EP1285105A1 - Couches formees par voie electrochimique et servant de protection anticorrosion ou de peinture primaire reactive - Google Patents
Couches formees par voie electrochimique et servant de protection anticorrosion ou de peinture primaire reactiveInfo
- Publication number
- EP1285105A1 EP1285105A1 EP01933902A EP01933902A EP1285105A1 EP 1285105 A1 EP1285105 A1 EP 1285105A1 EP 01933902 A EP01933902 A EP 01933902A EP 01933902 A EP01933902 A EP 01933902A EP 1285105 A1 EP1285105 A1 EP 1285105A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- metal
- layer
- inorganic compound
- electrically conductive
- conductive surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005260 corrosion Methods 0.000 title claims description 16
- 230000007797 corrosion Effects 0.000 title claims description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 76
- 239000002184 metal Substances 0.000 claims abstract description 76
- 238000000034 method Methods 0.000 claims abstract description 39
- 150000002484 inorganic compounds Chemical class 0.000 claims abstract description 36
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 36
- 238000000576 coating method Methods 0.000 claims abstract description 30
- 239000011248 coating agent Substances 0.000 claims abstract description 23
- 230000008569 process Effects 0.000 claims abstract description 22
- 229920000620 organic polymer Polymers 0.000 claims abstract description 13
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- 150000001875 compounds Chemical class 0.000 claims abstract description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 8
- 239000001257 hydrogen Substances 0.000 claims abstract description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 239000003973 paint Substances 0.000 claims abstract description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims abstract description 6
- 239000000843 powder Substances 0.000 claims abstract description 5
- 238000004070 electrodeposition Methods 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- 229910052787 antimony Inorganic materials 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- 229910052745 lead Inorganic materials 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 229910052712 strontium Inorganic materials 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 2
- 230000008021 deposition Effects 0.000 abstract description 16
- 238000007598 dipping method Methods 0.000 abstract description 2
- 229920000642 polymer Polymers 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 89
- 238000000151 deposition Methods 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- 239000000243 solution Substances 0.000 description 11
- 150000002739 metals Chemical class 0.000 description 9
- 239000004033 plastic Substances 0.000 description 9
- 229920003023 plastic Polymers 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 8
- 239000003792 electrolyte Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(i) oxide Chemical compound [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 6
- 238000010422 painting Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000004913 activation Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 150000002736 metal compounds Chemical class 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000003125 aqueous solvent Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004532 chromating Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000002848 electrochemical method Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000002905 metal composite material Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- -1 tetraalkylammonium halide Chemical class 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 2
- 229910000165 zinc phosphate Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 150000004673 fluoride salts Chemical class 0.000 description 1
- 229910021397 glassy carbon Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- 238000001027 hydrothermal synthesis Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 150000003346 selenoethers Chemical class 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 238000010129 solution processing Methods 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 229910052566 spinel group Inorganic materials 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 231100000563 toxic property Toxicity 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000004636 vulcanized rubber Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/22—Servicing or operating apparatus or multistep processes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
Definitions
- the invention is in the field of coating surfaces in order to protect them against corrosion and / or to provide them with a primer for a subsequent organic coating.
- the surfaces must be electrically conductive, for example represent surfaces of metals or surfaces of glass or plastics that have been made conductive by a corresponding treatment.
- a widespread technical task is to provide metallic or non-metallic substrates with a first coating which has a corrosion-inhibiting effect and / or which is an adhesive base for a coating to be applied with organic polymers.
- metals are pretreated before painting.
- Various methods are available in technology for this. Examples include a layer-forming or non-layer-forming phosphating, a chromating or a chromium-free conversion treatment, for example with complex fluorides of titanium, zirconium, boron or silicon.
- Technically easier to carry out, but less effective is a simple application of a primer layer on a metal before painting it. An example of this is the application of Menninge.
- dry processes in which a corrosion protection or adhesive layer is deposited from a gas phase.
- Such methods are known, for example, as PVD or CVD methods. They can be supported electrically, for example by a plasma discharge.
- a layer produced or applied in this way can serve, on the one hand, as a corrosion-protecting adhesive base for subsequent painting.
- the layer can also form a base for subsequent gluing.
- metallic substrates, but also substrates made of Plastic or glass are often chemically or mechanically pretreated before bonding to improve the adhesion of the adhesive to the substrate.
- metal or plastic parts are glued to each other, but also to each other.
- front and rear windows of vehicles are usually glued directly into the body.
- Further examples of the use of adhesive layers can be found in the production of rubber-metal composites.
- the metal substrate is usually mechanically or chemically pretreated before an adhesive layer is applied for gluing with rubber.
- the conventional wet or dry coating processes each have special disadvantages.
- chromating processes are disadvantageous from an ecological and economic point of view due to the toxic properties of chromium and the formation of highly toxic sludges.
- chrome-free wet processes such as phosphating are usually associated with the formation of sludges containing heavy metals, which have to be disposed of in a complex manner.
- Another disadvantage of conventional wet coating processes is that the actual coating step often requires preparatory or post-processing additional steps. This increases the space required for the treatment line and the consumption of chemicals.
- the phosphating used almost exclusively in automobile construction is associated with several cleaning steps, one activation step and generally a post-passivation step. In all of these steps, chemicals are consumed and waste to be disposed of.
- An electrochemical formation of an oxide layer also takes place in the processes known as anodizing.
- the present invention differs from this in that layers of metal compounds are deposited on a substrate, the metal of the metal compound being essentially a different metal from that which makes up the possibly metallic substrate.
- Electrochemical support for the formation of zinc phosphate layers is not within the scope of the present invention.
- the invention relates to the use of a layer on an electrically conductive surface, which is obtainable by a layer of at least one inorganic compound of at least one metal A with a mass per unit area of 0.01 on this surface in step a) up to 10 g / m 2 is electrochemically deposited from a solution which contains the metal A in dissolved form, the metal A being a different metal than the main component of the electrically conductive surface and the inorganic compound being less than 20% by weight Contains phosphate ions as a corrosion protection layer and / or as a primer for an organic coating.
- the solution which contains the metal A in dissolved form is also referred to below as "electrolyte". If this represents water in which the salt of metal A is dissolved, the conductivity of this solution is generally sufficient for the purpose according to the invention If a non-aqueous solvent is used or if the conductivity of an aqueous solution is insufficient, a conductive salt such as a tetraalkylammonium halide can be added.
- a conductive salt such as a tetraalkylammonium halide
- the electrically conductive surface can be an intrinsically conductive surface such as a metallic surface.
- the layer can also be deposited on a surface of a material that is not electrically or only slightly conductive if the surface is made electrically conductive by suitable measures. In the case of plastics, this can be done, for example, by first chemically depositing an electrically conductive metal layer, which then forms the basis for the electrochemical deposition of a metal A compound.
- a glass surface can be made electrically conductive, for example, by using a Dusting an electrically conductive substance powder or applying a conductive layer over the gas phase, for example as chemical vapor deposition (CVD).
- CVD chemical vapor deposition
- the electrically conductive surface is a metal surface.
- the inorganic compound of metal A is deposited from a solution which contains metal A in dissolved form.
- This can be a one- or multi-component aqueous or a non-aqueous solution.
- non-aqueous solvents with a good solubility for suitable metal compounds are liquid ammonia, dimethyl sulfoxide or organic phosphine derivatives.
- a multi-component aqueous solution are water-alcohol mixtures.
- the electrochemical deposition can be carried out cathodically or anodically, with cathodic deposition being more universal and therefore preferred.
- the inorganic compound of at least one metal A can be separated from a corresponding solution by two different mechanisms.
- the deposition can be coupled with a change in the oxidation state of metal A, a layer of a poorly soluble compound of metal A growing on the electrically conductive surface in the oxidation state which has changed compared to the solution.
- copper (I) oxide can be deposited cathodically from an aqueous solution containing copper (II) ions.
- Another deposition mechanism is based on the fact that the pH value shifts near the surface due to electrochemical processes on the electrically conductive surface.
- an inorganic compound of at least one metal A can grow on the electrically conductive surface and is poorly soluble on the surface under the local pH conditions. It is not necessary for the oxidation level of metal A to change during the deposition process.
- the pH value on the electrically conductive surface can be shifted, for example, by discharging hydrogen ions and thereby locally increasing the pH value. If this refers to an inorganic compound of at least one metal A, this means that this compound must in any case contain the metal A. However, it can also contain other metals B, C, ... These other metals can be present in the solution in addition to the metal A and can be deposited together with this.
- these other metals can also be components of the electrically conductive surface and can be incorporated directly into this connection when the layer of an inorganic compound of at least one metal A is formed.
- inorganic compounds which contain a further metal in addition to metal A are mixed oxides, which can belong, for example, to the structure type of spinels or perovskites. Examples include titanates and niobates.
- the compound deposited in step a) is an oxide.
- This can also be a mixed oxide of different metals.
- the use according to the invention is not restricted to oxides. It also includes non-oxidic inorganic compounds such as selenides, sulfides or nitrides, which can be separated from suitable, optionally anhydrous, solvents.
- the inorganic compound of at least one metal A is merely a binary or ternary compound. Rather, this connection can also have a more complex structure, for example by incorporating ions or molecules from the solution into the connection. Oxide hydrates or sulfates are an example of this.
- the use according to the invention does not include a pure electroplating, since an electroplating layer is not an “inorganic compound” in the sense of this invention.
- the condition of the layer of at least one inorganic compound of at least one metal A is rather that at least a part of the metal A in a Oxidation level> 0 is present.
- any layer of at least one inorganic compound of at least one metal A can be used for the use according to the invention, which layer can be deposited electrochemically and which is sufficiently chemically stable to act as a corrosion protection layer. This means that the
- Layer with or without applied paint provides better corrosion protection than the uncoated metal surface. For the sake of price and
- the metal A is selected from Mg, Ca, Sr,
- AI Si, Sn, Pb, Sb, Bi, Ti, Zr, V, Nb, Ta, Mo, W, Mn, Fe, Co, Ni, Zn, Cu.
- the most important metals from this for practical purposes are AI, Si, Ti, Zr, Mo, W, Mn, Fe,
- the electrochemical deposition can be potentiostatic or galvanostatic.
- the galvanostatic deposition is technically easier to carry out and is therefore preferred.
- the layer formation preferably takes place in that the inorganic compound on the electrically conductive surface at a potential compared to a standard hydrogen electrode between +0.1 and ⁇ 300 V or a current density in the range of ⁇ 0.1 to ⁇ 10000 mA per cm 2 electrically conductive surface is deposited. It is preferred to work at potentials between ⁇ 0.1 and ⁇ 100 V or at a current density in the range from ⁇ 0.5 to ⁇ 100 mA per cm 2 .
- the signs in front of voltage and current density express that the deposition can be cathodic or anodic. Cathodic deposition, ie a negative potential compared to the standard hydrogen electrode, is preferred.
- the morphology, the chemical composition and the crystal structure of the deposited layer depend on the deposition conditions and can thus be influenced by the choice of the conditions.
- the layer parameters mentioned depend on the concentration of the metal ions A and possibly other constituents in the solution, the flow rate of the solution relative to the electrically conductive surface, the set potential and / or the set current density.
- the layer properties can thus be specifically changed by selecting these parameters.
- the deposition is carried out here preferably under conditions such that the inorganic compound is deposited in X-ray crystalline form.
- X-ray crystalline means that the inorganic compound gives sharp X-ray reflections in an X-ray diffraction experiment.
- the resulting highly structured surface is particularly favorable as an adhesive base for an organic coating.
- Mixing the electrolyte and / or a relative movement of the electrolyte relative to the metallically conductive surface can accelerate the layer formation and influence the morphology of the layer. For example, this can be done by stirring the electrolyte or by pumping it around in the electrolysis vessel. Furthermore, the electrolyte can be mixed and moved by blowing in a gas, in particular air.
- the invention relates to a method for producing an at least two-layer coating on an electrically conductive surface, characterized in that in step a) on the electrically conductive surface a layer of at least one inorganic compound of at least one metal A with a mass per unit area from 0.01 to 10 g / m 2 is electrochemically deposited from a solution containing the metal A in dissolved form, the metal A being a metal other than the main component of the electrically conductive surface and the inorganic compound being less than 20 wt .-% Contains phosphate ions, and in a subsequent step b) at least one layer of an organic polymer is applied to the layer deposited in step a).
- an at least two-layer coating means that, as described above, a layer of at least one inorganic compound of at least one metal A is applied to the electrically conductive surface and in turn at least one layer of an organic polymer.
- an inorganic compound can be applied to the layer several different layers of organic polymers can also be applied, for example, this is known from automotive engineering, where, according to the prior art, at least 3 different layers of organic polymers are generally applied to the phosphate layer serving as an inorganic corrosion protection and adhesive layer Layers of an electrocoat, a filler and a topcoat.
- a layer whose formation, properties and composition has been described above can be selected as the layer of at least one inorganic compound of at least one metal A.
- a cathodically or anodically depositable electrodeposition paint can be applied.
- the inorganic compound is preferably rinsed with water between the deposition of the layer of the inorganic compound and the application of the electrocoating material.
- This can be done by dipping or spraying. It can be advantageous, at least in the last rinsing step rinse low or deionized water.
- the process according to the invention is carried out as a belt process.
- an organic polymer layer is applied by immersion or spraying or by application rollers.
- a belt process implicitly requires a non-rigid substrate, so that this process variant is preferably carried out on strips of metal.
- the method is preferably carried out continuously. The electrochemical layer formation in sub-step a) and the application of the organic polymer layer in sub-step b) thus take place with the belt running.
- the application of an organic polymer layer to a running belt is known in the prior art as the “coil coating method”.
- the coating systems used for this are also suitable for the method according to the invention.
- the organic polymer layer can have different thicknesses and different functions. For example, they are only a few ⁇ m thick and serve as a shaping aid and / or as a primer for subsequent painting.
- the composition and layer thickness of the primer are preferably set such that electrical resistance welding is still possible.
- Such organic primer layers on a chemically produced inorganic layer on a metal surface, depending on their function and composition are known in the art under various trade names, for example Durasteel R un d Granocoat R.
- the layer thickness in the above-described primer layers is in the range of below 10 ⁇ m and is, for example, 6 to 9 ⁇ m
- a thicker organic lacquer layer can also be used directly in the coil coating process applied, which will not be painted over later.
- the layer thicknesses are then in the range from 50 to 200 ⁇ m.
- a powder coating can be applied as organic polymer in sub-step b).
- the inorganic layer on the electrically conductive surface no longer has to be electrically conductive to the extent that is required for a subsequent electrocoating.
- a powder coating is preferably applied to molded objects that are not exposed to strong corrosive loads. Examples of this are items such as household appliances or electronic devices that are kept in closed rooms.
- the organic layer applied in sub-step b) can also be an adhesive layer.
- the inorganic layer of at least one metal A then serves as an adhesive layer between the adhesive and the metallic conductive base.
- the inorganic layer can therefore act as an adhesive layer between one of the substrates metal, plastic or glass and an adhesive, it being possible for the adhesive to bond the same or different substrates to one another. Examples can be found in the construction of vehicles, airplanes or household appliances, where metals are glued to one another or with plastic or glass. Bonding plastic with plastic is also an option. In particular, glass panes can be glued into vehicle bodies in this way.
- a special embodiment consists in applying an adhesive in sub-step b), with which a vulcanized or non-vulcanized rubber part is connected to a metal part.
- the component that is created in this way is generally referred to as a “rubber-metal composite”.
- the general procedure is to connect an unvulcanized rubber part with an adhesive to the metallic substrate via the inorganic layer serving as an adhesive layer and then by increasing the temperature , often with simultaneous exercise of pressure, vulcanized.
- the invention relates to a metal component, the surface of which bears an at least two-layer coating which can be obtained in one of the ways described above.
- This can be, for example, vehicles or vehicle parts, household appliances, housings for electronic devices, furniture or architectural parts.
- Preferred materials for the metal components are iron, zinc, aluminum, magnesium and alloys which consist of more than 50 atom% of one of these elements. Metals and alloys can be selected that are currently common for the metal components mentioned.
- the metal component described above carries the inorganic compound of at least one metal A in X-ray crystalline form.
- X-ray crystalline means that the inorganic compound gives sharp X-ray reflections in an X-ray diffraction experiment.
- the advantages of the use according to the invention and of the method according to the invention are in particular that the thickness, composition and inner and outer structure of the inorganic layer can be controlled more easily by the choice of the deposition parameters than in the case of purely chemical process control. Fewer process steps are required to apply the layer than with phosphating and there are generally fewer sludges than with purely chemical layer formation. Compared to deposition processes from the gas phase, electrochemical deposition is faster and requires less equipment and less energy. Furthermore, it is not necessary, like the vapor deposition, to provide volatile starting compounds. Another advantage of electrochemical layer formation is that the layer growth can be controlled via the electrical resistance on the metallically conductive surface.
- the layer growth slows down if the electrical resistance becomes too high due to the layer formation. As long as there are still unoccupied places on the metallic conductive surface or the layer is so thin that a current still flows at the set voltage, the layer growth takes place at these places. If the metallically conductive surface is almost completely covered with a layer of such a thickness that the electrical resistance increases significantly, the process of layer formation can be ended. With galvanostatically controlled layer growth, the almost complete layer formation is shown by the fact that the terminal voltage rises sharply. The process can then be stopped automatically at a preselected terminal voltage value.
- a pilot process for corrosion protection by means of cathodic deposition of Cu 2 O was carried out on cold-rolled steel without an activation step (shortening the process chain).
- the following process parameters were set:
- Electrolyte 0.4 M CuSO 4 + 3 M lactic acid, pH 10, 60 ° C, with 400 revolutions per
- the layers formed are closed after a treatment time of approx. 50 s and consist of fine ( ⁇ 1 ⁇ m) crystallites of Cu 2 O:
- the layer properties are very easy to control even without interfering with the electrolyte composition.
- Corrosion tests (10 cycles VDA alternating climate test, cathodic dip painting) show a significant improvement in corrosion protection through the coating depending on the applied layer thickness:
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Paints Or Removers (AREA)
- Prevention Of Electric Corrosion (AREA)
- Secondary Cells (AREA)
- Sealing Battery Cases Or Jackets (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP03025080A EP1394292A3 (fr) | 2000-05-06 | 2001-04-27 | Couches de TiO2 formées par voie electrochimique et servant de protection anticorrosion ou de peinture primaire reactive |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10022074 | 2000-05-06 | ||
| DE10022074A DE10022074A1 (de) | 2000-05-06 | 2000-05-06 | Elektrochemisch erzeugte Schichten zum Korrosionsschutz oder als Haftgrund |
| PCT/EP2001/004780 WO2001086029A1 (fr) | 2000-05-06 | 2001-04-27 | Couches formees par voie electrochimique et servant de protection anticorrosion ou de peinture primaire reactive |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP03025080A Division EP1394292A3 (fr) | 2000-05-06 | 2001-04-27 | Couches de TiO2 formées par voie electrochimique et servant de protection anticorrosion ou de peinture primaire reactive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1285105A1 true EP1285105A1 (fr) | 2003-02-26 |
| EP1285105B1 EP1285105B1 (fr) | 2004-03-17 |
Family
ID=7640989
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP03025080A Withdrawn EP1394292A3 (fr) | 2000-05-06 | 2001-04-27 | Couches de TiO2 formées par voie electrochimique et servant de protection anticorrosion ou de peinture primaire reactive |
| EP01933902A Expired - Lifetime EP1285105B1 (fr) | 2000-05-06 | 2001-04-27 | Couches formees par voie electrochimique et servant de protection anticorrosion ou de peinture primaire reactive |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP03025080A Withdrawn EP1394292A3 (fr) | 2000-05-06 | 2001-04-27 | Couches de TiO2 formées par voie electrochimique et servant de protection anticorrosion ou de peinture primaire reactive |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US20040099535A1 (fr) |
| EP (2) | EP1394292A3 (fr) |
| AT (1) | ATE262056T1 (fr) |
| AU (1) | AU2001260260A1 (fr) |
| DE (2) | DE10022074A1 (fr) |
| ES (1) | ES2218415T3 (fr) |
| WO (1) | WO2001086029A1 (fr) |
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| US7820300B2 (en) * | 2001-10-02 | 2010-10-26 | Henkel Ag & Co. Kgaa | Article of manufacture and process for anodically coating an aluminum substrate with ceramic oxides prior to organic or inorganic coating |
| US7578921B2 (en) * | 2001-10-02 | 2009-08-25 | Henkel Kgaa | Process for anodically coating aluminum and/or titanium with ceramic oxides |
| US7569132B2 (en) * | 2001-10-02 | 2009-08-04 | Henkel Kgaa | Process for anodically coating an aluminum substrate with ceramic oxides prior to polytetrafluoroethylene or silicone coating |
| US7452454B2 (en) * | 2001-10-02 | 2008-11-18 | Henkel Kgaa | Anodized coating over aluminum and aluminum alloy coated substrates |
| EP1548157A1 (fr) * | 2003-12-22 | 2005-06-29 | Henkel KGaA | Protection contre la corrosion par des couches d'oxide de métal électrochimiquement déposées sur des substrats métalliques |
| FR2885370B1 (fr) * | 2005-05-03 | 2007-09-28 | Commissariat Energie Atomique | Procede de depot electrochimique, source de rayonnements alpha et x, fabriquee par ce procede, et dispositif d'analyse pixe-xrf, utilisant cette source. |
| WO2006136333A2 (fr) * | 2005-06-22 | 2006-12-28 | Henkel Kommanditgessellschaft Auf Aktien | Materiau d'electrodeposition, procede permettant de fournir une couche anticorrosion de tio2 a un substrat conducteur et substrat metallique revetu de couche de tio2 |
| WO2006136334A2 (fr) * | 2005-06-22 | 2006-12-28 | Henkel Kommanditgesellschaft Auf Aktien | Materiau de depot electrolytique, procede permettant de former une couche anticorrosion de tio2 sur un substrat electroconducteur et substrat metallique recouvert d'une couche de tio2 |
| WO2006136335A1 (fr) * | 2005-06-22 | 2006-12-28 | Henkel Kommanditgesellschaft Auf Aktien | PROCÉDÉ SERVANT À PRODUIRE UNE COUCHE DE PROTECTION CONTRE LA CORROSION EN TiO2 SUR UN SUBSTRAT ÉLECTRIQUEMENT CONDUCTEUR ET SUBSTRAT EN MÉTAL RECOUVERT D'UNE COUCHE DE TiO2 |
| US20080131709A1 (en) * | 2006-09-28 | 2008-06-05 | Aculon Inc. | Composite structure with organophosphonate adherent layer and method of preparing |
| US20090169903A1 (en) * | 2007-12-27 | 2009-07-02 | Kansai Paint Co., Ltd. | Process for producing metal substrate with multilayer film, metal substrate with multilayer film obtained by the process, and coated article |
| US8882983B2 (en) | 2008-06-10 | 2014-11-11 | The Research Foundation For The State University Of New York | Embedded thin films |
| US9701177B2 (en) | 2009-04-02 | 2017-07-11 | Henkel Ag & Co. Kgaa | Ceramic coated automotive heat exchanger components |
| US9493541B2 (en) | 2010-06-07 | 2016-11-15 | Joshua Rabbani | Antibodies specific for sulfated sclerostin |
| US20150010707A1 (en) * | 2013-07-02 | 2015-01-08 | Jian- Liang LIN | Method for Marking a Tool |
| CN105112967A (zh) * | 2015-09-11 | 2015-12-02 | 西南交通大学 | 一种具有骨诱导和抗菌性能的导电涂层的制备方法 |
| DE102018107563B4 (de) | 2018-03-29 | 2022-03-03 | Infineon Technologies Austria Ag | Halbleitervorrichtung mit kupferstruktur und verfahren zur herstellung einer halbleitervorrichung |
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| EP4061986A1 (fr) * | 2019-11-22 | 2022-09-28 | PPG Industries Ohio, Inc. | Procédés de dépôt électrolytique de compositions de prétraitement |
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- 2000-05-06 DE DE10022074A patent/DE10022074A1/de not_active Ceased
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- 2001-04-27 EP EP03025080A patent/EP1394292A3/fr not_active Withdrawn
- 2001-04-27 EP EP01933902A patent/EP1285105B1/fr not_active Expired - Lifetime
- 2001-04-27 WO PCT/EP2001/004780 patent/WO2001086029A1/fr not_active Ceased
- 2001-04-27 DE DE50101713T patent/DE50101713D1/de not_active Expired - Fee Related
- 2001-04-27 US US10/275,504 patent/US20040099535A1/en not_active Abandoned
- 2001-04-27 AT AT01933902T patent/ATE262056T1/de not_active IP Right Cessation
- 2001-04-27 AU AU2001260260A patent/AU2001260260A1/en not_active Abandoned
-
2007
- 2007-03-01 US US11/681,122 patent/US20070144914A1/en not_active Abandoned
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2008
- 2008-11-19 US US12/273,969 patent/US20090162563A1/en not_active Abandoned
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Also Published As
| Publication number | Publication date |
|---|---|
| US20070144914A1 (en) | 2007-06-28 |
| EP1394292A2 (fr) | 2004-03-03 |
| ES2218415T3 (es) | 2004-11-16 |
| WO2001086029A1 (fr) | 2001-11-15 |
| DE10022074A1 (de) | 2001-11-08 |
| AU2001260260A1 (en) | 2001-11-20 |
| EP1394292A3 (fr) | 2004-06-16 |
| ATE262056T1 (de) | 2004-04-15 |
| US20040099535A1 (en) | 2004-05-27 |
| US20090162563A1 (en) | 2009-06-25 |
| EP1285105B1 (fr) | 2004-03-17 |
| DE50101713D1 (de) | 2004-04-22 |
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