EP1558425A2 - Procede et dispositif pour relier des objets - Google Patents

Procede et dispositif pour relier des objets

Info

Publication number
EP1558425A2
EP1558425A2 EP03770941A EP03770941A EP1558425A2 EP 1558425 A2 EP1558425 A2 EP 1558425A2 EP 03770941 A EP03770941 A EP 03770941A EP 03770941 A EP03770941 A EP 03770941A EP 1558425 A2 EP1558425 A2 EP 1558425A2
Authority
EP
European Patent Office
Prior art keywords
vacuum chamber
objects
holder
ring
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03770941A
Other languages
German (de)
English (en)
Inventor
Daniel Kappes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suess Microtec Laboratory Equipment GmbH
SUSS MicroTec Laboratory Equipment GmbH
Original Assignee
Suess Microtec Laboratory Equipment GmbH
SUSS MicroTec Laboratory Equipment GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suess Microtec Laboratory Equipment GmbH, SUSS MicroTec Laboratory Equipment GmbH filed Critical Suess Microtec Laboratory Equipment GmbH
Publication of EP1558425A2 publication Critical patent/EP1558425A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Definitions

  • the invention relates to a device and a method for connecting objects, in particular components in semiconductor technology, such as, for example, connecting a wafer or substrate to a carrier or connecting two wafers or substrates. Such a connection is usually established by means of an adhesive or an adhesive film between the two objects.
  • the invention has for its object to provide a device and a method for connecting objects with which the disadvantages mentioned in the prior art can be avoided.
  • the invention is based on the following basic ideas.
  • a locally narrow vacuum is created between and around the objects to be connected.
  • the expansion of the vacuum or the vacuum chamber is essentially determined by the horizontal and vertical expansion of the parts to be connected Objects and the flow resistance when extracting the air, which occurs due to insufficient distances between the volume to be evacuated. It is envisaged that the vacuum between the objects to be connected causes the objects to be pressed together by the atmospheric pressure. In addition, the pressing of the objects can take place in a controlled manner by means of a corresponding pressing device.
  • the invention has the following advantages.
  • Work step can be two objects as well as groups of objects (single wafer
  • the device can be used on standard Scara robots (selective compliance assembly robot arm) and on travel axes. Usual adhesives and adhesive films can be used for the
  • the device according to the invention can be produced inexpensively and is for
  • FIGS. 2a-2c steps of the method according to the invention by means of the device according to FIG. 1.
  • the device according to the invention according to FIG. 1 has a holder 4, to which a first object 1 (for example substrate or wafer) is fastened by suppressing a holding vacuum device 7. There is a protective film 11 between the first object 1 and the holder 4.
  • a vacuum chamber ring 6 Around the holder 4 there is a vacuum chamber ring 6, which is connected to the holder 4 and sealed against it with a first sealing ring 9.
  • the connection between the holder 4 and the vacuum chamber ring 6 is preferred formed by tension springs 14 which pull the two parts 4 and 6 as shown in FIGS. 1, 2a and 2c in the vertical direction up to the stop or hold together.
  • the holder 4 and the vacuum chamber ring 6 form a cover, which in the lowered state (FIG. 2a) forms a vacuum chamber 3 with a table 5.
  • a second sealing ring 10 At the lower end of the vacuum chamber ring 6, which lies opposite the table 5 with a second object 2 (e.g. substrate or wafer) thereon, there is a second sealing ring 10.
  • the vacuum chamber ring 6 has an opening 8 for evacuating and venting the vacuum chamber 3.
  • a vacuum pump P is optionally connected to the opening 8 via a shut-off valve 12; ventilation takes place via a ventilation valve 13 when the valve 12 is closed.
  • the lower end of the vacuum chamber ring 6 projects beyond the surface of the first object by a length which is greater than the thickness of the second object 2, so that when the vacuum chamber ring 6 is placed on it the surface 5a of the table 5, as shown in FIG. 2a, there is a distance d between the first object 1 and the second object 2.
  • the lowered state of the cover 4, 6 on the table 5 is shown in Figure 2a.
  • FIGS. 2a to 2c show steps of the method according to the invention using the device according to FIG. 1.
  • FIG. 2a shows the device according to the invention with a vacuum chamber 3 formed before the evacuation.
  • the chamber 3 is evacuated through the opening 8.
  • the holder 4 is movable relative to the first sealing ring 9 of the vacuum chamber ring 6 and is against the tensile force of the tension springs 14 which may be present due to the atmospheric pressure when it is stationary Vacuum chamber ring 6 moves in the direction of arrow A down to the table 5.
  • the spring force of the tension springs 14 is preferably such that when the chamber 3 is evacuated, the holder 4 is automatically pressed downward in the direction of arrow A (FIG. 2a) against the tension force of the springs 14 by the atmospheric pressure.
  • the movement of the holder 4 on the table 5 can be controlled and e.g. interrupted or delayed controlled.
  • a controlled lifting drive (not shown) is preferably provided for the movement of the holder in the direction of arrow A;
  • the tension springs 14 are additionally advantageous.
  • a spring-supported hold-down ring 15 (shown for simplicity only in FIG. 1) aligned with the table 5 can be arranged on the device according to FIG. 1 in order to fix the vacuum chamber ring 6 on the table 5.
  • the holder 4 can be decelerated in a controlled manner with the aid of the lifting drive, not shown, and then pressed down, thus increasing the contact pressure between the two objects 1, 2.
  • the device according to the invention and the method according to the invention are preferably used in semiconductor technology and the first object 1 is preferably a semiconductor substrate (wafer) and the second object 2 is a corresponding carrier or a another wafer.
  • both individual objects can be connected to one another at the same time.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

L'invention concerne un dispositif et un procédé pour relier au moins un premier avec un deuxième objet. Autour des objets à relier est disposée une chambre à vide dont les dimensions dépendent de celles des objets, de sorte que le vide puisse être fait rapidement dans ladite chambre. Pour être reliés, les objets sont pressés l'un contre l'autre par la pression atmosphérique, et ils peuvent, en outre, être pressés l'un contre l'autre de manière contrôlée.
EP03770941A 2002-09-12 2003-09-12 Procede et dispositif pour relier des objets Withdrawn EP1558425A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10242402A DE10242402A1 (de) 2002-09-12 2002-09-12 Vorrichtung und Verfahren für das Verbinden von Objekten
DE10242402 2002-09-12
PCT/EP2003/010178 WO2004026531A2 (fr) 2002-09-12 2003-09-12 Procede et dispositif pour relier des objets

Publications (1)

Publication Number Publication Date
EP1558425A2 true EP1558425A2 (fr) 2005-08-03

Family

ID=31969100

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03770941A Withdrawn EP1558425A2 (fr) 2002-09-12 2003-09-12 Procede et dispositif pour relier des objets

Country Status (4)

Country Link
EP (1) EP1558425A2 (fr)
AU (1) AU2003280332A1 (fr)
DE (1) DE10242402A1 (fr)
WO (1) WO2004026531A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004034421A1 (de) * 2004-07-15 2006-02-09 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zur wechselseitigen Kontaktierung von zwei Wafern
DE102006058493B4 (de) 2006-12-12 2012-03-22 Erich Thallner Verfahren und Vorrichtung zum Bonden von Wafern
DE102011080929B4 (de) * 2011-08-12 2014-07-17 Infineon Technologies Ag Verfahren zur Herstellung eines Verbundes und eines Leistungshalbleitermoduls
JP5756429B2 (ja) 2011-10-21 2015-07-29 東京エレクトロン株式会社 貼り合わせ装置及び該貼り合わせ装置を用いた貼り合わせ位置調整方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4316757A (en) * 1980-03-03 1982-02-23 Monsanto Company Method and apparatus for wax mounting of thin wafers for polishing
JPH07264B2 (ja) * 1987-08-10 1995-01-11 住友電気工業株式会社 半導体ウエハの貼付方法および装置
JPH081898B2 (ja) * 1988-11-02 1996-01-10 三菱電機株式会社 ウエハ貼付装置
JP2648638B2 (ja) * 1990-11-30 1997-09-03 三菱マテリアル株式会社 ウェーハの接着方法およびその装置
JP2534196B2 (ja) * 1993-12-21 1996-09-11 株式会社エンヤシステム ウエ−ハ貼付方法
DE19610112C2 (de) * 1996-03-14 2000-04-06 Tech Gmbh Antriebstechnik Und Verfahren zum Auflöten von Halbleiterchips
JPH1012578A (ja) * 1996-06-26 1998-01-16 Mitsubishi Electric Corp ウエハ・支持基板貼付け方法，及びウエハ・支持基板貼付け装置
DE10048881A1 (de) * 2000-09-29 2002-03-07 Infineon Technologies Ag Vorrichtung und Verfahren zum planen Verbinden zweier Wafer für ein Dünnschleifen und ein Trennen eines Produkt-Wafers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2004026531A2 *

Also Published As

Publication number Publication date
AU2003280332A1 (en) 2004-04-08
WO2004026531A2 (fr) 2004-04-01
WO2004026531A3 (fr) 2004-05-27
DE10242402A1 (de) 2004-04-01
AU2003280332A8 (en) 2004-04-08

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