EP1664976A4 - Procede de reduction d'eblouissement et de creation de fini mat de densite commandee sur une surface de silicium - Google Patents
Procede de reduction d'eblouissement et de creation de fini mat de densite commandee sur une surface de siliciumInfo
- Publication number
- EP1664976A4 EP1664976A4 EP04809720A EP04809720A EP1664976A4 EP 1664976 A4 EP1664976 A4 EP 1664976A4 EP 04809720 A EP04809720 A EP 04809720A EP 04809720 A EP04809720 A EP 04809720A EP 1664976 A4 EP1664976 A4 EP 1664976A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- creating
- silicon surface
- matte finish
- reducing glare
- controlled density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 230000004313 glare Effects 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods
- A61B17/32—Surgical cutting instruments
- A61B17/3209—Incision instruments
- A61B17/3211—Surgical scalpels, knives; Accessories therefor
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B17/00—Surgical instruments, devices or methods
- A61B2017/00526—Methods of manufacturing
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US50140003P | 2003-09-10 | 2003-09-10 | |
| PCT/US2004/029499 WO2005026910A2 (fr) | 2003-09-10 | 2004-09-09 | Procede de reduction d'eblouissement et de creation de fini mat de densite commandee sur une surface de silicium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1664976A2 EP1664976A2 (fr) | 2006-06-07 |
| EP1664976A4 true EP1664976A4 (fr) | 2010-02-24 |
Family
ID=34312273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP04809720A Withdrawn EP1664976A4 (fr) | 2003-09-10 | 2004-09-09 | Procede de reduction d'eblouissement et de creation de fini mat de densite commandee sur une surface de silicium |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP1664976A4 (fr) |
| JP (1) | JP2007511367A (fr) |
| WO (1) | WO2005026910A2 (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011167883A (ja) * | 2010-02-17 | 2011-09-01 | Akase Sangyo Kk | 木質添え飾りおよびその製造方法 |
| CN105643101B (zh) * | 2012-10-15 | 2019-04-26 | 昆山科森科技股份有限公司 | 用于医疗器械的焊接装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5579583A (en) * | 1992-09-22 | 1996-12-03 | Micromed, Incorporated | Microfabricated blades |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5841099A (en) * | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
| US5751585A (en) * | 1995-03-20 | 1998-05-12 | Electro Scientific Industries, Inc. | High speed, high accuracy multi-stage tool positioning system |
| IL138710A0 (en) * | 1999-10-15 | 2001-10-31 | Newman Martin H | Atomically sharp edge cutting blades and method for making same |
| DE29919914U1 (de) * | 1999-11-12 | 2000-01-27 | Richard Wolf Gmbh, 75438 Knittlingen | Strikturskalpell |
| US6677552B1 (en) * | 2001-11-30 | 2004-01-13 | Positive Light, Inc. | System and method for laser micro-machining |
-
2004
- 2004-09-09 EP EP04809720A patent/EP1664976A4/fr not_active Withdrawn
- 2004-09-09 JP JP2006526296A patent/JP2007511367A/ja not_active Withdrawn
- 2004-09-09 WO PCT/US2004/029499 patent/WO2005026910A2/fr not_active Ceased
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5579583A (en) * | 1992-09-22 | 1996-12-03 | Micromed, Incorporated | Microfabricated blades |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2005026910A3 (fr) | 2006-10-12 |
| EP1664976A2 (fr) | 2006-06-07 |
| WO2005026910A2 (fr) | 2005-03-24 |
| JP2007511367A (ja) | 2007-05-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 20060307 |
|
| AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR |
|
| AX | Request for extension of the european patent |
Extension state: AL HR LT LV MK |
|
| PUAK | Availability of information related to the publication of the international search report |
Free format text: ORIGINAL CODE: 0009015 |
|
| DAX | Request for extension of the european patent (deleted) | ||
| RIC1 | Information provided on ipc code assigned before grant |
Ipc: B23K 26/18 20060101ALI20061123BHEP Ipc: B23K 26/16 20060101ALI20061123BHEP Ipc: B23K 26/14 20060101ALI20061123BHEP Ipc: B23K 26/00 20060101AFI20061123BHEP |
|
| A4 | Supplementary search report drawn up and despatched |
Effective date: 20100122 |
|
| RIC1 | Information provided on ipc code assigned before grant |
Ipc: B23K 26/06 20060101ALI20100118BHEP Ipc: B23K 26/38 20060101ALI20100118BHEP Ipc: B23K 26/18 20060101ALI20100118BHEP Ipc: B23K 26/16 20060101ALI20100118BHEP Ipc: B23K 26/14 20060101ALI20100118BHEP Ipc: B23K 26/00 20060101AFI20061123BHEP |
|
| 17Q | First examination report despatched |
Effective date: 20100517 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
| 18D | Application deemed to be withdrawn |
Effective date: 20100928 |