EP1698434A4 - Schleifmaschine - Google Patents

Schleifmaschine

Info

Publication number
EP1698434A4
EP1698434A4 EP03782894A EP03782894A EP1698434A4 EP 1698434 A4 EP1698434 A4 EP 1698434A4 EP 03782894 A EP03782894 A EP 03782894A EP 03782894 A EP03782894 A EP 03782894A EP 1698434 A4 EP1698434 A4 EP 1698434A4
Authority
EP
European Patent Office
Prior art keywords
geinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03782894A
Other languages
English (en)
French (fr)
Other versions
EP1698434A1 (de
Inventor
Jun Ujike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UJIKE CO Ltd
Original Assignee
UJIKE CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UJIKE CO Ltd filed Critical UJIKE CO Ltd
Publication of EP1698434A1 publication Critical patent/EP1698434A1/de
Publication of EP1698434A4 publication Critical patent/EP1698434A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/26Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/08Circular back-plates for carrying flexible material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP03782894A 2003-12-25 2003-12-25 Schleifmaschine Withdrawn EP1698434A4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/016719 WO2005063444A1 (ja) 2003-12-25 2003-12-25 研磨盤

Publications (2)

Publication Number Publication Date
EP1698434A1 EP1698434A1 (de) 2006-09-06
EP1698434A4 true EP1698434A4 (de) 2008-10-15

Family

ID=34717657

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03782894A Withdrawn EP1698434A4 (de) 2003-12-25 2003-12-25 Schleifmaschine

Country Status (4)

Country Link
EP (1) EP1698434A4 (de)
CN (1) CN1886233A (de)
AU (1) AU2003292618A1 (de)
WO (1) WO2005063444A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017042848A (ja) * 2015-08-24 2017-03-02 アイシン・エーアイ株式会社 ギヤ研磨用工具及びそれに用いる研磨シート
CN107127674B (zh) * 2017-07-08 2021-01-08 上海致领半导体科技发展有限公司 一种用于半导体晶片抛光的陶瓷载盘

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998052717A1 (en) * 1997-05-19 1998-11-26 Lake Country Manufacturing, Inc. Foam buffing pad and method of manufacture thereof
US5888121A (en) * 1997-09-23 1999-03-30 Lsi Logic Corporation Controlling groove dimensions for enhanced slurry flow
US20030224706A1 (en) * 2002-05-31 2003-12-04 Sabo Gary L. Foam buffing/polishing pad

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08216029A (ja) * 1995-02-07 1996-08-27 Daiki:Kk 精密研磨シート
JP4586201B2 (ja) * 2001-02-09 2010-11-24 株式会社ウジケ 回転研磨機用研磨盤

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998052717A1 (en) * 1997-05-19 1998-11-26 Lake Country Manufacturing, Inc. Foam buffing pad and method of manufacture thereof
US5888121A (en) * 1997-09-23 1999-03-30 Lsi Logic Corporation Controlling groove dimensions for enhanced slurry flow
US20030224706A1 (en) * 2002-05-31 2003-12-04 Sabo Gary L. Foam buffing/polishing pad

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2005063444A1 *

Also Published As

Publication number Publication date
CN1886233A (zh) 2006-12-27
WO2005063444A1 (ja) 2005-07-14
AU2003292618A1 (en) 2005-07-21
EP1698434A1 (de) 2006-09-06

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20060620

AK Designated contracting states

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Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20080915

STAA Information on the status of an ep patent application or granted ep patent

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18D Application deemed to be withdrawn

Effective date: 20081213