EP1665342A2 - Module optique et systeme optique - Google Patents

Module optique et systeme optique

Info

Publication number
EP1665342A2
EP1665342A2 EP04766746A EP04766746A EP1665342A2 EP 1665342 A2 EP1665342 A2 EP 1665342A2 EP 04766746 A EP04766746 A EP 04766746A EP 04766746 A EP04766746 A EP 04766746A EP 1665342 A2 EP1665342 A2 EP 1665342A2
Authority
EP
European Patent Office
Prior art keywords
optical module
thin
circuit carrier
module according
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04766746A
Other languages
German (de)
English (en)
Inventor
Henryk Frenzel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Germany GmbH
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of EP1665342A2 publication Critical patent/EP1665342A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses

Definitions

  • the invention relates to an optical module with a circuit carrier, an unhoused semiconductor element arranged on the circuit carrier by means of flip-chip technology and a lens unit for projecting electromagnetic radiation onto the semiconductor element, the lens unit comprising a lens holder and a lens arrangement with at least one lens.
  • the invention further relates to an optical system with an optical module designed in this way.
  • Cameras for specific low-cost applications such as automotive, industry, digital cameras, cell phones, toys, etc. should, however, be able to be produced from cost and aspects of quality assurance as far as possible without adjustment processes between the optics and the camera chip, i.e. without adjusting the focus on the optical surface of the CMOS - or CCD sensor. This is fundamentally contrary to the requirements mentioned.
  • One possibility of developing a focus-free system is to reduce the sum of the possible tolerances and elements, so that the module or system works, depending on the design, without adjustment, at least in a certain distance and temperature range.
  • the circuit carrier for the camera chip eg CCD or CMOS
  • the circuit carrier for the camera chip has a large share in the tolerance chain.
  • the necessary solder and, if necessary, adhesive connections or the like between the chip and the circuit carrier have a large proportion in the tolerance chain.
  • PCB Printed circuit boards
  • MID Molded Interconnected Device
  • EVM EVM behavior
  • the invention has for its object an optical module and an optical system with one on a circuit carrier to provide arranged unhoused semiconductor element, in which the EVM disadvantage is avoided and / or the thickness tolerance of the necessary circuit carrier is minimized as much as possible, so that reliable optical quality can be provided without adjustment and, in particular, focusing effort with simple and cost-effective installation and above the lifespan of the module or system is maintained. After all, special measures should guarantee process-reliable production with simple handling.
  • the invention is based on the generic optical module in that the circuit carrier itself has at least one thin area and one thick area holding the thin, relatively sensitive area.
  • Such a circuit structure has advantages in terms of EVM behavior compared to a pure Flex solution due to the close proximity of a thick area.
  • it advantageously combines a tolerance dimension that has been reduced to a minimum while at the same time significantly increasing torsional rigidity.
  • the lens holder is preferably supported in the thin region of the circuit carrier, so that a defined reference dimension between the lens holder or lens unit and circuit carrier is ensured.
  • the semiconductor element is preferably also arranged in or adjacent to a thin region of the circuit carrier.
  • an easy-to-use remote enables technology with particularly low tolerances between the semiconductor element or the camera chip and the lens unit.
  • the thin area of the circuit carrier is advantageously held by the thick area. This allows the assembly (e.g. soldering, gluing or the like) of the semiconductor element, for example by means of flip-chip technology, on a thin, yet relatively stable, torsionally rigid plane, which advantageously guarantees process-reliable production than in comparable assembly processes of components exclusively flexibly trained circuit boards.
  • the thick area is preferably U-shaped in order to adequately hold the thin area.
  • the thin, relatively sensitive area is preferably held by a circumferential thick area, as if stretched in a frame. Further designs are conceivable as long as they hold or stretch the thin area, for example L-shaped, partially U-shaped, F- or E-fork-shaped or similar thick areas.
  • the thick region is preferably rigid, for example as a multilayer printed circuit board (PCB), so-called multilayer, FR 4 circuit board or the like.
  • PCB printed circuit board
  • the thin and the thick area are implemented as a Molded Interconnected Device (MID) with integrated conductor tracks.
  • MID Technology is essentially based on the use of high-temperature thermoplastics, which are metallized in a structured manner.
  • MIDs ie spatial (3-dimensional) injection molded circuit carriers, are molded parts with an integrated circuit structure.
  • MIDs can be produced in various ways, for example by producing the circuit carrier by single injection molding and then by hot stamping, which is then metallized, which is then structured by stamping. Electroplating can also be carried out after the single injection molding.
  • structuring can also be created using a 3D mask or an imaging laser process.
  • the circuit carrier according to the invention which has at least two regions, can also be produced by other plastic processing methods, for example by double injection molding.
  • the metallization and the structuring of the MID can also be carried out in an integrated manner by means of a conductor foil.
  • the thin area is preferably designed as a flexible PCB or the like and the thick area as a rigid PCB or the like.
  • the preferred design of the thin area as a flexible printed circuit board or so-called flex film fulfills all the requirements that a Circuit element carrier carrying the element must fulfill within the scope of the present invention, namely as far as possible no additional uncertainties with regard to the optical structure, which is why flexible printed circuit boards with the tightest possible tolerances are to be used in particular.
  • the aforementioned design variants of the first and second area of the circuit carrier roughly equally offer the possibility of using production technology with particularly low tolerances between the semiconductor element arranged in or adjacent to the thin area of the circuit carrier and the lens unit.
  • the tolerance chain which in conventional structures is still extended by the thickness of the circuit carrier and the thickness of any stabilizing elements that may be provided, is advantageously reduced to a minimum in the context of the present invention.
  • support elements are preferably at least partially formed on the lens holder, by means of which the lens holder and thus the lens unit are related to the circuit carrier in a defined degree to the optics.
  • the lens unit and circuit carrier are connected to one another in an otherwise customary manner, preferably adjacent to the support elements, in particular glued, laser-welded, screwed, riveted or the like, so that a connection between the printed circuit board and the lens holder or lens unit is made available by means of the spacer elements, which is practical no additional uncertainty regarding the optical quality of the module.
  • the thick second region of the circuit carrier is part of the lens unit or of the lens holder, the lens holder preferably being designed as a MID (“molded interconnected device”) with integrated conductor tracks.
  • the number of required components is reduced again while maintaining the holder according to the invention of a thin area.
  • the semiconductor element can be soldered or glued directly onto adjacent or in the thin area of the lens holder.
  • a production technology with particularly small tolerances between the semiconductor element and the lens unit is offered.
  • the holder according to the invention leads to a relatively stable, flat, thin area, which makes assembly, assembly or the like particularly simple.
  • the semiconductor element is preferably arranged on the side of the circuit carrier facing away from the lens unit, the thin region in the circuit carrier having an opening through which electromagnetic radiation is projected from the lens arrangement onto the semiconductor element.
  • the optical module is therefore constructed in the order of lens arrangement / circuit carrier or flexible printed circuit board / semiconductor element. Even if embodiments are conceivable in which the sequence of circuit carrier and semiconductor element is reversed, it has proven to be particularly advantageous to provide the circuit carrier with an opening and thus to enable the first-mentioned sequence.
  • the invention further consists in an optical system with an optical module of the type mentioned above In this way, the advantages of the optical module also come into play as part of an overall system.
  • the invention is based on the knowledge that it is possible to provide a compact, highly integrated module solution with small dimensions, which avoids the disadvantages mentioned in the prior art and, in particular, is more reliable in terms of manufacture, easier to assemble and is therefore particularly cost-effective.
  • optical module and the optical system are practically maintenance-free. Particularly in terms of cost savings, it is also no optical adjustment of the optical module is necessary, since this is now improved due to the geometric design of the components and because the tolerance chain is reduced to a measure by minimizing the circuit carrier tolerance, while at the same time improving the handling of the manufacturing technology.
  • the module is stable and of high quality;
  • an integrated solution of sensor and optics in a modular design is provided.
  • the modular design means that the number of variants is reduced, which is in line with the always sought-after common parts concept.
  • the invention can be used particularly useful in the implementation of video systems, possibly in combination with radar systems, ultrasound systems or the like in the automotive field.
  • FIG. 1 shows a first perspective illustration of an optical module according to the invention
  • FIG. 2 shows a second perspective illustration of an optical module according to the invention
  • FIG. 3 shows a third perspective, partially sectioned illustration of an optical module according to the invention
  • FIG. 4 shows a first exemplary embodiment of a circuit carrier of the module according to the invention, comprising a thin and a frame-shaped thick region;
  • FIG. 5 shows a second exemplary embodiment of a circuit carrier of the module according to the invention, comprising a thin and a U-shaped thick region;
  • FIG. 6 shows an exploded perspective view of an optical module according to the invention
  • 7 shows a first sectional view of an optical module according to the invention
  • FIG. 8 shows a first lens holder of an optical module according to the invention with partially formed supporting elements
  • FIG. 9 shows a second lens holder of an optical module according to the invention with alternatively partially designed supporting elements
  • FIG. 10 shows a third lens holder of an optical module according to the invention with a circumferential support ring
  • FIG. 11 shows a second sectional view of an optical module with a lens holder according to FIG. 10.
  • FIG. 12 shows a third sectional view of an optical module according to the invention.
  • FIG. 1 shows a perspective view of an optical module according to the invention.
  • a lens holder 14 and a circuit carrier 10 comprising a first thin region 10a and a second thick region 10b.
  • a (not visible) light-sensitive semiconductor element which is applied here as a so-called flip chip 12, is arranged under the globtop 26, which can also be seen, which is the advantage has that there are no additional tolerances within the sensor or component (e.g. carrier chip, adhesive, etc.).
  • solder pads 28 At the opposite end of the thin region 10a of the circuit carrier 10, the latter is provided with solder pads 28, so that contact is made between the optical module and a rigid circuit board (not shown), for example by iron soldering using the solder pads 28, without the need for any further electrical connection can be.
  • a corresponding electrical connection can also be implemented by a flat cable 36, as shown, for example, in FIG. 2. Recesses and light-emitting diodes 38 arranged therein can be seen on the side of the optical module opposite the globtop 26.
  • FIG. 2 shows a second perspective illustration of an optical module according to the invention.
  • a special alternating arrangement of the light-emitting diodes 38 around a lens 20 provided for the radiation entry can be seen here.
  • FIG. 3 shows a perspective, partially sectioned illustration of an optical module according to the invention.
  • the interior of the lens holder 14 can be seen here.
  • FIG. 6, shows an exploded view of the optical module according to the invention
  • FIG. 7, shows the optical module in a sectional view, but with a lens arrangement 16, 18 expanded by a diaphragm 21, 20th
  • Three lenses 16, 18, 20 are inserted into the lens holder 14 according to FIG. 3.
  • the lenses 16, 18, 20 or the diaphragm 21 shown in FIG. 7 are shaped in such a way that they are relative to one another who assume a defined position within the lens holder 14.
  • at least one of the lenses is designed such that it cooperates with the lens holder 14 and thus also assumes a defined position with respect to the lens holder 14 and ultimately with respect to the semiconductor element 12. In this way, all lenses 16, 18, 20 are adjusted with respect to the semiconductor element 12. This adjustment is not influenced by further measures, since the lens holder 14 is arranged directly in the thin region 10a of the circuit carrier.
  • connection between the semiconductor element 12 and the circuit carrier 10a takes place by means of flip-chip technology in that a soldered connection is made via solder bumps 30.
  • the connection can then be reinforced with an underfill. So that electromagnetic radiation from the lens arrangement 16, 18, 20; arranged on the side facing away from the mounting surface of the circuit carrier 10; 21 can reach the semiconductor element 12, the thin region 10a has an opening 24. Through this opening 24, electromagnetic radiation can reach a surface 34 of the semiconductor element 12 that is sensitive to electromagnetic radiation.
  • the semiconductor element 12 can - according to the current technology - be designed as a CMOS or CCD.
  • an adhesive connection can also be provided.
  • An underfill (not shown) can be applied for reinforcement.
  • a glob top 26 is provided.
  • an opening for ventilation can be provided. It is also possible to arrange an adhesive DAE (adhesive pressure compensation element) on an opening (not shown).
  • the optical module has a specially designed circuit carrier 10, comprising a thin region 10a and a thick region 10b holding the thin, relatively sensitive region 10a as in a frame, preferably the thin region 10a carrying a semiconductor element 12.
  • FIG. 4 shows a first exemplary embodiment of a circuit carrier 10 of the module according to the invention, comprising a thin 10a and a frame-shaped thick 10b region.
  • FIG. 5 shows a second exemplary embodiment of a circuit carrier 10 of the module according to the invention, comprising a thin 10a and a u-shaped thick 10b region.
  • FIG. 6 shows an exploded perspective view of the optical module according to the invention, including the light-emitting diodes 38, the mutual arrangement being clearly shown in FIG. 6.
  • FIG. 7 shows an optical module with a lens unit, comprising a lens holder 14, into which a lens arrangement comprising, for example, three lenses 16, 18, 20 and an aperture 21 is inserted.
  • the lenses are preferably 16, 18, 20 and the diaphragm 21 is clearly aligned with each other and with respect to the lens holder 14 by its geometric design, so that no further optical adjustment of the system is required.
  • the thick region 10b of the circuit carrier 10 holds a first region 10a, which is, for example, a flex film which carries a semiconductor element 12 which is sensitive to electromagnetic radiation.
  • the semiconductor element 12 is also in a defined position with respect to the other optical elements, that is, in particular the lenses 16, 18, 20 arranged.
  • the thick 10b and thin 10a areas in particular rigid and flexible PCBs, multilayer FR4 and thin PCBs, milling out to an exact dimension, realization in MID or the like.
  • the thin, relatively sensitive area 10a is held or stretched as if in a frame by the relatively rigid area 10b running at least in sections.
  • the small tolerances between the top and bottom of the PCB are achieved by the thin area 10a of the circuit carrier, possibly in combination with additional measures such as coordinated lens systems etc.
  • the contact between the lens holder 14 and circuit carrier 10 takes place in the thin area 10a.
  • 8 and 9 show a lens holder with partial supports 39 in this regard.
  • 10 shows a lens holder 14 with a circumferential support ring 39, which at the same time the lens unit 14; 16, 18, 20; 21 seals against the circuit carrier 10 and vice versa in an advantageous manner. This is shown in Fig. 11 in a sectional view.
  • FIG. 12 shows a circuit carrier 10 designed according to the invention with a cutout 10a in the direction of the flip chip 12.
  • no support elements need advantageously be formed on the lens holder 14.
  • Such a circuit carrier 10 also offers improved EVM behavior.
  • the present invention advantageously allows.

Landscapes

  • Lens Barrels (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un module optique présentant un support de lentilles (14) recevant un système de lentilles par exemple composé de trois lentilles (16, 18, 20) et d'un diaphragme (21). Les trois lentilles (16, 18, 20) et le diaphragme (21) sont de préférence orientés de façon univoque du fait de leur conception géométrique, de telle manière qu'aucun ajustage optique n'est nécessaire. Selon l'invention, le module optique comporte un support de circuit (10) présentant une zone mince (10a) et une zone épaisse (10b) maintenant la zone mince (10a), relativement fragile, comme dans un cadre, ladite zone mince (10a) portant de préférence un élément à semiconducteurs (12). En plus des tolérances très faibles entre élément à semiconducteurs (12) et unité de lentilles (14; 16, 18, 20; 21), l'invention permet un montage plus fiable (par ex. soudage, collage ou similaires) d'un élément à semiconducteurs (12), par ex. par connexion par bossages, sur un plan (10a) mince mais relativement solide, par rapport à des procédés connus de montage de composants sur des supports de circuit flexibles. Le module optique selon l'invention est notamment destiné à être utilisé à l'intérieur et/ou à l'extérieur d'un véhicule.
EP04766746A 2003-09-26 2004-09-09 Module optique et systeme optique Withdrawn EP1665342A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10344767A DE10344767B4 (de) 2003-09-26 2003-09-26 Optisches Modul und optisches System
PCT/EP2004/052096 WO2005031808A2 (fr) 2003-09-26 2004-09-09 Module optique et systeme optique

Publications (1)

Publication Number Publication Date
EP1665342A2 true EP1665342A2 (fr) 2006-06-07

Family

ID=34384302

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04766746A Withdrawn EP1665342A2 (fr) 2003-09-26 2004-09-09 Module optique et systeme optique

Country Status (5)

Country Link
US (1) US7670064B2 (fr)
EP (1) EP1665342A2 (fr)
JP (1) JP4604036B2 (fr)
DE (1) DE10344767B4 (fr)
WO (1) WO2005031808A2 (fr)

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WO2012096651A1 (fr) 2011-01-11 2012-07-19 Hewlett-Packard Development Company, L.P. Alignement optique passif
KR20140054384A (ko) * 2011-09-06 2014-05-08 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 기계식으로 정렬된 광 엔진
KR20140120885A (ko) 2012-01-31 2014-10-14 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 옵토-일렉트로닉 엔진을 위한 콤비네이션 언더필-댐 및 전기적-상호접속 구조체
DE102012103633B4 (de) * 2012-04-25 2020-08-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierende Vorrichtung und Verfahren zum Herstellen einer derartigen Vorrichtung
JP6056860B2 (ja) * 2012-07-31 2017-01-11 ソニー株式会社 レンズ取付機構とレンズ取付方法および撮像装置
DE102015201998A1 (de) 2015-02-05 2016-08-11 Conti Temic Microelectronic Gmbh Kameramodul sowie Verfahren zur Herstellung
DE102015212123B4 (de) * 2015-06-30 2017-12-28 Robert Bosch Gmbh Kameragehäuse zur Justierung einer Optik und Verfahren dazu
DE102017108688B4 (de) * 2017-04-24 2022-08-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines optoelektronischen Bauteils und optoelektronisches Bauteil
DE102018121732A1 (de) * 2018-09-06 2020-03-12 Osram Opto Semiconductors Gmbh Elektronisches bauelement
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Also Published As

Publication number Publication date
DE10344767B4 (de) 2010-06-17
US20060239631A1 (en) 2006-10-26
WO2005031808A2 (fr) 2005-04-07
US7670064B2 (en) 2010-03-02
WO2005031808A3 (fr) 2005-07-21
JP2007506997A (ja) 2007-03-22
DE10344767A1 (de) 2005-05-04
JP4604036B2 (ja) 2010-12-22

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