EP1210208A4 - Membranfühlersystem - Google Patents

Membranfühlersystem

Info

Publication number
EP1210208A4
EP1210208A4 EP99937404A EP99937404A EP1210208A4 EP 1210208 A4 EP1210208 A4 EP 1210208A4 EP 99937404 A EP99937404 A EP 99937404A EP 99937404 A EP99937404 A EP 99937404A EP 1210208 A4 EP1210208 A4 EP 1210208A4
Authority
EP
European Patent Office
Prior art keywords
control system
membrane control
membrane
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99937404A
Other languages
English (en)
French (fr)
Other versions
EP1210208A1 (de
Inventor
Gleason K Reed
Kenneth A Smith
Michael A Bayne
Timothy Lesher
Martin Koxxy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Beaverton Inc
Original Assignee
Cascade Microtech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cascade Microtech Inc filed Critical Cascade Microtech Inc
Publication of EP1210208A1 publication Critical patent/EP1210208A1/de
Publication of EP1210208A4 publication Critical patent/EP1210208A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
EP99937404A 1999-07-21 1999-07-21 Membranfühlersystem Withdrawn EP1210208A4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1999/016653 WO2001007207A1 (en) 1999-07-21 1999-07-21 Membrane probing system

Publications (2)

Publication Number Publication Date
EP1210208A1 EP1210208A1 (de) 2002-06-05
EP1210208A4 true EP1210208A4 (de) 2005-07-06

Family

ID=22273259

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99937404A Withdrawn EP1210208A4 (de) 1999-07-21 1999-07-21 Membranfühlersystem

Country Status (6)

Country Link
EP (1) EP1210208A4 (de)
JP (1) JP2003505871A (de)
KR (1) KR100724131B1 (de)
CN (1) CN1174836C (de)
AU (1) AU5224499A (de)
WO (1) WO2001007207A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
DE10143173A1 (de) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
EP1509776A4 (de) 2002-05-23 2010-08-18 Cascade Microtech Inc Sonde zum testen einer zu testenden einrichtung
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
DE202004021093U1 (de) 2003-12-24 2006-09-28 Cascade Microtech, Inc., Beaverton Aktiver Halbleiterscheibenmessfühler
JP4980903B2 (ja) 2004-07-07 2012-07-18 カスケード マイクロテック インコーポレイテッド 膜懸垂プローブを具えるプローブヘッド
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
JP5080459B2 (ja) 2005-06-13 2012-11-21 カスケード マイクロテック インコーポレイテッド 広帯域能動／受動差動信号プローブ
DE202007018733U1 (de) 2006-06-09 2009-03-26 Cascade Microtech, Inc., Beaverton Messfühler für differentielle Signale mit integrierter Symmetrieschaltung
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
JP2020016626A (ja) * 2018-07-27 2020-01-30 日置電機株式会社 測定装置
WO2020022085A1 (ja) * 2018-07-27 2020-01-30 日置電機株式会社 測定装置
JP2020115155A (ja) * 2020-05-07 2020-07-30 日置電機株式会社 測定装置
KR102309675B1 (ko) 2021-07-30 2021-10-07 김재길 필름 형태의 프로브카드

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4663840A (en) * 1984-12-11 1987-05-12 U.S. Philips Corporation Method of interconnecting conductors of different layers of a multilayer printed circuit board
US6002266A (en) * 1995-05-23 1999-12-14 Digital Equipment Corporation Socket including centrally distributed test tips for testing unpackaged singulated die

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3596228A (en) 1969-05-29 1971-07-27 Ibm Fluid actuated contactor
US5323035A (en) * 1992-10-13 1994-06-21 Glenn Leedy Interconnection structure for integrated circuits and method for making same
US5126286A (en) * 1990-10-05 1992-06-30 Micron Technology, Inc. Method of manufacturing edge connected semiconductor die
US5229782A (en) * 1991-07-19 1993-07-20 Conifer Corporation Stacked dual dipole MMDS feed
US5537372A (en) * 1991-11-15 1996-07-16 International Business Machines Corporation High density data storage system with topographic contact sensor
JP2710544B2 (ja) * 1993-09-30 1998-02-10 インターナショナル・ビジネス・マシーンズ・コーポレイション プローブ構造、プローブ構造の形成方法
US5814847A (en) * 1996-02-02 1998-09-29 National Semiconductor Corp. General purpose assembly programmable multi-chip package substrate
KR100674534B1 (ko) * 1996-05-17 2007-04-25 폼팩터, 인크. 초소형 전자 접촉 구조체 제조방법
KR100324064B1 (ko) * 1996-05-17 2002-06-22 이고르 와이. 칸드로스 초소형전자상호접속요소용접촉팁구조체와그제조방법
US5914613A (en) * 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4663840A (en) * 1984-12-11 1987-05-12 U.S. Philips Corporation Method of interconnecting conductors of different layers of a multilayer printed circuit board
US6002266A (en) * 1995-05-23 1999-12-14 Digital Equipment Corporation Socket including centrally distributed test tips for testing unpackaged singulated die

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *
See also references of WO0107207A1 *

Also Published As

Publication number Publication date
JP2003505871A (ja) 2003-02-12
AU5224499A (en) 2001-02-13
CN1174836C (zh) 2004-11-10
KR100724131B1 (ko) 2007-06-04
KR20020027483A (ko) 2002-04-13
CN1361725A (zh) 2002-07-31
EP1210208A1 (de) 2002-06-05
WO2001007207A1 (en) 2001-02-01

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RIN1 Information on inventor provided before grant (corrected)

Inventor name: KOXXY, MARTIN

Inventor name: LESHER, TIMOTHY

Inventor name: BAYNE, MICHAEL, A.

Inventor name: SMITH, KENNETH, A.

Inventor name: REED, GLEASON, K.

A4 Supplementary search report drawn up and despatched

Effective date: 20050524

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