EP1550185A1 - Contact electrique - Google Patents
Contact electriqueInfo
- Publication number
- EP1550185A1 EP1550185A1 EP03770895A EP03770895A EP1550185A1 EP 1550185 A1 EP1550185 A1 EP 1550185A1 EP 03770895 A EP03770895 A EP 03770895A EP 03770895 A EP03770895 A EP 03770895A EP 1550185 A1 EP1550185 A1 EP 1550185A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- contact
- electrical contact
- tin
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 229910052718 tin Inorganic materials 0.000 claims abstract description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000004332 silver Substances 0.000 claims abstract description 12
- 229910052709 silver Inorganic materials 0.000 claims abstract description 11
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 7
- 229910052738 indium Inorganic materials 0.000 claims abstract description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical group [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 11
- 229910000510 noble metal Inorganic materials 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 239000011159 matrix material Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical group [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 51
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910015373 AuCo Inorganic materials 0.000 description 1
- -1 CuSn4 bronze Chemical compound 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
- H01R13/035—Plated dielectric material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
Definitions
- the invention is based on an electrical contact, in particular an electrical contact of a connector, according to the type defined in more detail in the preamble of claim 1.
- Such an electrical contact is known from US Pat. No. 5,892,424 and represents an encapsulated contact point of an electrical connection.
- the known electrical contact consists of a substrate on which a contact layer is applied, which serves to increase the wear resistance of the electrical contact.
- This contact layer has a matrix formed from a first element which is doped with a second element.
- the matrix can be formed from an element selected from the group consisting of Mo, Zr, Nb, Hf, Ta and W includes.
- the additional element can be formed from an element selected from a group comprising Zn, Cd, Hg, Al, Ga, In, Tl, Ge, Sn, Pb, As, Sb and Bi.
- the additional element stabilizes the contact resistance of the electrical contact see during an electrical switching process. Furthermore, the additional element leads to an improvement in the wear resistance and the oxidation resistance of the electrical contact.
- the proportion of additional elements in the contact layer can be between 0.5 atom% and 50 atom%.
- the contact layer is applied by a sputtering process, an ion-assisted vapor deposition process, an ion plating process or a plasma CVD process.
- a sputtering process an ion-assisted vapor deposition process
- an ion plating process or a plasma CVD process.
- these processes are complex and not suitable for the production of large quantities.
- the metals from which the contact layer of the known electrical contact is made are expensive and therefore likewise not suitable for contacts which are required in large quantities. This applies in particular to electrical contacts in motor vehicles, which are required in quantities of 1000 to 3000 units per motor vehicle.
- electrical contacts in the automotive sector often have a contact layer made of tin.
- This layer can be hot-dip tinned or electroplated
- tin is characterized by its ductility and its good electrical conductivity.
- an intermediate layer consisting of intermetallic compounds such as CuSn3, Cu5Sn6 is formed at the interface to the substrate, which usually consists of a copper-based alloy, such as CuSn4-bronze, CuNiSi or the like, by diffusion.
- the intermediate layer is harder than the contact layer and can grow due to the temperature.
- tin alloys or layers have the disadvantage that they tend to rub through due to their low hardness and the resulting low wear resistance with frequent plugging operations or due to vehicle or engine-related vibrations, which leads to increased oxidation, so-called friction corrosion , leads.
- the abrasion and / or the fretting corrosion can in turn lead to a failure of an electrical component of a motor vehicle assigned to the relevant contact, for example a sensor, a control device or the like.
- thermotin a tin-based contact layer, also known as thermotin, of an electrical contact is known from practice, which consists of 100% intermetallic phases and is produced by hot aging. is posed. Abrasion tests have only shown limited usability for such contact layers.
- AuCo alloys with sub-nickel plating, silver layers with copper sub-plating or sub-nickel plating, or even gold layers have often been used as the contact layer in electrical contacts.
- the electrical contact according to the invention with a metallic substrate, on which a contact layer in the form of a gradient layer is applied, which is formed from at least two elements, one of which is silver and forms a matrix for the second element or with it is alloyed or of which one is nickel and the other phosphorus or of which one is indium and the other tin has the advantage that it is because of the for the components used in the contact layer, their availability and their relatively low procurement costs are a contact layer which is also suitable for electrical contacts required in large quantities.
- a gradient layer in the sense of the invention is a contact layer in which the proportion of the two elements changes in the direction of the normal to the substrate surface.
- the proportion of tin in a silver matrix or silver / tin alloy can decrease in the direction facing away from the substrate.
- the change in the element proportions of the contact layer can be linear. In this case it is a linear concentration gradient. Alternatively, it can also be a concentration gradient graded according to a staircase function.
- the proportion of one element in the contact layer in the gradient direction can pass through a range between 0% and 100%.
- the substrate is, for example, a substrate which is usually used for plug connections in the automotive sector, for example an alloy based on copper, such as CuSn4 bronze, CuNiSi or the like.
- a substrate made of a nickel-based alloy could also be used.
- the second element or additional element can be tin, gold or indium.
- the gradient layer preferably has a thickness of about 1 ⁇ m to 3 ⁇ m, but it can also be made with a greater thickness.
- the gradient layer can have a noble metal cover layer at least in regions.
- the noble metal cover layer preferably has a thickness between approximately 0.1 ⁇ m and 0.3 ⁇ m and thus represents a so-called “flash” layer.
- Au, Ru, Pt and. are particularly suitable as noble metals for the “flash” layer / or Pd.
- the contact layer is preferably produced by a galvanic process or else by a PVD (Physical Vapor Deposition) process.
- an electrical contact 1 which represents a contact of a connector that is used in an automobile.
- the electrical contact 1 comprises a substrate 2, which is made of a copper-based alloy such as CuSn4, CuNi2Si or the like.
- the substrate 2 has a thickness between 0.1 mm and 0.5 mm.
- a contact layer 3 which is applied by a galvanic process, is arranged on the substrate 2 of the electrical contact 1.
- the contact layer 3 represents a silver / tin material system, the silver and the tin being alloyed with one another.
- the proportion of tin in the contact layer 3 decreases in a substantially linear manner in the direction facing away from the substrate 2, for example from approximately 100% to approximately 20%.
- the contact layer 3 thus forms a gradient layer.
- the thickness of the contact layer 3 is in a range between approximately 1 ⁇ m and 3 ⁇ m.
- the gradient points in the opposite direction, so that the proportion of tin in the contact layer increases in the direction of the substrate and consequently the highest silver concentration is present on the surface of the contact layer or gradient layer.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Contacts (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
L'invention concerne un contact électrique, notamment un contact électrique d'une fiche, comprenant un substrat métallique (2), sur lequel est appliquée une couche de contact (3) sous la forme d'une couche à gradient. La couche à gradient (3) est composée d'au moins deux éléments. L'un de ces éléments est de l'argent et forme une matrice pour le deuxième élément, composant un alliage avec de dernier, ou bien l'un de ces élément est du nickel et l'autre du phosphore ou encore l'un est de l'indium et l'autre de l'étain.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10246062 | 2002-10-02 | ||
| DE10246062A DE10246062A1 (de) | 2002-10-02 | 2002-10-02 | Elektrischer Kontakt |
| PCT/DE2003/003296 WO2004032284A1 (fr) | 2002-10-02 | 2003-10-02 | Contact electrique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1550185A1 true EP1550185A1 (fr) | 2005-07-06 |
Family
ID=32010124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP03770895A Withdrawn EP1550185A1 (fr) | 2002-10-02 | 2003-10-02 | Contact electrique |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7589290B2 (fr) |
| EP (1) | EP1550185A1 (fr) |
| JP (1) | JP2006501615A (fr) |
| DE (1) | DE10246062A1 (fr) |
| WO (1) | WO2004032284A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104321937A (zh) * | 2011-12-16 | 2015-01-28 | 泰科电子Amp有限责任公司 | 具有微结构化触头元件的电插接型连接器 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10326788B4 (de) * | 2003-06-13 | 2005-05-25 | Robert Bosch Gmbh | Kontaktoberflächen für elektrische Kontakte und Verfahren zur Herstellung |
| DE102006043795B3 (de) * | 2006-09-19 | 2008-05-29 | Saia-Burgess Oldenburg Gmbh & Co. Kg | Elektrischer Mikroschalter |
| WO2013077286A1 (fr) * | 2011-11-22 | 2013-05-30 | エヌイーシー ショット コンポーネンツ株式会社 | Coupe-circuit thermique et électrode coulissante utilisée dans un coupe-circuit thermique |
| EP2838096B1 (fr) * | 2013-08-16 | 2017-07-19 | General Electric Company | Système de contact électrique |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3623205A (en) * | 1969-12-24 | 1971-11-30 | Curtiss Wright Corp | Composite bearing structure |
| DE2536985B2 (de) * | 1975-08-20 | 1977-10-06 | W.C. Heraeus Gmbh, 6450 Hanau | Elektrischer kontakt, insbesondere steckkontakt und verfahren zu dessen herstellung |
| DE2540943B2 (de) * | 1975-09-13 | 1978-02-02 | W.C. Heraeus Gmbh, 6450 Hanau | Kontaktkoerper fuer einen elektrischen steckkontakt |
| DE2940772C2 (de) * | 1979-10-08 | 1982-09-09 | W.C. Heraeus Gmbh, 6450 Hanau | Elektrischer Schwachstromkontakt |
| JPS63221517A (ja) * | 1987-03-09 | 1988-09-14 | 古河電気工業株式会社 | 電気接点材料とその製造法 |
| EP0428740A1 (fr) * | 1989-05-10 | 1991-05-29 | The Furukawa Electric Co., Ltd. | Materiau de contact electrique, procede de production de ce materiau, et contact electrique ainsi produit |
| US5420056A (en) * | 1994-01-14 | 1995-05-30 | Texas Instruments Incorporated | Junction contact process and structure for semiconductor technologies |
| US5892424A (en) * | 1995-02-10 | 1999-04-06 | The Furukawa Electric Co., Ltd. | Encapsulated contact material and a manufacturing method therefor, and a manufacturing method and a using method for an encapsulated contact |
| JPH08298038A (ja) | 1995-02-28 | 1996-11-12 | Furukawa Electric Co Ltd:The | 電気接点材料とその製造方法 |
| US5800932A (en) | 1995-02-28 | 1998-09-01 | The Furukawa Electric Co., Ltd. | Electric contact material and a manufacturing method therefor |
| US6136460A (en) * | 1998-04-03 | 2000-10-24 | Olin Corporation | Tin coatings incorporating selected elemental additions to reduce discoloration |
| US6183886B1 (en) * | 1998-04-03 | 2001-02-06 | Olin Corporation | Tin coatings incorporating selected elemental additions to reduce discoloration |
-
2002
- 2002-10-02 DE DE10246062A patent/DE10246062A1/de not_active Withdrawn
-
2003
- 2003-10-02 EP EP03770895A patent/EP1550185A1/fr not_active Withdrawn
- 2003-10-02 JP JP2004540534A patent/JP2006501615A/ja active Pending
- 2003-10-02 US US10/524,726 patent/US7589290B2/en not_active Expired - Fee Related
- 2003-10-02 WO PCT/DE2003/003296 patent/WO2004032284A1/fr not_active Ceased
Non-Patent Citations (1)
| Title |
|---|
| See references of WO2004032284A1 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104321937A (zh) * | 2011-12-16 | 2015-01-28 | 泰科电子Amp有限责任公司 | 具有微结构化触头元件的电插接型连接器 |
| CN104321937B (zh) * | 2011-12-16 | 2017-07-04 | 泰连德国有限公司 | 具有微结构化触头元件的电插接型连接器 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20060163047A1 (en) | 2006-07-27 |
| DE10246062A1 (de) | 2004-04-15 |
| US7589290B2 (en) | 2009-09-15 |
| WO2004032284A1 (fr) | 2004-04-15 |
| JP2006501615A (ja) | 2006-01-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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| 17P | Request for examination filed |
Effective date: 20050502 |
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| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR |
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| RBV | Designated contracting states (corrected) |
Designated state(s): DE FR GB |
|
| 17Q | First examination report despatched |
Effective date: 20101019 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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| 18D | Application deemed to be withdrawn |
Effective date: 20140502 |