EP1574877A1 - Strahlungsdetekormodul, Strahlungsdetektor und radiologisches Bilderzeugungsgerät - Google Patents

Strahlungsdetekormodul, Strahlungsdetektor und radiologisches Bilderzeugungsgerät Download PDF

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Publication number
EP1574877A1
EP1574877A1 EP05005277A EP05005277A EP1574877A1 EP 1574877 A1 EP1574877 A1 EP 1574877A1 EP 05005277 A EP05005277 A EP 05005277A EP 05005277 A EP05005277 A EP 05005277A EP 1574877 A1 EP1574877 A1 EP 1574877A1
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EP
European Patent Office
Prior art keywords
electrode
conductive
radiation
members
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05005277A
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English (en)
French (fr)
Inventor
Norihito c/o Hitachi Ltd. Int. Prop. Gr Yanagita
Katsutoshi c/o Hitachi Ltd. Int. Pr. Gr Tsuchiya
Hiroshi c/o Hitachi Ltd. Int. Prop. Gr Kitaguchi
Kensuke c/o Hitachi Ltd. Int. Prop. Gr. Amemiya
Yuuichirou c/o Hitachi Ltd. Int. Prop. Gr. Ueno
Kazuma c/o Hitachi Ltd. Int. Prop. Group Yokoi
Akihito Kitajima
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Hitachi Ltd
Acrorad Co Ltd
Original Assignee
Hitachi Ltd
Acrorad Co Ltd
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Publication of EP1574877A1 publication Critical patent/EP1574877A1/de
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/29—Measurement performed on radiation beams, e.g. position or section of the beam; Measurement of spatial distribution of radiation
    • G01T1/2914—Measurement of spatial distribution of radiation
    • G01T1/2921—Static instruments for imaging the distribution of radioactivity in one or two dimensions; Radio-isotope cameras
    • G01T1/2928—Static instruments for imaging the distribution of radioactivity in one or two dimensions; Radio-isotope cameras using solid state detectors

Definitions

  • the present invention relates to a radiation detection module, radiation detector and radiological imaging apparatus, and more particularly, to a radiation detection module, radiation detector and radiological imaging apparatus using semiconductor radiation detector elements.
  • detector element As an example of conventional radiation detectors which detect radiation such as ⁇ -rays, there is a semiconductor radiation detector provided with a semiconductor radiation detector element (hereinafter referred to as "detector element") made of a semiconductor material such as CdTe (cadmium telluride), CdZnTe (cadmium zinc telluride), TlBr (thallium bromide), GaAs (gallium arsenide). Since the detector element converts charges produced by interaction between radiation and the semiconductor material to an electric signal, the semiconductor radiation detector is characterized by higher efficiency of conversion into an electric signal than a radiation detector using a scintillator and its ability to be miniaturized.
  • the semiconductor radiation detector is provided with the aforementioned detector element and electrodes formed on both surfaces facing this detector element. By applying a DC high voltage between these electrodes, the semiconductor radiation detector collects charges generated when radiations such as X-rays, ⁇ -rays enter the detector element as signals from the electrodes.
  • a semiconductor radiation detector is connected to a wiring board to form a radiation detection section (e.g., see JP-A-2003-84068 (paragraph 0024, Fig. 3)). Furthermore, a technology which arranges a plurality of semiconductor radiation detectors on a radiation detector support board is proposed (e.g., see JP-A-2003-167058 (paragraphs 0020 and 0021, Fig. 3)).
  • the radiation detector according to a first invention comprises a plurality of radiation detector elements including a semiconductor region, a first electrode which collects a radiation detection signal and a second electrode which applies a bias voltage, both of which face each other with the semiconductor region interposed in between, the semiconductor region being disposed so as to cross a support substrate to which the radiation detector is attached, wherein the radiation detector elements are arranged with the electrodes of the same type arranged in parallel facing each other, conductive members are arranged between the mutually facing electrodes of the same type and attached to these electrodes and the conductive members are attached to a first support substrate by being connected to wiring provided for the first support substrate.
  • the conductive members are used as fixing members to attach the radiation detectors to the support substrate. This eliminates the necessity for any other fixing member to attach the radiation detectors to the support substrate and can improve arrangement density of radiation detectors on the support substrate. This also leads to an improvement in spatial resolution of an image obtained from the examinee.
  • the support substrate includes a plurality of first conductive connection members to which a first conductive member, which is a conductive member connected to a first electrode, is attached and a plurality of conductive second connection members to which a second conductive member, which is a conductive member connected to a second electrode, is attached, and the first connection members are arranged in two parallel rows between the second electrode connection members in one direction.
  • the respective first conductive members connected to the electrodes of the same type of the neighboring radiation detectors are connected to the respective first connection members arranged in two parallel rows between the second electrode connection members. Therefore, it is possible to reduce mutual electrical insulation among the radiation detectors in the one direction and narrow the distances among the radiation detectors in the one direction. This also makes it possible to improve the arrangement density of the radiation detectors on the support substrate and to improve spatial resolution of an image obtained.
  • the present invention can improve spatial resolution.
  • the PET imaging apparatus of this embodiment is provided with a PET imaging apparatus 1, a bed 31 which holds an examinee H, a data processing apparatus (computer, etc.) 2 and a display apparatus 3.
  • the PET imaging apparatus 1 includes many unit substrates U shown in Fig. 2 arranged in circumferential direction.
  • the examinee H is laid on a bed 31 which is movable in the longitudinal direction and inserted into a measuring space 32 surrounded by the unit substrates U.
  • the PET imaging apparatus l includes many unit substrates U arranged in the circumferential direction surrounding the measuring space 32 into which the bed 31 is inserted. A plurality of unit substrates U are also arranged in the longitudinal direction (axial direction of the measuring space 32) of the bed 31.
  • the unit substrate U includes a radiation detection module (hereinafter referred to as “detection module”) 20A and an integrated circuit substrate (hereinafter referred to as "ASIC substrate”) 20B.
  • the detection module 20A is provided with a plurality of semiconductor radiation detectors (hereinafter simply referred to as "detectors") 21.
  • the detectors 21 detect ⁇ -rays emitted from within the body of the examinee H.
  • the ASIC substrate 20B includes integrated circuits (ASIC) for measuring peak values and detection time of detected ⁇ -rays, designed to measure peak values and detection time of detected radiations ( ⁇ -rays).
  • the integrated circuit includes a plurality of signal processing apparatuses which process radiation detection signals.
  • the detector 21 includes a plurality of semiconductor radiation detector elements (hereinafter referred to as "detector elements,” see Fig. 3A) 211 including semiconductor regions (semiconductor sections) S, made up of a tabular semiconductor material, and conductive members (fixing members) 22, 23.
  • the detector element 211 forms thin film-like electrodes on the two entire surfaces facing the semiconductor region S using a vapor deposition method, etc.
  • the electrode formed on one surface is an anode electrode (first electrode, hereinafter referred to as "anode”) A and the electrode formed on the other surface is a cathode electrode (second electrode, hereinafter referred to as "cathode”) C.
  • the detector 21 arranges an even number (e.g., four) of vertically positioned detector elements 211 in parallel in such a way that the cathodes C face each other and the anodes A face each other and the electrodes of the same type (the anodes A and cathodes C) are electrically connected through the conductive members 22, 23 (see Fig. 3B).
  • the conductive member 23 (first conductive member) is interposed between the mutually facing anodes A of a pair of neighboring detector elements 211 and attached to the respective anodes A using a conductive adhesive 25.
  • the conductive member 22 (second conductive member) is interposed between the mutually facing cathodes C of another pair of neighboring detector elements 211 and attached to the respective cathodes C using a conductive adhesive.
  • the conductive members 22 are bonded to the respective cathodes C placed at both ends of the detector 21. In the detector 21, the anodes A and cathodes C are placed alternately and the conductive members 22 and conductive members 23 are also placed alternately.
  • the semiconductor region S is a region which interacts with radiation to generate charge and is formed of any one single crystal of CdTe, CdZnTe, TlBr, GaAs, etc. Furthermore, for the cathode C and anode A, any one material of Pt, Au, In, etc., is used.
  • the detector element 211 in this embodiment uses the cathode C whose principal ingredient is CdTe, Pt for the semiconductor region S and the anode A whose principal ingredient is In, forming a pn junction diode.
  • bias voltage a backward bias voltage (hereinafter referred to as "bias voltage" of pn junction applied between the cathode C and anode A
  • the semiconductor region S having a smaller t has a quicker rise of a peak value and has a higher degree of accuracy (energy resolution) of the peak value.
  • the rising speed of the peak value is high, for example, the accuracy of simultaneous measurement (coincidence resolution) of the PET imaging apparatus 1 improves.
  • the energy resolution of the semiconductor region S having a smaller thickness t increases (the efficiency of charge collection improves) because the time required for electrons to reach the anode A and the time required for holes to reach the cathode C are shortened, that is, the charge collection time is shortened. Furthermore, holes which are likely to be annihilated in midstream can reach the cathode C without being annihilated because of the small thickness.
  • the thickness t can also be expressed as a distance between the mutually facing cathode C and anode A.
  • the anode A is the electrode to extract a radiation detection signal and the cathode C is the electrode to apply a bias voltage.
  • the thickness (distance between the electrodes) t of the semiconductor region S is preferably 0.2 mm to 2 mm. This is because when the thickness t exceeds 2 mm, the rising speed of a peak value slows down and a maximum value of the peak value also decreases. Even if the thickness t is increased, it is possible to increase the moving speed of electrons and holes by increasing the bias voltage and increasing the electric field strength in the thickness direction in the detector element 211 to thereby shorten the time for electrons and holes to reach the electrodes.
  • increasing the bias voltage to be applied involves an increase in the size of a DC voltage power supply and may produce a harmful effect of causing dielectric breakdown inside the wiring board (support substrate) 24, and is therefore not preferable.
  • the thickness (volume) of the electrodes (cathode C, anode A) relatively increases.
  • this capacitance corresponds to an input capacitance component viewed from the signal processing circuit (ASIC) in the following stage, noise is more likely to occur in the signal processing circuit as the input capacitance increases and it is more likely to deteriorate energy resolution and coincidence resolution. Furthermore, securing the detection sensitivity per one detector 21 to a certain degree requires the volume of the detector 21 to be increased to a certain degree. For this purpose, the detector elements 211 are arranged in parallel to effectively secure the volume of the detector 21 as will be described later, but as the thickness t decreases, the number of elements to be arranged in parallel must be increased.
  • the capacitance per one detector increases synergistically, causing deterioration in performance of the PET imaging apparatus 1 (deterioration in PET image contrast due to the deterioration in energy resolution, increase in the inspection time due to the deterioration of coincidence resolution or deterioration in image quality, etc.).
  • the conductive members 22, 23 are flat plates of copper (or material whose principal ingredient is copper, for example, phosphor bronze) and have the same size as that of the respective electrodes of the detector element 211.
  • the thickness of the conductive members 22, 23 is approximately 10 ⁇ m to 100 ⁇ m and preferably approximately 50 ⁇ m.
  • the conductive member 22 includes a projection 22a (second electrical connection section) which protrudes outward from the semiconductor region S.
  • the conductive member 23 includes a projection 23a (first electrical connection section) which protrudes outward from the semiconductor region S. More specifically, the projection 22a of the conductive member 22 connected to the cathode C is located on one side (left side in Fig. 3B) of the detector 21.
  • the projection 23a of the conductive member 23 connected to the anode A is located on the other side facing the one side (right side in Fig. 3B) of the detector 21.
  • the detector 21 is fixed to the wiring board 24 electrically connected thereto with three projections 22a and two projections 23a (see Fig. 3C).
  • the conductive members 22, 23 also serve as fixing members to fix the detector 21 to the wiring board 24.
  • the projections (electrical connection sections) 22a, 23a serve as the fixing sections to attach the detector 21 to the wiring board 24.
  • Each detector 21 is disposed in such a way that the detector element 211 and the wiring board 24 cross each other, or more specifically cross each other at right angles, and is attached to the wiring board 24.
  • the material of the conductive members 22, 23 is not limited to copper, but can also be aluminum or aluminum alloy and the shape thereof need not always be tabular. Furthermore, the size of the conductive members 22, 23 is preferably the same as the size of the electrodes of the detector element 211, but the size need not always be completely the same.
  • each of the semiconductor regions S arranged in parallel has the aforementioned thickness t (0.2 to 2 mm).
  • the thickness of the cathode C and anode A is approximately several ⁇ m at most. Since the cathodes C and anodes A of the plurality of detector elements 211 are connected together respectively, the detector 21 is not structured so as to identify the semiconductor region S of which detector element 211 interacts with ⁇ -rays. Such a structure of the detector 21 is intended to reduce the thickness t of the semiconductor region S (see Fig.
  • the parallel arrangement of the semiconductor regions S is intended to reduce the amount of ⁇ -rays that pass through and increase interaction between the semiconductor regions S and ⁇ -rays (increase a ⁇ -ray count).
  • the increase in the ⁇ -ray count leads to improve the sensitivity of the detector 21.
  • the detector 21 is disposed on the wiring board 24 with a cathode connection member (e.g., printed wiring board pad) CP (second connection member) and an anode connection member AP (first connection member) provided on the surface of the wiring board 24 electrically connected to the projections 22a and projections 23a respectively using a conductive adhesive 25.
  • the projections 22a, 23a also serve as electrical connection sections to be connected to the connection members CP, AP which are the conductive members provided on the wiring board 24.
  • a plurality of connection members CP are disposed on the wiring board 24 as common connection members for a plurality of detectors 21.
  • connection members CP (one connection member CP is not shown) are arranged in parallel in the Y direction (from left to right in Fig. 4A) of the wiring board 24. All the connection members CP are shortcircuited by wiring 24a which is buried in the wiring board 24 and given the same potential.
  • the wiring 24a is connected to a terminal 33 provided at one end of the wiring board 24.
  • connection members for each detector 21 are arranged in two rows between two neighboring connection members CP and disposed on the wiring board 24.
  • a signal line (wiring) 24b buried in the wiring board 24 is connected to each connection member AP. This allows a ⁇ -ray detection signal of each detector 21 to be output through the corresponding signal line 24b.
  • the respective signal lines 24b are individually connected to a plurality of terminals 34 provided at one end of the wiring board 24.
  • a series of detectors 21 (six detectors 21) arranged in the Y direction are disposed in such a way that between the two adjacent neighboring detectors 21, the projections 23a, 23a of the respective conductive members 23 (connected to anodes A) face each other as shown in Fig. 4A.
  • the projections 23a of the respective detectors 21 are attached to the corresponding connection members AP using the adhesive 25.
  • the projections 22a of the respective detectors 21 are attached to the connection members CP using the adhesive 25.
  • connection member CP1 In the two detectors 21 disposed on both sides of a connection member CP1 which is located in the center among the four connection members CP, the projections 23a of the respective conductive members 22 (connected to cathodes C) face each other. This allows the connection member CP1 to be shared by the detectors 21 (neighboring in the Y direction) disposed on both sides of the connection member CP1.
  • thermoplastic adhesive for the adhesive 25.
  • thermosetting adhesive which has the nature opposite to that of the thermoplastic adhesive so that these components are not separated. Selecting two different adhesives is useful because in the former, the part to which the adhesive 25 is applied is softened by overheat allowing the detector 21 to be removed easily, while in the latter, the detector element 211 and conductive members 22, 23 are hardly separated even if the detector element 211 is heated by a heat transfer.
  • a bias voltage for charge collection e.g., a backward applied voltage such that the cathode C has -500 V and anode A has a potential close to ground potential, that is, the anode A has a potential 500 V higher than the potential of the cathode C
  • a DC voltage power supply not shown
  • holes corresponding to positive charge are attracted and moved to the cathode C, while electrons having negative charge are attracted and moved to the anode A.
  • electrons have relatively greater mobility, and therefore electrons reach the anode A in a shorter time.
  • holes have relatively smaller mobility, and therefore holes reach the cathode C in a relatively longer time. Holes may also be trapped before they reach the electrode.
  • the conductive members 23 disposed between the anodes A, and the conductive members 22 disposed between the cathodes C constitute insensible regions where no ⁇ -rays are detected. Therefore, the detector 21 constructed in such a way that the conductive members 23, 22 constituting the insensible regions are disposed between the detector elements 211, or more specifically, between the electrodes. Both the anodes A and cathodes C are insensible regions.
  • the detectors 21 are arranged on the wiring board 24 of the detection module 20A, six channels in the Y direction (radius direction of the PET imaging apparatus 1) from the detection module 20A to the ASIC substrate 20B, 16 channels in the X direction (circumferential direction of the PET imaging apparatus 1) orthogonal to the Y direction and two channels (both sides of the wiring board 24) in the Z direction (depth direction of the PET imaging apparatus 1) which is the thickness direction of the wiring board 24.
  • a total of 96 channels of the detectors 21 are arranged on one side of the wiring board 24, a total of 192 channels on both sides.
  • the detection module 20A can improve the arrangement density of the detectors 21 using the three structures as will be explained below.
  • the respective detectors 21 are arranged in such a way that the projections 22a, 22b are oriented in the Y direction. This prevents the respective projections from being oriented in the X direction, and therefore it is possible to narrow gaps between the detectors 21 in the X direction.
  • the respective detectors 21 are arranged in such a way that electrodes of the same polarity (e.g., cathode C) face each other in the X direction. This arrangement reduces insulation between the detectors 21 in the X direction, and can thereby narrow gaps between the detectors 21 in the X direction.
  • the neighboring detectors 21 in the Y direction are arranged in such a way that the projections (parts of electrical connections with the outside of the detector) connected to the electrodes of the same polarity (anode A or cathode C) are arranged so as to face each other. This arrangement reduces insulation between the detectors 21 in the Y direction, and can thereby narrow gaps between the detectors 21 in the Y direction.
  • the gaps between the detectors 21 in the X direction are narrow, and therefore when ⁇ -rays emitted from within the body of the examinee H on the bed 31 travel from bottom to top in Fig. 2A (Y direction, that is, radius direction of the PET imaging apparatus 1 (see Figs. 1A, 1B), it is possible to reduce the proportion of ⁇ -rays passing without being detected by the detectors 21 ( ⁇ -rays passing through gaps formed between the neighboring detectors 21). Therefore, the first and second structures increase the detection efficiency of ⁇ -rays and also improve spatial resolution of an image obtained. There is also an advantage of shortening an examination time.
  • the gaps between the detectors 21 in the Y direction are narrow, and therefore the proportion of ⁇ -rays in the Y direction traveling askew with respect to the wiring board 24 that pass through the gaps between the detectors 21 in the Y direction is reduced. Therefore, this third structure as well as the first and second structures can increase the detection efficiency of ⁇ -rays and improve the spatial resolution of an image obtained. It also contributes to a reduction of the examination time.
  • the detection module 20A having the first, second or third structure can increase the detection efficiency of ⁇ -rays and improve the spatial resolution of images.
  • this embodiment arranges the detectors 21 on both sides of the wiring board 24, it is possible to reduce the number of wiring boards 24 arranged in the depth direction (Z direction) of the PET imaging apparatus 1 to half that in the case where the detectors 21 are only arranged on one side. This makes it possible to arrange the detectors 21 in the Z direction more densely. This embodiment also contributes to an increase in detection efficiency of ⁇ -rays and an improvement of spatial resolution of images in this case, too. It is also possible to further reduce the examination time. In addition, since the number of wiring boards 24 (unit substrates U) can be reduced by half as shown above, there is also a merit that it saves time and trouble in mounting the unit substrates U on the PET imaging apparatus 1 (see Fig. 1A, 1B).
  • the detectors 21 are preferably coated with insulators to avoid dielectric breakdown.
  • the insulator coats can be formed by immersing the unit including the entire detection module 20A in an insulator such as silicon rubber and then drying it to a thickness of several tens of microns.
  • the detectors 21 excluding the projections 22a, 23a may be coated with the insulator first and then those projections 22a, 23a may be attached to the corresponding connection members of the wiring board 24.
  • CP of the corresponding electrodes it is possible to make the conductive members 22, 23 smaller than the detector elements 211 so that portions of the projections 22a, 22b are disposed between the detector elements 211.
  • the detectors 21 may also be adapted so that the areas of contact of the detector element 211 with the wiring board 24 may also be fixed to the wiring board 24 using an insulating adhesive.
  • an insulating adhesive is preferably thermoplastic taking into account convertibility of the detectors 21.
  • Fig. 5B it is also possible to further extend lower parts of the projections 22a, 23a of the conductive members 22, 23 downward to provide folded parts 22c, 23c and connect the folded parts 22c of the conductive members 22 to the connection member CP and connect the folded parts 23c of the conductive members 23 to the connection member AP as shown in Fig. 5A. It is possible to connect the folded parts 22c to the connection member CP and connect the folded parts 23c to the connection member AP using the adhesive 25. In this case, since contacts of the folded parts 22c, 23c with the connection member CP and connection member AP are surface-to-surface contacts, it is possible to fix the detectors 21 to the wiring board 24 more firmly.
  • Fig. 6 it is also possible to share one conductive member 22 by cathodes C of the neighboring detectors 21 so as to integrate a plurality of detectors 21 into a one greater detector 21A.
  • This structure can reduce the number of neighboring conductive members 22 of the neighboring detectors 21 by one for each pair in the X direction in Fig. 2A, increasing the number of detectors 21 in the X direction. Therefore, it is possible to realize high-density mounting of detectors 21 on the wiring board 24. Such mounting is feasible when there are an even number of detector elements 211 making up one detector 21 and the electrode disposed at one end at which the detectors 21 face each other is the cathode C.
  • the unit substrate U is provided with the detection module 20A on which a plurality of detectors 21 are arranged as described above and an ASIC substrate 20B.
  • the ASIC substrate 20B includes capacitors 26, resistors 27, analog ASICs 28 and a digital ASIC 29.
  • the detection module 20A is constructed of a plurality of detectors 21 arranged on the wiring board 24.
  • a voltage of, for example, 500 V is applied between the anode A and cathode C of the detector 21 for charge collection as described above.
  • This voltage is applied between the anode A and cathode C of the respective detectors 21 from power supply wiring (not shown) set on the ASIC substrate 20B via a connector C1 and power supply wiring (not shown) set on the wiring board 24 of the detection module 20A.
  • the detection module 20A is provided with the connector C1 at one end of the wiring board 24.
  • the connector C1 includes the aforementioned terminal 33 and a plurality of terminal 34. ⁇ -ray detection signals output from the respective detectors 21 are supplied to the ASIC substrate 20B via the connector C1.
  • the ASIC substrate 20B arranges four analog ASICs 28 and one digital ASIC 29 on one side of a wiring board (support substrate) 35.
  • a wiring board (support substrate) 35 As shown in Fig. 2B, since the analog ASICs 28 are disposed on both sides of the wiring board 35, one ASIC substrate 20B includes a total of eight analog ASICs 28.
  • capacitors 26 and resistors 27 as the detectors 21 are arranged on both sides of the wiring board 35.
  • connection wires (not shown) inside the wiring board 35 for electrically connecting these capacitors 26, resistors 27, analog ASICs 28 and digital ASIC 29. These connection wires have a layered structure inside the wiring board 35.
  • the arrangement of the capacitors 26, analog ASICs 28 and digital ASIC 29 on the wiring board 35 agrees with the order in which signals are supplied from the detectors 21 of the detection module 20A.
  • One end of the resistor 27 is connected to the input side of the capacitor 26 and the other end is connected to ground wiring (not shown) provided on the wiring board 35.
  • the analog ASIC 28 is an application-specific IC which processes analog signals ( ⁇ -ray detection signals) output from the detectors 21 and is a kind of an LSI.
  • the analog ASIC 28 is provided with a signal processing circuit for each detector 21. These signal processing circuits are designed to receive a ⁇ -ray detection signal (radiation detection signal) output from the corresponding one detector 21 and calculate a ⁇ -ray peak value.
  • the ASIC substrate 20B is provided with a connector (e.g., spring pin connector) C2 having a plurality of terminals connected to the respective capacitors 26 at one end of the wiring board 35.
  • a connector e.g., spring pin connector
  • the unit substrates U are arranged on a ring-shaped support member (not shown) provided on the PET imaging apparatus 1 in such a way that the surface on which the detectors 21 are arranged is oriented toward the depth direction (longitudinal direction of the bed 31 and Z direction in Fig. 2B) of the PET imaging apparatus 1.
  • This ring-shaped support member is provided so as to surround the measuring space 32.
  • the plurality of unit substrates U arranged on the ring-shaped member are disposed in the circumferential direction and surround the measuring space 32.
  • the unit substrates U are arranged in such a way that the detection modules 20A are oriented inward (measuring space 32 side) and the ASIC substrates 20B are oriented outward.
  • a plurality of unit substrates U are also arranged in the depth direction of the PET imaging apparatus 1.
  • the orientation of the X direction shown in Fig. 2A, Fig. 3C, etc. is the circumferential direction (circumferential direction of the ring-shaped support member) of the PET imaging apparatus 1 and the orientation of the Y direction shown in Fig. 2A, Fig. 3C, etc., is the radius direction (radius direction of the ring-shaped support member) of the PET imaging apparatus 1.
  • the ends of the detection module 20A and ASIC substrate 20B overlap with each other and the connector C1 and connector C2 which exist in this overlapped area are connected.
  • the ends of the detection module 20A and ASIC substrate 20B are connected in a freely detachable (freely separable and connectable) manner using screws, etc., for clamping the overlapped area. They are connected in the overlapped area for the following reasons. That is, the unit substrate U consisting of the combined detection module 20A and ASIC substrate 20B is supported on one side inside the PET imaging apparatus 1, and therefore forces of deflecting or bending the unit substrate U act on the central part (connection section) of the unit substrate U depending on the installation position thereof.
  • the connection section having a structure with the end faces of the wiring board 24 and wiring board 35 butt-contacted is likely to deflect or bend, and is therefore undesirable.
  • this embodiment has the structure in which the detection module 20A and ASIC substrate 20B are connected in the overlapped area.
  • the unit substrate U used in this embodiment improves toughness against deflection and bending compared to the connection of the wiring board 24 and wiring board 35, the ends of which are butt-contacted. Improving the toughness of the unit substrate U against deflection and bending suppresses, for example, dislocation of the detectors 21 and improves the accuracy of identifying positions at which ⁇ -rays occur.
  • many unit substrates U are arranged in the PET imaging apparatus 1 in the circumferential direction and depth direction, and therefore the unit substrates U located at the lower part (especially the bottom) in Fig. 1A are likely to deflect or bend. For this reason, the toughness against deflection and bending of the unit substrates U constitutes an important factor.
  • the detection module 20A is attached to the ASIC substrate 20B in a freely detachable manner using screws, etc., if problems like detection fault, etc., occurs in the detectors 21 and ASICs 28, 29, it is only necessary to replace parts with the problem (detection module 20A or ASIC substrate 20B). Moreover, since the detection module 20A and ASIC substrate 20B are electrically connected using the connector C1 such as the aforementioned spring pin connector, connection or disconnection (coupling or decoupling) between substrates is easy.
  • one detection module 20A is connected to the ASIC substrate 20B, but the detection module 20A may be divided into plurality of portions.
  • the detection module 20A may be divided into plurality of portions.
  • this structure when one detector 21 malfunctions, it is only necessary to replace the one detection module mounted with the faulty detector out of the two detection modules, and thereby reduce waste (cost reduction) during maintenance.
  • This structure makes it possible to shorten the length (distance) of wiring for transmitting feeble ⁇ -ray detection signals output from the detectors 21 to amplifiers of the analog ASICs. This reduces influences of noise on the ⁇ -ray detection signals and also reduces attenuation of the ⁇ -ray detection signals.
  • capacitors 26 and resistors 27 are disposed outside the analog ASIC 28 in this embodiment.
  • the capacitors 26, resistors 27 and analog ASICs 28 provided on the ASIC substrate 20B may also be provided on the detection module 20A instead of the ASIC substrate 20B.
  • the capacitors 26, resistors 27 and analog ASICs 28 are arranged closer to the ASIC substrate 20B than the detectors 21. Since the detection module 20A includes the detectors 21 and analog ASICs 28, it is possible to further shorten the distance (length of wiring) between the detector 21 and analog ASIC 28. This further reduces influences of noise.
  • radiopharmaceuticals e.g., containing 18 F
  • Radiopharmaceuticals are administered to the examinee H using a method such as an injection so that radioactivity in the body becomes approximately 370 MBq.
  • Radiopharmaceuticals are selected according to the purpose of inspection (to locate cancers or inspect pulmonary aneurysm of heart, etc.).
  • the radiopharmaceuticals administered are soon concentrated on the affected area of the examinee H. In this condition, the examinee H is laid on the bed 31.
  • the inspector who performs a PET inspection (clinical radiologic technologist or doctor) inputs necessary information (region whose tomogram is to be obtained (imaging region or region of concern), number of slices, slice interval, absorbed dose, etc.) through the data processing apparatus 2 (see Fig. 1A) according to the purpose of inspection.
  • necessary information region whose tomogram is to be obtained (imaging region or region of concern), number of slices, slice interval, absorbed dose, etc.
  • the bed 31 is moved in the longitudinal direction to insert the examinee H into the measuring space 32 until the region to be inspected (e.g., affected area of cancer) of the examinee H up to a predetermined position.
  • the PET imaging apparatus 1 is activated.
  • a DC high voltage is applied between the anode A and cathode C of the detector 21 and the PET imaging apparatus 1 starts a PET inspection.
  • ⁇ -rays emitted from within the body of the examinee H provoked by radiopharmaceuticals are detected by the detectors 21. That is, a pair of ⁇ -rays are emitted in diametrically opposite directions at the time of annihilation of positrons emitted from the PET radiopharmaceuticals and detected by different detectors 21.
  • the detectors 21 output ⁇ -ray detection signals. These detection signals are input to a signal processing circuit (not shown) inside the corresponding analog ASIC 28 via the signal lines 24b, connectors C1, C2 and capacitors 26.
  • This signal processing circuit amplifies the ⁇ -ray detection signals and finds peak values of the detected ⁇ -rays. These peak values are converted to digital peak value information through an analog/digital converter (ADC) (not shown) in the digital ASIC 29.
  • ADC analog/digital converter
  • the digital ASIC 29 further outputs position information of the detectors 21 which have detected ⁇ -rays and information on the ⁇ -ray detection time.
  • the digital peak value information, position information of the detectors 21 and information of the ⁇ -ray detection time are input to the data processing apparatus 2.
  • a simultaneous measurement apparatus (not shown) of the data processing apparatus 2 counts a pair of ⁇ -rays generated by annihilation of one positron as one using the detection time information and identifies the positions of the detectors 21 which have detected the pair of ⁇ -rays based on the position information thereof. Furthermore, a tomogram information creation apparatus (not shown) which is the image information creation apparatus of the data processing apparatus 2 creates the position of accumulation of radiopharmaceuticals, that is, tomogram information (image information) of the examinee at the malignant tumor position using the count value obtained by simultaneous measurement and position information of the detectors 21. This tomogram information is displayed on the display apparatus 3.
  • the PET imaging apparatus of this embodiment has a structure with the detectors 21 used for the PET imaging apparatus 1 shown in Fig. 1A, 1B replaced by detectors 21B shown in Figs. 7A, 7B.
  • the structure of the PET imaging apparatus of this embodiment other than the detectors is the same as that of the PET imaging apparatus 1 shown in Fig. 1 which is the foregoing embodiment.
  • the detector 21B used in this embodiment will be explained using Fig. 7A.
  • the detectors 21B each consist of an even number of detector elements 211 arranged in parallel with mutually facing anodes A and mutually facing cathodes C.
  • a conductive member 23A is interposed between the anodes A of the neighboring detector elements 211 and a conductive member 22A is interposed between the cathodes C of the neighboring detector elements 211.
  • the conductive member 23A is attached to the anodes A of the neighboring detector elements 211 using a conductive adhesive.
  • the conductive member 22A is attached to the cathodes C of the neighboring detector elements 211 using a conductive adhesive.
  • the conductive member 22A is also attached to the cathodes C provided for the respective detector elements 211 at both ends of the detector 21B using a conductive adhesive.
  • the conductive members 22A and 23A form projections 22b, 23b which protrude from the same side (plane facing the wiring board 24) toward the same direction.
  • the projections 22b, 23b protrude outward from the semiconductor region S, that is, downward from the bottom (surface facing the wiring board 24) of the detector 21B.
  • the projection 22b is located on one side of the detector element 211 and the projection 23b is located on the other side of the detector element 211 facing the one side.
  • the respective projections 22b of the detector 21B are placed on the connection member CP and attached to the connection member CP using the adhesive 25. Furthermore, the respective projections 23b of the detector 21B are placed on the connection member AP and attached to the connection member AP using the adhesive 25. In this way, the detector 21B is attached to the wiring board 24.
  • the respective semiconductor regions S of the detector 21B are arranged so as to cross the wiring board 24, or more specifically so as to cross at right angles. This embodiment also arranges a plurality of detectors 21B on the wiring board 24 as shown in Fig. 4A to form a detection module.
  • This embodiment can produce the effects (1) to (7) and (9) to (20) of Embodiment 1 above. This embodiment further produces the following effects:
  • Embodiment 2 in which the projections face each other refers to a state in which of the two sides of the neighboring detectors 21B in the Y direction crossing the surface of the detector 21B from which projection 22b protrudes at right angles, the sides on the projection 22b side face each other.
  • Fig. 7C it is also possible to further extend the lower parts of the projections 22b, 23b of the conductive members 22A, 23A downward and form a folded parts 22d in the projection 22b and form a folded parts 23d in the projection 23b.
  • the folded parts 22d is connected to the connection member CP and the folded parts 23d is connected to the connection member AP using the adhesive 2,5.
  • Such connections of the folded parts 22d, 23d can realize enhanced fixing of the detectors 21 to the wiring board 24.
  • one connection member AP per one detector 21 (or 21B) is provided on the wiring board 24.
  • the respective projections 23a (or 23b) of one detector 21 (or 21B) are connected to different connection members AP using the adhesive 25.
  • These connection members AP are connected to one signal line 24b inside the wiring board 24.
  • Adopting such a structure can reduce the area of the connection members AP on the surface of the wiring board 24 (e.g., make the area equal to the cross-sectional area of the projection 23a (or 23b)) and can thereby prevent dielectric breakdown between the cathode C and conductive member 22 (or 22A) and connection member AP.
  • Such a structure of the connection member AP is also applicable to the connection member CP. That is, as many different connection members CP as projections 22a (or 22b) of the respective detectors 21 (or 21B) connected to one connection member CP shown in Fig. 4A are arranged on one row on the wiring board 24. Then, the projections 22a (or 22b) corresponding to these connection members CP are connected separately using the adhesive 25.
  • connection members CP are connected to one wiring 24a inside the wiring board 24.
  • the connection member CP which connects the mutually facing projections 22a (or 22b) of the neighboring detectors 21 (or 21B) is disposed on the wiring board 24 one by one between the mutually facing projections 22a (or 22b).
  • the area of the connection member CP on the surface of the wiring board 24 can also be reduced in the same way as the above-described connection member AP, and therefore it is possible to prevent dielectric breakdown between the anode A and conductive member 23 (or 23A) and connection member CP.
  • connection member AP is provided for each projection 23a (or 23b) of the detector 21 (or 21B) and the connection member AP is provided for each projection 22a (or 22b) of the detector 21 (or 21B) on the wiring board 24.
  • This structure is also applicable to the respective detection modules provided with detectors having the folded parts 22c, 23c shown in Fig. 5B and detectors having the folded parts 22d, 23d shown in Fig. 7C. In this case, it is preferably to determine the sizes of the folded parts 22c, 23c, 22d, 23d to sizes enough to hold the detectors 21.
  • the projections 23a (or 23b) of the conductive members 23 (or 23A) connected to the anode A are connected to the connection member AP and the projection 22a (or 22b) of the conductive members 22 (or 22A) connected to the cathode C are connected to the connection member CP, but it is also possible to connect the projections 23a (or 23b) to the connection member CP and connect the projections 22a (or 22b) to the connection member AP.
  • the cathode C becomes the electrode for outputting ⁇ -ray detection signals and the anode A becomes the electrode for applying a bias voltage. Any pattern can be realized if the voltage applied between the anode A and cathode C is at least a backward voltage.
  • the potential of the anode A is set to substantially ground potential and the potential of the cathode C is set to -500 V, but there is no restriction on the potential if it is at least a backward one and it is possible to set a voltage value within a range in which the PET imaging apparatus functions. It is also possible to use the cathode C as the electrode for extracting radiation detection signals and use the anode A as the electrode for applying a bias voltage.
  • Embodiments 1 and 2 arrange the cathodes C at both ends of the detector 21 (or 21B). However, it is also possible to arrange four detector elements 211 so that the anodes A are disposed at both ends of the detector 21 (or 21B). In this way, the cathodes C face each other at two locations and the anodes A face each other at one location in the detector.
  • Embodiments 1 and 2 four detector elements 211 are arranged in parallel to form a detector 21, but the number of elements arranged in parallel is not limited to four. However, to improve electrical insulating properties in the X direction, it is preferable to construct one detector with an even number of detector elements 211.
  • connection members AP and connection members CP on the wiring board 24 are also provided at locations other than areas where the adhesive 25 is connected.
  • the area of these connection member AP and connection member CP can be limited to a minimum necessary area to which the adhesive 25 is connected and can be connected within the wiring board 24 if necessary. This makes it possible to enhance electrical insulating properties between the connection member AP, connection member CP and corresponding electrodes on the surface of the wiring board 24.
  • the PET imaging apparatus see Fig. 1 as an example of radiological imaging apparatus
  • the detector and detection module of the present invention are not limited to the PET imaging apparatus and can be applied to a SPECT (Single Photon Emission Computer Tomography) apparatus and ⁇ -camera.
  • SPECT Single Photon Emission Computer Tomography
  • a functional image obtained by a ⁇ -camera is two-dimensional and it is provided with a collimator for regulating the position of incidence (angle) of ⁇ -rays.
  • Radiological imaging apparatus combining a PET imaging apparatus or SPECT apparatus with an X-ray CT.

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  • Physics & Mathematics (AREA)
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  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Measurement Of Radiation (AREA)
  • Light Receiving Elements (AREA)
  • Nuclear Medicine (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
EP05005277A 2004-03-11 2005-03-10 Strahlungsdetekormodul, Strahlungsdetektor und radiologisches Bilderzeugungsgerät Withdrawn EP1574877A1 (de)

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