EP1415519A1 - Chassis de brochage soude - Google Patents

Chassis de brochage soude

Info

Publication number
EP1415519A1
EP1415519A1 EP02756051A EP02756051A EP1415519A1 EP 1415519 A1 EP1415519 A1 EP 1415519A1 EP 02756051 A EP02756051 A EP 02756051A EP 02756051 A EP02756051 A EP 02756051A EP 1415519 A1 EP1415519 A1 EP 1415519A1
Authority
EP
European Patent Office
Prior art keywords
lead
leadframe
holes
hole
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02756051A
Other languages
German (de)
English (en)
Inventor
Lars Gustafsson
Jan ÖHRN
Per LUNDSTRÖM
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of EP1415519A1 publication Critical patent/EP1415519A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts

Definitions

  • the invention is related to a method of joining leads to substrates, e.g. in the manufacture of subassemblies mounted on a larger circuit board.
  • a subassembly here taken as comprising a carrier having a conductive pattern, various components mounted thereto and a leadframe. If the subassembly has the carrier, e.g. a ceramic substrate, located under the leadframe, the weight of the carrier and the components may cause the assembly to collapse and the substrate to fall down. This case is illustrated in Fig. 1.
  • the carrier e.g. a ceramic substrate
  • Solder is herein taken to mean an alloy having a melting point below 450°C, intended for joining two parts at a temperature below the melting points of these parts.
  • a braze is an alloy having a melting point higher than 450 °C and intended for the same use.
  • solders in the desired temperature range have disqualifying properties such as brittleness, high cost or that they can contain hazardous substances. Also, many components cannot withstand the elevated temperature needed when using high temperature solders. - The components cannot withstand the high temperature needed for the reflow process of brazing materials.
  • holes are made in the leads of the frame and then the leads are welded to the pads.
  • the holes reduce the energy required for the welding.
  • the holes can preferably cover about 50% of the area heated in the welding process.
  • Fig. 1 is a cross-sectional view of a leadframe joined to a substrate
  • FIG. 2 is fragmentary plan view of a lead joined to a contact pad.
  • a subassembly comprising an e.g. ceramic substrate 1 joined to a leadframe 3 at joining positions 5.
  • connection leads or legs 7 of the leadframe are made to be electrically connected to pads 9 of the substrate, see the fragmentary, plan view of Fig. 2.
  • the leads 7 have a thickness considerably larger than then thin contact pads 9.
  • the leads are welded to the pads using e.g. a laser beam, plasma welding, a microflame, as indicated at 10.
  • the pads will hence be more easily heated than the leads due to the difference in heat capacity resulting from the different thicknesses.
  • the leads 7 are provided with at least one and preferably two holes 11 covering e.g. about 50% of the area heated in the welding. These holes can have any shape, e.g. being circular as illustrated in the figure.
  • a meltdown of the material in the walls of the holes 11 or in the edge regions of the lead at the holes is obtained, the melted material flowing down to be joined with the material of the underlying pad 9.
  • the leadframe is heated at regions around the holes and also the substrate, i.e. the pads 9 thereof, the latter heating occurring through the holes 11.
  • the holes 11 can have a diameter in the range of about 0.1 - 0.8 mm made in the leadframe material which can have a thickness in the range 0.1 - 1 mm.
  • the incoming, heating energy indicated by the arrows 10, has a direction that is approximately perpendicular to the large surface of the components to be welded to each other.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

En assemblant un conducteur d'un châssis de brochage (3) ou d'un composant à une plage de contact (9) d'un substrat (1), le conducteur et la plage de contact sont localement soudés aux fins de liaison électrique. Pour réduire la puissance utilisée lors du soudage, le conducteur présente au moins un trou, de préférence, deux trous (11) si bien que lors du soudage, le matériau du conducteur fond en bordure des trous et est ainsi assemblé au matériau chauffé de la plage. Lors du soudage, on peut ainsi utiliser une puissance assez faible puisque le chauffage local utilisé lors du soudage, engendre la fusion, de préférence ou principalement, du matériau des parois de ce ou ces trou(s).
EP02756051A 2001-08-07 2002-08-07 Chassis de brochage soude Withdrawn EP1415519A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE0102668 2001-08-07
SE0102668A SE521528C3 (sv) 2001-08-07 2001-08-07 Svetsad benram
PCT/SE2002/001434 WO2003015485A1 (fr) 2001-08-07 2002-08-07 Chassis de brochage soude

Publications (1)

Publication Number Publication Date
EP1415519A1 true EP1415519A1 (fr) 2004-05-06

Family

ID=20284987

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02756051A Withdrawn EP1415519A1 (fr) 2001-08-07 2002-08-07 Chassis de brochage soude

Country Status (6)

Country Link
EP (1) EP1415519A1 (fr)
JP (1) JP2004538656A (fr)
CN (1) CN1270376C (fr)
SE (1) SE521528C3 (fr)
TW (1) TW531462B (fr)
WO (1) WO2003015485A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4842118B2 (ja) * 2006-01-24 2011-12-21 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN102054658B (zh) * 2009-10-30 2013-03-27 日月光封装测试(上海)有限公司 封装打线工艺的加热治具及其方法
DE102020210201A1 (de) * 2020-08-12 2022-02-17 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren und Vorrichtung zum temperaturkritischen Fügen zweier Bauteilschichten
JP7690357B2 (ja) * 2020-12-02 2025-06-10 新光電気工業株式会社 リードフレーム、半導体装置及びリードフレームの製造方法
KR102840683B1 (ko) * 2022-11-30 2025-07-31 한국생산기술연구원 홀 드릴링 패턴을 이용한 접합소재 레이저 솔더링 접합방법 및 이에 사용되는 접합물 구조체

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4889275A (en) * 1988-11-02 1989-12-26 Motorola, Inc. Method for effecting solder interconnects
US4972989A (en) * 1989-10-30 1990-11-27 Motorola, Inc. Through the lead soldering
DE19840306A1 (de) * 1998-09-04 2000-03-09 Bosch Gmbh Robert Ausrichtleiste

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO03015485A1 *

Also Published As

Publication number Publication date
CN1270376C (zh) 2006-08-16
SE0102668D0 (sv) 2001-08-07
TW531462B (en) 2003-05-11
SE521528C2 (sv) 2003-11-11
WO2003015485A1 (fr) 2003-02-20
SE0102668L (sv) 2003-02-08
SE521528C3 (sv) 2003-12-10
JP2004538656A (ja) 2004-12-24
CN1539256A (zh) 2004-10-20

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