland Dr. Feola
Johann Gmoser
Michael Dr. Gobec
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Allnex Austria GmbH
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Solutia Austria GmbH
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Publication date
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Priority to AT01125468T priority Critical patent/ATE294843T1/de
Priority to DK01125468T priority patent/DK1209206T3/da
Publication of EP1209206A1 publication Critical patent/EP1209206A1/fr
Application granted granted Critical
Publication of EP1209206B1 publication Critical patent/EP1209206B1/fr
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Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/14—Block or graft polymers prepared by polycondensation of aldehydes or ketones on to macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Definitions

  • the invention relates to water-thinnable self-crosslinking at room temperature Binder.
  • binders of this type are required Baking temperatures around 190 ° C for crosslinking, whereby the films e.g. in your Salt spray resistance in no way meets the requirements of practice in the automotive industry become.
  • these products are networked, they are split off from Formaldehyde and amines, which can cause environmental pollution.
  • a big part the above modifications therefore serve less to improve the Film properties, as a reduction in the cleavage products. So in the case of Modification with half-blocked diisocyanates in DE-A 25 54 080 expressly indicated that the isocyanate groups contribute little to the crosslinking and only to capture released amines.
  • WO 83/00872 discloses cathodic electrodeposition paint binders, which by mixed condensation of partially de-functionalized epoxy resins and Phenolic resoles and simultaneous or subsequent reaction of the epoxy groups with primary or secondary amines can be obtained.
  • a major disadvantage with the Manufacturing these products lies in the need to manufacture what phenol resoles is known to take a considerable amount of time and is relatively large Amounts of phenol and saline wastewater results. If necessary in the resin Remaining salt residues can also interfere with electrical separation to lead.
  • cathodically depositable coating agents which by Mix and heat to at least 50 ° C from epoxy resin amine adducts and etherified Phenol-formaldehyde and / or aminoplast resins can be obtained.
  • a partial Condensation of the components is said to result in the emulsion stability of the protonated products Water, compared to mixtures of the components mentioned can be improved.
  • Epoxy resin amine adducts used in accordance with this reference are essentially tertiary amino groups, since the reaction takes place under conditions which lead to a largely complete reaction of the amino hydrogens. Because of their structure products of this type require baking temperatures of sufficient for crosslinking over 170 ° C.
  • reaction products of epoxy-amine adducts with Formaldehyde and those compounds that form condensation resins with formaldehyde can be formulated to form self-crosslinking binders.
  • the reaction is preferably carried out so that not a preformed one Formaldehyde condensation resin is reacted with epoxy-amine adducts, but that in the reaction mixture at the beginning of epoxy-amine adducts, formaldehyde resin and Formaldehyde or a formaldehyde source are available separately.
  • the invention therefore relates to water-dilutable binders which self-crosslink at room temperature and contain reaction products ABF of epoxy-amine adducts A and formaldehyde resin formers B, selected from phenols B1, (substituted) ureas B2, melamine B3, guanamines B4, and mixtures of the resin formers mentioned, with formaldehyde F or compounds which release formaldehyde under the reaction conditions, such as paraformaldehyde or trioxane.
  • Such binders are referred to as "water-dilutable” if - after partial neutralization - form stable mixtures with water that form when stored Do not macroscopically separate room temperature (20 ° C) for at least 4 weeks or sediment.
  • the epoxy-amine adducts A are obtained by reacting epoxy resins A1 with at least 2 epoxy groups per molecule and a specific epoxy group content SEG of 1000 to 5600 mmol / kg with aliphatic amines A2 with one to twenty, preferably 4 to 18 carbon atoms, which have at least one primary Contain amino group and optionally a further primary or tertiary amino group and optionally obtain a compound A3 with at least one carboxyl group or at least one secondary amino group.
  • the reaction is carried out in such a way that no epoxide groups can be detected in the reaction mixture after it has ended.
  • the epoxy resins A1 which can be used for the invention are commercially available di- or polyepoxide compounds, such as are obtained by reacting polyhydric phenols, in particular bisphenol A or phenol novolaks and epichlorohydrin. If necessary, other epoxy resins, for example those based on polyols, can also be used. Products of this type are known to the person skilled in the art and are described in large numbers in the literature. Epoxy resins based on bisphenol A or phenol novolaks with a specific epoxy group content SEG of 1.0 to 5.5 mol / kg ("epoxy equivalent weight" of 180 to 1000 g / mol) are preferably used for the process according to the invention.
  • Preferred amines A2 are primary monoalkylamines, in particular those whose alkyl radical has 4 or more carbon atoms or primary alkylene diamines or diamines which, in addition to the primary amino group, also have a tertiary amino group, for example a dialkylamino group.
  • Preferred representatives are n- or iso-butylamine, hexylamines, in particular n-hexylamine, 2-ethylhexylamine, ethylenediamine and its homologues, and primary tertiary diamines, such as dimethylaminopropylamine, diethylaminopropylamine and homologues from this series.
  • Mixtures of alkylamines or alkylenediamines and dialkylaminoalkylamines are particularly preferably used.
  • the modifiers A3 are selected from carboxyl compounds and compounds with at least one secondary amino group.
  • carboxyl group-containing adduct compounds of maleic anhydride with unsaturated oils and / or unsaturated hydrocarbon compounds whose anhydride groups have been opened with half-ester formation with monohydroxy compounds are used, the free carboxyl groups optionally being partially reacted with monoepoxide compounds. This modification can significantly improve the film surface and the flexibility of the films.
  • the carboxyl compounds of this type which are suitable for modifying the epoxy resin-amine adduct are obtained in a known manner by adding maleic anhydride to unsaturated oils, for example wood oil, linseed oil, dehydrated castor oil, soybean oil, sunflower oil and similar natural oils.
  • unsaturated oils for example wood oil, linseed oil, dehydrated castor oil, soybean oil, sunflower oil and similar natural oils.
  • synthetically produced hydroxyl-free esters of the fatty acids contained in the abovementioned oils or of the tall oil fatty acids with polyols can also be used as the starting material.
  • Unsaturated low molecular weight hydrocarbon polymers or oligomers for reaction with the maleic anhydride are preferably used as the polyene compound.
  • polybutadiene oils which are liquid oligomers of butadiene with different stereospecific structures or the corresponding oligomers of pentadienes or cyclopentadiene, it being possible to use mixed oligomers.
  • These compounds usually have molar masses (weight average M w ) between 400 and 3000 g / mol. Mixtures of these oligomers can of course also be used to form the adduct with the maleic anhydride.
  • the amount of maleic anhydride is chosen so that that made from it Carboxyl compound has an acid number of 30 to 130 mg / g, preferably 35 to 80 mg / g having.
  • the maleic anhydride adducts are used for the half-ester formation
  • Monohydroxy compounds implemented in a known manner at 50 to 150 ° C.
  • Monohydroxy compounds come with saturated or unsaturated monoalcohols with 1 up to 18 carbon atoms, such as methanol and its homologues, fatty alcohols, allyl alcohol and the like to the Commitment.
  • Glycol monoesters can also be used as monohydroxy compounds (Meth) acrylic acid, such as hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate and the other homologous and isomeric compounds can be used.
  • the unsaturated Monohydroxy compounds is advantageously the reaction in the presence of Inhibitors, such as hydroquinone.
  • One way to reduce the number of carboxyl groups in these half esters consists in the reaction of these half esters with monoepoxide compounds, such as esters of epoxidized fatty acids or glycidyl esters or ethers.
  • monoepoxide compounds such as esters of epoxidized fatty acids or glycidyl esters or ethers.
  • the glycidyl esters of KOCH acids especially those which are tertiary Carbon atom have at least two alkyl radicals with at least one carbon atom.
  • the compounds A2 are preferably used in an amount such that the ratio of the amount of amino groups in A2 to the amount of epoxy groups in A1 is 0.6: 1 to 1 : 1, and that the ratio of the sum of the amounts of the carboxyl groups and the secondary amino groups in the compounds A3 to the amount of the epoxy groups in A1 is preferably from 0: 1 to 0.4: 1.
  • the epoxy-amine adduct A is reacted with one or more compounds B and formaldehyde F or a compound which releases formaldehyde.
  • the amounts of formaldehyde resin formers B and formaldehyde F are preferably selected so that the ratio of the amount of the amine hydrogen atoms (NH groups) remaining in A to the amount of compounds B is 0.5: 1 to 1: 1, and that The ratio of the amount of formaldehyde to the amount of formaldehyde-reactive groups in B is 0.25: 1 to 0.9: 1, particularly preferably 0.6: 1 to 0.8: 1.
  • the present invention furthermore relates to a process for the preparation of the ABF products , the reaction of components A1, A2 and optionally A3 taking place at a temperature of 50 to 120 ° C. until no more epoxy groups can be detected.
  • the epoxy-amine adduct A is reacted together with the formaldehyde resin formers B and the formaldehyde at a temperature of 50 to 90 ° C. until the formaldehyde is consumed.
  • the reaction product is neutralized with acids and then transferred into the aqueous phase, water-dilutable organic solvents optionally being added.
  • the method according to the invention is distinguished by its simple feasibility.
  • a particular advantage is the lack of unusable by-products.
  • the coating compositions formulated in a suitable manner from the binders produced according to the invention show excellent properties after application and drying of the paint film at room temperature. The reason for this is likely to be found in the hydrolysis resistance of the molecule formed by the direct linkage of epoxy resin, amine and formaldehyde resin generator B. Even at drying temperatures from 10 ° C, the products produce films with optimum corrosion resistance even without the use of catalysts.
  • the epoxy resins A1 are reacted with the primary amine A2 to form an epoxy resin-amine adduct containing secondary amino groups.
  • the ratio of the amount of substance of the available epoxy groups of the epoxy resin A1 to that of the primary amino groups in A2 is preferably 1: 0.6 to 1: 1.0 mol / mol.
  • the reaction is preferably carried out at 50 to 90 ° C.
  • a solvent its presence for the reaction in individual cases essential is aromatic hydrocarbons, such as toluene or xylene, or Glycol dieters such as diethylene glycol dimethyl ether are used. It can too Glycol monoether can be used.
  • the amount of the solvent is preferably between 10 and 50% based on the epoxy-amine adduct.
  • the epoxy-amine adduct can optionally be modified with compounds A3 selected from carboxyl compounds, such as saturated or unsaturated fatty acids, carboxyl-containing polyesters and carboxyl-containing other prepolymers, for example based on acrylate.
  • the modifiers A3 are preferably used in such an amount that up to 40% of the epoxy groups originally available in A1 are consumed.
  • Monocarboxylic acids with 7 to 20 carbon atoms of synthetic or natural origin are preferably used as fatty acids.
  • benzoic acid, isooctanoic and isononanoic acid, ⁇ -branched synthetic monocarboxylic acids with C 8 -C 12 -alkyl radicals (so-called "KOCH acids”) or oil fatty acids and tall oil fatty acids can be used.
  • Other monocarboxyl compounds for modifying the epoxy resin-amine adducts are half esters of dicarboxylic acids with monoalcohols with more than 3 carbon atoms or carboxylic acids modified with oxazolidines. The production of the latter is described for example in AT-PS 375 946.
  • the oxazolidines serve as additional formaldehyde donors.
  • the reaction of the epoxy resins A1 with the carboxyl group-containing modifiers A3 is advantageously carried out at 90 to 120 ° C. before the reaction with the amines A2 .
  • This group of carboxyl compounds A3 is preferably reacted with the epoxy groups of epoxy resin A1 at 90 to 150 ° C. The reaction is advantageously carried out until the modifying component is completely bound.
  • Secondary amines in particular secondary ones, can also be used as further modifiers Alkylamines are used.
  • the resulting tertiary amino groups can the solubility of the products can be influenced.
  • the reaction stage leading to the epoxy resin-amine adduct is up to an epoxy value of practically 0, i.e. the epoxy resin-amine adducts obtained are free of Are epoxy groups.
  • the resulting epoxy-amine adduct A is selected in the reaction according to the invention with formaldehyde or a compound which releases formaldehyde under the reaction conditions and a formaldehyde resin former B from phenolic compounds B1 , namely mono- and polyhydric phenols, alkylphenols , Aminoalkylation products of monosubstituted mono- or dihydric phenols and the aminoplast resin formers B2 of the urea, melamine or guanamine type.
  • the amounts of the reactants are preferably chosen so that the ratio of the amount of NH groups in the epoxy-amine adduct A to the amount of formaldehyde resin formers B is 1: 0.5 to 1: 1 mol / mol, and that the ratio of Amounts of the formaldehyde-reactive sites in the formaldehyde resin formers B to the amount of formaldehyde (or methylol groups formed in the reaction product) is 1: 0.25 to 1: 0.9 mol / mol.
  • the reaction is preferably carried out at 50 to 90 ° C. and is carried out until the formaldehyde used is bound as far as possible.
  • phenol itself is used in its commercially available forms, e.g. liquefactum (90%), or alkylphenols, such as the methyl, butyl or higher alkylphenols, such as nonylphenol or diphenols of the formula HO - Ar - R - Ar - OH, where Ar is an arylene radical, in particular 1,4-phenylene, and R is a straight-chain or branched alkylene radical having 1 to 5 carbon atoms, bisphenol A is preferably used.
  • the phenols used must have at least 2 formaldehyde-reactive sites in order to achieve the desired properties.
  • the mono- or polyhydric phenol and / or alkylphenol used as the phenolic formaldehyde resin former B1 can also be partially or completely replaced by other formaldehyde-reactive compounds. It has been found that the phenols can be replaced by amino compounds B2 of the urea, thiourea, melamine or guanamine type, which further improves the solubility characteristics and color fastness of the film.
  • This variant is characterized in that the phenol compounds B1 used are replaced, in whole or in part, by formaldehyde-reactive amino compounds B2 of the urea, thiourea, imidourea, melamine B3 , or guanamine B4 type such as acetoguanamine or benzoguanamine, or mixtures of these compounds and in a common one Reaction stage with the amino compound having secondary amino groups and the formaldehyde.
  • the mass fraction of aminic formaldehyde resin formers of groups B2 to B4 is preferably at least 20%, based on the sum of the masses of all components of type B.
  • the partial or complete replacement of the phenolic compounds B1 by the formaldehyde-reactive amino compounds B2 leads not only to an improvement in the solubility characteristics but also to an increased adhesive strength of the deposited film both on the coated substrate and in relation to possible subsequent layers.
  • urea is preferably used in the form of an aqueous solution with a solids mass fraction of 30 to 50%, in particular approximately 40%.
  • substituted ureas include thiourea, N-alkyl (thio) ureas, N, N-dialkyl and N, N'-dialkyl (thio) ureas with C 1 -C 20 -alkyl radicals, (optionally substituted on the ring) ethylene and propylene urea and glycoluril. Unsubstituted urea is particularly preferred.
  • the formaldehyde is preferably used as paraformaldehyde in one of the commercially available Molds with an effective formaldehyde content of 80 to 100% are used.
  • Formaldehyde donors or formaldehyde-releasing compounds can also additionally such compounds are used, which under the process conditions Release formaldehyde.
  • Such compounds are paraformaldehyde, the cyclic Oligomeric trioxane and tetroxane, and also, for example, oxazolidine compounds, which e.g. in the form of their carboxyl derivatives or as amines for modifying the Epoxy resin can be used.
  • the formaldehyde is used in such an amount used that the molar ratio of formaldehyde to formaldehyde-reactive Groups in the reaction mixture 25 to 90, preferably 30 to 85, particularly preferred Is 60 to 80 mol / (100 mol). It is to achieve a self-networking structure advantageous that the amount of formaldehyde is at least 30% greater than that of existing NH groups.
  • the basic groups of the reaction product ABF are partially (ie at least 5%) or completely neutralized with acids, preferably with formic acid, acetic acid or lactic acid.
  • Inorganic polybasic acids such as phosphoric acid (partial ester) or boric acid can also be used for neutralization.
  • neutralization of 10 to 40% of the basic groups or an amount of approx. 20 to 60 mmol acid per 100 g solid resin is usually sufficient.
  • the binders are then diluted to the desired concentration with deionized water; if necessary, they are processed with pigments, fillers and other additives into pigmented lacquers before neutralization or before dilution or in the partially diluted state.
  • aqueous lacquers which contain the binders according to the invention can be use in particular for coating metallic substrates, whereby the give coated substrate excellent corrosion protection. You let yourself be also advantageous for coating temperature-sensitive substrates such as wood, Use paper, cardboard and textile surfaces as the binders according to the invention already dry quickly at room temperature.
  • Adduct AV Adduct AV
  • the resin with the provided amount of acid corresponding to a degree of neutralization of about 25% and then slowly added deionized water with stirring to form a low viscosity dispersion. This turned into a large part of the organic at 30 to 60 ° C Solvent removed by distillation under reduced pressure.
  • binder 1 250 g of binder 1 were mixed with 70 g of titanium dioxide and 30 g of an aluminum silicate pigment (ASP 600 from Engelhardt) on the bead mill with the addition of 5 g acetic acid (30% Solution in water) and 60 g of water dispersed for 2 hours.
  • the pigmented so obtained The preparation has a grain size of less than 12 ⁇ m. It was made with a dry film thickness of 40 ⁇ m applied to a bare steel sheet and dried for 72 hours at room temperature. After this time, the coated sheet was subjected to a salt spray test (ASTM B 117-64). The result is 2 mm infiltration from the cut, it became practical no bubbles were observed.
  • Binder varnish 2 3 4 5 Dry film thickness in ⁇ m 50 55 45 50 Drying time at room temperature in hours 48 36 72 36 Infiltration in the salt spray test in mm 1.5 3 2 2.5 vesicle no few few no

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Epoxy Resins (AREA)
EP20010125468 2000-11-15 2001-11-06 Résine de liaison réticulable, diluable dans l'eau Expired - Lifetime EP1209206B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AT01125468T ATE294843T1 (de) 2000-11-15 2001-11-06 Selbstvernetzende wasserverdünnbare bindemittel
DK01125468T DK1209206T3 (da) 2000-11-15 2001-11-06 Tværbindende vandfortyndbare bindemidler

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT19272000 2000-11-15
AT0192700A AT409964B (de) 2000-11-15 2000-11-15 Selbstvernetzende wasserverdünnbare bindemittel

Publications (2)

Publication Number Publication Date
EP1209206A1 true EP1209206A1 (fr) 2002-05-29
EP1209206B1 EP1209206B1 (fr) 2005-05-04

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EP20010125468 Expired - Lifetime EP1209206B1 (fr) 2000-11-15 2001-11-06 Résine de liaison réticulable, diluable dans l'eau

Country Status (5)

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US (1) US6670041B2 (fr)
EP (1) EP1209206B1 (fr)
AT (2) AT409964B (fr)
DE (1) DE50106096D1 (fr)
DK (1) DK1209206T3 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003093342A1 (fr) * 2002-04-29 2003-11-13 Huntsman Advanced Materials (Switzerland) Gmbh Bases de mannich obtenues a partir d'adduits d'amines isoles

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Publication number Priority date Publication date Assignee Title
EP2147955A1 (fr) * 2008-07-21 2010-01-27 Cytec Surface Specialties Austria GmbH Liants aqueux pour des revêtements anticorrosion, bois et beton
US12195371B2 (en) 2020-06-03 2025-01-14 Ecolab Usa Inc. Antifouling compounds used for microbial fouling control
WO2021247814A1 (fr) 2020-06-03 2021-12-09 Ecolab Usa Inc. Procédés de nettoyage non caustique et utilisations
US11932795B2 (en) 2020-06-03 2024-03-19 Ecolab Usa Inc. Aromatic amine epoxide adducts for corrosion inhibition

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Publication number Priority date Publication date Assignee Title
GB2050381A (en) * 1979-05-23 1981-01-07 Ici Ltd Aqueous coating composition
EP0158128A1 (fr) * 1984-03-16 1985-10-16 Vianova Kunstharz Aktiengesellschaft Procédé de préparation de liants pour peintures applicables par électrodéposition cathodique
EP0179184A1 (fr) * 1984-10-01 1986-04-30 Vianova Kunstharz Aktiengesellschaft Procédé de fabrication de liants pour vernis électrodéposables à la cathode

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DE2711385A1 (de) 1977-03-16 1978-09-21 Basf Ag Kathodisch abscheidbares elektrotauchlackbindemittel
DE2751498B2 (de) 1977-11-18 1979-08-30 Basf Farben + Fasern Ag, 2000 Hamburg Beschichtungsbad für das kataphoretische Beschichten von Oberflächen elektrisch. leitfähiger Substrate
GB1604545A (en) 1978-05-30 1981-12-09 Ici Ltd Coating compositions
DE3045251C2 (de) 1980-12-01 1984-02-23 Basf Farben + Fasern Ag, 2000 Hamburg Kunstharz mit Komplex gebundenem Kupfer
DE3135010A1 (de) 1981-09-04 1983-03-24 Hoechst Ag, 6000 Frankfurt "bindemittel auf der grundlage von mischkondensaten aus epoxydharzen, resolen und aminen, verfahren zu dessen herstellung und zur elektrophoretischen abscheidung sowie elektrophoresebad"
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Publication number Priority date Publication date Assignee Title
GB2050381A (en) * 1979-05-23 1981-01-07 Ici Ltd Aqueous coating composition
EP0158128A1 (fr) * 1984-03-16 1985-10-16 Vianova Kunstharz Aktiengesellschaft Procédé de préparation de liants pour peintures applicables par électrodéposition cathodique
EP0179184A1 (fr) * 1984-10-01 1986-04-30 Vianova Kunstharz Aktiengesellschaft Procédé de fabrication de liants pour vernis électrodéposables à la cathode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003093342A1 (fr) * 2002-04-29 2003-11-13 Huntsman Advanced Materials (Switzerland) Gmbh Bases de mannich obtenues a partir d'adduits d'amines isoles

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Publication number Publication date
DK1209206T3 (da) 2005-08-22
EP1209206B1 (fr) 2005-05-04
US6670041B2 (en) 2003-12-30
ATE294843T1 (de) 2005-05-15
AT409964B (de) 2002-12-27
US20020086918A1 (en) 2002-07-04
DE50106096D1 (de) 2005-06-09
ATA19272000A (de) 2002-05-15

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