EP1842870A3 - Résine de silicone polyimide et composition thermodurcissable la comprenant - Google Patents

Résine de silicone polyimide et composition thermodurcissable la comprenant Download PDF

Info

Publication number
EP1842870A3
EP1842870A3 EP07102432A EP07102432A EP1842870A3 EP 1842870 A3 EP1842870 A3 EP 1842870A3 EP 07102432 A EP07102432 A EP 07102432A EP 07102432 A EP07102432 A EP 07102432A EP 1842870 A3 EP1842870 A3 EP 1842870A3
Authority
EP
European Patent Office
Prior art keywords
same
group
silicone resin
polymide
thermosetting composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP07102432A
Other languages
German (de)
English (en)
Other versions
EP1842870A2 (fr
EP1842870B1 (fr
Inventor
Michihiro c/o Silicone-Electronics Materials Research Center Sugo
Hideto c/o Functional Material Research Center Kato
Tomoyuki c/o Silicone-Electronics Materials Research Center Goto
Shohei c/o Silicone-Electronics Materials Research Center Tagami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of EP1842870A2 publication Critical patent/EP1842870A2/fr
Publication of EP1842870A3 publication Critical patent/EP1842870A3/fr
Application granted granted Critical
Publication of EP1842870B1 publication Critical patent/EP1842870B1/fr
Ceased legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/32—Post-polymerisation treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
EP07102432.7A 2006-02-15 2007-02-15 Résine de silicone polyimide et composition thermodurcissable la comprenant Ceased EP1842870B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006037844A JP4771414B2 (ja) 2006-02-15 2006-02-15 ポリイミドシリコーン樹脂及びそれを含む熱硬化性組成物

Publications (3)

Publication Number Publication Date
EP1842870A2 EP1842870A2 (fr) 2007-10-10
EP1842870A3 true EP1842870A3 (fr) 2010-01-13
EP1842870B1 EP1842870B1 (fr) 2014-05-21

Family

ID=38429139

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07102432.7A Ceased EP1842870B1 (fr) 2006-02-15 2007-02-15 Résine de silicone polyimide et composition thermodurcissable la comprenant

Country Status (5)

Country Link
US (1) US7781541B2 (fr)
EP (1) EP1842870B1 (fr)
JP (1) JP4771414B2 (fr)
KR (1) KR101280718B1 (fr)
TW (1) TWI424004B (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009025319A1 (fr) * 2007-08-22 2009-02-26 Sony Chemical & Information Device Corporation Composition de polyimide, panneau de câblage flexible et procédé de fabrication d'un panneau de câblage flexible
KR101690544B1 (ko) * 2008-11-10 2016-12-28 아지노모토 가부시키가이샤 실록산 함유 폴리이미드 수지
JP5206977B2 (ja) * 2009-03-12 2013-06-12 信越化学工業株式会社 新規ポリイミドシリコーン及びこれを含有する感光性樹脂組成物並びにパターン形成方法
US20110052968A1 (en) * 2009-08-28 2011-03-03 General Electric Company Battery pack assembly and related processes
JP5499312B2 (ja) 2009-09-30 2014-05-21 信越化学工業株式会社 アルコール性水酸基を有する新規のポリイミドシリコーンおよびその製造方法
TWI516527B (zh) * 2009-12-10 2016-01-11 信越化學工業股份有限公司 光固化性樹脂組成物，圖案形成法和基板保護膜，以及使用該組成物之膜狀黏著劑及黏著片
JP7461191B2 (ja) 2020-03-27 2024-04-03 株式会社ノリタケカンパニーリミテド 銀ペースト
JP2025157937A (ja) 2024-04-03 2025-10-16 信越化学工業株式会社 シロキサン変性ポリエステル樹脂及びその硬化物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4794153A (en) * 1984-12-05 1988-12-27 General Electric Company Polyanhydride-siloxanes and polyimide-siloxanes obtained therefrom
GB2224742A (en) * 1984-12-05 1990-05-16 Gen Electric Polyanhydride-siloxanes and polyimide-siloxanes obtained therefrom
US5258487A (en) * 1990-08-03 1993-11-02 Shin-Etsu Chemical Co., Ltd. Polyamido-acid copolymer and its manufacture

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4404350A (en) * 1982-07-07 1983-09-13 General Electric Company Silicone-imide copolymers and method for making
JPH0713144B2 (ja) * 1983-04-11 1995-02-15 ゼネラル・エレクトリック・カンパニイ シリコーン―イミド共重合体用ポリジオルガノシロキサン
US4795680A (en) * 1986-05-09 1989-01-03 General Electric Company Polyimide-siloxanes, method of making and use
US5104958A (en) * 1991-01-25 1992-04-14 General Electric Company Solvent resistant silicone polyimides
JP2740064B2 (ja) * 1991-10-14 1998-04-15 住友ベークライト株式会社 熱圧着可能なフィルム状接着剤
JPH05125334A (ja) * 1991-11-01 1993-05-21 Sumitomo Bakelite Co Ltd 熱圧着可能な導電性フイルム状接着剤
JP2713051B2 (ja) * 1992-08-26 1998-02-16 信越化学工業株式会社 ポリアミック酸及びポリイミド樹脂、これらの製造方法並びに半導体装置保護用材料
JP2713052B2 (ja) * 1992-08-26 1998-02-16 信越化学工業株式会社 ポリイミド樹脂溶液組成物及びコーティング剤
JP3221756B2 (ja) * 1992-12-28 2001-10-22 新日鐵化学株式会社 プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法
KR100209286B1 (ko) * 1994-10-31 1999-07-15 윤종용 고밀도 기록용 광자기 디스크
JP3329677B2 (ja) 1997-01-10 2002-09-30 信越化学工業株式会社 熱硬化性樹脂組成物
DE19734245A1 (de) * 1997-08-07 1999-02-11 Wacker Chemie Gmbh Siliconimide
WO2001057112A1 (fr) * 2000-02-01 2001-08-09 Nippon Steel Chemical Co., Ltd. Resine polyimide adhesive et stratifie adhesif
JP4219660B2 (ja) * 2002-11-18 2009-02-04 信越化学工業株式会社 ウエハダイシング・ダイボンドシート
JP4136693B2 (ja) * 2003-02-07 2008-08-20 信越化学工業株式会社 発光装置及びその製造方法
JP4530284B2 (ja) * 2004-10-07 2010-08-25 信越化学工業株式会社 ポリイミド系光硬化性樹脂組成物並びにパターン形成方法及び基板保護用皮膜
JP2006028533A (ja) * 2005-10-13 2006-02-02 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4794153A (en) * 1984-12-05 1988-12-27 General Electric Company Polyanhydride-siloxanes and polyimide-siloxanes obtained therefrom
GB2224742A (en) * 1984-12-05 1990-05-16 Gen Electric Polyanhydride-siloxanes and polyimide-siloxanes obtained therefrom
US5258487A (en) * 1990-08-03 1993-11-02 Shin-Etsu Chemical Co., Ltd. Polyamido-acid copolymer and its manufacture

Also Published As

Publication number Publication date
KR20070082536A (ko) 2007-08-21
US20070197680A1 (en) 2007-08-23
TWI424004B (zh) 2014-01-21
TW200804462A (en) 2008-01-16
JP2007217490A (ja) 2007-08-30
US7781541B2 (en) 2010-08-24
KR101280718B1 (ko) 2013-07-01
EP1842870A2 (fr) 2007-10-10
JP4771414B2 (ja) 2011-09-14
EP1842870B1 (fr) 2014-05-21

Similar Documents

Publication Publication Date Title
EP1842870A3 (fr) Résine de silicone polyimide et composition thermodurcissable la comprenant
EP2261299A3 (fr) Aromatique amine composition et appareil electronique utilisant cette composition
WO2008078699A1 (fr) Composition de résine pour une plaque d'impression
WO2008143058A1 (fr) Feuille de cuivre avec couche de résine
ATE524507T1 (de) Polyimidharz
MY148272A (en) Curable silicone composition
WO2009018327A3 (fr) Compositions ultraphobes et procédés d'utilisation
WO2013036752A3 (fr) Compositions liantes pour fabriquer des produits en fibres de verre
WO2008088028A1 (fr) Dispersion de solvant organique de polymère/dopant conducteur et composition contenant la dispersion
EP2216354A3 (fr) Polyuréthane contenant un groupe de carboxyl et utilisation associées
CA2691598A1 (fr) Equipement de controle de l'humidite, equipement de test environnemental et regulateur de temperature/d'humidite
MY130673A (en) Elastomer-modified epoxy siloxane compositions
MX2009012976A (es) Aditivos de desempeño para elastomeros termoplasticos.
AU2008250633A8 (en) Medical devices comprising a Co-Polymer of a modified polyamide and a polyether
ATE491479T1 (de) Oberflächenbehandlung biomedizinischer vorrichtungen
WO2008133229A1 (fr) Composé à teneur en silicium, composition durcissable et produit durci
EP2033984A3 (fr) Composition de polyimide-silicone thermodurcissable et film durci avec celle-ci
MY169438A (en) Resin composition, prepreg, laminate, and wiring board
DE502008003027D1 (de) Härtbare zusammensetzungen aus silanen mit zwei hydrolisierbaren gruppen
EP2578534A8 (fr) Matériau composite en résine
WO2011032727A8 (fr) Film de séparation essentiellement biodégradable
IN2012DN02171A (fr)
JP2008530256A5 (fr)
EP2308911A3 (fr) Polymère et dispositif électroluminescent organique l'incluant
ATE476457T1 (de) Leitfähige, organische beschichtungen mit optimiertem polymersystem

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK YU

RIC1 Information provided on ipc code assigned before grant

Ipc: C08L 79/08 20060101AFI20070926BHEP

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK RS

RIC1 Information provided on ipc code assigned before grant

Ipc: C08G 73/10 20060101ALI20091210BHEP

Ipc: C08L 79/08 20060101AFI20070926BHEP

17P Request for examination filed

Effective date: 20100518

17Q First examination report despatched

Effective date: 20100730

AKX Designation fees paid

Designated state(s): DE FR GB

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602007036813

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: C08G0077000000

Ipc: C08G0077455000

RIC1 Information provided on ipc code assigned before grant

Ipc: C08G 77/455 20060101AFI20131106BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20140108

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: SHIN-ETSU CHEMICAL CO., LTD.

RIN1 Information on inventor provided before grant (corrected)

Inventor name: TAGAMI, SHOHEI

Inventor name: GOTO, TOMOYUKI

Inventor name: KATO, HIDETO

Inventor name: SUGO, MICHIHIRO

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602007036813

Country of ref document: DE

Effective date: 20140703

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602007036813

Country of ref document: DE

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20150224

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602007036813

Country of ref document: DE

Effective date: 20150224

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20150215

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 10

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150215

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 11

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 12

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20211230

Year of fee payment: 16

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20220118

Year of fee payment: 16

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602007036813

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230228

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230901