EP1799402A4 - Verfahren und vorrichtung zur verbesserten chemisch-mechanischen planarisierung - Google Patents

Verfahren und vorrichtung zur verbesserten chemisch-mechanischen planarisierung

Info

Publication number: EP1799402A4
Authority: EP; European Patent Office
Prior art keywords: chemical mechanical; mechanical planarization; improved chemical; improved; planarization
Prior art date: 2004-10-06
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP05808056A

Other languages

English (en)

French (fr)

Other versions

EP1799402A1 (de

Inventor

Rajeev Bajaj

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Individual

Original Assignee

Individual

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2004-10-06

Filing date

2005-10-05

Publication date

2009-12-16

2005-10-05 Application filed by Individual filed Critical Individual

2007-06-27 Publication of EP1799402A1 publication Critical patent/EP1799402A1/de

2009-12-16 Publication of EP1799402A4 publication Critical patent/EP1799402A4/de

Status Withdrawn legal-status Critical Current

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Mechanical Treatment Of Semiconductor (AREA)

EP05808056A 2004-10-06 2005-10-05 Verfahren und vorrichtung zur verbesserten chemisch-mechanischen planarisierung Withdrawn EP1799402A4 (de)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US61694404P	2004-10-06	2004-10-06
US63925704P	2004-12-27	2004-12-27
PCT/US2005/035979 WO2006042010A1 (en)	2004-10-06	2005-10-05	Method and apparatus for improved chemical mechanical planarization

Publications (2)

Publication Number	Publication Date
EP1799402A1 EP1799402A1 (de)	2007-06-27
EP1799402A4 true EP1799402A4 (de)	2009-12-16

Family

ID=36148660

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP05808056A Withdrawn EP1799402A4 (de)	2004-10-06	2005-10-05	Verfahren und vorrichtung zur verbesserten chemisch-mechanischen planarisierung

Country Status (5)

Country	Link
EP (1)	EP1799402A4 (de)
JP (1)	JP5025478B2 (de)
KR (1)	KR101165114B1 (de)
TW (1)	TWI270438B (de)
WO (1)	WO2006042010A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP2318180A1 (de)	2008-06-26	2011-05-11	3M Innovative Properties Company	Polierscheibe mit porösen elementen und verfahren zur herstellung und verwendung derselben
EP2323808B1 (de) *	2008-07-18	2015-09-30	3M Innovative Properties Company	Polierkissen mit schwimmenden elementen und herstellungs- und verwendungsverfahren dafür
JP5551479B2 (ja) *	2010-03-19	2014-07-16	ニッタ・ハース株式会社	研磨装置、研磨パッドおよび研磨情報管理システム
US9751189B2 (en) *	2014-07-03	2017-09-05	Applied Materials, Inc.	Compliant polishing pad and polishing module
US11192215B2 (en) *	2017-11-16	2021-12-07	Rohm And Haas Electronic Materials Cmp Holdings, Inc.	Polishing pad with pad wear indicator
US11325221B2 (en) *	2017-11-16	2022-05-10	Rohm And Haas Electronic Materials Cmp Holdings, Inc.	Polishing pad with multipurpose composite window
JP7010166B2 (ja) *	2018-07-24	2022-01-26	株式会社Sumco	ワークの両面研磨装置および両面研磨方法
CN109616412A (zh) *	2018-12-14	2019-04-12	大连理工大学	一种光化学与机械抛光相结合的半导体晶片加工方法
JP7317440B2 (ja) *	2019-04-15	2023-07-31	株式会社ディスコ	ドレッシング工具
KR102570825B1 (ko) *	2020-07-16	2023-08-28	한국생산기술연구원	다공성 돌출 패턴을 포함하는 연마 패드 및 이를 포함하는 연마 장치
US20230398659A1 (en) *	2022-06-09	2023-12-14	Taiwan Semiconductor Manufacturing Co., Ltd.	Polishing Pad for Chemical Mechanical Polishing and Method
CN115365922B (zh) *	2022-10-24	2023-02-28	西安奕斯伟材料科技有限公司	研磨轮、研磨设备及硅片
CN116276337B (zh) *	2023-04-23	2023-11-07	南京茂莱光学科技股份有限公司	一种高平整度平面玻璃加工方法及加工装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB9309972D0 (en) *	1993-05-14	1993-06-30	De Beers Ind Diamond	Tool insert
US5795218A (en) *	1996-09-30	1998-08-18	Micron Technology, Inc.	Polishing pad with elongated microcolumns
JPH10225864A (ja) *	1997-02-17	1998-08-25	Sony Corp	研磨パッドとその製造方法並びにその研磨パッドを用いたウエハの研磨方法
JP2000158327A (ja) *	1998-12-02	2000-06-13	Rohm Co Ltd	化学的機械的研磨用研磨布およびそれを用いた化学的機械的研磨装置
US20020077037A1 (en) *	1999-05-03	2002-06-20	Tietz James V.	Fixed abrasive articles
US6962524B2 (en) *	2000-02-17	2005-11-08	Applied Materials, Inc.	Conductive polishing article for electrochemical mechanical polishing
US6612916B2 (en) *	2001-01-08	2003-09-02	3M Innovative Properties Company	Article suitable for chemical mechanical planarization processes
JP2003103470A (ja) *	2001-09-28	2003-04-08	Dainippon Printing Co Ltd	研磨層に凹部を有する研磨シート
JP4165118B2 (ja) *	2002-05-14	2008-10-15	ソニー株式会社	研磨装置、研磨部材厚さ検出方法および研磨部材厚さ検出装置

2005
- 2005-10-05 WO PCT/US2005/035979 patent/WO2006042010A1/en not_active Ceased
- 2005-10-05 KR KR1020077010346A patent/KR101165114B1/ko not_active Expired - Fee Related
- 2005-10-05 JP JP2007535807A patent/JP5025478B2/ja not_active Expired - Fee Related
- 2005-10-05 EP EP05808056A patent/EP1799402A4/de not_active Withdrawn
- 2005-10-06 TW TW094135023A patent/TWI270438B/zh not_active IP Right Cessation

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *

Also Published As

Publication number	Publication date
TWI270438B (en)	2007-01-11
WO2006042010A1 (en)	2006-04-20
TW200626291A (en)	2006-08-01
EP1799402A1 (de)	2007-06-27
KR20070057271A (ko)	2007-06-04
KR101165114B1 (ko)	2012-07-12
JP2008516452A (ja)	2008-05-15
JP5025478B2 (ja)	2012-09-12

Legal Events

Date	Code	Title	Description
2007-05-25	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2007-06-27	17P	Request for examination filed	Effective date: 20070427
2007-06-27	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
2008-01-09	DAX	Request for extension of the european patent (deleted)
2009-12-16	A4	Supplementary search report drawn up and despatched	Effective date: 20091116
2009-12-16	RIC1	Information provided on ipc code assigned before grant	Ipc: B24B 37/04 20060101AFI20091110BHEP Ipc: B24D 11/00 20060101ALI20091110BHEP
2011-04-22	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN
2011-05-25	18W	Application withdrawn	Effective date: 20110411

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