EP1291901A3 - Vorrichtung mit einem Greifer zur Handhabung von Platten - Google Patents
Vorrichtung mit einem Greifer zur Handhabung von Platten Download PDFInfo
- Publication number
- EP1291901A3 EP1291901A3 EP02019578A EP02019578A EP1291901A3 EP 1291901 A3 EP1291901 A3 EP 1291901A3 EP 02019578 A EP02019578 A EP 02019578A EP 02019578 A EP02019578 A EP 02019578A EP 1291901 A3 EP1291901 A3 EP 1291901A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- gripper device
- plates
- receiving plate
- manipulating plates
- manipulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Manipulator (AREA)
Abstract
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10144409A DE10144409B4 (de) | 2001-09-10 | 2001-09-10 | Vorrichtung mit einem Greifer zur Handhabung von Platten |
| DE10144409 | 2001-09-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1291901A2 EP1291901A2 (de) | 2003-03-12 |
| EP1291901A3 true EP1291901A3 (de) | 2005-12-07 |
Family
ID=7698419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP02019578A Withdrawn EP1291901A3 (de) | 2001-09-10 | 2002-09-02 | Vorrichtung mit einem Greifer zur Handhabung von Platten |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP1291901A3 (de) |
| DE (1) | DE10144409B4 (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10254762A1 (de) | 2002-11-22 | 2004-06-09 | Transcoject Gesellschaft für medizinische Geräte mbH & Co. KG | Verfahren zur Herstellung und/oder Handhabung eines hochreinen Gegenstandes |
| DE102005000665B4 (de) * | 2005-01-04 | 2009-05-20 | Nanophotonics Ag | Greifer zum Halten und Positionieren eines scheiben- oder plattenförmigen Objekts und Verfahren zum Halten und Positionieren eines scheiben- oder plattenförmigen Objekts |
| AT501643B1 (de) * | 2005-04-11 | 2006-12-15 | Mechatronic Systemtechnik Gmbh | Greifer zum handhaben dünner scheibenförmiger gegenstände |
| EP2843695B9 (de) | 2013-08-28 | 2021-04-14 | Mechatronic Systemtechnik GmbH | Vorrichtung, insbesondere Endeffektor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0924148A1 (de) * | 1997-12-16 | 1999-06-23 | SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG | Vorrichtung zum Transport dünner, scheibenförmiger Gegenstände |
| WO1999046806A1 (en) * | 1998-03-11 | 1999-09-16 | Trusi Technologies, Llc | Article holders and holding methods |
| EP1091389A2 (de) * | 1999-10-08 | 2001-04-11 | Infineon Technologies AG | Bernoulli- und Vakuum-Kombigreifer |
| WO2002012098A1 (en) * | 2000-08-04 | 2002-02-14 | Tru-Si Technologies, Inc. | Detection and handling of semiconductor wafers and wafer-like objects |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5067762A (en) * | 1985-06-18 | 1991-11-26 | Hiroshi Akashi | Non-contact conveying device |
-
2001
- 2001-09-10 DE DE10144409A patent/DE10144409B4/de not_active Expired - Fee Related
-
2002
- 2002-09-02 EP EP02019578A patent/EP1291901A3/de not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0924148A1 (de) * | 1997-12-16 | 1999-06-23 | SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG | Vorrichtung zum Transport dünner, scheibenförmiger Gegenstände |
| WO1999046806A1 (en) * | 1998-03-11 | 1999-09-16 | Trusi Technologies, Llc | Article holders and holding methods |
| EP1091389A2 (de) * | 1999-10-08 | 2001-04-11 | Infineon Technologies AG | Bernoulli- und Vakuum-Kombigreifer |
| WO2002012098A1 (en) * | 2000-08-04 | 2002-02-14 | Tru-Si Technologies, Inc. | Detection and handling of semiconductor wafers and wafer-like objects |
Also Published As
| Publication number | Publication date |
|---|---|
| DE10144409B4 (de) | 2004-11-18 |
| EP1291901A2 (de) | 2003-03-12 |
| DE10144409A1 (de) | 2003-03-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| AK | Designated contracting states |
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|
| AX | Request for extension of the european patent |
Extension state: AL LT LV MK RO SI |
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| PUAL | Search report despatched |
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| AK | Designated contracting states |
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| AX | Request for extension of the european patent |
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|
| RIC1 | Information provided on ipc code assigned before grant |
Ipc: 7H 01L 21/68 B Ipc: 7H 01L 21/00 A |
|
| 17P | Request for examination filed |
Effective date: 20060413 |
|
| AKX | Designation fees paid |
Designated state(s): AT FR GB IT |
|
| REG | Reference to a national code |
Ref country code: DE Ref legal event code: 8566 |
|
| 17Q | First examination report despatched |
Effective date: 20080205 |
|
| R17C | First examination report despatched (corrected) |
Effective date: 20080205 |
|
| RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: INFINEON TECHNOLOGIES AG |
|
| GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 20101208 |