EP1436656A2 - Verbindungstechnik für optische komponenten mit einer glass-zwischenschicht - Google Patents
Verbindungstechnik für optische komponenten mit einer glass-zwischenschichtInfo
- Publication number
- EP1436656A2 EP1436656A2 EP02767686A EP02767686A EP1436656A2 EP 1436656 A2 EP1436656 A2 EP 1436656A2 EP 02767686 A EP02767686 A EP 02767686A EP 02767686 A EP02767686 A EP 02767686A EP 1436656 A2 EP1436656 A2 EP 1436656A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- glass
- optical
- component
- bonding
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011521 glass Substances 0.000 title claims abstract description 95
- 230000003287 optical effect Effects 0.000 title claims abstract description 73
- 238000000034 method Methods 0.000 title claims description 67
- 238000000576 coating method Methods 0.000 claims abstract description 22
- 230000009477 glass transition Effects 0.000 claims abstract description 22
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000004031 devitrification Methods 0.000 claims abstract description 12
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 229910052785 arsenic Inorganic materials 0.000 claims abstract description 3
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 50
- 239000000758 substrate Substances 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 13
- 230000007704 transition Effects 0.000 claims description 10
- 239000005304 optical glass Substances 0.000 claims description 9
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 8
- 238000005304 joining Methods 0.000 claims description 7
- 239000005387 chalcogenide glass Substances 0.000 claims description 5
- UKUVVAMSXXBMRX-UHFFFAOYSA-N 2,4,5-trithia-1,3-diarsabicyclo[1.1.1]pentane Chemical compound S1[As]2S[As]1S2 UKUVVAMSXXBMRX-UHFFFAOYSA-N 0.000 claims description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 238000001552 radio frequency sputter deposition Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 3
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 claims description 3
- 230000000295 complement effect Effects 0.000 claims description 2
- 238000004320 controlled atmosphere Methods 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 238000000935 solvent evaporation Methods 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- 229910052714 tellurium Inorganic materials 0.000 claims description 2
- 229910010272 inorganic material Inorganic materials 0.000 claims 2
- 239000011147 inorganic material Substances 0.000 claims 2
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 37
- 239000013078 crystal Substances 0.000 description 15
- 238000010276 construction Methods 0.000 description 8
- 238000011109 contamination Methods 0.000 description 6
- 238000004455 differential thermal analysis Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910007475 ZnGeP2 Inorganic materials 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 2
- 229910018110 Se—Te Inorganic materials 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000002427 irreversible effect Effects 0.000 description 2
- 210000003127 knee Anatomy 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 244000283070 Abies balsamea Species 0.000 description 1
- 235000007173 Abies balsamea Nutrition 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000004858 Canada balsam Substances 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/126—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind using polarisation effects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12116—Polariser; Birefringent
Definitions
- the present invention relates to optical components bonded together with index matching glass coatings.
- Our copending UK Patent Applications Nos. GB 0123740.3 and GB 0123742.9 relate specifically to non-linear optical devices in which components are bonded together using index matching glass coatings, and our copending UK Patent Application No. GB 0123744.5 relates to the provision of antireflection layers produced from index matching glass coatings.
- the present invention facilitates the construction of bonded multi-component optical devices with low optical loss interfaces.
- the presence of gaps or spaces between faces which should be in optical contact can arise from such sources as imperfections in the surfaces to be joined, or the presence of contamination at the surfaces, particularly particulate contamination, and leads inter alia to optical losses due to reflection (because of index mismatch) and scattering.
- Direct interfacing requires very accurate physical preparation of the surfaces of the components, and extremely high standards of cleanliness. For this reason, while this technique is used in practice, it is difficult and best avoided if possible.
- Bonding of components with an intermediate layer of a material such as an adhesive can serve to reduce or remove light loss and so increase device efficiency.
- a material such as an adhesive
- Canada Balsam which has a refractive index very similar to that of conventional silica based optical glasses, was used for many years as an adhesive for mounting microscope slides and for joining lens components.
- Many modern optical components are of materials with indices much greater than conventional glass, for example semiconductor electro-optic devices and glasses, and this commonly occurs with components for use in the infrared region, for example.
- the refractive indices of conventional adhesive compositions fail to match these greatly increased indices, so that reflection at the interfaces is again increased, and it has often been necessary to resort to direct interfacing.
- window material two glass layers are joined by a plastics layer under conditions of pressure and heat, and fire resistant glass has a boron containing layer sandwiched between two glass layers.
- the technique depends on being able to produce joins without gaps or spaces between each optical component and the intermediate layer, and this type of bonding tends to be employed in constructions where optical performance is not critical, such as in window for buildings and vehicle windscreens.
- Each intermediate layer of adhesive or other bonding material produces two interfaces, and if the joint is sufficiently bad it is even possible that optical performance could deteriorate beyond that of two directly coupled components.
- an intermediate bonding layer In many applications, if an intermediate bonding layer is to be employed, it is desirable to be able to provide such a layer with a thickness which not only is extremely low but which also can be accurately controlled. This is not particularly easy using the adhesive or other intermediate materials conventionally used in the art.
- At least one optical component to be bonded to another is coated with a thin layer of a glassy material.
- a glass devitrification temperature Tc corresponding to a change from a glassy phase to a melt phase or a crystalline phase
- many glasses have at least one glass transition temperature Tg where a glassy phase is retained but with somewhat different properties.
- heating the glass through a temperature Tg t o obtain a higher temperature glassy phase (the reader will appreciate that the phase change may require other conditions, and in particular the phase change may take a significant time) can provide a phase which is appreciably softer or more mobile.
- Glass phase transitions may be detected by differential thermal analysis, wherein heat is supplied at a controlled rate to a sample and the temperature of the sample is plotted over time.
- the temperature initially follows a generally linear plot, and phase transitions are indicated by deviations from linearity.
- a glass transition temperature Tg may be identified by a discontinuity in the plot, generally in the form of a knee. Further transition points may be identified at higher temperatures, and at least one of these may correspond to the devitrification temperature. The latter may be identified since upon performing the reverse measurement by cooling the sample the corresponding knee is absent or at least does not occur at the same temperature.
- Figures 1 to 3 are exemplary differential thermal analysis plots illustrating glass phase transitions
- Figures 4 and 5 shows constructions of zero order waveplates made using the method of the present invention.
- Figure 1 shows a differential thermal analysis plot for the material Ge 15 As 15 Se 29 Te 4 ⁇ ; using the following cycle:
- Two inflection points on the rising part of the curve at 120°C and 240°C are respective first and second glass (glass/glass) transition temperatures Tgl and Tg2.
- Steeper transitions Tel and Tc2 at 290°C and 380°C are transitions associated with crystal phases, and the lower of these temperatures, Tel, will be the devitrification temperature since at that point the material ceases to be in a glassy phase.
- the curve is not retraced upon cooling, shows no (reverse) glass/glass transition points corresponding to Tgl and Tg2, and does not return to the starting point.
- any thermal processing of this material is likely to be associated with marked changes in the properties of the material, and these changes may be dependent on a number of factors (e.g. times, temperatures, heating rates, atmospheres) so that any change may well be difficult to reproduce reliably.
- first glass transition temperature refers to the lowest glass transition temperature above ambient.
- Figure 2 shows a differential thermal analysis plot for the material Ge 15 As ⁇ 5 Se 17 Te 3 using the following cycle:
- the present invention provides a method of joining opposed surfaces of two optical components, the method comprising the steps of providing at least one said surface with a thin layer of bonding glass having a glass transition temperature Tg substantially lower than the glass devitrification temperature Tel, placing the components together with only the coating or coatings therebetween to form an assembly, and heating the assembly under pressure to a temperature Tb which lies between Tg and Tel and is sufficiently high to soften the glass and bond the components together.
- the conditions under which bonding is effected are preferably selected so that there is no undesired change in either of the components which are bonded together, for example by destroying or distorting them or their surfaces, or producing an irreversible phase change therein.
- the ideal is that the components are substantially wholly unaffected by the bonding process, or at least that subsequent to the bonding process they correspond substantially to the starting components even if some form of change has occurred in the meantime.
- Tb is selected to cause a desired change such as an irreversible phase change in the material of one component so as to produce a component with modified but desired properties.
- the conditions under which bonding is effected are preferably selected such that there is no substantial extrusion of the glass out from between the bonded surfaces and/or so that the thickness of the thin layer or layers remains substantially constant.
- Tb is preferably selected to lie between the first and second glass transition temperatures.
- the bonding glass is selected such that it undergoes the bonding cycle reversibly, so that its properties at the end of the cycle are substantially identical to those at the commencement of the cycle.
- the glass of Figure 1 does not conform to this criterion and so is not a preferred material.
- the glasses of Figures 2 and 3 are preferred materials according to this criterion.
- the bonding glass has only one glass transition temperature before the devitrification temperature is reached, making the glass of Figure 3 more preferable than that of Figure 2.
- the glass of Figure 3 is again more preferable to that of Figure 2, although both conform to the wider criteria.
- the refractive index of the bonding glass is preferably close to tliose of the two components to be joined (i.e. of the material providing the surfaces to be joined) Ideally it has a value Rg substantially equal to the square root of the product of the two indices of the materials to be joined, which may or may not be equal. This reduces undesired reflections at the interfaces with the bonding glass layer.
- the bonding glass has a refractive index which is preferably within 20% of Rg (i.e. Rg +/- 20%), more preferably within 15%, even more preferably within 10%, and most preferably within 5%>.
- the glass is preferably an inorganic glass for example a chalcogenide glass or amorphous arsenic sulphide.
- the bonding glass may comprise Ge, As, Se and Te, and one range of preferred glasses has the general formula Ge( x-a )As a Se(ioo-x-b)Teb, where 25 ⁇ x ⁇ 55 (preferably 25 ⁇ x ⁇ 40); 10 ⁇ a ⁇ 25; 40 ⁇ b ⁇ 70, and (100-x-b)>0 (see our copending UK Patent Application No. GB 0123743.7).
- the glasses of Figures 1 to 3 conform to this formula, and generally have refractive indices between 3.0 and 3.5 at 2.1 microns, and slightly lower values at 9.3 microns.
- b is preferably at least 41.
- Some glasses conforming to the above formula show good or very good thermal characteristics for the purposes of the present invention.
- compositions Ge ⁇ 5 As 2 sSe 14 Te 46 , Ge 2 oAs oSe 14 Te 46 , Ge ⁇ 5 As ⁇ 5 Se 5 Te 65 , and the composition of Figure 2 have good to very good thermal characteristics and indices of 3.267, 3.200, 3.246 and 3.447 respectively at 2.1 microns.
- US 4072782 deals with the problem of protecting an erosion or water sensitive infrared window material such as zinc selenide with a more robust outer widow such as of zinc sulphide. To this end it suggests the use of a bond between the two windows provided by an As-S-Se glass, the bond being formed largely from a thin separately interposed wafer of the glass material. As particularly described, bonding is effected by vacuum hot-pressing a 20 mil (500 micron) thick wafer of the glass between two pieces of transparent window material, each of which has previously been coated by vacuum evaporation with a 10 micron layer of the As-S-Se glass. The process takes about 2 hours and results in most of the glass being squeezed out to leave a "relatively uniform" intermediate layer of 2 to 5 microns.
- the window materials specified in US 4072782 are polycrystalline in form. For the window use envisaged in that disclosure neither of these considerations may be significant. Nevertheless, many other optical constructions involve generally monocrystalline substrates and/or require precise control in the thickness and uniformity of any intermediate glass layer, and the present invention can facilitate the formation of constructions where the substrates to be joined are substantially monocrystalline.
- embodiments of the present invention use a thin layer of a glass having a relatively low glass transition point Tg, preferably an inorganic glass, deposited on the surface of at least one of two optical components to be joined, and there is no further interposition of, or any use at all of, a relatively thick wafer of the same glass, nor is there any substantial extrusion of the glass when the components are joined. This enables the components to be joined with a very precise and controllable spacing.
- Tg glass transition point
- the thickness of the coating applied to one or both of the surfaces to be joined will be dictated at least in part by the characteristics of the surfaces and their manner of preparation. It is extremely difficult to prepare some surfaces with a high degree of optical precision (surface quality and surface form — while most commonly the surfaces to be joined will be optically flat, other shaped surfaces fall within the invention), or the conditions are such that optical cleanness cannot be guaranteed. Under such conditions a somewhat thicker layer may be required to ensure that surface defects however caused are effectively surrounded by the bonding glass and do not contribute excessively to light scattering or separation of closely adjacent regions of the substrate surfaces.
- the thickness of the coating on one or both surfaces is less than 100 microns. Commonly the thickness lies in the range 0.1 to 20 microns, more preferably 1 to 10 microns, and is most preferably no more than 5 microns.
- the maximum thickness of the glass in the bonded device is preferably 20 microns, more preferably 10 microns, even more preferably 6 microns and most preferably no more than 4 microns.
- layers of greater thickness can be provided for reasons mentioned immediately above.
- the layer or layers of bonding glass may be deposited by any standard method, such as RF sputtering, flash evaporation, solvent evaporation or spin coating.
- the bonding step is carried out under a controlled atmosphere. This may involve an increased or reduced pressure, or a near vacuum, and the atmosphere may be inert or active.
- the methods of the first aspect are capable of forming a strong, low optical-loss bond between the two components.
- the glass engulf any particulate contamination on either surface minimising the impact of scattering loss, and it can also soften sufficiently to flow into any surface indentations thus making this technique particularly useful for bonding to crystalline materials that are inherently difficult to polish, such as ZnGeP .
- optical component is intended not only a simple monolithic substrate providing a surface on which the low glass transition point glass is to be deposited, but also more complex components providing such a surface.
- the surfaces of the components that are bonded may be planar or non-planar, for example curved in one or both dimensions, but clearly it is necessary for them to be substantially complementary in shape.
- a component may be laminar, such as a planar or curved parallel-sided sheet of optical material. Alternatively it may be non- laminar, i.e. without parallel major surfaces, for example a lens, with one or no planar surfaces.
- a component may be or comprise a passive optical component such as a layer which resists optical radiation damage, or a lens, prism, mirror or amplitude diffraction grating, or a Brewster window, or a window with an antireflection coating; or it may be, or comprise an active optical component, e.g. an electro-optic component such as a light source (for example an LED or a laser diode), or a detector (such as a or photodiode) or a component comprising non-linear or lasing material, for example a parametric device. It may or may not be a semiconductor component.
- a passive optical component such as a layer which resists optical radiation damage, or a lens, prism, mirror or amplitude diffraction grating, or a Brewster window, or a window with an antireflection coating
- an active optical component e.g. an electro-optic component such as a light source (for example an LED or a laser diode), or
- the material of a component may be, for example, ZnGeP 2 , silicon, gallium arsenide, germanium or lithium niobate, inter alia.
- the component is adapted or suitable for use in the infra-red part of the spectrum, although the invention extends to components for use in the visible and/or near UN parts of the spectrum also.
- the bonding glass will be chosen to be transmissive in the part of the spectrum of intended use.
- Two passive components, or two active components e.g. an emitter and a detector in an optical coupler or isolator, or a passive component and an active component may be bonded together.
- a lens is joined to a semiconductor LED or photodiode; and a protective window is joined to a non-linear optical layer.
- a stack of components with multiple adjacent pairs so joined may be formed simultaneously by placing appropriately coated components into a stack assembly and subjecting the entire assembly to heat and pressure.
- the stack may be formed sequentially by making the joints one at a time, or by any intermediate process.
- LED's light emitting diodes
- detectors it is known to bond germanium lenses to infrared semiconductor gas-sensor devices such as light emitting diodes (LED's) or detectors to provide a compact, low-cost, method of improving device performance.
- LED's light emitting diodes
- detectors the apparent size is increased, and in the case of LED's made from high refractive index material it can have very large benefits in improving the external efficiency and in shaping the emission profile.
- the prospective facing planar surfaces of a germanium convex lens and a GaAs LED are each coated with a layer of Gei 5 Asi 5 Se 1 Tes 3 glass, about 5 microns thick, by RF sputtering as described in the section "Surface Coating". They are subsequently placed together in a desired alignment and the assembly is subjected to a controlled pressure and temperature cycle to form a strong, low optical-loss bond.
- the maximum temperature in the cycle is lower than 200°C, and the cycle is designed so that the glass should engulf any particulate contamination minimising the impact of scattering loss.
- the lens could be replaced by an optical grating or other interference device, such as a Fresnel lens.
- the principal requirement for the material is to have a refractive index similar to that of the bulk optical crystal in order to minimise reflection loss at the material/crystal interfaces.
- the attached material can take the form of a plane layer, e.g. a disc, or a Brewster cut prism which further avoids the need for an AR coating.
- the bonded assembly is useful as an improved non-linear optical crystal in the mid-infrared.
- Phase retardation plates are commonly used to alter the polarisation status of laser and other optical beams. They rely on the birefringent nature of certain crystalline optical materials or polymer films, and are often supplied as zero (first) or multiple order plates providing quarter or half wave retardation. Multiple order plates are made from a single birefringent plate having a thickness providing an odd integer multiple of either the quarter or half wave thickness.
- Zero order wave plates are made from two birefringent plates with optic axes arranged mutually orthogonally, the plates differing in thickness by precisely the quarter or half wave thickness. Two thicker plates are used because the quarter of half wave thickness in most birefringent crystals is too thin to enable stable construction of a zero wave plate from a single plate. Compared with multiple order plates, zero order plates offer improved acceptance angles, bandwidth and operating temperature ranges, but manufacture is more complex, since two plates need to be mounted. Furthermore, the presence of two additional optical surfaces increases reflection losses.
- CdS is commonly used in the mid infra-red (2-5.5 microns).
- CdS may be used for the far infra-red (6-12 microns), but needs to be used with the air gap method since no suitable optical cement is available and optical contacting is difficult.
- Figure 4 schematically illustrates the formation of a zero order wave plate by coating a surface of each of two birefringent plates 1, 2 with a respective glass layer 3, 4 ( Figure 4a) and subsequently bonding the plates together with the application of pressure and heat ( Figure 4b).
- the thickness of the resulting glass layer 5 is not critical, but should be sufficient to engulf any particulate contamination on the plate surfaces. Its refractive index should be chosen to match the index of the plates 1, 2 according to criteria discussed above.
- the thermal properties of the glass, and the bonding temperature and pressure will need to be chosen bearing in mind the properties of the plates 1, 2.
- the method used for applying the glass coatings may be any of those mentioned above, and it would be possible to use a coating on only one of the components to be joined, although this is not preferred.
- Figure 5 shows an alternative form of zero order wave plate which can be achieved by application of the method of the present invention.
- the plate 1 of Figure 4 is replaced by a non-birefringent substrate 6, Figure 5a, and after bonding of the substrate 6 and plate 2, Figure 5b, the plate 2 is polished down to a layer 7 of the desired quarter or half wave optical thickness, Figure 6c.
- the refractive index of the substrate 6 is chosen to closely match that of the plate 2, and the index of the glass should approximate the square root of the product of the indices of the substrate 6 and plate 2 as described above.
- This design not only reduces the amount of costly material processing that is required, but it also reduces any requirement for mutual orientation of two plates.
- the birefringent plates could be of CdS, with a refractive index of 2.2, in which case a suitable glass for bonding would be arsenic trisulphide.
- a suitable glass for bonding would be arsenic trisulphide.
- the latter is readily available commercially, has a low softening temperature of about 210°C (so that bonding can take place below 250°C), good optical transparency and a refractive index of 2.4.
- the non-birefringent substrate 6 could then be of zinc selenide (refractive index 2.4).
- the substrate can have any desired thickness.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Ceramic Engineering (AREA)
- Joining Of Glass To Other Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0123731 | 2001-10-03 | ||
| GB0123731A GB0123731D0 (en) | 2001-10-03 | 2001-10-03 | Optical bonding technique |
| PCT/GB2002/004485 WO2003029856A2 (en) | 2001-10-03 | 2002-10-02 | Bonding technique for optical components using an intermediate glass layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1436656A2 true EP1436656A2 (de) | 2004-07-14 |
Family
ID=9923159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP02767686A Withdrawn EP1436656A2 (de) | 2001-10-03 | 2002-10-02 | Verbindungstechnik für optische komponenten mit einer glass-zwischenschicht |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP1436656A2 (de) |
| JP (1) | JP2005506264A (de) |
| AU (1) | AU2002331985A1 (de) |
| GB (1) | GB0123731D0 (de) |
| WO (1) | WO2003029856A2 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9519093B2 (en) | 2013-08-23 | 2016-12-13 | Kla-Tencor Corporation | Broadband and wide field angle compensator |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005024474A1 (en) * | 2003-09-09 | 2005-03-17 | Carl Zeiss Smt Ag | Phase delay element and method for producing a phase delay element |
| US7548370B2 (en) | 2004-06-29 | 2009-06-16 | Asml Holding N.V. | Layered structure for a tile wave plate assembly |
| DE102004038727A1 (de) * | 2004-08-10 | 2006-02-23 | Schott Ag | Verfahren und Vorrichtung zum Herstellen von Hybridlinsen |
| JP4352133B2 (ja) * | 2006-02-13 | 2009-10-28 | 防衛省技術研究本部長 | 隣接した光学部品の接着法 |
| US20080020083A1 (en) * | 2006-06-06 | 2008-01-24 | Kabushiki Kaisha Topcon | Method for joining optical members, structure for integrating optical members and laser oscillation device |
| US10191186B2 (en) | 2013-03-15 | 2019-01-29 | Schott Corporation | Optical bonding through the use of low-softening point optical glass for IR optical applications and products formed |
| JP7062882B2 (ja) * | 2017-04-28 | 2022-05-09 | 富士通オプティカルコンポーネンツ株式会社 | 波長モニタ装置、光源装置及び光モジュール |
| JP6905191B2 (ja) * | 2017-09-14 | 2021-07-21 | 日本電信電話株式会社 | レンズ及び複眼レンズ |
| KR102801776B1 (ko) * | 2022-12-15 | 2025-04-30 | 국방과학연구소 | 적외선 투과 및 실링 특성을 가진 칼코지나이드 적외선 유리를 이용한 접합 소자 제조 방법 및 이에 의해 제조된 접합소자 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3466120A (en) * | 1966-03-14 | 1969-09-09 | Bell Telephone Labor Inc | Method of making optical components |
| JPS62143841A (ja) * | 1985-12-16 | 1987-06-27 | Nippon Sheet Glass Co Ltd | カルコゲナイドガラス |
| US5725626A (en) * | 1986-06-18 | 1998-03-10 | Canon Kabushiki Kaisha | Method for manufacturing an optical element by bonding a plurality of elements |
| US5009690A (en) * | 1990-03-09 | 1991-04-23 | The United States Of America As Represented By The United States Department Of Energy | Method of bonding single crystal quartz by field-assisted bonding |
| JP4108790B2 (ja) * | 1997-07-23 | 2008-06-25 | 浜松ホトニクス株式会社 | ガラス部材の接合方法 |
| JP2001080974A (ja) * | 1999-09-08 | 2001-03-27 | Fuji Photo Film Co Ltd | 複合基板材料およびその製造方法 |
| US7053419B1 (en) * | 2000-09-12 | 2006-05-30 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
-
2001
- 2001-10-03 GB GB0123731A patent/GB0123731D0/en not_active Ceased
-
2002
- 2002-10-02 JP JP2003533013A patent/JP2005506264A/ja active Pending
- 2002-10-02 AU AU2002331985A patent/AU2002331985A1/en not_active Abandoned
- 2002-10-02 EP EP02767686A patent/EP1436656A2/de not_active Withdrawn
- 2002-10-02 WO PCT/GB2002/004485 patent/WO2003029856A2/en not_active Ceased
Non-Patent Citations (1)
| Title |
|---|
| See references of WO03029856A3 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9519093B2 (en) | 2013-08-23 | 2016-12-13 | Kla-Tencor Corporation | Broadband and wide field angle compensator |
| US9857292B2 (en) | 2013-08-23 | 2018-01-02 | Kla-Tencor Corporation | Broadband and wide field angle compensator |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003029856A2 (en) | 2003-04-10 |
| AU2002331985A1 (en) | 2003-04-14 |
| WO2003029856A3 (en) | 2003-12-31 |
| JP2005506264A (ja) | 2005-03-03 |
| GB0123731D0 (en) | 2001-11-21 |
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