EP1334341A1 - Capteur de pression et de force presentant une puce a resonateur, des parties mecaniquement separees (fentes) et une membrane souple - Google Patents

Capteur de pression et de force presentant une puce a resonateur, des parties mecaniquement separees (fentes) et une membrane souple

Info

Publication number
EP1334341A1
EP1334341A1 EP01980096A EP01980096A EP1334341A1 EP 1334341 A1 EP1334341 A1 EP 1334341A1 EP 01980096 A EP01980096 A EP 01980096A EP 01980096 A EP01980096 A EP 01980096A EP 1334341 A1 EP1334341 A1 EP 1334341A1
Authority
EP
European Patent Office
Prior art keywords
sensor
force
chip
sensor according
lateral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01980096A
Other languages
German (de)
English (en)
Inventor
Claudio Cavalloni
Marco Gnielka
Martin Haueis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kistler Holding AG
Original Assignee
KK Holding AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KK Holding AG filed Critical KK Holding AG
Publication of EP1334341A1 publication Critical patent/EP1334341A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0001—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means
    • G01L9/0008—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations
    • G01L9/0019—Transmitting or indicating the displacement of elastically deformable gauges by electric, electro-mechanical, magnetic or electro-magnetic means using vibrations of a semiconductive element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • G01L1/183—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material by measuring variations of frequency of vibrating piezo-resistive material

Definitions

  • the invention relates to a sensor according to the preamble of claim 1.
  • the chip used in which a resonator is used as a measuring sensor, is known from a lecture by Mr. M. Haueis at the 20th International Congress of Theoretical and Applied Mechanies, August 27 to September 02, 2000, Chicago, Illinois, USA, which was published as abstract TL1 "Single crystalline microresonator for force sensing with on-chip vibration excitation and detection" by M. Haueis et al.
  • a more detailed description of this sensor the development of which was based on the task of creating a sensor for an extended temperature range - up to about 300 ° C., is published in the paper: Haueis M. et al.
  • the chip of this known sensor is clamped in a housing by two bolts arranged on both sides of the sensor. It has now been shown that this sensor reacts sensitively to temperature fluctuations by which changing voltages are induced in the sensor. This temperature sensitivity is caused by different thermal expansion of chip material, in the present example silicon, and housing, which generally consists of steel.
  • the object of the invention is to at least reduce this temperature sensitivity, which is achieved by the features in the characterizing part of claim 1.
  • both sides of the chip can expand to different extents from the areas of the fastening without causing thermal mechanical stresses in the sensor.
  • the decoupled middle leg can be connected locally to the lateral legs by means of webs.
  • a precise adjustment of the chip in the direction of the force application can be achieved by a stop.
  • Another possibility is to align the outer edges of the lateral legs in the longitudinal direction parallel to the edge of the slot.
  • the middle leg via which the force is applied, can be prestressed relative to the lateral legs, preferably in tension, in order to improve the linearity of the measurement results and / or to determine the measurement range.
  • Fig. 1 in a spatial representation the chip containing the sensor
  • Fig. 2 shows a side view of the chip inserted into part of the housing
  • Fig. 3 is a plan view of FIG. 2;
  • Fig. 4 shows a longitudinal section IV-IV of Figure 3 through the complete, i.e. complemented by a second housing part, sensor; Fig. 5 in the same representation as Fig. 1, a second embodiment of the chip.
  • the measuring element of the sensor is a chip 1 (FIG. 1), which consists of three silicon wafers connected to one another in a gastight manner. He is Manufactured in a known manner using SOI technology and contains the actual sensor 2 in the middle layer, which is, for example, a micromechanical resonator, but can also be another force-sensitive element.
  • the middle layer which is, for example, a micromechanical resonator, but can also be another force-sensitive element.
  • piezoelectric or magnetorestrictive elements as well as piezoresistive or agnetoresistive resistors can be used as measuring sensors.
  • contact pads 3 are indicated above the sensor 2, via which the sensor 2 is connected to the associated electronics 15 (FIG. 2) by means of wire bonding.
  • a slot 4 shields the sensor 2 against mechanical incorrect loads, which can be caused, for example, by the bonded wire connections of the contact pads 3 to the electronics.
  • the sensor 2 is accommodated in a relatively narrow strip of the chip 1.
  • This strip which widens into a central leg 5 receiving the central fastening, is separated by slots 6 and cavities 7 from lateral legs 8 and mechanically decoupled, which in turn form the lateral fastenings. It has the task of bundling the forces introduced specifically to sensor 2.
  • a bolt 9 serves as the central fastening, which is inserted into a bore 10 of the chip 1 with slight play and is connected to a sensor head 11 (FIG. 4), for example, by crimping.
  • Partial surfaces 12 of the lateral legs 8 serve as lateral attachments, which are inserted into a slot 25 of a cylindrical housing part 13 (FIG. 2) and adjusted in the longitudinal direction of the chip 1 by a stop 14.
  • the subregions 12 can be additionally fixed in the housing part 13 by gluing or another fixed connection.
  • the chip 1 is aligned through the slot 25 in the two directions orthogonal to the introduction of force 17.
  • the sensor head 11, which has an internal thread 21 (FIG. 4) for connecting a force-introducing connection, is connected on its outer circumference to a steel membrane 22 which is connected in the longitudinal direction, ie in the direction of the force application, via a membrane sleeve 23 in the housing part 13 , adjustable and fixed (point 24).
  • this pretension preferably consists of a tensile load.
  • the membrane 22 is made relatively soft, as a result of which a high sensitivity and a reduction in the thermal errors reaching the measuring sensor are achieved.
  • the precise axial and central introduction of force into the chip 1 is improved with a soft membrane 22.
  • the webs 16 bridging the slots 6 have the effect that the elasticity of the sensor is great in the direction 17 of the force introduction, while there is increased rigidity in the two directions perpendicular thereto.
  • the thermal expansion of the components for the introduction of the force to be measured should be as large as possible as that of the fixing of the chip 1 in the housing part 13 and the introduction of force. This is preferably achieved by an identical choice of material for the components 11, 13 and 23 lying in between and an equal distance a between the application of force via the internal thread 21 to the bore 10 on the one hand and to the adhesive or clamping areas on the partial surfaces 12 of the lateral fastenings or to the stop 14 guaranteed.
  • a chip 1 for such a variant is shown in FIG. 5.
  • the displacement of the end of the side legs 8 or the fixing regions 12 resting against the stop 14 relative to the point of application of the force application at the bore 10 of the central leg 5 should be the difference in the thermal expansions of the different materials for the sensor head 11 on the one hand and for the membrane sleeve 23 and the housing part 13 on the other hand correspond to the maximum required temperature range.
  • the cylindrical housing part 13 is “cut open” on the left-hand side and forms a shell there, the free end of which is provided with a thread 18.
  • a second housing part 19 (FIG. 4) is screwed onto this, which closes the open shell of the housing part 13 and covers both the electronics 15 and the chip 1.
  • the part 19 is designed on the left as a hexagon head for the attachment of a wrench and on the right has a thread 20 with which the sensor can be screwed into a measurement object. Due to the two-part design of the housing, decoupling from the measurement object and an insensitivity to voltages caused by the installation of the sensor are also achieved.
  • the housing parts 13, 19 are preferably made of steel.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

En raison de dilatations thermiques différentes entre la puce (1), renfermant la sonde (2) et de préférence constituée de silicium, et le boîtier (13, 19) en général en acier, des tensions thermiques sont induites dans les sondes (2) dans le cas de variations thermiques, après le montage de la puce (1) dans le boîtier (13, 19), lesquelles tensions peuvent fausser les résultats de mesure. Selon la présente invention, ces tensions sont réduites par l'agencement de fixations centrales (9, 10) et latérales dans des parties de la puce (1) mécaniquement séparées les unes des autres, du côté de la sonde (2) où la force (17) est induite.
EP01980096A 2000-11-15 2001-11-07 Capteur de pression et de force presentant une puce a resonateur, des parties mecaniquement separees (fentes) et une membrane souple Withdrawn EP1334341A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH222300 2000-11-15
CH22232000 2000-11-15
PCT/CH2001/000650 WO2002040956A1 (fr) 2000-11-15 2001-11-07 Capteur de pression et de force presentant une puce a resonateur, des parties mecaniquement separees (fentes) et une membrane souple

Publications (1)

Publication Number Publication Date
EP1334341A1 true EP1334341A1 (fr) 2003-08-13

Family

ID=4568080

Family Applications (1)

Application Number Title Priority Date Filing Date
EP01980096A Withdrawn EP1334341A1 (fr) 2000-11-15 2001-11-07 Capteur de pression et de force presentant une puce a resonateur, des parties mecaniquement separees (fentes) et une membrane souple

Country Status (4)

Country Link
US (1) US20040011144A1 (fr)
EP (1) EP1334341A1 (fr)
JP (1) JP2004513378A (fr)
WO (1) WO2002040956A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060070464A1 (en) * 2004-09-30 2006-04-06 Walker Robert R On-board scale sensor with mechanical amplification and improved output signal apparatus and method
EP2414693B1 (fr) * 2008-12-22 2013-07-03 Aktiebolaget SKF Unité de palier munie de capteur
JP6228790B2 (ja) * 2013-09-18 2017-11-08 アルプス電気株式会社 圧力検知装置およびこれを使用した吸気圧測定装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3204454A (en) * 1962-02-21 1965-09-07 Asea Ab Means for measuring the tension in a strip or sheet shaped material
CH424312A (de) * 1964-08-15 1966-11-15 Kistler Instrumente Ag Beschleunigungskompensierter piezoelektrischer Messwandler
US4522066A (en) * 1982-05-13 1985-06-11 Kistler-Morse Corporation Temperature-compensated extensometer
DE3232817C1 (de) * 1982-09-03 1988-09-08 Endress U. Hauser Gmbh U. Co, 7867 Maulburg Biegefeder
JPH03148028A (ja) * 1989-11-02 1991-06-24 Matsushita Electric Ind Co Ltd 圧電型圧力センサ
FR2723638B1 (fr) * 1994-08-10 1996-10-18 Sagem Transducteur force-frequence a poutres vibrantes
DE19626081A1 (de) * 1996-06-28 1998-01-02 Siemens Ag Halbleiter-Bauelement
DE19840829B4 (de) * 1998-09-07 2005-10-20 Siemens Ag Verfahren zum Befestigen eines mikromechanischen Sensors in einem Gehäuse und Sensoranordnung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0240956A1 *

Also Published As

Publication number Publication date
US20040011144A1 (en) 2004-01-22
WO2002040956A1 (fr) 2002-05-23
JP2004513378A (ja) 2004-04-30

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