EP1717352A3 - Galvanisiereinrichtung - Google Patents

Galvanisiereinrichtung Download PDF

Info

Publication number
EP1717352A3
EP1717352A3 EP06005414A EP06005414A EP1717352A3 EP 1717352 A3 EP1717352 A3 EP 1717352A3 EP 06005414 A EP06005414 A EP 06005414A EP 06005414 A EP06005414 A EP 06005414A EP 1717352 A3 EP1717352 A3 EP 1717352A3
Authority
EP
European Patent Office
Prior art keywords
plate
solution tank
solution
electroplating
electroplating apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06005414A
Other languages
English (en)
French (fr)
Other versions
EP1717352A2 (de
Inventor
Wataru Yamamoto-Ms Co Ltd Yamamoto
Katsunori Yamamoto-Ms Co Ltd Akiyama
Tokiko Yamamoto-Ms Co Ltd Katsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamamoto MS Co Ltd
Original Assignee
Yamamoto MS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamamoto MS Co Ltd filed Critical Yamamoto MS Co Ltd
Publication of EP1717352A2 publication Critical patent/EP1717352A2/de
Publication of EP1717352A3 publication Critical patent/EP1717352A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
EP06005414A 2005-04-22 2006-03-16 Galvanisiereinrichtung Withdrawn EP1717352A3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005125538A JP2006299367A (ja) 2005-04-22 2005-04-22 電気めっき試験器

Publications (2)

Publication Number Publication Date
EP1717352A2 EP1717352A2 (de) 2006-11-02
EP1717352A3 true EP1717352A3 (de) 2007-01-17

Family

ID=36809576

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06005414A Withdrawn EP1717352A3 (de) 2005-04-22 2006-03-16 Galvanisiereinrichtung

Country Status (6)

Country Link
US (1) US20060237304A1 (de)
EP (1) EP1717352A3 (de)
JP (1) JP2006299367A (de)
KR (1) KR20060111385A (de)
CN (1) CN1865519B (de)
TW (1) TW200637935A (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009006282A1 (de) * 2009-01-27 2010-07-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Erzeugung metallisch kristalliner Oberflächenstrukturen im Wege einer galvanischen Metallabscheidung
EP2246460A1 (de) * 2009-04-28 2010-11-03 Golden Eagle Trading Ltd Anlage zur Oberflächenbearbeitung von Werkstücken
JP6226229B2 (ja) * 2013-08-19 2017-11-08 株式会社山本鍍金試験器 めっき装置及びこれを用いたセンサ装置
US11674236B2 (en) * 2018-03-13 2023-06-13 Yamamoto-Ms Co., Ltd. Plating apparatus and plating system
CN110565154B (zh) * 2019-09-06 2024-07-09 陕西汉和新材料科技有限公司 一种新型铜箔防氧化电镀阳极板
JP7316908B2 (ja) * 2019-10-30 2023-07-28 株式会社荏原製作所 アノード組立体
CN112853445B (zh) * 2021-01-08 2022-08-26 上海戴丰科技有限公司 一种阳极可侧向抽拉式晶圆水平电镀池及晶圆水平电镀装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5312532A (en) * 1993-01-15 1994-05-17 International Business Machines Corporation Multi-compartment eletroplating system
US6077412A (en) * 1997-08-22 2000-06-20 Cutek Research, Inc. Rotating anode for a wafer processing chamber
US6416647B1 (en) * 1998-04-21 2002-07-09 Applied Materials, Inc. Electro-chemical deposition cell for face-up processing of single semiconductor substrates
US20040037682A1 (en) * 2002-08-13 2004-02-26 Junichiro Yoshioka Substrate holder, plating apparatus, and plating method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE7603626L (sv) * 1975-03-27 1977-01-04 Otto Alfred Becker Anordning for att galvanisera metallytor, serskilt vid snittkantytor hos genom stapling tillskurna platar
US4129494A (en) * 1977-05-04 1978-12-12 Norman Telfer E Electrolytic cell for electrowinning of metals
US4459194A (en) * 1983-03-10 1984-07-10 At&T Technologies, Inc. Electroplating apparatus
US5039381A (en) * 1989-05-25 1991-08-13 Mullarkey Edward J Method of electroplating a precious metal on a semiconductor device, integrated circuit or the like
US5242563A (en) * 1992-03-12 1993-09-07 The United States Of America As Represented By The Secretary Of The Navy Molten salt reactor for potentiostatic electroplating
DE19729893C2 (de) * 1997-07-12 1999-04-29 Mc Micro Compact Car Ag Lenksäule in einem Kraftfahrzeug
US6143146A (en) * 1998-08-25 2000-11-07 Strom; Doug Filter system
US6217727B1 (en) * 1999-08-30 2001-04-17 Micron Technology, Inc. Electroplating apparatus and method
US6627052B2 (en) * 2000-12-12 2003-09-30 International Business Machines Corporation Electroplating apparatus with vertical electrical contact
JP3588777B2 (ja) 2002-04-12 2004-11-17 株式会社山本鍍金試験器 電気めっき試験器の陰極カートリッジ
US20050189228A1 (en) * 2004-02-27 2005-09-01 Taiwan Semiconductor Manufacturing Co., Ltd. Electroplating apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5312532A (en) * 1993-01-15 1994-05-17 International Business Machines Corporation Multi-compartment eletroplating system
US6077412A (en) * 1997-08-22 2000-06-20 Cutek Research, Inc. Rotating anode for a wafer processing chamber
US6416647B1 (en) * 1998-04-21 2002-07-09 Applied Materials, Inc. Electro-chemical deposition cell for face-up processing of single semiconductor substrates
US20040037682A1 (en) * 2002-08-13 2004-02-26 Junichiro Yoshioka Substrate holder, plating apparatus, and plating method

Also Published As

Publication number Publication date
EP1717352A2 (de) 2006-11-02
CN1865519B (zh) 2010-08-11
JP2006299367A (ja) 2006-11-02
CN1865519A (zh) 2006-11-22
KR20060111385A (ko) 2006-10-27
TW200637935A (en) 2006-11-01
US20060237304A1 (en) 2006-10-26

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