EP1406351B2 - Connecteur à broches - Google Patents

Connecteur à broches Download PDF

Info

Publication number
EP1406351B2
EP1406351B2 EP03020970A EP03020970A EP1406351B2 EP 1406351 B2 EP1406351 B2 EP 1406351B2 EP 03020970 A EP03020970 A EP 03020970A EP 03020970 A EP03020970 A EP 03020970A EP 1406351 B2 EP1406351 B2 EP 1406351B2
Authority
EP
European Patent Office
Prior art keywords
insulating body
circuit board
plane
printed circuit
male strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP03020970A
Other languages
German (de)
English (en)
Other versions
EP1406351A2 (fr
EP1406351B1 (fr
EP1406351A3 (fr
Inventor
Walter Apfelbacher
Annemarie Lehmeier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=31984367&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP1406351(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of EP1406351A2 publication Critical patent/EP1406351A2/fr
Publication of EP1406351A3 publication Critical patent/EP1406351A3/fr
Application granted granted Critical
Publication of EP1406351B1 publication Critical patent/EP1406351B1/fr
Publication of EP1406351B2 publication Critical patent/EP1406351B2/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals

Definitions

  • the invention relates to a pin header for surface mounting on a printed circuit board, with fixed in an insulator angled pins, each pin has a provided for soldering on the circuit board, while parallel to this aligning support leg and a vertical adjoining this contact leg.
  • EP 0 612 204 B1 is a pin header for surface mounting on a printed circuit board with fixed in an insulator spaced from the insulator fixed angled pins known; Each pin has a designated for soldering on the circuit board, aligned parallel to this free support leg and a perpendicular to this subsequent, fixed in the insulating contact leg.
  • T2 is an electrical connector assembly with fixed in an insulating housing terminals with perpendicular, laterally protruding from the housing solder tails known; the lower edges of the solder tails facing a printed circuit board lie in a plane with the base edges of the housing; a similar connector assembly is characterized by the EP 0 747 998 A2 known, wherein the base edges of the terminals and Lötfahen receiving housing are offset from the lower edges of the Lötfahen and with respect to the printed circuit board in the distance.
  • a pin header is known in which perpendicular to a circuit board extending portions of angled contact pins are soldered to this; To increase the mechanical strength between the pin header and the circuit board in addition, the pins holding plastic part of the header is mechanically connected to the circuit board.
  • the invention has for its object to provide a particularly simple design, suitable for surface mounting on a circuit board pin header, which allows for a small footprint a mechanically particularly stable connection between pin header and circuit board the task.
  • the pin header is particularly stable on the circuit board fixed. Furthermore, a particularly reliable electrical and mechanical connection to the circuit board is given by the arrangement of the projecting out of the insulating support legs parallel to the surface of the circuit board. An additional mechanical connection of the insulating body with the circuit board is not required.
  • the Isolier Sciences ground Structure or at least a portion of this surface is less from the surface of the circuit board - generally a mounting plane - spaced as the lower edge of the support legs. If the Isolier analyses ground Structure on the mounting plane, so the support legs are thus slightly raised from this level. In this way, a space for applying provided for contacting the support leg solder paste is given on the circuit board, while ensuring that the insulating body rests aligned parallel to the mounting plane on the circuit board.
  • the support leg provided for support on the printed circuit board is preferably covered by at least 50%, in particular at least 65% of its length, by the insulating body.
  • a complete coverage of the support leg through the insulator is possible.
  • the supported on the circuit board insulator thus contributes in a particularly effective manner for stable fixation of the pin header on the circuit board.
  • a separate holding frame, such as with pins, which engage in holes in the circuit board is therefore not required.
  • an opposite, ie the printed circuit board facing away Isolier stresses away Isolier stressesab gleich is preferably smaller in size than the Isolierterrorism ground materials.
  • the dimensioning here refers in each case to the outer contours of the Isolierterrorism ground Structure and the Isolier stressesab gleich construction.
  • the surfaces mentioned, in particular the insulator base surface can also be formed in a frame-shaped or otherwise non-closed manner.
  • the reduced dimensions of the Isolier stressesab gleich Structure compared to Isolier Economics ground construction can be realized, for example, characterized in that at least one arranged between the two surfaces mentioned Isolieroasae Structure is set at least in a partial area obliquely.
  • the insulating body may also be designed in such a stepped manner that a relatively narrow section, which is intended to rest on the printed circuit board, has a relatively narrow section connects to Isolier analysesab gleich Structure back.
  • the relatively narrow portion preferably serves as the contact leg of the pin alone or together with other parts of the insulator retaining reinforcing portion.
  • each individual pin can be embedded in a separate reinforcing section or a single reinforcing section can fix several pins at the same time.
  • a fixation of the support leg in the insulating body can also be provided at least in some areas.
  • a slip-on body can be placed on the insulating body.
  • the plug-on body is placed on the insulating body only after the soldering operation and is preferably provided for receiving a plug which contacts the contact legs of the pins.
  • the advantage of the invention is, in particular, that in a surface-mountable male connector with parallel to a circuit board on this resting legs angled pins a fixing these insulating on the circuit board and thus a particularly stable connection of the pin header to the circuit board with rationally feasible soldering and low Space requirement on the circuit board allows.
  • FIGS. 1a to 1g show a pin header 1 with a manufactured as an injection molded plastic part 2 and held in this angled pins 3 made of metal.
  • An attachable to the insulating or body 2 Aufsteckêt is not shown in this embodiment.
  • the illustrated pin header 1 comprises two pins 3; Likewise, an arbitrarily higher number of pins 3 could be taken together in a single insulator 2. Also a multi-row arrangement of pins 3 in an insulating body 2 is possible.
  • Each pin 3 has a support leg 4, which is provided for soldering on a printed circuit board and is arranged parallel to this, and a right angle adjoining the support leg 4 as a contact leg 5 designated second leg, which allows the connection of a component, not shown.
  • the support legs 4 are angled in the embodiment in the same direction, but may also be angled in opposite directions.
  • the insulating body 2 has a substantially rectangular outer contour in plan view and can be placed with a Isoliersammlungground Structure 6 on a circuit board.
  • the Isolierterrorismground Structure 6 is stepped and thus leaves on the outer contour of the insulating body 2 space for the passage of the support leg 4 between the circuit board and the insulating body 2.
  • the lower edges 7 of the support leg 4 and the Isolier stresses ground Structure 6 partially in a common plane E.
  • E1 and the plane in which the circuit board is the smallest spaced part of the Isolier Economics ground Structure 6, denoted by E2.
  • the first plane E1 which is given by the support legs 4
  • the second plane E2 which is given by the Isolier emotions ground Structure 6, in the illustrated embodiment, virtually identical and therefore equated with the common plane E.
  • pin header 1 When mounted on a circuit board pin header 1 falls the plane E ( Fig. 1e ) at least almost together with a mounting plane ME, which is given by the circuit board surface. A slight distance between the plane E and the mounting plane ME may be generated by applied solder paste.
  • a smooth, angular fit of the insulating body 2 on the printed circuit board is, as in Fig. 1g schematically shown in an exaggerated manner, provided according to a preferred embodiment, a deviation of the first plane E1 of the second plane E2.
  • the first plane E1 of the mounting plane ME is further spaced than the second plane E2.
  • the second level E2 is identical to the mounting level ME.
  • the insulator 2 is thus supported smoothly on the circuit board, while at the same time there is sufficient space for the application of solder paste between the circuit board and the support leg 4 of the pin 3.
  • the pin header 1 is thus securely attached to the circuit board without further fasteners.
  • the support leg 4 can be soldered to virtually the entire length L to the circuit board. About two-thirds of the length L, denoted cover length AL, are covered by the insulating body 2. In the illustrated embodiment, each support leg 4 has a tip 8, which is not absolutely necessary. Likewise, the pins 3, for example, also have a round or other cross section instead of the illustrated square cross section.
  • the Isolier Sciences ground Structure 6 is composed of two arranged on adjacent corners of the insulating body 2 lying in the plane E base surfaces 9 and one of the plane E spaced circumferential surface 10, which completes the rectangular outer contour of the insulating body 2.
  • the insulating body 2 has four Isolier Sciencese lake 11, which are inclined relative to the plane E.
  • the insulating body 2 with the pins 3 held in this is suitable for mounting with a conventional pick and place machine.
  • the soldering of the insulating body 2 takes place simultaneously with the soldering of the other arranged on the circuit board surface mount components (SMD components).
  • SMD components circuit board surface mount components
  • the soldering process may cause minor geometry changes. In particular, it is not ensured that the grid dimension R, for example 5.0 or 5.08 mm, which is given by the spacing of adjacent pins 3, in particular in the upper, i. the plane E remote from the region of the contact legs 5 is still observed exactly.
  • FIGS. 2a to f As well as in the FIGS. 3a, b shown in various embodiments, after the soldering process made of plastic slip body 15 attachable.
  • the plug-on body 15 engages around the insulating body 2 and rests on a printed circuit board 16.
  • a plug 17 can be inserted.
  • the plug-on body 15 is mechanically connected exclusively by the soldered pin header 1 to the circuit board 16.
  • two screws 18 are provided which serve the mechanical connection of the plug-on body 15 with the circuit board 16 or another, not shown component. Such a screw is only, as from a comparison of FIGS. 2a to f with the FIGS. 3a, b it can be seen in a relatively large slip body 15 required.

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Dry Shavers And Clippers (AREA)
  • Connecting Device With Holders (AREA)

Claims (7)

  1. Barrette à broches (1) à monter en surface sur une carte à circuit imprimé (16) et munie de broches (3) repliées fixées dans un corps isolant (2), chaque broche (3) comportant une branche d'appui (4), prévue pour le brasage sur la carte à circuit imprimé et par conséquent orientée parallèlement à celle-ci, ainsi qu'une branche de contact (5) qui suit en angle droit la branche d'appui et le corps isolant (2) comportant une surface de base (6) ayant une surface de socle (9) qui repose sur la carte à circuit imprimé (16) au sens d'un appui ainsi qu'une surface circulaire (10), située à distance de son plan (E, E1, E2) et dans la zone de laquelle les branches d'appui (4) dépassent du corps isolant (2), les bords inférieurs (7) orientés vers la carte à circuit imprimé (16) étant situés pratiquement dans le même plan (E, E1, E2) que la surface de socle (9), caractérisée en ce que des surfaces de socle (9) sont placées sur le côté du corps isolant (2) qui est en face du côté du corps isolant (2) où les branches d'appui (4) dépassent du contour extérieur du corps isolant (2), les contours extérieurs d'une surface terminale de corps isolant (14) située en face de la surface de base de corps isolant (6) ayant de plus petites dimensions que les contours extérieurs de la surface de base de corps isolant (6), une surface latérale de corps isolant (11) placée entre la surface de base de corps isolant (6) et la surface terminale de corps isolant (14) étant en biais par rapport à la surface de base de corps isolant (6).
  2. Barrette à broches (1) selon la revendication 1, caractérisée en ce que les bords inférieurs (7) - orientés vers la carte à circuit imprimé - des branches d'appui (4) se trouvent dans un premier plan (E1) situé à une distance maximale de 0,05 mm d'un deuxième plan (E2) dans lequel se trouve la partie de la surface de base de corps isolant (6) prévue pour la mise en place sur un plan de montage (ME) de la carte à circuit imprimé.
  3. Barrette à broches (1) selon la revendication 2, caractérisée en ce que le deuxième plan (E2) est à une moindre distance du plan de montage (ME) que le premier plan (El).
  4. Barrette à broches (1) selon l'une des revendications 1 à 3, caractérisée en ce que chaque branche d'appui (4) est re-couverte par le corps isolant (2) sur au moins 50 % de sa longueur (L).
  5. Barrette à broches (1) selon l'une des revendications 1 à 4, caractérisée en ce que la branche de contact (4) de chaque broche (3) est maintenue par une portion de renforcement (13) - du corps isolant (2) - placée entre la surface terminale de corps isolant (14) et une surface intermédiaire de corps isolant (12).
  6. Barrette à broches (1) selon l'une des revendications 1 à 5, caractérisée par un corps enfichable (15) qui peut être posé sur le corps isolant (2).
  7. Barrette à broches (1) selon la revendication 6, caractérisée en ce que le corps enfichable (15) est prévu pour recevoir une prise (17) qui assure le contact des branches de contact (5).
EP03020970A 2002-10-02 2003-09-16 Connecteur à broches Expired - Lifetime EP1406351B2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10246094A DE10246094A1 (de) 2002-10-02 2002-10-02 Stiftleiste
DE10246094 2002-10-02

Publications (4)

Publication Number Publication Date
EP1406351A2 EP1406351A2 (fr) 2004-04-07
EP1406351A3 EP1406351A3 (fr) 2006-03-22
EP1406351B1 EP1406351B1 (fr) 2007-11-07
EP1406351B2 true EP1406351B2 (fr) 2013-01-16

Family

ID=31984367

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03020970A Expired - Lifetime EP1406351B2 (fr) 2002-10-02 2003-09-16 Connecteur à broches

Country Status (3)

Country Link
EP (1) EP1406351B2 (fr)
AT (1) ATE377856T1 (fr)
DE (2) DE10246094A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016050586A1 (fr) 2014-10-02 2016-04-07 Wago Verwaltungsgesellschaft Mbh Barrette à broches

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011077550B4 (de) * 2011-06-15 2017-03-23 Preh Gmbh Verbesserte Stiftleiste zur Oberflächenmontage

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4439000A (en) † 1982-03-31 1984-03-27 Amp Incorporated Surface mount/daughter board connector
EP0616489A1 (fr) † 1993-03-19 1994-09-21 Mitsui Mining & Smelting Co., Ltd. Laminé revêtu de cuivre et plaque à circuit imprimé
DE68918621T2 (de) † 1988-04-11 1995-05-18 Whitaker Corp Elektrischer Verbinder mit verbesserten Eigenschaften für das Festhalten der Leiter am Verbindergehäuse.
DE69210783T2 (de) † 1991-12-09 1996-10-02 Molex Inc Sockel-Deckung
EP0765010A2 (fr) † 1995-09-14 1997-03-26 Molex Incorporated Connecteur de plaque-à-plaque empêchant l'effet mèche
US5681174A (en) † 1995-12-21 1997-10-28 The Whitaker Corporation Electrical connector with releasable positioning cover
DE29904493U1 (de) † 1999-03-11 1999-06-10 Siemens AG, 80333 München Auf einer Leiterplatte montierbare Stiftleiste mit abgewinkelten Kontaktstiften
DE10009215C1 (de) † 2000-02-26 2001-05-10 Harting Kgaa Steckverbinder sowie Verfahren zur Herstellung eines Steckverbinders
US6328600B1 (en) † 1999-03-15 2001-12-11 J.S.T. Mfg. Co., Ltd. Horizontally and vertically convertible connector for printed circuit boards

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0511664Y2 (fr) * 1989-07-19 1993-03-23
US5242311A (en) * 1993-02-16 1993-09-07 Molex Incorporated Electrical connector header with slip-off positioning cover and method of using same
US5785536A (en) * 1995-06-07 1998-07-28 Santec, Inc. Connector having press fit mating shrouds
US5655914A (en) * 1995-06-07 1997-08-12 Samtec, Inc. Connector having press fit mating shrouds
DE19736607C1 (de) * 1997-08-22 1999-07-15 Dunkel Otto Gmbh Leiterplattensteckbuchse

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4439000A (en) † 1982-03-31 1984-03-27 Amp Incorporated Surface mount/daughter board connector
DE68918621T2 (de) † 1988-04-11 1995-05-18 Whitaker Corp Elektrischer Verbinder mit verbesserten Eigenschaften für das Festhalten der Leiter am Verbindergehäuse.
DE69210783T2 (de) † 1991-12-09 1996-10-02 Molex Inc Sockel-Deckung
EP0616489A1 (fr) † 1993-03-19 1994-09-21 Mitsui Mining & Smelting Co., Ltd. Laminé revêtu de cuivre et plaque à circuit imprimé
EP0765010A2 (fr) † 1995-09-14 1997-03-26 Molex Incorporated Connecteur de plaque-à-plaque empêchant l'effet mèche
US5681174A (en) † 1995-12-21 1997-10-28 The Whitaker Corporation Electrical connector with releasable positioning cover
DE29904493U1 (de) † 1999-03-11 1999-06-10 Siemens AG, 80333 München Auf einer Leiterplatte montierbare Stiftleiste mit abgewinkelten Kontaktstiften
US6328600B1 (en) † 1999-03-15 2001-12-11 J.S.T. Mfg. Co., Ltd. Horizontally and vertically convertible connector for printed circuit boards
DE10009215C1 (de) † 2000-02-26 2001-05-10 Harting Kgaa Steckverbinder sowie Verfahren zur Herstellung eines Steckverbinders

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
TYCO ELECTRONICS CORPORATION: "Modular Jack Surface Mount PC (Printed Circuit) Board Assemblies", TYCO/ELECTRONICS AMP, APPLICATION SPECIFICATION 114-6040, 8 February 2002 (2002-02-08) - 8 February 2002 (2002-02-08), HARRISBURG, PA, pages 1 - 14 †

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016050586A1 (fr) 2014-10-02 2016-04-07 Wago Verwaltungsgesellschaft Mbh Barrette à broches
US9819106B2 (en) 2014-10-02 2017-11-14 Wago Verwaltungsgesellschaft Mbh Male strip connector

Also Published As

Publication number Publication date
ATE377856T1 (de) 2007-11-15
DE10246094A1 (de) 2004-04-22
EP1406351A2 (fr) 2004-04-07
EP1406351B1 (fr) 2007-11-07
EP1406351A3 (fr) 2006-03-22
DE50308528D1 (de) 2007-12-20

Similar Documents

Publication Publication Date Title
DE69323340T2 (de) Randverbinder für eine Leiterplatte
DE10006530A1 (de) Antennenfeder
DE69620494T2 (de) Batterieklemme von Miniatur-elektronischem Gerät und Struktur zur Aufnahme
DE4005829C2 (fr)
DE3221459A1 (de) Montagesockel fuer magnetblasenspeicher
DE4409612C2 (de) Elektrische Vorrichtung zum Verbinden elektrischer Leiter, insbesondere Reihenklemme
DE2933359A1 (de) Elektrische lampe mit einem huelsenfoermigen sockel
EP0822337B1 (fr) Dispositif de montage pour un ventilateur électrique, en particulier pour un petit ventilateur
DE3738545C2 (fr)
DE10008932A1 (de) Elektrischer Stecker
DE69813640T2 (de) Elektrische verbinder
DE69401510T2 (de) Festhalteelement zum festhalten von elektrischen und/oder elektronischen komponenten
EP1406351B2 (fr) Connecteur à broches
EP0909467B1 (fr) Petite lampe a incandescence et support pour une telle lampe
DE102010043495B4 (de) Elektrisches Bauteil zur Oberflächenmontage
DE3808704A1 (de) Kontaktfahne fuer stromschienensysteme auf leiterplatten
EP0648382B1 (fr) Connecteur de filtrage a fiches avec boitier de blindage
WO2019086066A1 (fr) Connecteur enfichable
EP1206005A1 (fr) Contact à crimp pour des plaquettes à circuits
DE4125823C1 (en) Screened connector for mounting on circuit board - has fasteners for fitting in holes in PCB, which have upper and lower sprung legs pushed into corresp. recesses in connector body
EP0731538A1 (fr) Connecteur à dispositif de fixation
DE2445292C2 (de) Leuchte
DE102017105470B4 (de) Leuchtenbaugruppe
DE29503735U1 (de) Abgeschirmtes Gehäuse für Hochfrequenzschaltungen
EP0508395A1 (fr) Dispositif pour mise à la terre

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL LT LV MK

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL LT LV MK

RIC1 Information provided on ipc code assigned before grant

Ipc: H01R 12/04 20060101AFI20060131BHEP

17P Request for examination filed

Effective date: 20060606

17Q First examination report despatched

Effective date: 20060926

AKX Designation fees paid

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REF Corresponds to:

Ref document number: 50308528

Country of ref document: DE

Date of ref document: 20071220

Kind code of ref document: P

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 20080117

ET Fr: translation filed
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080218

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071107

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080207

NLV1 Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080207

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071107

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071107

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071107

PLBI Opposition filed

Free format text: ORIGINAL CODE: 0009260

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071107

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071107

26 Opposition filed

Opponent name: WAGO VERWALTUNGSGESELLSCHAFT MBH

Effective date: 20080801

PLAX Notice of opposition and request to file observation + time limit sent

Free format text: ORIGINAL CODE: EPIDOSNOBS2

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080407

REG Reference to a national code

Ref country code: IE

Ref legal event code: FD4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071107

PLAF Information modified related to communication of a notice of opposition and request to file observations + time limit

Free format text: ORIGINAL CODE: EPIDOSCOBS2

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080208

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071107

PLBB Reply of patent proprietor to notice(s) of opposition received

Free format text: ORIGINAL CODE: EPIDOSNOBS3

BERE Be: lapsed

Owner name: SIEMENS A.G.

Effective date: 20080930

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071107

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080930

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080930

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071107

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080916

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080930

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080930

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080916

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080508

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20071107

APBM Appeal reference recorded

Free format text: ORIGINAL CODE: EPIDOSNREFNO

APBP Date of receipt of notice of appeal recorded

Free format text: ORIGINAL CODE: EPIDOSNNOA2O

APAH Appeal reference modified

Free format text: ORIGINAL CODE: EPIDOSCREFNO

APBU Appeal procedure closed

Free format text: ORIGINAL CODE: EPIDOSNNOA9O

RIC2 Information provided on ipc code assigned after grant

Ipc: H01R 12/57 20110101AFI20121018BHEP

PUAH Patent maintained in amended form

Free format text: ORIGINAL CODE: 0009272

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: PATENT MAINTAINED AS AMENDED

27A Patent maintained in amended form

Effective date: 20130116

AK Designated contracting states

Kind code of ref document: B2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: DE

Ref legal event code: R102

Ref document number: 50308528

Country of ref document: DE

Effective date: 20130116

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 14

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 15

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 16

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20190918

Year of fee payment: 17

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20190902

Year of fee payment: 17

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20191119

Year of fee payment: 17

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20190926

Year of fee payment: 17

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 50308528

Country of ref document: DE

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20200916

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210401

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200930

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200916

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200916