EP1555335A3 - Zusatz für Plattierungsbad - Google Patents
Zusatz für Plattierungsbad Download PDFInfo
- Publication number
- EP1555335A3 EP1555335A3 EP05250172A EP05250172A EP1555335A3 EP 1555335 A3 EP1555335 A3 EP 1555335A3 EP 05250172 A EP05250172 A EP 05250172A EP 05250172 A EP05250172 A EP 05250172A EP 1555335 A3 EP1555335 A3 EP 1555335A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- plating bath
- additive
- hydroxyalkanesulfonic acid
- circuit
- hydroxyalkanesulfonic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004009284 | 2004-01-16 | ||
| JP2004009284A JP2005200714A (ja) | 2004-01-16 | 2004-01-16 | メッキ浴用添加剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP1555335A2 EP1555335A2 (de) | 2005-07-20 |
| EP1555335A3 true EP1555335A3 (de) | 2007-06-20 |
| EP1555335B1 EP1555335B1 (de) | 2010-03-17 |
Family
ID=34616913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP05250172A Expired - Lifetime EP1555335B1 (de) | 2004-01-16 | 2005-01-14 | Zusatz für Plattierungsbad |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20050155514A1 (de) |
| EP (1) | EP1555335B1 (de) |
| JP (1) | JP2005200714A (de) |
| KR (1) | KR20050075692A (de) |
| CN (1) | CN1670259A (de) |
| DE (1) | DE602005019930D1 (de) |
| TW (1) | TW200536955A (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4858907B2 (ja) * | 2006-05-29 | 2012-01-18 | 奥野製薬工業株式会社 | 置換析出型金めっきの前処理用活性化組成物 |
| JP5120533B2 (ja) * | 2007-02-28 | 2013-01-16 | 栗田工業株式会社 | めっき液添加剤のカチオン除去装置、及びめっき液添加剤の処理方法 |
| JP5272275B2 (ja) * | 2008-11-14 | 2013-08-28 | ユケン工業株式会社 | 酸性亜鉛めっき浴 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4132610A (en) * | 1976-05-18 | 1979-01-02 | Hyogo Prefectural Government | Method of bright electroplating of tin-lead alloy |
| US4696773A (en) * | 1986-07-07 | 1987-09-29 | Johnson & Johnson Baby Products Company | Process for the preparation of isethionic acid |
| US4987250A (en) * | 1987-09-25 | 1991-01-22 | Union Oil Company Of California | Synthesis of hydroxy sulfonic acids |
| US5912385A (en) * | 1997-01-20 | 1999-06-15 | Tokai Denka Kogyo Kabushiki Kaisha | Process for the production of pure alkanesulfonic acids |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6251253B1 (en) * | 1999-03-19 | 2001-06-26 | Technic, Inc. | Metal alloy sulfate electroplating baths |
-
2004
- 2004-01-16 JP JP2004009284A patent/JP2005200714A/ja active Pending
-
2005
- 2005-01-05 KR KR1020050000663A patent/KR20050075692A/ko not_active Withdrawn
- 2005-01-10 TW TW094100656A patent/TW200536955A/zh unknown
- 2005-01-14 CN CNA2005100039750A patent/CN1670259A/zh active Pending
- 2005-01-14 EP EP05250172A patent/EP1555335B1/de not_active Expired - Lifetime
- 2005-01-14 US US11/035,847 patent/US20050155514A1/en not_active Abandoned
- 2005-01-14 DE DE602005019930T patent/DE602005019930D1/de not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4132610A (en) * | 1976-05-18 | 1979-01-02 | Hyogo Prefectural Government | Method of bright electroplating of tin-lead alloy |
| US4696773A (en) * | 1986-07-07 | 1987-09-29 | Johnson & Johnson Baby Products Company | Process for the preparation of isethionic acid |
| US4987250A (en) * | 1987-09-25 | 1991-01-22 | Union Oil Company Of California | Synthesis of hydroxy sulfonic acids |
| US5912385A (en) * | 1997-01-20 | 1999-06-15 | Tokai Denka Kogyo Kabushiki Kaisha | Process for the production of pure alkanesulfonic acids |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1555335B1 (de) | 2010-03-17 |
| CN1670259A (zh) | 2005-09-21 |
| KR20050075692A (ko) | 2005-07-21 |
| JP2005200714A (ja) | 2005-07-28 |
| EP1555335A2 (de) | 2005-07-20 |
| US20050155514A1 (en) | 2005-07-21 |
| TW200536955A (en) | 2005-11-16 |
| DE602005019930D1 (de) | 2010-04-29 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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|
| RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
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| 17P | Request for examination filed |
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