EP1765526A4 - Zusammensetzungen und verfahren zum trocknen von strukturierten wafern bei der herstellung von integrierten schaltungsprodukten - Google Patents

Zusammensetzungen und verfahren zum trocknen von strukturierten wafern bei der herstellung von integrierten schaltungsprodukten

Info

Publication number
EP1765526A4
EP1765526A4 EP04751653A EP04751653A EP1765526A4 EP 1765526 A4 EP1765526 A4 EP 1765526A4 EP 04751653 A EP04751653 A EP 04751653A EP 04751653 A EP04751653 A EP 04751653A EP 1765526 A4 EP1765526 A4 EP 1765526A4
Authority
EP
European Patent Office
Prior art keywords
compositions
methods
during manufacture
integrated circuitry
wafers during
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04751653A
Other languages
English (en)
French (fr)
Other versions
EP1765526A1 (de
Inventor
Chongying Xu
Michael Korzenski
Thomas H Baum
Alexander Borovik
Eliodor G Ghenciu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Technology Materials Inc
Original Assignee
Advanced Technology Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Technology Materials Inc filed Critical Advanced Technology Materials Inc
Publication of EP1765526A1 publication Critical patent/EP1765526A1/de
Publication of EP1765526A4 publication Critical patent/EP1765526A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
EP04751653A 2004-05-07 2004-05-07 Zusammensetzungen und verfahren zum trocknen von strukturierten wafern bei der herstellung von integrierten schaltungsprodukten Withdrawn EP1765526A4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2004/014353 WO2005113167A1 (en) 2004-05-07 2004-05-07 Compositions and methods for drying patterned wafers during manufacture of integrated circuitry products

Publications (2)

Publication Number Publication Date
EP1765526A1 EP1765526A1 (de) 2007-03-28
EP1765526A4 true EP1765526A4 (de) 2007-11-14

Family

ID=35428293

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04751653A Withdrawn EP1765526A4 (de) 2004-05-07 2004-05-07 Zusammensetzungen und verfahren zum trocknen von strukturierten wafern bei der herstellung von integrierten schaltungsprodukten

Country Status (4)

Country Link
EP (1) EP1765526A4 (de)
JP (1) JP2007536730A (de)
CN (1) CN1960813A (de)
WO (1) WO2005113167A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8440573B2 (en) * 2010-01-26 2013-05-14 Lam Research Corporation Method and apparatus for pattern collapse free wet processing of semiconductor devices
TWI689004B (zh) 2012-11-26 2020-03-21 美商應用材料股份有限公司 用於高深寬比半導體元件結構具有污染物去除之無黏附乾燥處理
US10283344B2 (en) 2014-07-11 2019-05-07 Applied Materials, Inc. Supercritical carbon dioxide process for low-k thin films
US10026629B2 (en) * 2014-10-17 2018-07-17 Tokyo Electron Limited Substrate liquid processing apparatus, substrate liquid processing method, and computer-readable storage medium storing substrate liquid processing program
CN108140603B (zh) 2015-10-04 2023-02-28 应用材料公司 基板支撑件和挡板设备
JP6639657B2 (ja) 2015-10-04 2020-02-05 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 熱質量が小さい加圧チャンバ
CN116206947A (zh) 2015-10-04 2023-06-02 应用材料公司 缩减空间的处理腔室
KR102054605B1 (ko) 2015-10-04 2019-12-10 어플라이드 머티어리얼스, 인코포레이티드 고 종횡비 피처들을 위한 건조 프로세스
JP7394563B2 (ja) * 2019-09-12 2023-12-08 東京エレクトロン株式会社 基板処理装置の洗浄方法及び基板処理システム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002066176A1 (en) * 2001-02-15 2002-08-29 Micell Technologies, Inc. Methods for cleaning microelectronic structures
US20030232512A1 (en) * 2002-06-13 2003-12-18 Dickinson C. John Substrate processing apparatus and related systems and methods

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5730874A (en) * 1991-06-12 1998-03-24 Idaho Research Foundation, Inc. Extraction of metals using supercritical fluid and chelate forming legand
US6187911B1 (en) * 1998-05-08 2001-02-13 Idaho Research Foundation, Inc. Method for separating metal chelates from other materials based on solubilities in supercritical fluids
US6576066B1 (en) * 1999-12-06 2003-06-10 Nippon Telegraph And Telephone Corporation Supercritical drying method and supercritical drying apparatus
US6558475B1 (en) * 2000-04-10 2003-05-06 International Business Machines Corporation Process for cleaning a workpiece using supercritical carbon dioxide
CN1246429C (zh) * 2000-09-26 2006-03-22 北卡罗来纳-查佩尔山大学 用于二氧化碳的磷酸酯氟表面活性剂
US6602351B2 (en) * 2001-02-15 2003-08-05 Micell Technologies, Inc. Methods for the control of contaminants following carbon dioxide cleaning of microelectronic structures
US6398875B1 (en) * 2001-06-27 2002-06-04 International Business Machines Corporation Process of drying semiconductor wafers using liquid or supercritical carbon dioxide
US6782900B2 (en) * 2001-09-13 2004-08-31 Micell Technologies, Inc. Methods and apparatus for cleaning and/or treating a substrate using CO2
US7326673B2 (en) * 2001-12-31 2008-02-05 Advanced Technology Materials, Inc. Treatment of semiconductor substrates using long-chain organothiols or long-chain acetates
US6764552B1 (en) * 2002-04-18 2004-07-20 Novellus Systems, Inc. Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials
JP3920738B2 (ja) * 2002-08-22 2007-05-30 株式会社神戸製鋼所 微細構造体の乾燥方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002066176A1 (en) * 2001-02-15 2002-08-29 Micell Technologies, Inc. Methods for cleaning microelectronic structures
US20030232512A1 (en) * 2002-06-13 2003-12-18 Dickinson C. John Substrate processing apparatus and related systems and methods

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
DARIO L. GOLDFARB, JUAN J. DE PABLO, PAUL F. NEALEY: "Aqueous-based photoresist drying using supercritical carbon dioxide to prevent pattern collapse", 27 July 2000, AMERICAN VACUUM SOCIETY, XP002453186 *
HIDEO NAMATSU: "Supercritical drying for water-rinsed resist systems", 1 August 2000, AMERICAN VACUMM SOCIETY, XP002453185 *
See also references of WO2005113167A1 *

Also Published As

Publication number Publication date
EP1765526A1 (de) 2007-03-28
CN1960813A (zh) 2007-05-09
WO2005113167A1 (en) 2005-12-01
JP2007536730A (ja) 2007-12-13

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RIN1 Information on inventor provided before grant (corrected)

Inventor name: XU, CHONGYING

Inventor name: BAUM, THOMAS, H.

Inventor name: KORZENSKI, MICHAEL

Inventor name: BOROVIK, ALEXANDER

Inventor name: GHENCIU, ELIODOR, G.

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