EP1849341A2 - Procede et dispositif pour relier des elements a semi-conducteurs ou des interposeurs a une bande support et utilisation d'un tel dispositif - Google Patents

Procede et dispositif pour relier des elements a semi-conducteurs ou des interposeurs a une bande support et utilisation d'un tel dispositif

Info

Publication number
EP1849341A2
EP1849341A2 EP06708208A EP06708208A EP1849341A2 EP 1849341 A2 EP1849341 A2 EP 1849341A2 EP 06708208 A EP06708208 A EP 06708208A EP 06708208 A EP06708208 A EP 06708208A EP 1849341 A2 EP1849341 A2 EP 1849341A2
Authority
EP
European Patent Office
Prior art keywords
semiconductor elements
carrier tape
interposer
heating
endless belts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06708208A
Other languages
German (de)
English (en)
Inventor
Volker PÖNITZ
Matthias Klooss
Wolfram Kunze
Dieter Bergmann
Stefan Bierl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Muehlbauer GmbH and Co KG
Original Assignee
Muehlbauer GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muehlbauer GmbH and Co KG filed Critical Muehlbauer GmbH and Co KG
Publication of EP1849341A2 publication Critical patent/EP1849341A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying

Definitions

  • the invention relates to a method for connecting single or multi-row semiconductor elements or Interposem with a flexible, continuous carrier tape by means of heat-curable adhesives or Lotschn according to the preamble of patent claim 1. Furthermore, the invention relates to a device for connecting or multi-row semiconductor elements or interposer with the flexible, continuous carrier tape by means of heat curable adhesives or Lotstoffn, on the top of the semiconductor elements or interposer with an adjustable first pressing force down first pressing heating elements and at least one on the bottom of the semicon terimplantation or interposer of the first pressure force counteracting second heating element according to the preamble of claim 11 and a use of such a device according to the preamble of claim 16th
  • a cure time of such commonly used adhesives due to the adhesive composition is between 6 and 14 seconds. When using solder as a contact agent this must first be liquefied. This means that such machines with high number of components and consequently high throughput for the actual final bonding (step of curing of the adhesive) must be slowed down.
  • final bonders which can be applied to the semiconductor elements or interposers as a whole and provided with heating elements, can be referred to as stationary final bonders formed on the running direction of the continuous flexible carrier tape.
  • Such stationary final bonder must be applied between 6 and 14 seconds with their heating elements on the semiconductor elements and optionally on the underside of the carrier tape until a complete curing of the adhesive is present. During this time, the normally continuous carrier tape must be stopped, whereby a lower throughput of the entire machine or plant is obtained.
  • a curing device provided with heating elements for application to the semiconductor elements or the interposer and the carrier tape are moved in unison with the carrier tape.
  • a curing time of the adhesives used must be adapted to a cycle time of the final bonder, and due to the limited possible number of heating elements, a slowing down of the carrier belt travel speed is brought about, in order to cure the semiconductor elements or semiconductor elements simultaneously in the presence of a plurality of populated semiconductor elements or interposers To enable Interposem bonded adhesives even with a tracking FinalBonder.
  • the object is on the method side by the features of claim 1, on the device side by the features of claim 11, on the use side solved by the features of claim 16.
  • the core idea of the invention is that, in a method for connecting single or multi-row semiconductor elements or interposers with a flexible, continuous carrier tape by means of heat curable adhesives or Lotschn, wherein on the top of the semiconductor elements or interposer first heating elements with an adjustable first Pushing force from top to bottom and at the bottom of the semiconductor elements at least a second heating element of the first pressure force opposes from bottom to top, between the first heating elements and the semiconductor elements and between the second heating element and the semiconductor elements each an endless belt at the same speed with respect to the Carrier tape is continuously moved parallel to the direction of the carrier tape, while the first heating elements exert the first compressive force by spring loading.
  • the endless belts are moved at the same speed as the carrier tape and deflected via at least two deflection rollers or deflected via at least two Umlenkpressrollen for pressing the semiconductor elements on the carrier tape with a second pressure force.
  • a heat transfer from the heating elements to the adhesive surface and the semiconductor elements or interposer takes place through the endless belts, which advantageously consist of Teflon material at least on its surface to a To avoid sticking the endless belts.
  • the endless belts are thus pulled along against the stationary arranged heating elements on the surfaces thereof.
  • the second pressure force can be set perpendicular to the carrier belt plane by moving the deflection press rollers and thus an initial fixation of the semiconductor elements or interposer on the carrier tape can be achieved.
  • the Umlenkpressrollen are advantageously heated and rubberized, resulting in a finely adjustable force control with respect to the second pressure force and thus maintaining the initial positioning of the semiconductor elements or interposer on the carrier tape results.
  • endless belts Through the use of such endless belts is the exercise of a continuous pressure over the length over which the endless belts extend to the semiconductor elements or interposer or the underlying carrier tape, regardless of the width of the carrier tape, that is independent of the number of rows in wel - Chen the semiconductor elements or interposer are arranged on the carrier tape, possible.
  • the belt speed of the endless belts as a function of the carrier belt or independently of the carrier belt, a control of the curing time due to the different time periods, which are thereby traversed by the semiconductor elements or interposers between the endless belts, allows.
  • the common running speeds of the endless belts and the carrier belt can be changed depending on a curing time of the adhesives.
  • a variation of these speeds can be additionally supported by a buffer device, which serves for intermediate storage of the flexible carrier tape and the heating elements and thus the actual curing device upstream.
  • the running speeds of the endless belts of the upstream processing devices such as a Broadungsstrom, predetermined running speeds of the carrier tape adapted.
  • the curing device when using Interposem the curing device is designed such that the endless belts in their initial area, ie in the area in which the interposer and the carrier tape contact the endless belts first, are strongly heated by the heating elements and in the rear area, ie in the Area in which the interposer and the carrier tape leave the endless belt area are cooled.
  • the pre-fixed on the carrier tape interposer and existing between the carrier tape and the Interposem adhesive or Lotstoffmaschine which is designed as a contact point, heated at the beginning of the pass through the endless belts, whereby thermal energy for melting or liquefying transfer the contact point becomes.
  • the heat is in turn withdrawn due to the cooling of the contact point and thus the contact means, while another by the at least upper endless belt by means of the heating elements continues to exist.
  • a solidification of the contacting takes place while the interposer are pressed onto the carrier tape. A reliable and permanent contact and adhesion of the interposer on the carrier tape is thereby obtained.
  • a prefixing device In front of the actual curing device, a prefixing device can be arranged, which, in particular when using interposer or bridge modules, already selectively applies it to the carrier tape or other tray and fixes it in a first step relative to this carrier tape or the tray in order subsequently to be in the actual position Hardening device to perform the actual contact.
  • Vorfixier nails can be arranged within a separating device provided for Interposer and bring these Interposer in the hot or cold state above its actual storage position of the carrier tape and then press it on the carrier tape.
  • the contacting agent which constitutes the adhesive or the solder, is applied in an upstream process step to contact sides of the interposer / bridge module and heated in the singulator to a temperature which is sufficient for the subsequent pressing of the interpolated ser / bridge modules on the tray / the carrier tape to create a permanent connection between them, and thus to prevent slippage during their further transport on the tape.
  • the contacting agent is applied to the intended contact points within the storage position of the moving tray / the moving carrier tape in a previous process step. Subsequently, the interposer / bridge modules are brought in the cold state above their storage positions and pressed more or less in the already existing contacting.
  • thermoset adhesives or solder An apparatus for bonding semiconductor elements or interposers to the carrier tape by curing the thermoset adhesives or solder becomes advantageous for joining interposers or module bridges with flat shelves and Dice with smart labels, strabes, smart cards and the like under the action of pressure forces and Temperature used.
  • Figure 1 is a schematic side view of an apparatus for performing the method according to the invention according to an embodiment of the invention.
  • FIG. 2 is a schematic plan view of the device shown in FIG. 1; FIG.
  • FIG. 3 is a schematic side view of an apparatus for carrying out the method according to the invention according to an embodiment of the invention with height-adjusted upper heating elements;
  • Fig. 4 is a schematic perspective view of an apparatus for
  • a device according to an embodiment of the invention for carrying out the method according to the invention is shown in a schematic side view.
  • a common carrier tape 1 On a common carrier tape 1 a plurality of semiconductor elements 2 are arranged in multiple rows, which are applied by a multi-row pressing station 3.
  • the flexible continuous carrier tape 1 is interposed to allow various processing speeds of the indicated by an arrow 5 continuous carrier tape 1 with the semiconductor elements 2 arranged thereon by a curing unit 6. Between the semiconductor elements 2 and the carrier tape 1, an adhesive layer of an adhesive which hardens when heated, is arranged.
  • first heating elements 7a, 7b and 7c In the curing unit 6 are on the upper side first heating elements 7a, 7b and 7c, the spring-loaded by means of a spring element, not shown, press from top to bottom on the semiconductor elements arranged.
  • the first heating elements 7a, 7b and 7c are generally longer in the running direction 5 than an upper side 2a of the semiconductor elements 2.
  • a heating plate 8 is arranged for application to lower sides 2b of the semiconductor elements 2.
  • Both the top-side heating elements 7a, 7b, and 7c and the heating plate are covered at their faces to the semiconductor elements 2 surfaces of endless belts 9 and 10, which are deflected over Umlenkpressrollen 11, 12, 13 and 14 and back run back.
  • the deflection press rollers 11, 12 and 13, 14 are rotated about an imaginary axis extending perpendicular to the image plane in such a way that the endless belts 9, 10 extend on their sides facing the carrier tape 1 in the direction of travel 5 of the carrier tape. This is indicated by the arrows 15, 16 and 17, 18.
  • the Teflon-coated endless belts 9, 10 advantageously have a running speed which corresponds to the running speed of the carrier tape 1.
  • the first heating elements 7a, 7b and 7c and the upper-side deflection press rollers 11 and 12 are mounted in a height-adjustable manner in an element 19 (not illustrated in detail here), in which that the contact pressure on the semiconductor elements and the adhesive layers and the carrier tape can be varied.
  • FIG. 2 the device shown in Fig. 1 is shown in a plan view.
  • the carrier tape 1 has, as the illustration of FIG. 2 can be clearly seen, a total of four rows of semiconductor elements, which are processed simultaneously by the Umlenkpressrollen 11, 12 and the endless belt 9 with the underlying heating elements.
  • FIG. 3 shows in a schematic side view a further embodiment of the device according to the invention for carrying out the method according to the invention. Identical and equivalent components are provided with the same reference numerals.
  • the lower heating plate 8 additionally has individual further heating elements 20, on the surfaces of which the endless belt 10 of Teflon material runs along.
  • the endless belt 9 made of Teflon material runs along the underside surfaces of the first heating elements 7.
  • the carrier tape 1 extends with the semiconductor elements not shown here arranged on it.
  • the element 19 associated with the upper heating has been moved downwards in height-adjusted manner in order to generate a contact pressure between the deflection press rollers 11 and 13 as well as 12 and 14 on the carrier strip and the semiconductor elements.
  • the upper-side heating elements are resiliently pressed down on the semiconductor elements to continuously exert a force on the semiconductor elements during the curing process.
  • the heating plate 8 with the other heating elements 20, however, are not height-adjustable arranged on a fixed level. In this way, a variable pressure is exerted both on the semiconductor elements and the carrier tape by the deflection press rollers and by the spring-loaded top-side heating elements 7.
  • FIG. 4 shows, in a schematic perspective representation, an apparatus for carrying out the method according to a further embodiment of the invention.
  • a device is used in particular for applying, fixing and contacting Interposem on tape-like shelves 23.
  • the device comprises a pre-fixing device 22 as an upstream device, which positions the separated interposer 24 above the storage position assigned to it and presses it on the continuous storage belt in the region of this storage position.
  • the Vorfixier vibration is formed wheel-shaped.
  • Such pre-fixation of the interposer on the storage belt is maintained by previously adhesive or solder is applied either to the contact points of the not yet applied interposer or on the complementarily provided contact points within the storage positions of the storage belt.
  • the depositing belt 23 with the interposers 25 mounted thereon passes through the actual curing device, which has top-side heating elements 26 and a bottom-side heating plate 27.
  • the heating elements 26 and the heating plate 27 and the interposer with the storage belt 23 extend an upper and lower side endless belt 28, 29, which are deflected by means of guide rollers 30, 31, 32 and 33 and preferably have the same speed as the storage belt.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

L'invention concerne un procédé pour relier des éléments à semi-conducteurs (2) ou des interposeurs (24) disposés en une ou plusieurs rangées à une bande support (1, 23) flexible continue au moyen de produits de brasage ou d'adhésifs durcissables par chauffage, des premiers éléments chauffants (7a-c ; 26) étant appliqués de haut en bas sur les faces supérieures (2a) de éléments à semi-conducteurs (2) ou des interposeurs (24) avec une première force de pression réglable et au moins un deuxième élément chauffant (8 ; 27) allant à l'encontre de cette première force de pression de bas en haut au niveau de la face inférieure (2b) des éléments à semi-conducteurs (2) ou des interposeurs (24). L'invention se caractérise en ce qu'une bande sans fin respective (9, 10 ; 28, 29) présentant la même vitesse d'avance que la bande support (1, 23) est déplacée de façon continue parallèlement au sens d'avance (5) de ladite bande support (1, 23) entre les premiers éléments chauffants (7a-c ; 26) et les éléments à semi-conducteurs (2) ou les interposeurs (24), ainsi qu'entre le deuxième élément chauffant (8 ; 27) et les éléments à semi-conducteurs (2) ou les interposeurs (24), tandis que les premiers éléments chauffants (7a-c ; 26) exercent la première force de pression par sollicitation par ressort.
EP06708208A 2005-02-15 2006-02-13 Procede et dispositif pour relier des elements a semi-conducteurs ou des interposeurs a une bande support et utilisation d'un tel dispositif Withdrawn EP1849341A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005006978A DE102005006978B3 (de) 2005-02-15 2005-02-15 Verfahren und Vorrichtung zum Verbinden von Halbleiterelementen oder Interposern mit einem Trägerband und Verwendung einer derartigen Vorrichtung
PCT/EP2006/050866 WO2006087301A2 (fr) 2005-02-15 2006-02-13 Procede et dispositif pour relier des elements a semi-conducteurs ou des interposeurs a une bande support et utilisation d'un tel dispositif

Publications (1)

Publication Number Publication Date
EP1849341A2 true EP1849341A2 (fr) 2007-10-31

Family

ID=36441971

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06708208A Withdrawn EP1849341A2 (fr) 2005-02-15 2006-02-13 Procede et dispositif pour relier des elements a semi-conducteurs ou des interposeurs a une bande support et utilisation d'un tel dispositif

Country Status (3)

Country Link
EP (1) EP1849341A2 (fr)
DE (1) DE102005006978B3 (fr)
WO (1) WO2006087301A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006050964A1 (de) 2006-10-28 2008-04-30 Man Roland Druckmaschinen Ag Applikator für elektrische oder elektronische Bauelemente
DE102006058892A1 (de) * 2006-12-05 2008-06-12 Somont Gmbh Verfahren und Einrichtung zum Herstellen einer Lötverbindung
DE102009022299B4 (de) 2008-05-26 2014-07-17 Technische Universität Chemnitz Verfahren und Vorrichtung zum Aufbringen eines elektronischen Bauelements auf ein Substrat
DE102012012879B3 (de) 2012-06-28 2013-09-19 Mühlbauer Ag Thermokompressionsvorrichtung und Verfahren zum Verbinden elektrischer Bauteile mit einem Substrat
DE102015006981B4 (de) * 2015-05-29 2018-09-27 Mühlbauer Gmbh & Co. Kg Thermokompressionsvorrichtung und Verfahren zum Verbinden von elektrischen Bauteilen mit einem Substrat

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DE3373289D1 (en) * 1983-07-01 1987-10-08 Roland Melzer Method of producing plastic cards
FR2599669B1 (fr) * 1986-06-10 1989-06-23 Tech Indles Plastification Machine pour la plastification d'un element de forme plate par application et fusion d'un film en matiere thermo-plastique
US5605547A (en) * 1995-03-27 1997-02-25 Micron Technology, Inc. Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor
EP1030349B2 (fr) * 1999-01-07 2013-12-11 Kulicke & Soffa Die Bonding GmbH Méthode et dispositif pour le traitement de composants électroniques montés sur substrat, en particulier de puces semi-conductrices
WO2001021401A2 (fr) * 1999-09-17 2001-03-29 Melzer Maschinenbau Gmbh Dispositif permettant de laminer par segments une structure stratifiee constituee d'au moins deux bandes en matiere plastique
DE10140661C1 (de) * 2001-08-24 2003-01-16 Orga Kartensysteme Gmbh Vorrichtung und Verfahren zur Herstellung von Flip-Chip-Modulen
EP1376658B1 (fr) * 2002-06-25 2011-07-06 Kabushiki Kaisha Toshiba Méthode et appareil de fabrication de dispositif semiconducteur
DE10245398B3 (de) * 2002-09-28 2004-06-03 Mühlbauer Ag Vorrichtung und Verfahren zur Aufbringung von Halbleiterchips auf Trägern

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Title
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Also Published As

Publication number Publication date
DE102005006978B3 (de) 2006-06-08
WO2006087301A2 (fr) 2006-08-24
WO2006087301A3 (fr) 2006-12-07

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