EP1653778A1 - Film de chauffage avec stabilisation de température automatisée - Google Patents

Film de chauffage avec stabilisation de température automatisée Download PDF

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Publication number
EP1653778A1
EP1653778A1 EP04025382A EP04025382A EP1653778A1 EP 1653778 A1 EP1653778 A1 EP 1653778A1 EP 04025382 A EP04025382 A EP 04025382A EP 04025382 A EP04025382 A EP 04025382A EP 1653778 A1 EP1653778 A1 EP 1653778A1
Authority
EP
European Patent Office
Prior art keywords
heating element
substrate
film layer
electrothermal film
film heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04025382A
Other languages
German (de)
English (en)
Inventor
Cheng-Ping Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to EP04025382A priority Critical patent/EP1653778A1/fr
Publication of EP1653778A1 publication Critical patent/EP1653778A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed with two or more layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/011—Heaters using laterally extending conductive material as connecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/02—Heaters using heating elements having a positive temperature coefficient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/032—Heaters specially adapted for heating by radiation heating

Definitions

  • the present invention relates to a film heating element, and more particularly to a film heating element having an automatic temperature control function.
  • a conventional heating device includes a heating element consisting of a nickel-chromium coil or a quartz tube disposed at a proper position.
  • the heating element is heated in a heat convection manner with the air as a medium of heat transfer.
  • the heat transfer efficiency in the air is poor, so that the heating temperature of the heating element is not evenly distributed.
  • the conventional heating device has a larger volume, and the heating temperature of the heating element cannot be controlled easily.
  • the electrothermal film includes a substrate, a silver gel, and an electrode.
  • the substrate has a first side provided with a far infrared layer and a second side provided with an electrothermal film layer.
  • the electrothermal film layer has a conductive protective layer having an oxidation surface.
  • the silver gel is located at a predetermined position of the protective layer and is electrically connected to an inside of the protective layer.
  • the electrode is electrically connected to the electrothermal film layer through the protective layer and the silver gel.
  • the electrothermal film layer co-operates with the far infrared layer to produce far infrared rays so as to heat a target efficiently.
  • the conventional heating device uses the electrothermal film to function as a heating source.
  • the substrate is provided with the far infrared layer in a high temperature sintering manner, thereby complicating the working process.
  • the substrate is located between the far infrared layer and the electrothermal film layer, thereby decreasing the heat transfer efficiency.
  • the electrothermal film is made of electric resistance material, so that the temperature cannot be controlled easily. Thus, it is necessary to provide a temperature control device additionally.
  • Another conventional heating device comprises a PTC heating body formed by a pressing or extruding process.
  • the PTC heating body is made of PTC material.
  • the PTC heating body produces a larger electric current and a larger current density, so that the PTC heating body produces a larger heat to increase the temperature, and the temperature increasing rate reaches 10 4 to 10 6 K/S.
  • the crystal of the PTC heating body is a semiconductor and the crystal boundary of the PTC heating body is a highly resistant body, so that the external electric field is mainly applied on the crystal boundary of the PTC heating body.
  • the electric intensity on the crystal boundary of the PTC heating body may reach one hundred times of that applied on the testing sample, thereby producing a high temperature.
  • the temperature is not distributed evenly.
  • the pressure stress is converted into a tension stress suddenly due to a phase variation, so that the stress reaches the limit value.
  • the ceramic blank of the PTC material of the PTC heating body has a poor capacity to resist the tension stress, so that the ceramic blank of the PTC material of the PTC heating body is easily broken.
  • the ceramic blank of the PTC material of the PTC heating body easily produces hot spots, thereby causing a heat break or an electric perforation.
  • a film heating element comprising: a substrate; an electrothermal film layer coated on a surface of the substrate and made of a material having a PTC effect; and two electrodes mounted on two opposite sides of the electrothermal film layer and each electrically connected to the electrothermal film layer.
  • the primary objective of the present invention is to provide a film heating element having an automatic temperature control function.
  • Another objective of the present invention is to provide a film heating element, wherein the electrothermal film layer is made of the PTC effect material having a positive temperature coefficient, so that the film heating element has a simplified construction and does not need a temperature control.
  • a further objective of the present invention is to provide a film heating element, wherein the substrate is integrally formed with the functional far infrared material without needing a high temperature sintering process, thereby simplifying the manufacturing process.
  • a further objective of the present invention is to provide a film heating element, wherein the thermal insulating layer is coated on the top face of the electrothermal film layer to provide a thermal insulating effect to the electrothermal film layer.
  • a film heating element in accordance with the preferred embodiment of the present invention comprises a substrate 1, an electrothermal film layer 2 coated on a surface of the substrate 1 and made of a material having a PTC effect, two electrodes 31 mounted on two opposite sides of the electrothermal film layer 2 and each electrically connected to the electrothermal film layer 2, and a thermal insulating layer 4 coated on a top face of the electrothermal film layer 2 to provide a thermal insulating effect to the electrothermal film layer 2.
  • the electrothermal film layer 2 produces heat by electrical conduction of the two electrodes 31.
  • the substrate 1 has a plate shape, a tubular shape or a cellular shape so that the substrate 1 is available for heating devices of different types.
  • the PTC effect is described as follows.
  • the temperature of the PTC material is smaller, and when the temperature is increased, the resistance of the PTC material is increased with rise of the temperature.
  • the temperature of the PTC material reaches a determined value, such as the Curie temperature point, the resistance of the PTC material is increased to reach that of an insulating body, so that the PTC material contains a voltage without passage of a current.
  • the resistance of the PTC material is reduced due to dissipation of the temperature (the Curie temperature point is reduced), thereby producing a current to provide a power required for dissipation of the temperature so as to achieve a balance effect, which indicates the PTC effect.
  • the PTC effect material of the electrothermal film layer 2 is a material having a positive temperature coefficient and having a PTC effect.
  • the impedance of the PTC material having a positive temperature coefficient is increased, so that the temperature will not be increased without restriction.
  • the electrothermal film layer 2 has a thickness smaller than 2 ⁇ m.
  • the electrothermal film layer 2 is combined with the substrate 1 in a molecular link manner and in a high temperature diffusion chemical reaction manner, so that when the electrothermal film layer 2 severely produces heat instantaneously, the electrothermal film layer 2 will not produce a temperature differential and hot spots so as to overcome the shortcomings of the conventional PTC heating body formed by a pressing or extruding process.
  • the electrothermal film layer 2 is made of the PTC effect material having a positive temperature coefficient, so that the film heating element has a simplified construction and does not need a temperature control.
  • the substrate 1 is added with a functional far infrared material, such as a ceramic material, to project far infrared rays onto an object to be heated.
  • a functional far infrared material such as a ceramic material
  • the functional far infrared material is mixed with the substrate 1 before the substrate 1 is formed, so that the substrate 1 is integrally formed with the functional far infrared material without needing a high temperature sintering process, thereby simplifying the manufacturing process.
  • the electrothermal film layer 2 is made of the PTC effect material having a positive temperature coefficient, so that the film heating element has a simplified construction and does not need a temperature control.
  • the substrate 1 is integrally formed with the functional far infrared material without needing a high temperature sintering process, thereby simplifying the manufacturing process.
  • the thermal insulating layer 4 is coated on the top face of the electrothermal film layer 2 to provide a thermal insulating effect to the electrothermal film layer 2.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Resistance Heating (AREA)
EP04025382A 2004-10-26 2004-10-26 Film de chauffage avec stabilisation de température automatisée Withdrawn EP1653778A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP04025382A EP1653778A1 (fr) 2004-10-26 2004-10-26 Film de chauffage avec stabilisation de température automatisée

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04025382A EP1653778A1 (fr) 2004-10-26 2004-10-26 Film de chauffage avec stabilisation de température automatisée

Publications (1)

Publication Number Publication Date
EP1653778A1 true EP1653778A1 (fr) 2006-05-03

Family

ID=34927111

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04025382A Withdrawn EP1653778A1 (fr) 2004-10-26 2004-10-26 Film de chauffage avec stabilisation de température automatisée

Country Status (1)

Country Link
EP (1) EP1653778A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102511066A (zh) * 2009-09-29 2012-06-20 整合公司 正温度系数加热元件以及其制造
CN103005907A (zh) * 2012-12-31 2013-04-03 蒋军闽 皮毛一体化冬暖夏凉式养生保健薄床垫
WO2017005662A1 (fr) * 2015-07-03 2017-01-12 Kautex Textron Gmbh & Co. Kg Dispositif de décongélation pour réservoir de liquide fonctionnel
CN112020158A (zh) * 2020-09-11 2020-12-01 广州烯健康新材料科技有限公司 一种节能型ptc电热膜

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3875413A (en) * 1973-10-09 1975-04-01 Hewlett Packard Co Infrared radiation source
US4889974A (en) * 1987-02-21 1989-12-26 U.S. Philips Corporation Thin-film heating element
JPH1189950A (ja) * 1997-09-25 1999-04-06 Omron Corp 赤外線治療器
JPH11129370A (ja) * 1997-10-31 1999-05-18 Sunrise Kogyo Kk 遠赤外線放射シート
WO2000034411A1 (fr) * 1998-12-07 2000-06-15 Young Keun Kim Composition de materiau polyvalent a rayonnement dans l'infrarouge lointain
US20040175339A1 (en) * 2001-04-30 2004-09-09 Yong-Gon Kim Multi-functional material emitting far-infrared ray in aqueous phase and the use thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3875413A (en) * 1973-10-09 1975-04-01 Hewlett Packard Co Infrared radiation source
US4889974A (en) * 1987-02-21 1989-12-26 U.S. Philips Corporation Thin-film heating element
JPH1189950A (ja) * 1997-09-25 1999-04-06 Omron Corp 赤外線治療器
JPH11129370A (ja) * 1997-10-31 1999-05-18 Sunrise Kogyo Kk 遠赤外線放射シート
WO2000034411A1 (fr) * 1998-12-07 2000-06-15 Young Keun Kim Composition de materiau polyvalent a rayonnement dans l'infrarouge lointain
US20040175339A1 (en) * 2001-04-30 2004-09-09 Yong-Gon Kim Multi-functional material emitting far-infrared ray in aqueous phase and the use thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 09 30 July 1999 (1999-07-30) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 10 31 August 1999 (1999-08-31) *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102511066A (zh) * 2009-09-29 2012-06-20 整合公司 正温度系数加热元件以及其制造
US9392645B2 (en) 2009-09-29 2016-07-12 Conflux Ab Positive temperature coefficient heating elements and their manufacturing
CN103005907A (zh) * 2012-12-31 2013-04-03 蒋军闽 皮毛一体化冬暖夏凉式养生保健薄床垫
CN103005907B (zh) * 2012-12-31 2015-06-10 蒋军闽 皮毛一体化冬暖夏凉式养生保健薄床垫
WO2017005662A1 (fr) * 2015-07-03 2017-01-12 Kautex Textron Gmbh & Co. Kg Dispositif de décongélation pour réservoir de liquide fonctionnel
CN112020158A (zh) * 2020-09-11 2020-12-01 广州烯健康新材料科技有限公司 一种节能型ptc电热膜

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