EP1652233A4 - Couches empilables contenant des modules a grille matricielle a billes - Google Patents

Couches empilables contenant des modules a grille matricielle a billes

Info

Publication number
EP1652233A4
EP1652233A4 EP03818224A EP03818224A EP1652233A4 EP 1652233 A4 EP1652233 A4 EP 1652233A4 EP 03818224 A EP03818224 A EP 03818224A EP 03818224 A EP03818224 A EP 03818224A EP 1652233 A4 EP1652233 A4 EP 1652233A4
Authority
EP
European Patent Office
Prior art keywords
balls
layers containing
containing matrix
matrix grid
grid modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03818224A
Other languages
German (de)
English (en)
Other versions
EP1652233A1 (fr
Inventor
Floyd K Eide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nytell Software LLC
Original Assignee
Aprolase Development Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aprolase Development Co LLC filed Critical Aprolase Development Co LLC
Priority claimed from PCT/US2003/024706 external-priority patent/WO2005018000A1/fr
Publication of EP1652233A1 publication Critical patent/EP1652233A1/fr
Publication of EP1652233A4 publication Critical patent/EP1652233A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
EP03818224A 2003-08-08 2003-08-08 Couches empilables contenant des modules a grille matricielle a billes Withdrawn EP1652233A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2003/024706 WO2005018000A1 (fr) 2002-02-07 2003-08-08 Couches empilables contenant des modules a grille matricielle a billes

Publications (2)

Publication Number Publication Date
EP1652233A1 EP1652233A1 (fr) 2006-05-03
EP1652233A4 true EP1652233A4 (fr) 2009-11-25

Family

ID=34885493

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03818224A Withdrawn EP1652233A4 (fr) 2003-08-08 2003-08-08 Couches empilables contenant des modules a grille matricielle a billes

Country Status (3)

Country Link
EP (1) EP1652233A4 (fr)
JP (1) JP2007521631A (fr)
AU (1) AU2003261429A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7676912B2 (en) * 2007-09-05 2010-03-16 Headway Technologies, Inc. Method of manufacturing electronic component package

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998031738A1 (fr) * 1997-01-17 1998-07-23 Loctite Corporation Compositions de resines thermodurcissables
US20020094603A1 (en) * 2000-06-21 2002-07-18 Isaak Harlan R. Three-dimensional memory stacking using anisotropic epoxy interconnections
US20030043650A1 (en) * 2001-09-03 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Multilayered memory device
WO2003038861A2 (fr) * 2001-10-30 2003-05-08 Irvine Sensors Corporation Couches empilables encapsulant des microcircuits, avec couches d'interconnexion en chevauchement et procede de fabrication

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998031738A1 (fr) * 1997-01-17 1998-07-23 Loctite Corporation Compositions de resines thermodurcissables
US20020094603A1 (en) * 2000-06-21 2002-07-18 Isaak Harlan R. Three-dimensional memory stacking using anisotropic epoxy interconnections
US20030043650A1 (en) * 2001-09-03 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Multilayered memory device
WO2003038861A2 (fr) * 2001-10-30 2003-05-08 Irvine Sensors Corporation Couches empilables encapsulant des microcircuits, avec couches d'interconnexion en chevauchement et procede de fabrication

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2005018000A1 *

Also Published As

Publication number Publication date
AU2003261429A1 (en) 2005-03-07
EP1652233A1 (fr) 2006-05-03
JP2007521631A (ja) 2007-08-02

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20051216

AK Designated contracting states

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Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: APROLASE DEVELOPMENT CO., LLC

A4 Supplementary search report drawn up and despatched

Effective date: 20091028

RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 1/14 20060101ALI20091022BHEP

Ipc: H01L 25/10 20060101AFI20091022BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20100514