EP1238410A1 - Dispositif et procede pour orienter des substrats en forme de disques - Google Patents

Dispositif et procede pour orienter des substrats en forme de disques

Info

Publication number
EP1238410A1
EP1238410A1 EP00981319A EP00981319A EP1238410A1 EP 1238410 A1 EP1238410 A1 EP 1238410A1 EP 00981319 A EP00981319 A EP 00981319A EP 00981319 A EP00981319 A EP 00981319A EP 1238410 A1 EP1238410 A1 EP 1238410A1
Authority
EP
European Patent Office
Prior art keywords
substrate
support
stop
support elements
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00981319A
Other languages
German (de)
English (en)
Inventor
Ottmar Graf
Paul Mantz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Steag RTP Systems GmbH
Original Assignee
Steag RTP Systems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag RTP Systems GmbH filed Critical Steag RTP Systems GmbH
Publication of EP1238410A1 publication Critical patent/EP1238410A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

Definitions

  • the present invention relates to an apparatus and a method for aligning disk-shaped substrates, in particular semiconductor wafers, with an alignment detection unit.
  • semiconductor wafers consisting of a single crystal, also called wafers
  • wafers are generally subjected to different processing processes for the production of semiconductor elements.
  • These machining processes are highly automated and the semiconductor wafers are transported between the machining processes with handling devices, which generally have support plates. Centered placement of the disks on the support plates is important in order to ensure correct positioning of the disks in the various processing devices.
  • the disks must be aligned according to the axes of their crystal lattice. Both the centering and the alignment of the disks are carried out by alignment devices, which are also referred to as aligners.
  • a semiconductor wafer 1 is deposited by a handling device 2 on support pins 3 of the aligner.
  • the handling device is then moved out of the area below the wafer and the pins 2 are lowered, as a result of which the disk is positioned on a turntable 4 called a chuck.
  • the turntable 4 has a vacuum suction device to hold the disk firmly thereon.
  • the turntable 4 is rotated about its axis of rotation. During this rotation, a lateral offset of the disk with respect to the axis of rotation is measured with a camera 5.
  • the pins are then raised again in order to lift the semiconductor wafer 1 off the turntable 4, and the pins are moved in a horizontal direction depending on the measured offset in order to center the wafer on the turntable 4. Subsequently the disc is again placed on the turntable 4 in order to repeat the above measurement process and to ensure that the disc 1 is now centered on the turntable 4. This process is repeated until complete centering is achieved.
  • the camera 5 is able to recognize a marking in the form of a cutout, which is also known as a notch, or a flattening of the edge of the pane 1, which is also known as a Fiat, in the crystal direction the disc indicates.
  • a marking in the form of a cutout which is also known as a notch, or a flattening of the edge of the pane 1, which is also known as a Fiat, in the crystal direction the disc indicates.
  • the turntable 4 is rotated in a desired direction in order to bring the marking into a predetermined position.
  • the positioning is monitored by the camera, which then also simultaneously reads the ID number incorporated into the semiconductor wafer, which, for example, has the form of a bar code or a sequence of numbers.
  • the alignment method described above is very complex and, since it comprises several repetitive steps, it is also very time-consuming, which results in a low throughput.
  • extensive software for controlling the various elements and a suction device for holding the disk on the turntable are required, which unnecessarily increases the costs for the device.
  • FIGS. 12a and 12b show the underside of a semiconductor wafer 1 before it was sucked onto a turntable
  • FIG. 12b shows the surface of the wafer after it was sucked onto the turntable.
  • a device for aligning the edges of a wafer in which the wafer is in turn positioned on a turning studio.
  • the turntable has a vacuum suction device to hold the disc firmly. While the disc is sucked in, the turntable is rotated about its axis of rotation, and a lateral offset of the disc with respect to the axis of rotation is measured using a row of photodetectors to be used for subsequent centering of the wafer.
  • US Pat. No. 3,982,627 describes a device for automatically aligning a wafer, in which the wafer is placed on an inclined support. Due to the slope, the wafer slides against a rotating stop. To align the wafer, the rotatable stop, and thus the wafer, is rotated until it reaches a desired position. During the rotation of the wafer, it is held at a distance from the support by an air cushion.
  • the present invention is based on the object of specifying a device and a method for aligning disk-shaped substrates, in particular semiconductor wafers, with an alignment detection unit, which enables alignment of the substrate in a simple and inexpensive manner and simple integration allowed in existing wafer processing plants. Alignment not only includes a spatial arrangement, but also a specific rotational arrangement of the substrate.
  • this object is achieved in a device of the type mentioned by at least one movable first support for receiving the substrate, which forms a support plane, and a device for tilting the first support with respect to the horizontal in order to move the support plane into a position inclined to the horizontal bring, a stop against which the substrate is movable due to the slope and a rotating device for rotating the substrate.
  • the movable first support enables the substrate to be deposited and removed in a substantially horizontal position, as a result of which the device can be easily integrated into previously existing systems in which handling devices generally hold the substrates in horizontal positions. It is not necessary to change the handling devices previously used. Due to the inclined support, the substrate is automatically moved into a spatially defined position against the stop.
  • the substrate By means of the rotating device, the substrate can now be moved into a predetermined rotating position, which is detected by the alignment detection unit.
  • the positioning and alignment takes place in a single step and does not require complex control of different elements.
  • suction of the substrate is not necessary, since it cannot slide sideways during rotation due to the inclined position and the stop. This eliminates the costs and problems associated with the suction device.
  • the first support preferably has at least two first support elements forming the plane, which enable the handling device for the loading and unloading of the substrate to be moved as freely as possible.
  • the support elements In order to avoid damage to the substrate and the generation of particles during a relative movement between the support elements and the substrate, the support elements have at least in the Contact area a material with low friction, especially Teflon. Damage to the substrate during a relative movement between the support elements and the substrate can preferably also be avoided by rounding off the support area of the support elements.
  • the stop is preferably also tiltable.
  • the stop preferably has at least two spaced-apart stop pins in order to at least partially accommodate the substrate in between and to ensure a firm spatial positioning of the substrate.
  • At least one of the stop pins can be rotated, as a result of which the substrate lying thereon can be rotated in a particularly simple and inexpensive manner.
  • the stop pins can preferably be rotated synchronously with one another. This is preferably via a common drive element, such as. B. a common drive belt engaged with the stop pins.
  • the rotating device can be controlled as a function of an alignment of the substrate determined by the detection unit.
  • the support elements and / or the stop pins are arranged on a common plate, which is preferably tiltable.
  • the device has a second, essentially horizontal plane support for receiving the substrate.
  • the first and second editions are included preferably movable relative to one another in order to transfer the substrate from one support to the other and to bring the substrate in particular from a horizontal position into an oblique position.
  • the second support preferably has at least two second support elements forming the horizontal plane, which preferably have rounded support surfaces in order to avoid damage to the substrate at the edges of the support elements during a relative movement between the substrate and the support element.
  • the second support elements are stationary.
  • the second support elements preferably extend through openings in the plate to which the first support elements and / or the stop pins are attached.
  • the second support elements can be moved with and relative to the plate in order to transfer the substrate from the second support elements to the first support elements and vice versa when the plate is tilted, with the least possible degree of relative movement between the substrate and the second support elements to enable. Furthermore, it can thereby be achieved that the contact surfaces of the second contact elements always extend essentially parallel to a contact surface of the substrate.
  • the support elements are preferably biased in a direction pointing away from the substrate.
  • the device preferably has a device for measuring the substrate diameter.
  • the distance between the stop pins can preferably be adjusted as a function of the substrate diameter, in order thereby to achieve an exact positioning of the center of the substrate which is constant for substrates with different diameters.
  • the first support elements can be rotated about a common center, which preferably coincides with the center of the wafer. A rotation of the first support elements avoids a relative movement between the substrate and the support elements during the rotation, thereby reducing the risk of damage to the substrate.
  • the first support elements are preferably arranged on a rotatable element.
  • the center point of the substrates is positioned in different locations during the alignment, unless the center point is positioned uniformly by adjusting the stop pins as a function of the substrate diameter.
  • the movement of the handling device is controlled according to one embodiment of the invention as a function of the substrate diameter.
  • centering between the substrate and the handling device is achieved by a device for synchronously moving the first or second support depending on the substrate diameter. In this way, after the first edition has been tilted back, an exact positioning of the center of the substrate, which is the same for substrates with different diameters, is achieved, so that special control of the handling device is dispensed with.
  • the object on which the invention is based is also achieved by a method for aligning disc-shaped substrates, in particular semiconductor wafers, in that the substrate is placed on an aligning device, a movable first support of the aligning device is moved into an oblique position to the horizontal, in particular tilted, around the Bring the substrate in a position inclined to the horizontal and due to the inclination against at least one stop, and the substrate in a predetermined given rotation position, which is monitored with a detection unit, is rotated.
  • This results in the advantages already mentioned with reference to the device in particular a simple and inexpensive alignment of substrates, which takes place in a single sequence of steps in a time-saving manner.
  • the support By moving, in particular tilting, the support, the substrate can first be placed in a substantially horizontal position on the alignment device, as was the case with previous devices. This results in good compatibility of the method according to the invention with existing substrate handling devices for transporting the substrate.
  • the support and the stop are preferably moved together.
  • the substrate For a simple rotation of the substrate, it is preferably rotated by rotating at least one stop element of the stop. Two spaced stop elements are preferably rotated for the most uniform possible rotation.
  • the rotation of the substrate is preferably controlled as a function of an orientation of the substrate determined by the detection unit in order to ensure correct and precise positioning of the substrate in the direction of rotation.
  • the diameter of the substrate is advantageously determined and, in a preferred embodiment of the invention, the distance between the stop elements is set as a function of the diameter of the substrate. This enables a precise and constant positioning of a center of the substrate regardless of its diameter.
  • the substrate is preferably rotated by rotating the support.
  • the movement of a substrate handling device is controlled as a function of the diameter of the substrate in order to ensure that the substrate is centered.
  • the centered receptacle is achieved in that the support elements of the first or the second support are moved synchronously in one direction after the first support has been tilted back, depending on the substrate diameter
  • 1 a and b show a schematic side view and a top view of a device according to the present invention
  • 2a and b show a schematic side view and a top view similar to FIG. 1, with a semiconductor wafer deposited on the device;
  • Fig. 3 is a schematic side view of the device according to
  • Fig. 4 is a schematic side view of the device according to
  • Figure 5 is a top view of the device in its tilted position.
  • FIG. 6 shows a schematic representation of semiconductor substrates with different diameters, such as those which rest against a non-movable stop of the device according to the invention
  • FIG. 7 shows a schematic illustration of semiconductor wafers with different diameters as they rest against a movable stop according to the device according to the invention
  • Fig. 8 is an enlarged view of an inventive
  • FIG. 10 shows a schematic side view of a device according to FIG. 9 in a tilted position
  • 11 a - d are schematic side views of a conventional alignment device, illustrating the operation of the device
  • FIGS. 1 a and b show a schematic side view and a top view of a device 10 for aligning disk-shaped semiconductor wafers 12 (see FIG. 2).
  • the device 10 has a plate 14 which, as will be described below, can be tilted.
  • the plate 14 has three oval openings 16 extending from the bottom up through the plate 14.
  • Three support pins 18 extend through the openings 16 in the plate 14 and are fastened to a base plate (not shown in more detail).
  • the support pins 18 form a three-point support with an essentially horizontal support plane for receiving the semiconductor wafer 12, as can best be seen in FIG. 2a.
  • Teflon disks 22 which, as will be described below, serve as support elements for the semiconductor wafer 12 when the plate 14 is tilted with respect to the horizontal.
  • the three pins 18 and the three disks 22 it is also possible to provide two elongate elements each, which form a support plane and allow the wafer to be held securely.
  • Two rotatable stop pins 24 are also provided on the plate 14.
  • the stop pins 24 can be rotated via a drive mechanism (not shown in more detail), the two pins via a common drive belt. Men are interconnected to achieve a synchronous rotation of the two pins.
  • FIG. 3 shows a schematic side view of the device 10 with a wafer 12 placed thereon in an initial position.
  • the wafer 12 rests on the support pins 18 and the plate 14 is in a horizontal orientation.
  • FIG. 4 shows the device 10 in a different position.
  • the plate 14 is tilted to the horizontal, so that the wafer 12 no longer rests on the stationary support pins 18 but on the Teflon disks 22 and is therefore also in an inclined position. Due to the incline and the fact that Teflon has a low frictional resistance, the wafer 12 slides against the stop pins 24 and is centered between them, as can best be seen in the top view according to FIG. 5. In this position, the stop pins 24 are rotated in order to rotate the wafer 12 about its central axis, as is also best seen in the top view according to FIG. 5.
  • semiconductor wafers generally have a notch, also known as a notch, or a flattening, also known as a fiat, by means of which the crystal direction of the wafer can be determined.
  • the device 10 has a sensor device, not shown, such as a camera or a CCD line, which is able to recognize the marking of the wafer and to determine its position during the above-mentioned rotation of the wafer about its central axis.
  • a sensor device not shown, such as a camera or a CCD line, which is able to recognize the marking of the wafer and to determine its position during the above-mentioned rotation of the wafer about its central axis.
  • its rotation is controlled in such a way that the marking of the wafer is rotated into a predetermined position, which is recognized by the sensor device. The rotation is therefore controlled on the basis of the position of the marking determined by the sensor.
  • the semiconductor wafer When the mark is in the predetermined position, the semiconductor wafer is both spatial and with respect to its crystal direction aligned.
  • the plate 14 is now tilted back, as a result of which the wafer 12 is placed on the support pins 18 again.
  • the wafer 12 is now in a precisely determined spatial position and aligned with respect to its crystal direction on the support pins 18.
  • a substrate handling device is moved under the wafer 12 in such a way that it picks it up and transports it for further processing.
  • the stop pins 24 are fixed locally on the plate 14. If semiconductor wafers with different diameters are deposited on the device 10 and then aligned, the center point of the respective wafers lies at different locations, as can be seen in FIG. 6. In the case of wafers with smaller diameters, the center point of the wafers moves closer to a straight line A passing through the stop pins 24.
  • a sensor for measuring the wafer diameter. This function is performed by the alignment sensor, i.e. for example by a camera or CCD line. A length scale on the plate 14 is read by the camera or CCD line, whereby the wafer diameter is known.
  • the movement of the handling device for removing the semiconductor wafer is controlled as a function of the wafer diameter determined in this way, so that it always picks up the wafer in a precisely centered manner.
  • other types of determination of the wafer diameter are also possible.
  • FIG. 7 schematically shows an alternative embodiment of the invention, in which essentially the same components as in the first exemplary embodiment are provided.
  • the stop pins 24 are attached to the plate 14 so that they can move laterally.
  • a lateral movement of the stop elements 24 from a first position shown in FIG. 7, which is shown by a solid point is to a second position, which is represented by a circle, it is possible to accommodate semiconductor wafers with different diameters so that their center is always in the same position. For this purpose it is again necessary to determine the diameter of the wafer and then to move the stop pins laterally so that the center of the substrate lies at a predetermined point.
  • the substrate handling device can always move into the same position regardless of the wafer diameter in order to receive the wafer in a centered manner.
  • this enables the wafer to be centered with respect to the Teflon pads 22 regardless of the wafer diameter.
  • the Teflon pads 22 it is possible to arrange the Teflon pads 22 such that they lie on a circle, the center of which coincides with the centers of the wafers.
  • a rotatable element such as. B. arranges a turntable or a rotatable circular ring, the rotation of the wafer, and thus the alignment of the wafer with respect to Notch or Fiat, can take place via the Teflon disks. This in particular prevents friction between the Teflon disks and the wafer, since there is no relative movement between the wafer and the impact disks during the rotation.
  • the centered receptacle is achieved in that the support elements of the first or second support are moved synchronously in one direction after the first support has been tilted back, depending on the substrate diameter
  • FIG. 8 shows how the plate 14 of the device 1 according to FIG. 1 is tilted back after an alignment process.
  • the wafer 12 is partially received on one of the support pins 18 and partially on one of the Teflon disks 22. It happens during the tilting movement the plate 14 to a relative movement between the encircled edge of the support pin 18 and the encircled edge of the Teflon disc 22, since the wafer is pressed to the right by the stop pins 24. This can lead to undesired particle formation and scratches on the wafer surface.
  • edges of the support pins 18 and the Teflon disks 22 or their entire support surface are rounded, whereby rolling of the wafer on the pins or disks is achieved. In particular, scratches from edges of the support pins or the Teflon washers are avoided.
  • FIGS. 9 and 10 show an alternative device 30 for aligning semiconductor wafers 32.
  • the device 30 has a base plate 34 and a tilting plate 36 which are pivotally connected to one another via an articulated connection 37.
  • rotatable stop pins 38 are attached to the tilting plate 36 and can be rotated about their central axis by means of a device (not shown).
  • First support pins 40 and second support pins 42 are also arranged on the tilting plate 36.
  • Three first and second support pins 40, 42 are provided, each of which forms a three-point support for the semiconductor wafer 32.
  • the support pins 40 extend through the tilt plate 60 and are movable relative to the tilt plate 36.
  • the movement of the support pins 40 relative to the tilting plate 36 is limited by an upper and a lower limiting disk 44, 46, which are arranged above and below the tilting plate 36.
  • a spring 48 is arranged between the lower limiting disk 46 and an underside of the tilting plate 36, which biases the stop pin 40 downward, ie away from the semiconductor wafer 32.
  • the support pin 40 has a foot 50 which, in a first position of the tilting plate 36, as shown in FIG. 9, is in contact with an upper side of the base plate 34 and the Support pin 40 pushes upward through the plate 36 against the spring preload. In this first position, shown in FIG. 9, the support pins 40 form an essentially horizontal support plane which lies above a support plane formed by the support pins 42.
  • the feet 50 of the support pins 40 move away from the top of the base plate 34 and the support pins 40 move away from the substrate 32 due to the spring preload.
  • This movement is limited by the upper limiting disk 44, as can be seen in FIG. 10.
  • the support plane formed by the support pins 40 lies below the support plane formed by the support pins 42, so that the substrate now rests on the support pins 42.
  • the wafer 32 slides against the stop pins 38 and, as in the first exemplary embodiment, is centered between them and aligned as described above.
  • the plate 36 is tilted back, as a result of which the feet 50 of the support pins 40 come into engagement with the base plate 34 and push the pins against the spring preload in the direction of the semiconductor wafer 32.
  • the feet 50 of the support pins 40 are rounded in order to roll off on the base plate when tilting back and to prevent the pins from tilting within the tilt plate 36. Since the support pins 40 are tilted with the tilting plate 36, their support surfaces are always parallel to the wafer surface, as a result of which placing the wafer on only one pin edge and a relative movement between the support pins 40 and the wafer 32 when tilting back are essentially excluded.
  • the present invention is not restricted to this.
  • An inclined support level leaves can also be achieved by a relative movement in the vertical direction between the support elements.
  • the problem of particle accumulation on the wafer can be reduced by providing a particle suction device which sucks down particles on the wafer, in particular when the plate is in the tilted state.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention vise à permettre une orientation aisée et peu onéreuse de substrats et concerne un dispositif d'orientation de substrats en forme de disques, en particulier de tranches de silicium de semi-conducteurs, comprenant une unité de saisie d'orientation. L'invention est caractérisée en ce que le dispositif comporte : au moins un premier support pour le substrat, support qui présente un plan incliné, une butée, vers laquelle le substrat se déplace du fait du plan oblique, un dispositif de pivotement pour faire tourner le substrat. L'invention concerne également un procédé pour orienter des substrats en forme de disques, en particulier des tranches de silicium de semi-conducteurs, présentant les phases suivantes : mise du substrat en position oblique en le posant sur un support qui présente un plan incliné, le substrat s'appuyant alors contre au moins une butée ; rotation du substrat dans une position de pivotement prédéfinie ; surveillance de la position de pivotement par une unité de saisie.
EP00981319A 1999-12-01 2000-11-29 Dispositif et procede pour orienter des substrats en forme de disques Withdrawn EP1238410A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19957758A DE19957758C2 (de) 1999-12-01 1999-12-01 Vorrichtung und Verfahren zum Ausrichten von scheibenförmigen Substraten
DE19957758 1999-12-01
PCT/EP2000/011955 WO2001041193A1 (fr) 1999-12-01 2000-11-29 Dispositif et procede pour orienter des substrats en forme de disques

Publications (1)

Publication Number Publication Date
EP1238410A1 true EP1238410A1 (fr) 2002-09-11

Family

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Application Number Title Priority Date Filing Date
EP00981319A Withdrawn EP1238410A1 (fr) 1999-12-01 2000-11-29 Dispositif et procede pour orienter des substrats en forme de disques

Country Status (6)

Country Link
US (1) US7004716B2 (fr)
EP (1) EP1238410A1 (fr)
JP (1) JP2003515947A (fr)
KR (1) KR100730428B1 (fr)
DE (1) DE19957758C2 (fr)
WO (1) WO2001041193A1 (fr)

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WO2001041193A1 (fr) 2001-06-07
KR100730428B1 (ko) 2007-06-19
KR20020059832A (ko) 2002-07-13
DE19957758A1 (de) 2001-06-13
DE19957758C2 (de) 2001-10-25
US20020172585A1 (en) 2002-11-21
US7004716B2 (en) 2006-02-28
JP2003515947A (ja) 2003-05-07

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