EP1332106A2 - Procede de production de structures sandwich verre-silicium-verre - Google Patents
Procede de production de structures sandwich verre-silicium-verreInfo
- Publication number
- EP1332106A2 EP1332106A2 EP01993578A EP01993578A EP1332106A2 EP 1332106 A2 EP1332106 A2 EP 1332106A2 EP 01993578 A EP01993578 A EP 01993578A EP 01993578 A EP01993578 A EP 01993578A EP 1332106 A2 EP1332106 A2 EP 1332106A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- glass
- silicon substrate
- silicon
- substrate
- anodic bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011521 glass Substances 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 80
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 57
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 57
- 239000010703 silicon Substances 0.000 claims abstract description 57
- 238000000034 method Methods 0.000 claims abstract description 35
- 238000005530 etching Methods 0.000 claims abstract description 16
- 238000005498 polishing Methods 0.000 claims abstract description 9
- 238000000227 grinding Methods 0.000 claims abstract description 3
- 230000000873 masking effect Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000206 photolithography Methods 0.000 claims description 2
- 229920002120 photoresistant polymer Polymers 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- 238000003754 machining Methods 0.000 claims 2
- 238000007517 polishing process Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910008045 Si-Si Inorganic materials 0.000 description 1
- 229910006411 Si—Si Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
- B81C1/00357—Creating layers of material on a substrate involving bonding one or several substrates on a non-temporary support, e.g. another substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/019—Bonding or gluing multiple substrate layers
Definitions
- the invention relates to a method for producing irreversibly and aligned interconnected glass-silicon-glass sandwich structures, consisting of a lower and an upper glass substrate, and an intermediate silicon substrate, at least one of the substrates being provided with a 3-D depth structuring ,
- EP 0 633 468 A2 describes a process for the production of three-dimensional microcapillaries for the production of complex microsystems, which allows the integration of singular sensor elements using special fluidic, mechanical, electrical interface elements, the so-called channel stoppers.
- a disadvantage of this technology can be seen in the fact that the height of the microchannel cannot deviate from the specified thickness of the silicon substrate used, which is usually a few hundred micrometers, and therefore extremely small channel volumes of 150 ... 5 nl / cm can hardly be achieved are.
- PCT / DE 00/00768 describes a manufacturing technology for manufacturing 3-D manifolds, which is based on the use of low-temperature cofiring ceramic (short: LTCC - ceramic) and names the possibility as a specific advantage Integrate intersecting fluidic and electrical functional levels in a compact module. Cons This technology means that channel systems with channel volumes below 2 ⁇ l / cm cannot be produced in this way and that the surface quality of the ceramic material is significantly poorer because of the porosity of the materials silicon and glass. For extreme low-volume applications, this method is therefore [generally not suitable.
- SOI wafer material silicon on insulator
- Si-Si fusion bond 1000 ° C. for several hours.
- the disadvantage of the high material costs and the large additional technological expenditure in the production should be countered with the introduction of the production technology according to the invention.
- the invention has for its object to provide an inexpensive manufacturing process, particularly with a view to the mass production of glass-silicon-glass sandwich structures, which is also suitable for applications in, for example, molecular biology or biotechnology. -.
- the object on which the invention is based is achieved in that the silicon substrate is irreversibly connected to one of the glass substrates by anodic bonding before or after its 3-D deep structuring, the bond by means of grinding, etching and polishing methods of the glass and / or Silicon side is thinned to a predetermined final thickness and that the remaining silicon surface is subsequently connected to a second In glass substrate by anodic bonding.
- subclaims 2 and 3 show two advantageous variants of the method according to the invention.
- FIG. 1 shows:
- the glass-silicon-glass sandwich structures according to the invention can be used, for example, as a microreaction space in chemical analysis, the status of the chemical reaction taking place in the microcapillary 4 being able to be queried online and, due to the transparent structure, preferably by means of optical detection methods.
- the special feature of the manufacturing process according to the invention is that the manufacture of glass-silicon-glass sandwich structures is technically possible even with the smallest channel geometries or the smallest 3-D depth structuring and can also be carried out particularly economically and in bulk.
- the SOG process is to be understood as a silicon-on-glass process, in which the silicon substrate 1 is either attached unstructured to a glass substrate 3 by anodic bonding and subsequently thinned (variant I), or the silicon substrate 1 is structured, then with the structured one Side is fixed on the glass substrate 2 by anodic bonding and subsequently thinned (variant II).
- variant which variant can be used depends on the design and the required quality characteristics of the end product.
- the masking of the silicon substrate 1 by Coatings are carried out, which has been applied to the surface of the silicon substrate 1 by spin coating from Fotopolyme.ren or by a CVD coating.
- the deep etching by wet chemical or dry chemical, anisotropically working deep etching processes is used.
- the masking of the silicon substrate 1 is necessary, which is done by means of structured photoresists, structured metal layers or also by structured inorganic insulator layers.
- the structured metal layers can consist of aluminum. Si0 2 or Si 3 N 4 can be used as the inorganic insulator layers.
- Variant I of the process for producing a glass-silicon-glass sandwich structure comprises the following steps:
- the process comprises the following steps:
- the typical lateral dimensions of the microcapillary 4 ie the length, width and height of the microchannel, can be any value from a few 5 ⁇ m.
- the microcapillary can take any shape and can also be connected to a microreaction space or the like.
- Such electrode systems can be transparent or non-transparent, but in any case they can be extremely thin.
- holes 5 can be provided in one or both glass substrates 2, 3, which ensures access perpendicular to the course of the microchannel 4.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Joining Of Glass To Other Materials (AREA)
- Micromachines (AREA)
Abstract
L'invention concerne un procédé de production de structures sandwich verre-silicium-verre assemblées de manière mutuellement réglée et irréversible. Ces structures comprennent un substrat de verre inférieur (2), un substrat de verre supérieur (3) et, intercalé entre ces deux substrats, un substrat de silicium intermédiaire (1). Au moins un substrat (1, 2, ou 3) est pourvu d'une structure 3-D profonde. Pour obtenir un procédé de fabrication économique, notamment pour une production de masse de structures sandwich verre-silicium-verre, le substrat de silicium (1) est relié, de façon irréversible avant ou après sa structuration 3D profonde, à un substrat de verre (2 ou 3) par liaison anodique. La liaison est amincie par un procédé de meulage, de gravure et de polissage sur le côté verre et/ou silicium et réduite une épaisseur finale. Ensuite, la surface de silicium restante est assemblée au deuxième substrat de verre (3; 2) par liaison anodique.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10055155 | 2000-11-07 | ||
| DE10055155 | 2000-11-07 | ||
| PCT/DE2001/004141 WO2002038490A2 (fr) | 2000-11-07 | 2001-11-07 | Procede de production de structures sandwich verre-silicium-verre |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1332106A2 true EP1332106A2 (fr) | 2003-08-06 |
Family
ID=7662439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP01993578A Withdrawn EP1332106A2 (fr) | 2000-11-07 | 2001-11-07 | Procede de production de structures sandwich verre-silicium-verre |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP1332106A2 (fr) |
| WO (1) | WO2002038490A2 (fr) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IL82960A0 (en) * | 1986-06-30 | 1987-12-20 | Rosemount Inc | Differential pressure sensor |
| US4996627A (en) * | 1989-01-30 | 1991-02-26 | Dresser Industries, Inc. | High sensitivity miniature pressure transducer |
| DE4318407A1 (de) | 1993-06-03 | 1994-12-08 | Rossendorf Forschzent | Mikrokapillare mit integrierten chemischen Mikrosensoren und Verfahren zu ihrer Herstellung |
| DE4409068C2 (de) * | 1994-03-14 | 1998-05-28 | Hartmann & Braun Ag | Bondverfahren und damit hergestellte Bondverbindung |
| EP0975465A4 (fr) * | 1997-04-18 | 2000-05-10 | Topaz Tech Inc | Plaque de buse pour tete d'impression par jet d'encre |
-
2001
- 2001-11-07 EP EP01993578A patent/EP1332106A2/fr not_active Withdrawn
- 2001-11-07 WO PCT/DE2001/004141 patent/WO2002038490A2/fr not_active Ceased
Non-Patent Citations (1)
| Title |
|---|
| See references of WO0238490A2 * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002038490A2 (fr) | 2002-05-16 |
| WO2002038490A3 (fr) | 2002-08-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 20030522 |
|
| AK | Designated contracting states |
Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
| 17Q | First examination report despatched |
Effective date: 20040311 |
|
| RBV | Designated contracting states (corrected) |
Designated state(s): AT DE |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 20040923 |