EP1743368A4 - Säge- und handhabungssystem für die herstellung eines halbleitergehäuses - Google Patents

Säge- und handhabungssystem für die herstellung eines halbleitergehäuses

Info

Publication number
EP1743368A4
EP1743368A4 EP04821957A EP04821957A EP1743368A4 EP 1743368 A4 EP1743368 A4 EP 1743368A4 EP 04821957 A EP04821957 A EP 04821957A EP 04821957 A EP04821957 A EP 04821957A EP 1743368 A4 EP1743368 A4 EP 1743368A4
Authority
EP
European Patent Office
Prior art keywords
sawing
manufacturing
processing system
semiconductor housing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04821957A
Other languages
English (en)
French (fr)
Other versions
EP1743368A1 (de
Inventor
Ik-Kyun Na
Suk-Bae Kim
Seung-Hee Choi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanmi Semiconductor Co Ltd
Original Assignee
Hanmi Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020040032326A external-priority patent/KR100574584B1/ko
Application filed by Hanmi Semiconductor Co Ltd filed Critical Hanmi Semiconductor Co Ltd
Publication of EP1743368A1 publication Critical patent/EP1743368A1/de
Publication of EP1743368A4 publication Critical patent/EP1743368A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0478—Apparatus for manufacture or treatment the substrates being processed being not semiconductor wafers, e.g. leadframes or chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP04821957A 2004-05-07 2004-11-30 Säge- und handhabungssystem für die herstellung eines halbleitergehäuses Withdrawn EP1743368A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020040032326A KR100574584B1 (ko) 2003-05-31 2004-05-07 반도체 패키지 제조공정용 절단 및 핸들러시스템
PCT/KR2004/003127 WO2005109492A1 (en) 2004-05-07 2004-11-30 Sawing and handler system for manufacturing semiconductor package

Publications (2)

Publication Number Publication Date
EP1743368A1 EP1743368A1 (de) 2007-01-17
EP1743368A4 true EP1743368A4 (de) 2009-01-28

Family

ID=35320473

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04821957A Withdrawn EP1743368A4 (de) 2004-05-07 2004-11-30 Säge- und handhabungssystem für die herstellung eines halbleitergehäuses

Country Status (4)

Country Link
EP (1) EP1743368A4 (de)
JP (1) JP2007536727A (de)
CN (1) CN100470758C (de)
WO (1) WO2005109492A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101969038B (zh) 2004-08-23 2012-02-15 洛克系统有限公司 支承一组集成电路单元的支承装置
JP4869184B2 (ja) * 2006-08-28 2012-02-08 ハンミ セミコンダクター カンパニー リミテッド パッケージ固定用ジグアセンブリ
JP4944711B2 (ja) * 2006-08-28 2012-06-06 ハンミ セミコンダクター カンパニー リミテッド 半導体パッケージ固定アセンブリ
JP2010539583A (ja) * 2007-09-14 2010-12-16 ハンミ セミコンダクター カンパニー リミテッド メモリーカード加工装置
NL2001790C2 (nl) 2008-07-11 2010-01-12 Fico Bv Inrichting en werkwijze voor het zagen van elektronische componenten.
WO2010009881A1 (en) * 2008-07-23 2010-01-28 Meyer Burger Ag Multi-wire cutting device with a revolving workpiece mount
SG183593A1 (en) * 2011-03-02 2012-09-27 Rokko Systems Pte Ltd Improved system for substrate processing
KR101414690B1 (ko) * 2013-04-22 2014-07-08 한미반도체 주식회사 반도체 스트립 절단장치
KR102267946B1 (ko) * 2014-11-04 2021-06-22 세메스 주식회사 반도체 패키지 및 반도체 스트립 이송 장치
KR101828381B1 (ko) * 2016-08-31 2018-02-12 (주)임펙 엔터프라이즈 복합 이송툴을 구비하는 기판절단장비 및 이를 이용한 기판 이송 방법
KR101863139B1 (ko) * 2017-10-23 2018-05-31 (주)임펙 엔터프라이즈 언로딩영역의 하부에 스크랩수집부가 설치된 기판절단장비
KR102019377B1 (ko) * 2017-11-24 2019-09-06 한미반도체 주식회사 반도체 자재 절단장치
CN110370468B (zh) * 2019-09-06 2020-07-24 浙江利恩工程设计咨询有限公司 一种多方位大理石切割装置
JP7377092B2 (ja) * 2019-12-16 2023-11-09 Ｔｏｗａ株式会社 統計データ生成方法、切断装置及びシステム
KR102617780B1 (ko) * 2020-11-19 2023-12-26 세메스 주식회사 반도체 스트립 절단 및 분류 설비에서 공기 분사 장치
KR102702318B1 (ko) * 2020-11-25 2024-09-03 세메스 주식회사 반도체 스트립 절단 및 분류 설비에서 패키지 건조 장치
JP7496328B2 (ja) 2021-03-24 2024-06-06 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
JP7430154B2 (ja) * 2021-03-29 2024-02-09 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
JP7645146B2 (ja) * 2021-08-03 2025-03-13 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
JP7799398B2 (ja) * 2021-08-04 2026-01-15 Ｔｏｗａ株式会社 加工装置、及び加工品の製造方法
KR20230082955A (ko) * 2021-12-02 2023-06-09 세메스 주식회사 테이블 세정 장치를 포함하는 반도체 패키지 절단 및 분류 설비
CN115971110A (zh) * 2022-12-28 2023-04-18 荣成歌尔微电子有限公司 封装结构的清洗方法和清洗设备
CN116727361A (zh) * 2023-08-16 2023-09-12 长园半导体设备(珠海)有限公司 去污装置及分选设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1028455A2 (de) * 1999-02-10 2000-08-16 Disco Corporation Schneid- und Transfersystem und Pellettransfervorrichtung
US20020073575A1 (en) * 2000-12-20 2002-06-20 Na Ik-Gyun Handler system for cutting a semiconductor package device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3232575B2 (ja) * 1990-10-16 2001-11-26 ソニー株式会社 半導体処理装置
JP3116619B2 (ja) * 1993-01-11 2000-12-11 株式会社東京精密 半導体ウェーハの製造システム
JP2917262B2 (ja) * 1993-01-11 1999-07-12 株式会社東京精密 半導体ウェーハの洗浄・乾燥装置
US5427644A (en) * 1993-01-11 1995-06-27 Tokyo Seimitsu Co., Ltd. Method of manufacturing semiconductor wafer and system therefor
JPH07171754A (ja) * 1993-12-20 1995-07-11 Disco Abrasive Syst Ltd 外観検査機能付きダイシング装置
JPH07240452A (ja) * 1994-02-28 1995-09-12 Seiko Seiki Co Ltd 半導体ウエハ加工装置
JPH07240453A (ja) * 1994-02-28 1995-09-12 Seiko Seiki Co Ltd 半導体ウエハ加工装置
JPH0831785A (ja) * 1994-07-12 1996-02-02 Sony Corp ウェーハの洗浄方法および装置
JP4339452B2 (ja) * 1999-07-09 2009-10-07 株式会社ディスコ Ｃｓｐ基板分割装置
JP3738176B2 (ja) * 2000-08-03 2006-01-25 三洋電機株式会社 半導体装置の製造方法
JP3765265B2 (ja) * 2001-11-28 2006-04-12 株式会社東京精密 ダイシング装置
JP2003318137A (ja) * 2002-04-24 2003-11-07 Korea Semiconductor System Co Ltd 半導体パッケージの単数化方法
JP4315788B2 (ja) * 2003-11-26 2009-08-19 アピックヤマダ株式会社 半導体装置の製造方法及び製造装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1028455A2 (de) * 1999-02-10 2000-08-16 Disco Corporation Schneid- und Transfersystem und Pellettransfervorrichtung
US20020073575A1 (en) * 2000-12-20 2002-06-20 Na Ik-Gyun Handler system for cutting a semiconductor package device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2005109492A1 *

Also Published As

Publication number Publication date
CN1954423A (zh) 2007-04-25
CN100470758C (zh) 2009-03-18
EP1743368A1 (de) 2007-01-17
JP2007536727A (ja) 2007-12-13
HK1098251A1 (zh) 2007-07-13
WO2005109492A1 (en) 2005-11-17

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