Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
  • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
  • B24D5/12—Cut-off wheels
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B28—WORKING CEMENT, CLAY, OR STONE
  • B28D—WORKING STONE OR STONE-LIKE MATERIALS
  • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
  • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
  • B28D1/04—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
  • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B28—WORKING CEMENT, CLAY, OR STONE
  • B28D—WORKING STONE OR STONE-LIKE MATERIALS
  • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
  • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
  • B28D1/12—Saw-blades or saw-discs specially adapted for working stone
  • B28D1/121—Circular saw blades
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B22—CASTING; POWDER METALLURGY
  • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
  • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
  • B22F2998/10—Processes characterised by the sequence of their steps

Definitions

• the invention is based on a tool for machine tools according to the preamble of claim 1.
• Diamond cutting disks for processing hard materials, in particular stone, concrete or masonry, with a base body to which a cutting surface has been applied are known.
• the cutting surface is composed of a binding material and abrasive cutting bodies or diamonds, which are integrated into the binding material in a hot-press sintering process.
• the invention relates to a tool for machine tools with a base body and a cutting surface which has a binding material in which abrasive ve cutting body, especially diamonds, are firmly integrated.
• At least one cutting body be surrounded with a jacket that protects the cutting body during the sintering process.
• the sheath can have a thickness of 0.001 mm to 0.05 mm. Effective protection can be achieved and in particular so-called graphitization, i.e. a chemical reaction of carbon-containing cutting bodies with the binding material at temperatures of approx. 600 ° C to 1200 ° C during the sintering process can be avoided. An associated destruction of the cutting bodies can be prevented and the life of the cutting bodies can be increased.
• the sheathing can be embedded in the sheathing in inexpensive and economical binding materials that could otherwise destroy the cutting body.
• the tool can advantageously be produced in a sintering process at temperatures between 600 ° C and 1200 ° C.
• the sintering can be carried out with less effort and at higher temperatures than a sintering process after a hot pressing process. There is no need for a mold as is required for hot pressing.
• the encased cutting body can be used for all sintering processes, e.g. Hot pressing, free sintering etc.
• the casing has at least one component of a base material reactive with the cutting body and at least one component of a non-reactive material. It can be removed during the sintering process non-reactive material reaches an advantageous protection of the cutter body and simultaneously by the 'base material, an advantageous connection to the cutter body and a beneficial compound can be prepared for the binding material by the non-reactive material.
• the casing consists only of non-reactive material, which means that the cutting body can be protected in a particularly advantageous manner.
• the base material is a metal or an alloy from the rows of the periodic table IVb, Vb, VIb, a particularly advantageous anchoring of the cutting body, in particular of diamonds, can be achieved in the casing.
• An advantageous chemical connection can be achieved between carbon (C) and the metallic materials from the rows IVb, Vb and VIb of the periodic table.
• the sheathing have more non-reactive material than reactive material, as a result of which reliable protection can be achieved, in particular during a sintering process with temperatures of 600 ° C. to 1200 ° C.
• Particularly suitable as non-reactive material are metals or metal alloys, specifically from the series Ib, Ilb, VIIIb, lilac and IVa of the periodic table. With the listed non-reactive metals, a secure connection can be created between the casing and the binding material of the cutting surface and advantageous protection can be achieved.
• jackets which are based on the reactive and the non-reactive active material approx. 10 - 30% Cr, 50 - 70% Ni and 10 - 30% Cu or 40 - 60% bronze, 30 - 50% 'Cu and 1 - 15% Ti.
• cutting bodies are advantageously combined with one another, such as Diamonds with cubic boron nitride (CBN) and / or with tungsten carbide (WC) etc., which means that the area of application can be expanded to include steel or reinforced concrete.
• CBN cubic boron nitride
• WC tungsten carbide
• cutting bodies of only one specific type, in particular diamonds can each be surrounded by a covering, all cutting bodies can each be surrounded by the same covering, or different ones
• a binder is being prepared, - the metallic components, the abrasive cutting elements and the binder are mixed and processed into granules,
• the abrasive cutting bodies, the casing and the binding material are connected to the liquid phase by diffusion and / or by a chemical reaction and / or by sintering.
• the solution according to the invention can be used with various tools with abrasive cutting bodies that appear to be useful to the person skilled in the art, such as, for example, with drills, grinding tools and in particular with cutting discs.
• FIG. 1 shows a diamond cutting disc according to the invention
• FIG. 2 shows an enlarged illustration of a section along the line II-II in FIG. 1
• FIG. 3 shows an enlarged detail III from FIG. 2,
• FIG. 1 shows a diamond cutting disc 20 according to the invention of a cut-off machine (not shown in more detail) with a base body 10 and individual segments 22.
• the segments 22 have a cutting surface 12 with a binding material 14 in which abrasive cutting bodies 16, namely polycrystalline diamonds, in a free-sintering process , are firmly integrated.
• the cutting bodies 16 are each surrounded by a casing 18, which protect the cutting bodies 16 during the sintering process (FIGS. 2 and 3).
• the casing 18 has a component of a base material reactive with the cutting body 16 and a component of a non-reactive material.
• the reactive and the non-reactive material form a Cr-Ni-Cu alloy, whereby Cr form the base material and Ni and Cu form the non-reactive material.
• the individual metallic components are mixed in powder form. The mixed metallic components and the diamonds 16 are then weighed in the required amount.
• a binder consisting of a plastic powder and an isopropanol is stirred together to form a solution.
• the pasty binder, the metallic components and the cutting body 16 are then mixed and in one
• Granulating machine processed into granules. This produces granules with a size between 0.1 mm and 1.7 mm, the sheathing 18 of the cutting body 16 having a thickness of 0.001 mm to 0.05 mm.
• the resulting granulate and a metallic powder, which forms the binding material 14 of the cutting surface 12, are mixed and pressed to form a green compact, which is then sintered in a free-sintering process at 600 ° C. to 1200 ° C.
• Rows Ib, VIb and Vlllb of the periodic table or an alloy of these elements is used.
• the base material undergoes a chemical reaction with the cutting body 16 and combines with it.
• the non-reactive material protects the cutting body 16 and on the one hand largely prevents the cutting body 16 from decomposing by the base material, and on the other hand sinters the non-reactive material with the binding material 14 of the cutting surface 12 and promotes the holding of the cutting body 16 in the
• the casing 18, the cutting body 16 and the binding material 14 are firmly connected to one another by diffusion after the sintering process.

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Chemical & Material Sciences (AREA)
• Mining & Mineral Resources (AREA)
• Materials Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Polishing Bodies And Polishing Tools (AREA)
• Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
• Powder Metallurgy (AREA)

Applications Claiming Priority (3)

Publications (2)

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ID=7688733

Family Applications (1)

Country Status (7)

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Family Cites Families (7)

• 2001
  • 2001-06-20 DE DE10129599A patent/DE10129599A1/de not_active Ceased
• 2002
  • 2002-05-10 EP EP02748697A patent/EP1402080B1/fr not_active Expired - Lifetime
  • 2002-05-10 CN CNB028124286A patent/CN1272455C/zh not_active Expired - Fee Related
  • 2002-05-10 WO PCT/EP2002/005156 patent/WO2003000943A2/fr not_active Ceased
  • 2002-05-10 KR KR1020037002359A patent/KR100895962B1/ko not_active Expired - Fee Related
  • 2002-05-10 JP JP2003507323A patent/JP2004520957A/ja active Pending
  • 2002-05-10 DE DE50213872T patent/DE50213872D1/de not_active Expired - Lifetime
  • 2002-05-10 AT AT02748697T patent/ATE443779T1/de not_active IP Right Cessation

Non-Patent Citations (1)

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