EP1576064A1 - Article autoadhesif presentant au moins une couche d'une masse autoadhesive electroconductrice et procede de fabrication dudit article - Google Patents

Article autoadhesif presentant au moins une couche d'une masse autoadhesive electroconductrice et procede de fabrication dudit article

Info

Publication number
EP1576064A1
EP1576064A1 EP03767624A EP03767624A EP1576064A1 EP 1576064 A1 EP1576064 A1 EP 1576064A1 EP 03767624 A EP03767624 A EP 03767624A EP 03767624 A EP03767624 A EP 03767624A EP 1576064 A1 EP1576064 A1 EP 1576064A1
Authority
EP
European Patent Office
Prior art keywords
psa
electrically conductive
sensitive adhesive
psas
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03767624A
Other languages
German (de)
English (en)
Inventor
Marc Husemann
Stephan ZÖLLNER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tesa SE
Original Assignee
Tesa SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa SE filed Critical Tesa SE
Publication of EP1576064A1 publication Critical patent/EP1576064A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/24—Homopolymers or copolymers of amides or imides
    • C08L33/26—Homopolymers or copolymers of acrylamide or methacrylamide
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Definitions

  • the invention relates to a method for producing a pressure-sensitive adhesive article which has at least one layer of a thermally conductive pressure-sensitive adhesive, and to a pressure-sensitive adhesive article obtainable in this way, in particular for bonds in the field of electrical and electronic components.
  • US Pat. No. 5,620,795 and US Pat. No. 6,126,865 use polyacrylates of a certain comonomer composition as electrically conductive acrylic PSAs.
  • the comonomer composition of the polyacrylates is chosen such that very non-polar resins are compatible with the polyacrylate and thus high adhesive strengths can be achieved on non-polar surfaces with the electrically conductive PSA.
  • the coating method is a conventional coating method, for example from solution, in which stretching or stretching is carried out after the coating, preferably on a stretchable carrier.
  • Moderate basic monomers are, for example, N, N-dialkyl-substituted amides, such as, for example, N, N-dimethylacrylamide, N, N-dimethylmethylmethacrylamide, N-tert.-butylacrylamide, N-vinylpyrrolidone, N-vinyllactam, dimethylaminoethyl methacrylate, dimethylaminoethylacrylate, diethylamethylamate, diethylamate , N-methylol methacrylamide, N- (buthoxymethyl) methacrylamide, N-methylolacrylamide, N- (ethoxymethyl) acrylamide, N-isopropylacrylamide, although this list is not exhaustive.
  • N, N-dialkyl-substituted amides such as, for example, N, N-dimethylacrylamide, N, N-dimethylmethylmethacrylamide, N-tert.-butylacrylamide, N-vinylpyrrol
  • monomers are added to the described comonomers which have a high static glass transition temperature.
  • Zen. Aromatic vinyl compounds, such as, for example, styrene, are suitable as components, the aromatic nuclei preferably consisting of C 4 to C 18 building blocks and also being able to contain heteroatoms.
  • Particularly preferred examples are 4-vinylpyridine, N-vinylphthalimide, methylstyrene, 3,4-dimethoxystyrene, 4-vinylbenzoic acid, benzyl acrylate, benzyl methacrylate, phenyl acrylate, phenyl methacrylate, t-butylphenyl acrylate, t-butylphenyl methacrylate, 4-biphenyl acrylate and 2-methacrylate Naphylacrylate and methacrylate as well as mixtures of those monomers, although this list is not exhaustive.
  • part of the inventive PSA is an addition of an electrically conductive connection.
  • electrically conductive filling materials are therefore used.
  • Such materials include, without being restricted by this list, metal particles, metal powder, metal balls, metal fibers, where as metals e.g. Nickel, gold, silver, iron, lead, tin, zinc, stainless steel, bronze and copper or nickel coatings on copper particles, on nickel particles, on polymer balls or particles or glass microspheres can be used.
  • metals e.g. Nickel, gold, silver, iron, lead, tin, zinc, stainless steel, bronze and copper or nickel coatings on copper particles, on nickel particles, on polymer balls or particles or glass microspheres can be used.
  • lead / tin alloys with different compositions, e.g. by Sherrit Gordon, Ltd. Tobe offered.
  • electrically conductive polymers are added, such as, for example, polythiophene, substituted polythiophenes, polyethylene dioxythiophenes, polyaniline, substituted polyanilines, polyparaphenyls, substituted polyparaphenylenes, polypyrrole, substituted polypyrroles, polyacetylenes, substituted polyacetylenes, poly, phenylphenyl, poly, phenylphenyl substituted polyfurans polyalkylfluorene, substituted polyalkylfluorenes and mixtures of the above-mentioned polymers. So-called dopants can be added to improve conductivity.
  • all (soluble) resins compatible with the corresponding polyacrylate can be used, in particular reference is made to all aliphatic, aromatic, alkylaromatic hydrocarbon resins, hydrocarbon resins based on pure monomers, hydrogenated hydrocarbon resins, functional hydrocarbon resins and natural resins.
  • UV-absorbing photoinitiators can be added to the polyacrylate PSAs.
  • Useful photoinitiators that are very easy to use are benzoin ethers, such as. As benzoin methyl ether and benzoin isopropyl ether, substituted acetophenones, such as. B. 2,2-diethoxyacetophenone (available as Irgacure 651 ® from Ciba Geigy ® ), 2,2-dimethoxy-2-phenyl-1-phenylethanone, dimethoxyhydroxyacetophenone, substituted ⁇ -ketols, such as. B.
  • the average molecular weights M of the PSAs formed in the radical polymerization are very preferably selected such that they are in a range from 200,000 to 4,000,000 g / mol; PSAs with average molecular weights M w of 400,000 to 1,400,000 g / mol are produced especially for further use as electrically conductive hotmelt PSAs with resilience.
  • the average molecular weight is determined using size exclusion chromatography (GPC) or matrix-assisted laser desorption / ionization mass spectrometry (MALDI-MS).
  • a water-miscible or hydrophilic cosolvent can be added to the aqueous polymerization reactions in order to ensure that the reaction mixture is in the form of a homogeneous phase during the monomer conversion.
  • Controlled radical polymerization methods are also suitable for the production of polyacrylate PSAs with a narrow molecular weight distribution.
  • a contra-reagent of the general formula is then preferably used for the polymerization:
  • Halogen atoms are preferably F, Cl, Br or I, more preferably Cl and Br. Both linear and branched chains are outstandingly suitable as alkyl, alkenyl and alkynyl radicals in the various substituents.
  • alkynyl having 3 to 18 carbon atoms examples include propynyl, 2-butynyl, 3-butynyl, n-2-octynyl and n-2-octadecynyl.
  • hydroxy-substituted alkyl radicals are hydroxypropyl, hydroxybutyl or hydroxy hexyl.
  • US 4,581,429 A discloses a controlled radical polymerization process which uses a compound of the formula R'R "NOY as an initiator, where Y is a free radical species which can polymerize unsaturated monomers, but the reactions generally have low conversions. Polymerization of acrylates, which proceeds only in very low yields and molar masses, is particularly problematic.
  • WO 98/13392 A1 describes open-chain alkoxyamine compounds "EP 735 052 A1 discloses a process for the production of thermoplastic elastomers with narrow molar mass distributions.
  • the orientation within the PSA is generated during the coating by the coating process.
  • the electrically conductive PSAs are coated using a roll coating process and the orientation is generated by stretching. Different roller coating processes are described in the "Handbook of Pressure Sensitive Adhesive Technology" by Donatas Satas (van Nostrand, New York 1989).
  • orientation is achieved by coating via a melting nozzle.
  • the orientation of the electrically conductive PSA can be generated by the nozzle design inside the coating nozzle or by a stretching process after the nozzle emerges. The orientation can be freely adjusted.
  • the stretching ratio can be controlled, for example, by the width of the nozzle gap always when the layer thickness of the PSA film on the substrate to be coated is less than the width of the nozzle gap.
  • a material can be used as the contact medium that is able to make contact between the PSA and the roller surface, in particular a material that fills the voids between the carrier material and the roller surface (for example, unevenness in the roller surface, bubbles).
  • a liquid such as water, is chosen as the contact medium.
  • a grounded metal roller is usually used, which absorbs the incident electrons and the resulting X-rays.
  • the roller is usually covered with a protective layer to prevent corrosion. This is preferably selected so that it is well wetted by the contact medium. Generally the surface is conductive. However, it can also be cheaper to coat them with one or more layers of insulating or semiconducting material.
  • a second roller advantageously with a wettable or absorbent surface, runs through a bath with the contact medium, is wetted or soaked with the contact medium, and is in contact with the roller Apply or spread film of this contact medium.
  • the invention relates to the use of the electrically conductive and oriented PSAs for bonding components in the electrical and electronics industry.
  • the inventive PSAs are as Transfer tapes used.
  • the release paper is removed to bond electrically conductive substances.
  • the direction of gluing is chosen such that the inventive electrically conductive PSA has a resilience in the direction of the next parallel conductor track. In this way, short circuits can be avoided, since the PSA does not flow out in this direction compared to conventional electrically conductive PSAs.
  • Another advantage is the electrically conductive, pressure-sensitive die-cut parts which are particularly easy to produce and are dimensionally stable even during bonding and are therefore very effective for bonding very small electrical parts.
  • Another advantage of the electrically conductive and oriented PSAs is their reversibility. As a result of the orientation, the inventive PSAs can be stretched in the oriented direction, which in turn leads to a decrease in the adhesive strength and the bag. In this way, electrically conductive substances bonded to the inventive PSA can be separated again.
  • the inventive PSA has anisotropic electrically conductive properties. Due to the orientation of the polymer chains, the electrically conductive filling materials are pulled apart in a preferred direction and lose contact with one another. As a result of this process, the electrical conductivity is reduced in the orientation direction, so that the PSAs and therefore also the corresponding PSA tapes likewise have anisotropic electrical conductivities.
  • the coated and oriented PSAs were stored over a longer period of time as a rag sample and then analyzed.
  • a conventional 200 L reactor for radical polymerizations was charged with 2400 g of acrylamide, 64 kg of 2-ethylhexyl acrylate, 6.4 kg of N-isopropylacrylamide and 53.3 kg of acetone / isopropanol (95: 5). After passing through with nitrogen gas for 45 minutes while stirring, the reactor was heated to 58 ° C. and 40 g of 2,2'-azoisobutyronitrile (AIBN) were added. The outer heating bath was then heated to 75 ° C. and the reaction was carried out constantly at this outside temperature. After a reaction time of 1 h, 40 g of AIBN were again added.
  • AIBN 2,2'-azoisobutyronitrile
  • Polymer 2 was mixed with 20 wt .-% nickel particles based on the polymer content.
  • Polymer 2 was mixed with 30 wt .-% nickel particles based on the polymer content.
  • Test C was carried out to determine the electrical conductivity.
  • the adhesive strength was determined according to test D.
  • two polymers with an average molecular weight M of approximately 800,000 g / mol were produced.
  • Examples 1-4 according to the invention were produced with these PSAs.
  • Nickel particles and silver-coated nickel particles were selected as the electrically conductive materials.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

Selon un procédé de fabrication d'un article autoadhésif, une masse autoadhésive électroconductrice contenant de l'acrylate est appliquée sur un substrat par thermofusion puis étendue ou étirée de façon à former une couche électroconductrice anisotrope présentant un retrait d'au moins 3 % mesuré sur le film de masse autoadhésive exposé. Des pièces estampées destinées à l'industrie électrique et électronique peuvent être avantageusement fabriquées à partir de ce matériau.
EP03767624A 2002-12-19 2003-11-24 Article autoadhesif presentant au moins une couche d'une masse autoadhesive electroconductrice et procede de fabrication dudit article Withdrawn EP1576064A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10259549A DE10259549A1 (de) 2002-12-19 2002-12-19 Haftklebeartikel mit wenigstens einer Schicht aus einer elektrisch leitfähigen Haftklebemasse und Verfahren zu seiner Herstellung
DE10259549 2002-12-19
PCT/EP2003/013169 WO2004056933A1 (fr) 2002-12-19 2003-11-24 Article autoadhesif presentant au moins une couche d'une masse autoadhesive electroconductrice et procede de fabrication dudit article

Publications (1)

Publication Number Publication Date
EP1576064A1 true EP1576064A1 (fr) 2005-09-21

Family

ID=32477803

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03767624A Withdrawn EP1576064A1 (fr) 2002-12-19 2003-11-24 Article autoadhesif presentant au moins une couche d'une masse autoadhesive electroconductrice et procede de fabrication dudit article

Country Status (6)

Country Link
EP (1) EP1576064A1 (fr)
JP (1) JP2006510762A (fr)
KR (1) KR20050084414A (fr)
AU (1) AU2003292089A1 (fr)
DE (1) DE10259549A1 (fr)
WO (1) WO2004056933A1 (fr)

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DE10321585A1 (de) * 2003-05-14 2005-02-03 Tesa Ag Haftklebeband
DE102004001299A1 (de) * 2004-01-08 2005-07-28 Tesa Ag Hitze-aktivierbare Haftklebemasse
DE102004002279A1 (de) * 2004-01-16 2005-08-04 Tesa Ag Orientierte Acrylathaftklebemassen, Verfahren zu ihrer Herstellung und ihre Verwendung
DE602005017472D1 (de) * 2004-03-09 2009-12-17 Henkel Corp Wärmeleitfähige zweikomponentige klebstoffzusammensetzung
JP5280034B2 (ja) * 2007-10-10 2013-09-04 日東電工株式会社 配線回路基板用両面粘着テープ又はシートおよび配線回路基板
JP2011153190A (ja) * 2010-01-26 2011-08-11 Nitto Denko Corp 導電性粘着テープ
DE102011080724A1 (de) * 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige hitzeaktivierbare Klebemasse
DE102011080729A1 (de) * 2011-08-10 2013-02-14 Tesa Se Elektrisch leitfähige Haftklebemasse und Haftklebeband
JP6106148B2 (ja) 2013-11-27 2017-03-29 日東電工株式会社 導電性粘着テープ、電子部材及び粘着剤
DE102020206126A1 (de) 2020-05-14 2021-11-18 Tesa Se Haftklebriger Elektrolyt
KR102568290B1 (ko) * 2023-04-20 2023-08-17 박건우 점착제, 점착제층을 구비한 점착필름 및 이를 포함하는 액정패널
DE102023117415A1 (de) 2023-06-23 2024-12-24 Huhtamaki Flexible Packaging Germany Gmbh & Co. Kg Tubenlaminat mit genau einer vorgefertigten Folie und beiderseits aufgetragenen Polymerlagen
DE102024203546A1 (de) 2024-04-17 2025-10-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren zur Herstellung eines elektrochromen Laminats und elektrochromes Laminat
DE102024121461A1 (de) * 2024-07-29 2026-01-29 Tesa Se Verfahren zum Herstellen einer klebenden Struktur mit einer elektrisch lösbaren Haftklebemasse

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EP1361260A2 (fr) * 2002-05-11 2003-11-12 tesa AG Utilisation de macromonomères pour la préparation d'adhésifs acrylates

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WO2003044119A1 (fr) * 2001-11-22 2003-05-30 Tesa Ag Procede de production d'adhesifs acrylates thermofusibles orientes
WO2003044116A1 (fr) * 2001-11-22 2003-05-30 Tesa Ag Procede de production d'articles decoupes adhesifs
WO2003044117A1 (fr) * 2001-11-22 2003-05-30 Tesa Ag Procede pour la production de produits decoupes adhesifs par contact
EP1361260A2 (fr) * 2002-05-11 2003-11-12 tesa AG Utilisation de macromonomères pour la préparation d'adhésifs acrylates

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Publication number Publication date
KR20050084414A (ko) 2005-08-26
DE10259549A1 (de) 2004-07-08
WO2004056933A1 (fr) 2004-07-08
AU2003292089A1 (en) 2004-07-14
JP2006510762A (ja) 2006-03-30

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