EP1936414A2 - Kleines optisches Gehäuse mit mehreren optisch ausgerichteten, gelöteten Elementen darin - Google Patents

Kleines optisches Gehäuse mit mehreren optisch ausgerichteten, gelöteten Elementen darin Download PDF

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Publication number
EP1936414A2
EP1936414A2 EP07254671A EP07254671A EP1936414A2 EP 1936414 A2 EP1936414 A2 EP 1936414A2 EP 07254671 A EP07254671 A EP 07254671A EP 07254671 A EP07254671 A EP 07254671A EP 1936414 A2 EP1936414 A2 EP 1936414A2
Authority
EP
European Patent Office
Prior art keywords
optical fiber
sealed container
solder
base member
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07254671A
Other languages
English (en)
French (fr)
Inventor
Kuochou Tai
Andre Wong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Viavi Solutions Inc
Original Assignee
JDS Uniphase Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JDS Uniphase Corp filed Critical JDS Uniphase Corp
Publication of EP1936414A2 publication Critical patent/EP1936414A2/de
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4271—Cooling with thermo electric cooling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall

Definitions

  • This invention relates to a substantially thermally stable small optical package that houses a plurality of optically aligned elements forming an optical component, wherein the elements are all directly soldered to a base member or directly soldered to a supporting member soldered to a common base member.
  • optical devices and components operational within optical systems are typically subjected to various thermal and mechanical loads and or stresses during their lifetime.
  • An example of such optical devices is an optical filter assembly.
  • An assembly of this type comprises two optical glass fibers inserted into capillary ferrules to produce fiber-ferrule sub-assemblies aligned with an optical filter assembly.
  • the optical components of the filter assembly generally have graded-index (GRIN) lenses embedded into an insulating glass tube, which in turn are mechanically protected by a metal housing.
  • GRIN graded-index
  • Input glass ferrules generally employ one of two designs.
  • a single capillary suitable for containing multiple glass fibers or separate circular capillaries for each fiber have been used, each with relatively short fiber-receiving conical lead-in ends.
  • the optical fiber is subjected to an unwanted S-bending over the short conical end. This excessive micro bending increases the insertion losses.
  • Fiber-ferrule subassemblies employing such ferrules are manufactured by inserting the optical fibers stripped of their polymer coating into the respective ferrule capillaries; epoxy bonding the fibers into the ferrule capillaries, including the conical end portions; grinding and polishing an angled facet on the fiber-ferrule; and depositing on the polished surface an anti-reflection (AR) coating.
  • AR anti-reflection
  • adhesives are used to secure fiber-ferrules to a base or support member within their package.
  • these fiber-ferrules are laser welded to a support member.
  • a precise alignment achieved during initial assembly of a filter prior to final packaging can be easily decreased due to the adhesive curing process and the high temperature thermal cycles associated with laser welding during the final packaging of the components.
  • Such manufacturing processes and resulting components have several problems resulting from stresses on the optical components due to the thermal contraction as a result of a thermal mismatch between the glass and metal materials, polymerization shrinkage in adhesive bonds, and structural constraints induced by bonding during encapsulation. These stresses lead to displacements of optical components during bonding, resulting in 0.3 to 1 dB or greater increases in the insertion loss.
  • Fig. 1 is a diagram of an optical package that is the result of years of development in an attempt to automate the assembly process and to lessen manufacturing costs while providing a relatively small, thermally stable optically packaged component. The goal was to provide a packaged component wherein performance would not significantly degrade over the expected lifetime of the device. Problems related to cost, and reliability have resulted in the abandonment of this solution.
  • a non-linear frequency doubling crystal 10 performs filtering of an input signal and outputs a frequency doubled optical signal.
  • optical fibers 12a and 12b held in sleeves must be precisely aligned so that light launched from the input fiber 12a to its output and through the frequency doubling crystal 10 must couple without undue loss into the output receiving optical fiber 12b and provide optimum filtering through the crystal 10.
  • a frequency doubling optical component having an input optical fiber 12a held in an optical sleeve or ferrule 14a, optically coupled to a frequency doubling crystal 10, and optically coupled to an output optical fiber 12b.
  • the optical sleeve 14a is held down in a fixed position by clamp 16 which is laser welded to a base member beneath.
  • the optical crystal is secured to a holder 18 which is clamped to the base by a clamp 7.
  • Bolts 9 secure sub-base members to the package. It is evident that the numerous interfaces between elements within the package increase the likelihood of misalignment of components. Furthermore, having this many elements and fasteners within this package lessens available space for other components.
  • the package shown in Fig. 1 is conveniently shown before the top is positioned and hermetically seals the package.
  • an optical fiber is housed within a sleeve and the sleeve is bonded to a base member, there is a possibility that there will be relative movement of the optical fiber and the sleeve. Furthermore, there is the possibility that there will be relative movement between the optical sleeve and the base member.
  • the optical fiber is directly bonded to the base member, there is only the possibility of relative movement between the optical fiber and the base member. In this regard, it is preferable lessen the number of interfaces.
  • a sealed container comprising;
  • a method of manufacturing a sealed container comprising:
  • Fig. 1 is a view illustrating a conventional packaged component having a plurality of interfaces.
  • Fig. 2 is a view of a packaged component in accordance with an embodiment of this invention wherein fewer parts and interfaces are required and wherein a filter is soldered to the package base.
  • Fig. 3 is a schematic side view of a base member having an input lensed optical fiber optically aligned with an output optical lensed fiber having a PPLN (poled lithium niobate) crystal there between wherein the optical fibers and the crystal are soldered to their supporting members.
  • PPLN poled lithium niobate
  • Fig. 4 is a top view of the components shown in Fig. 3 .
  • Fig. 2 a photograph of a non-sealed container in accordance with the invention is shown, prior to placing and hermetically sealing a lid in place over the device.
  • the device of Fig. 2 provides the same functionality as the device of Fig. 1 .
  • the device of Fig. 1 requires the thermal electric cooler to be outside of the package due to the limited space.
  • an input optical fiber 22a is shown soldered in place on a base 21 precisely aligned with the non-linear frequency doubling crystal 20 and with the output optical fiber 22b.
  • the solder ball made of AuSn (gold tin) 24a is shown resting upon a low pedestal 23a is preferably a Zr02 ceramic such as ytterbium stabilized zirconium, which is also soldered to the base 21 of the container. Only solder is present between the optical fiber 22a and an upper end of the pedestal 23a, and only solder is present between the lower end of the pedestal 23a and the base 21 of the container.
  • the frequency doubling crystal 20 is also directly soldered to the base 21 upon which it rests, so that the planar lower surface of the crystal 20 securely mates with the container having only solder there between. This solder is applied by using a reflow technique.
  • a similar arrangement is shown at the output end wherein optical fiber 22b is directly soldered to its respective pedestal 23b, which is directly soldered to the base 21 of the package. No ferrules are required to house and hold the optical fibers 22a and 22b, lessening the possibility of misalignment.
  • a thermal electric cooler (TEC) 25 is disposed beneath the base 21 and within the package, so that efficient cooling and a more rapid cooling response time can be obtained. Electrodes 29 are provided to power the TEC 25. This particular device requires the temperature to be maintained at a predetermined temperature that is within +/-.01 C.
  • a thermistor 26 is also disposed within the package on the base 21 for temperature monitoring.
  • CTE coefficient of thermal expansion
  • Figs. 3 and 4 illustrate the optical input and output optical fibers 32a, 32b, the pedestals or optical fiber mounts 33a and 33b, and the periodically poled lithium niobate frequency doubling crystal 30 in more detail.
  • the optical fiber 32a has an output end adjacent to the crystal 30 shown to have a pointed or chiseled lens tip to focus and couple light from the fiber 32a to a region near the surface of the crystal 30. Furthermore, optical fiber 32a is securely mounted to the pedestal 33a via a single solder ball 34a, made of a solder with a relatively high melting temperature T h 295 C.
  • the fiber mount 33a is secured to the base member 31 by way of having a very thin layer of solder between the mount 33a and the base member 31.
  • a solder reflow technique is used to fixedly attach the base member 31 with the fiber mount 33a.
  • the frequency doubling crystal 30 is also soldered to the base member 31; however, with a lower melting temperature solder, e.g.
  • BiSn solder having a melting temperature of approximately 160C well below Th.
  • the crystal 30 can be relatively moved and aligned during manufacture without the risk of moving the fiber mounts 32a and 32b, which are first secured to the base 31 with high melting temperature solder of about 295C, e.g. AuSn solder.
  • the base member 31 which preferably consists of stainless steel, has a coefficient of thermal expansion (CTE) that is substantially matched to the CTE of the crystal 30 to less than 5 ppm/K.
  • CTE coefficient of thermal expansion
  • PPLN periodically poled lithium niobate
  • SST403 is smaller than 2ppm/k. If the CTE of the crystal 30 was not suitably matched to the CTE of the base member, the crystal 20 would be adversely stressed upon cooling down from the 160 °C soldering temperature.
  • this device can be manufactured using various alignment techniques, such as moving one optical fiber, e.g. 32a, while keeping the other optical fiber, e.g. 32b, and the crystal 30 fixed by first securing them with solder to the base 31. Preferably this is done while applying a signal to the device via one of the optical fibers and monitoring power at the output end. Once an optimum alignment is achieved the output fiber capturing the test light can be soldered in place.
  • this invention provides a method and device wherein two optical fibers are aligned with an optical element where all three are fixed to a common base using solder.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
EP07254671A 2006-12-14 2007-12-01 Kleines optisches Gehäuse mit mehreren optisch ausgerichteten, gelöteten Elementen darin Withdrawn EP1936414A2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86997206P 2006-12-14 2006-12-14

Publications (1)

Publication Number Publication Date
EP1936414A2 true EP1936414A2 (de) 2008-06-25

Family

ID=39269298

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07254671A Withdrawn EP1936414A2 (de) 2006-12-14 2007-12-01 Kleines optisches Gehäuse mit mehreren optisch ausgerichteten, gelöteten Elementen darin

Country Status (3)

Country Link
US (1) US20080144997A1 (de)
EP (1) EP1936414A2 (de)
CN (1) CN101226317A (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104009378B (zh) * 2014-05-15 2017-03-29 深圳大学 一种基于绿光光纤激光器泵浦的可见光超连续谱光源
JP2016161654A (ja) * 2015-02-27 2016-09-05 住友大阪セメント株式会社 補強部材を用いた基板加工方法、及び補強部材により補強された基板より成る機能素子
CN109164606A (zh) * 2018-09-19 2019-01-08 中国电子科技集团公司第二十六研究所 一种具有高性能稳定性的光纤声光器件
JP2019117397A (ja) * 2019-03-08 2019-07-18 住友大阪セメント株式会社 基板加工方法
US11768341B2 (en) * 2019-09-18 2023-09-26 Nippon Telegraph And Telephone Corporation Package for optical module
CN115629443A (zh) * 2022-12-07 2023-01-20 武汉光谷航天三江激光产业技术研究院有限公司 一种大芯径高功率光纤光栅的封装结构及封装方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5026138A (en) * 1989-08-29 1991-06-25 Gte Laboratories Incorporated Multi-fiber alignment package for tilted facet optoelectronic components
FR2655161B1 (fr) * 1989-11-30 1992-12-24 Cit Alcatel Dispositif a double couplage optique, notamment pour systeme de transmission a fibres optiques.
JP3409781B2 (ja) * 2000-09-05 2003-05-26 住友電気工業株式会社 光半導体モジュールの製造方法
US20020151113A1 (en) * 2001-04-13 2002-10-17 Hung Henry H. Apparatus and method for suppressing false resonances in fiber optic modulators
US6773171B2 (en) * 2003-01-14 2004-08-10 Intel Corporation Optoelectronic housings and methods of assembling optoelectronic packages
TWI278075B (en) * 2004-08-17 2007-04-01 Toshiba Corp LSI package with interface module, transmission line package, and ribbon optical transmission line
JP4197668B2 (ja) * 2004-08-17 2008-12-17 株式会社東芝 インターフェイスモジュール付ｌｓｉパッケージとインターフェイスモジュール及び接続保持機構

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US20080144997A1 (en) 2008-06-19
CN101226317A (zh) 2008-07-23

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