EP1758814A4 - Verkapselung für elektro-mechanische-mikrosysteme und herstellungsverfahren dafür - Google Patents

Verkapselung für elektro-mechanische-mikrosysteme und herstellungsverfahren dafür

Info

Publication number
EP1758814A4
EP1758814A4 EP05725682A EP05725682A EP1758814A4 EP 1758814 A4 EP1758814 A4 EP 1758814A4 EP 05725682 A EP05725682 A EP 05725682A EP 05725682 A EP05725682 A EP 05725682A EP 1758814 A4 EP1758814 A4 EP 1758814A4
Authority
EP
European Patent Office
Prior art keywords
packaging
methods
mechanical systems
making same
microelectric mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05725682A
Other languages
English (en)
French (fr)
Other versions
EP1758814A2 (de
Inventor
Paul A Kohl
Farrokh Ayazi
Paul Jayachandran Joseph
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Georgia Tech Research Institute
Georgia Tech Research Corp
Original Assignee
Georgia Tech Research Institute
Georgia Tech Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Georgia Tech Research Institute, Georgia Tech Research Corp filed Critical Georgia Tech Research Institute
Publication of EP1758814A2 publication Critical patent/EP1758814A2/de
Publication of EP1758814A4 publication Critical patent/EP1758814A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0108—Sacrificial polymer, ashing of organics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0154—Moulding a cap over the MEMS device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
EP05725682A 2004-03-15 2005-03-15 Verkapselung für elektro-mechanische-mikrosysteme und herstellungsverfahren dafür Withdrawn EP1758814A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US55317804P 2004-03-15 2004-03-15
PCT/US2005/008664 WO2005089348A2 (en) 2004-03-15 2005-03-15 Packaging for micro electro-mechanical systems and methods of fabricating thereof

Publications (2)

Publication Number Publication Date
EP1758814A2 EP1758814A2 (de) 2007-03-07
EP1758814A4 true EP1758814A4 (de) 2010-12-15

Family

ID=34994284

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05725682A Withdrawn EP1758814A4 (de) 2004-03-15 2005-03-15 Verkapselung für elektro-mechanische-mikrosysteme und herstellungsverfahren dafür

Country Status (6)

Country Link
US (2) US8476096B2 (de)
EP (1) EP1758814A4 (de)
JP (1) JP5133680B2 (de)
KR (1) KR101335163B1 (de)
CN (1) CN101094804B (de)
WO (1) WO2005089348A2 (de)

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WO2009073692A1 (en) * 2007-12-03 2009-06-11 Kolo Technologies, Inc. Packaging and connecting electrostatic transducer arrays
EP2218094A1 (de) * 2007-12-03 2010-08-18 Kolo Technologies, Inc. Waferdurchgangsverbindungen eines elektrostatischen wandlers und anordnung
JP2009141036A (ja) * 2007-12-05 2009-06-25 Hitachi Media Electoronics Co Ltd パッケージ構造体
WO2009147556A2 (en) * 2008-05-27 2009-12-10 Nxp B.V. Microscopic structure packaging method and device with packaged microscopic structure
CN101633490B (zh) * 2008-07-25 2014-06-04 亚太优势微系统股份有限公司 具有微帽盖的元件、模组及其晶圆级封装方法
US8580596B2 (en) * 2009-04-10 2013-11-12 Nxp, B.V. Front end micro cavity
EP2266919A1 (de) * 2009-06-25 2010-12-29 Nxp B.V. MEMS-Vorrichtungen
DE102009029199A1 (de) * 2009-09-04 2011-03-10 Robert Bosch Gmbh Stressentkoppelte Aufbautechnik für substratlose Mold-Packages
KR101650893B1 (ko) * 2010-08-06 2016-08-25 스미토모 베이클리트 컴퍼니 리미티드 마이크로전자 어셈블리를 위한 폴리머 조성물
TWI455265B (zh) * 2010-11-01 2014-10-01 矽品精密工業股份有限公司 具微機電元件之封裝結構及其製法
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EP3126065B1 (de) 2014-03-31 2021-05-19 Koninklijke Philips N.V. Integrierter schaltungs-chip, ultraschallsonde, ultraschalldiagnosesystem und verfahren
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US10870575B2 (en) * 2018-06-29 2020-12-22 Infineon Technologies Dresden GmbH & Co. KG Stressed decoupled micro-electro-mechanical system sensor
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US11180366B2 (en) 2020-03-23 2021-11-23 General Electric Company Methods for forming a MEMS device layer on an active device layer and devices formed thereby
CN112259528A (zh) * 2020-09-28 2021-01-22 立讯电子科技（昆山）有限公司 具有双面选择性电磁屏蔽封装的sip结构及其制备方法
KR102213908B1 (ko) 2020-10-28 2021-02-08 주식회사 삼정이엔씨 오일 회수기능을 구비하는 수소가스 충전기용 저온 냉각시스템
KR102231721B1 (ko) 2020-10-28 2021-03-25 김승섭 전자식 냉각밸브를 구비한 수소가스 충전기용 냉각시스템
KR102202439B1 (ko) 2020-10-28 2021-01-13 김승섭 수소가스 충전건 결빙 방지장치
KR102217530B1 (ko) 2020-10-28 2021-02-19 주식회사 삼정이엔씨 수소가스 충전기용 냉각장치 제어시스템

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Also Published As

Publication number Publication date
US20100307786A1 (en) 2010-12-09
US8405170B2 (en) 2013-03-26
CN101094804A (zh) 2007-12-26
EP1758814A2 (de) 2007-03-07
CN101094804B (zh) 2011-12-28
WO2005089348A3 (en) 2007-06-21
KR101335163B1 (ko) 2013-12-02
JP2007529333A (ja) 2007-10-25
KR20070005674A (ko) 2007-01-10
HK1110061A1 (en) 2008-07-04
US20070273013A1 (en) 2007-11-29
US8476096B2 (en) 2013-07-02
JP5133680B2 (ja) 2013-01-30
WO2005089348A2 (en) 2005-09-29

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