Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/14—Layered products comprising a layer of synthetic resin next to a particulate layer
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
  • B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/40—Properties of the layers or laminate having particular optical properties
  • B32B2307/412—Transparent
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2457/00—Electrical equipment
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
  • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
  • Y10T428/2813—Heat or solvent activated or sealable
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]
  • Y10T428/31721—Of polyimide

Definitions

• the present invention relates to a film-coating film and articles comprising such a film.
• article is meant any packaging, packaging or protective device or sheet material, including paper.
• the article may be for example an information medium, in particular a document, such as for example an identity paper, a visa, a means of payment, in particular a banknote or a check, a ticket, in particular a ticket transportation or an entrance ticket to event events such sports or cultural, or a coupon, this list is not exhaustive.
• the article may also be, for example, a folding case, a mounted box of paper or cardboard, or a flexible plastic package. The article can still be a book.
• film-coating is meant a film intended to cover at least partially, or entirely, at least one substrate or structure, for example at least one sheet, at least one other film or a cardboard or book cover or booklet for example (passport, savings bank or health book) or book jacket.
• the film-coating film sometimes sometimes referred to as a laminating or plasticizing film, is for example intended to be laminated with at least one other layer.
• the film-coating film may comprise an adhesive layer and / or have heat-melt properties.
• the application of the film to the film-forming structure or substrate may be by passing between rolls, either hot or cold, depending, for example, on whether the adhesive is heat-activatable or pressure-sensitive.
• Laminating film can be used to protect data in the case of security documents.
• the film-coating film can be used, if necessary, for aesthetic purposes as well as to provide mechanical protection in the case for example of cases for packaging or can be used to provide mechanical and chemical protection in the case of covers books or booklets or book jackets, in particular.
• the film In hot lamination processes, the film may be designed from the outset with a layer of adhesive, and the film with its adhesive and the substrate or structure to be laminated are rolled between two hot rollers. Optionally, the film may not have adhesive and adhere to the substrate or structure by melting material.
• the film In cold laminating processes, the film may initially be coated with an adhesive and laminated to the substrate or structure to be laminated or may be laminated to the substrate or structure using an adhesive provided under liquid form by a coating system, also called laminating system, the film and the substrate or the structure being laminated under pressure between two cold rolls.
• PoIyIc presents on its website an inlay supporting an RFID device, which is printed.
• This inlay is a semi-finished product intended to be sandwiched between a paper or plastic medium and for example an adhesive layer.
• transparent films to protect prints, for example variable mentions, wear and attempts to falsify after printing. It is also known to protect the substrates for packaging by laminating with transparent films. These transparent films can also be partially metallized, holographic, printed, pigmented, diffractive or lenticular to provide a visual effect (advertising tool) or secure (prevention of counterfeiting).
• the present invention aims in particular to further enhance the security during the use of such films and / or to allow traceability and / or to offer new features.
• the application WO 03/100721 discloses a method of protecting inscriptions by means of a transparent film. Such a method is relatively complex to implement and does not conduct a planar structure.
• the subject of the invention is a film-coating film comprising: an at least partially transparent flexible film, a flexible chip present on one side of the film, a thickness compensating layer covering the film at least partially around the chip, and better all around the chip.
• the film may comprise at least one non-opacified region that does not alter the reading of information underlying an article that would be covered by the film-coating film.
• the transparency can be “visual", allowing the reading of information under the film but it can also be a transparency "radiofrequency radiation” for contactless reading of the chip underlying the film.
• the term “chip” designates a more or less complex electronic device, which may for example be an RFID device and may comprise at least one memory and a processor.
• the chip may possibly allow non-contact data exchange, for example by using at least one integrated antenna or by being connected to at least one antenna. If necessary, the chip may include an antenna coupled to another antenna of the article, of larger size.
• the chip can receive and / or exchange information with at least one additional electronic device carried or not by the film of film coating, such as for example a sensor, in particular temperature, humidity, pressure or light or sensitive to an external condition or action, for example an opening.
• the aforementioned electronic device may also be a display device, for example liquid crystal or electroluminescent, including LED or OLED or the like.
• the chip or the attached electronic device (s) can still be connected to an electrical source, which is for example formed on the film, for example by printing technology.
• the thickness compensation layer may make it possible to obtain a substantially planar structure in the presence of the chip and the associated electronic device or devices and / or the electrical source.
• the film may be electrically insulating at least in the vicinity of the chip and / or its antenna if necessary, so as not to hinder the operation of the chip.
• the film and / or the thickness compensation layer and / or the adhesive layer possible may have anti-static properties, for example due to sufficient electrical conductivity to evacuate the electrical charges.
• the chip is for example fixed by gluing or welding on the film or printed on it. It may be the same or ancillary electronic devices.
• the antenna may be wired, being for example fixed by thermocompression in the film.
• the antenna can still be printed on the film, transferred or engraved.
• the chip In that it is flexible because it is produced for example at least partially in a polymer and / or with a small thickness, for example according to the CIRCONFLEX technique described in the aforementioned article EMPC, the chip proves to be less fragile that the conventional silicon thick chips and can accept a certain curvature, which allows it to be supported by the film despite the flexibility of it. In addition, the chip is less likely to damage the film.
• the chip is made to be able to undergo flexion (in compression) with a radius of curvature of 3 mm, better 2 mm, even better 1 mm, or even 0.75 mm, without undergoing degradation. preventing to function.
• the CIRCONFLEX chip disclosed in the aforementioned article is announced as being able to flex (in compression) with a radius of curvature of 0.7 mm, while remaining operational.
• the materials used to make the chip and the film may possibly have near optical indices, which can make the visual location of the chip less easy.
• the thickness compensating layer covers the film at least all around the chip and has a thickness preferably at least substantially equal to that of the chip.
• the chip may not generate any appreciable excess thickness when the film coating film is fixed on the substrate or structure to be film-coated.
• the small thickness of the chip combined with the presence of the thickness-compensating layer may make it possible to avoid making a cavity in the film or article that makes it possible to at least partially accommodate the chip, which facilitates the manufacturing.
• the use of the film laminating can be simplified.
• the presence of the thickness compensating layer optionally allows the roll storage of the film-coating film.
• the invention is particularly suitable for film-coating films in which the film is intended to be stuck on an identity document such as a passport or to be part of an identity document such as an identity card, the film-coating film being for example intended to protect variable information.
• the film laminating film can be heat sealed.
• the thickness-compensating layer is advantageously adhesive, being for example cold-adhesive or alternatively hot-only.
• the thickness compensating layer is adhesive only hot, the pre-positioning of the film on the article to be covered can be facilitated.
• the thickness-compensating layer may be further non-adhesive and be covered by a layer of an adhesive, which may optionally be hot-tack only.
• the film-coating film may, for example, be intended to be complexed on paper or cardboard for the production of folding cases, mounted boxes or for the production of flexible packaging, the aforementioned film-coating film being laminated, for example with other movies.
• the film-coating film may be in the form of a roll of film ready to be laminated on the structure or the substrate to be film-coated, for example when hot.
• the chips and any antennas may be previously fixed on an inner face of the film, for example with regular spaces.
• the film laminating film may still have been cut to a format adapted to the substrate or the structure to be coated.
• the invention further relates, in another of its aspects, to an article comprising a film-coating film as defined above.
• the article when the article is a sheet material, in particular a document, the article may comprise a sheet of paper on which the film-coating film is glued.
• the article and the film laminating film may be devoid of recess at least partially receiving the chip.
• the laminating film may be intended to completely cover one side of a document.
• the chip may have a thickness less than or equal to 15 microns, more preferably 12.5 microns, for example of the order of at least 10 microns, especially when performed according to the aforementioned CIRCONFLEX method.
• the invention further relates, in another aspect, to an at least partially transparent film-coating film comprising a flexible chip.
• the invention also relates to a film-coating film comprising: an at least partially transparent flexible film, a chip produced by printing on one side of the transparent film, -a layer of adhesive allowing the attachment of the film on an article.
• the invention further relates, according to another of its aspects, a packaging film on which is fixed at least one chip.
• Such a film may be heat shrinkable, for example.
• the film does not necessarily have a thickness compensation layer, although preferable to facilitate in particular coil packaging, and may not be transparent.
• the chip may be as defined above or otherwise.
• a packaging film can increase security and facilitate traceability.
• the chip can be glued to the film.
• the invention also relates to a method for securing and / or tracking an article, in particular a document, in which: a film of film coating as defined above is fixed on the article.
• FIG. schematic of a film coating film according to the invention Figure 2 is a view similar to Figure 1 of an alternative embodiment
• Figure 3 illustrates the fixing of the film of film coating of Figure 1 on an article
• the FIG. 4 is a diagrammatic section of an alternative embodiment of the invention
• FIG. 5 illustrates the use of the article of FIG. 4 to protect variable information
• FIG. 6 represents a box comprising a film according to the invention
• FIG. 7 represents a variant of film
• FIG. 1 shows a film-coating film 1 comprising a film 2, for example a transparent plastic material.
• the film 2 is on one side a layer of adhesive 3 and a chip 4, for example polymer, in particular semiconductor polymer and / or organic or mineral, silicon, sufficiently thin.
• the adhesive layer 3 serves not only for fastening the security element on an article 5, as illustrated in FIG. 3, but also for a thickness-compensating layer. thickness of the layer 3 being substantially equal to or even greater than that of the chip 4.
• the adhesive layer 3 can protect the chip 4 shocks or pressures exerted during a possible printing of the film 2 for example, or during the treatment of the article 5 which is coated thereon.
• Article 5 is for example a page of a passport or any other security document, such as a badge or an identity card.
• Article 5 can also be a folded box or a folding case, among others.
• Article 5 may comprise any known security means such as in particular an impression with optically variable or thermochromic inks, holographic reliefs, at least partial metallization, reactive inks by color change in case of attack, transferable inks and non-transferable to highlight attempts to peel, to name a few examples.
• the film can convey traditional security so as to allow its authentication or visual impressions for its personalization.
• the chip 4 allows for example a reading and / or writing data without contact, by inductive coupling.
• the chip 4 may comprise for this purpose an integrated antenna.
• the chip 4 may be electrically connected to a separate antenna, this antenna being for example carried by the inner face of the film 2.
• the antenna is for example wired or made by screen printing or by another printing technique on the movie 2
• the antenna is made otherwise still, being for example not electrically connected to the chip 4 but inductively coupled thereto, or when the chip does not have an antenna .
• the chip 4 may comprise conductive, semiconducting or insulating portions of organic or inorganic material (s), for example carrying out diode or transistor functions, resistance, capacity, salt, and / or an information storage function.
• organic or inorganic material for example carrying out diode or transistor functions, resistance, capacity, salt, and / or an information storage function.
• the chip 4 may in particular comprise an integrated circuit comprising an organic polymer chosen, for example, from the conjugated polymers, as described in publication WO 99/54842.
• the organic polymer may be chosen for example from oligomeric pentacene, poly (thienylene vinylene) or poly-3 alkylthiophene.
• the German company PoIyIC produces semiconductor polymer chips that can be used.
• the chip is for example entirely polymeric based on polyester, the circuit being made by printing.
• the chip is for example TFTC technology (Thin Film Transistors
• the chip can be printed on the film 2 and be encapsulated or not, in particular so that some of its constituents are protected from the ambient air.
• the use of a semiconductor polymer chip can in particular make it possible to have a thickness for the relatively small chip 4, for example less than or equal to 20 ⁇ m.
• the chip 4 may comprise a flexible film supporting the circuits of the chip, in particular a polymeric film, for example a polyimide film.
• the chip 4 can also be produced according to the application EP 1 494 167.
• the chip 4 can thus be produced for example according to the CIRCONFLEX method, in which the circuit is produced on an SOI wafer and covered by a polyimide film, then detached from the wafer SOI in order to be supported by the polyimide film.
• the use of a flexible chip makes it possible, thanks to the flexibility of the chip 4, to more easily store the security element in roll before use.
• Refractive indices close to the chip 4 and the film 2 are likely to make the chip more difficult to detect visually, but the chip 4 can be made without having a refractive index close to that of the film.
• the chip 4 can be fixed or deposited in various ways on the film 2 and in particular by gluing, welding or printing.
• the film may comprise, as illustrated in FIG. 7, at least one electronic device 20 which may or may not transmit or exchange data with the chip.
• This or these ancillary electronic devices 20 can operate autonomously when for example exposed to electromagnetic radiation or receive their energy from an electrical source 21 which can be carried by the film 2, for example an electrical source produced by a technology of impression.
• the associated electronic device or devices 20 may be connected by electrical conductors 22 to the electrical source 21.
• the at least one electronic device is for example selected from sensors, for example sensitive to pressure, temperature, humidity, light, conductivity, or may be sensitive to at least one external condition, for example the presence of a gas or a particular liquid or compound or an action, for example the opening of a package or exposure to light or oxygen from the air. It can be biosensors.
• the attached electronic device or devices may include a capacitive sensor for detecting the presence of a person nearby.
• the chip may be arranged to cause the display, for example by means of a display device carried by the film or not, information for example of a commercial nature.
• the display device may be connected by a wire link or not to a sensor, if necessary.
• the associated electronic device or devices may transmit information to the chip 4 which may, for example, store them for later reading by a suitable reading device.
• This may allow for example to provide information on the history of the article following a predefined detection coated film, for example storage conditions or transport. This may be useful for example to check that certain conditions have been met until the article is offered to consumers.
• the attached electronic device or devices may also comprise at least one display device, for example electroluminescent, LED or OLED or liquid crystal.
• the adhesive layer 3 may, if necessary, contribute at least partly to the maintenance of the chip 4 on the film 2.
• the adhesive layer 3 is for example formed by an adhesive having a cold or hot adhesion.
• the adhesive layer 3 may be covered before use by a removable protective film, for example a silicone paper.
• the adhesive layer 3 is for example an acrylic adhesive. Movie
• the film may be made of a plastic material which may be stretchable or not, for example polyester, polypropylene or polyurethane, the latter material being particularly suitable when the film is thin, for example less than or equal to 100 ⁇ m thick, especially at 50 ⁇ m.
• the thickness of the film may be even smaller, for example less than or equal to 15 ⁇ m, or even 12 ⁇ m.
• the film may also be oriented polypropylene (OPP), a cellulose acetate or a polyamide, such as for example Nylon ® .
• the film may comprise, on its face 6 covered by the security element 1, impressions, for example variable mentions.
• the film may comprise a coating on the surface, for example a varnish, facilitating its customization, thanks to prints for example.
• the film may have undergone surface treatment increasing its printability.
• the film may have anti-static properties.
• the film is visually at least transparent.
• the film may advantageously have a scratch resistance thanks to a special anti-abrasion layer.
• the film may be for example extruded polyester terephthalate, for example with a thickness of between 50 and 60 microns.
• a film suitable for hot-lamination it is for example PET coated with a heat-activatable adhesive and carrying the chip.
• a film may be intended to be hot rolled on a cardboard during the filming.
• the film When the film is intended for cold-coating, for example a treated PE film (by corona effect or with a primer), carrying the chip, it may be intended to be laminated on a cardboard during the filming with an acrylic liquid glue.
• a treated PE film by corona effect or with a primer
• carrying the chip it may be intended to be laminated on a cardboard during the filming with an acrylic liquid glue.
• This thickness compensation can be provided at least partially, or entirely, by an adhesive if it is already present on the structure (this is possible in the case of hot-rolling in particular) or by a non-adhesive compensation layer ( case of cold lamination).
• Such thickness-compensated films can provide a planar final structure, both durable and aesthetic.
• the thickness compensating layer may be the adhesive layer as mentioned above or at least one non-adhesive layer.
• FIG. 2 shows an alternative embodiment in which the thickness compensation is provided mainly by an inner layer 7, intermediate between the adhesive layer 3 and the film 2, the inner layer 7 being for example formed by a material without adhesive properties.
• the film-coating film may be secured, before it is fixed to the structure or substrate to be film-coated, with a support to which the film adheres by its face opposite to that receiving the chip.
• the adhesion of the film to the support is sufficiently weak for allow separation without damage to the film-coating film.
• the adhesion force between the film and the support is thus less than that of the adhesive layer on the article.
• the support is for example a polystyrene film.
• the film laminating film 1 may form a pouch and have two parts 1a and 1b intended to be folded over one another around the article whose contents are to be protected, for example an identity card, as illustrated. Figures 4 and 5.
• the chip can be connected to an antenna 8 present on the inside face of one of the flaps of the film 2, this antenna being for example a printed or wired antenna.
• the edges 10 of the film 2 can meet around the document 5, as shown in Figure 5, the film 2 being for example heat-sealed at its periphery.
• the film can still be made with flaps in the manner of a document guard, for engaging in each of the flaps one of the flaps of the document, the film can fold by accompanying the folding of the document on itself.
• the film may or may not be glued to the document.
• the invention applies not only to the security of official documents, including identity, but also to the traceability and authentication of various items such as for example packaging, books, laminating objects, etc.
• the film according to the invention may be useful for example in the security and traceability of packaging including cosmetics or perfumes, or books.
• the film coating may be carried out in particular by hot rolling with the packaging or the cover of the book.
• articles of a library may include protective covers made of a film-coating film according to the invention.
• the laminating film chip can for example exchange data with a system for automatically recording the output and return of the books.
• FIG. 7 shows a carton 30, for example, formed by folding a sheet on one side of which the film-coating film has been glued in order to obtain a more attractive package, for example.
• the presence of the chip 4 on the film may for example allow the consumer to query it for information on the product contained in the package.
• It may for example be a user manual or a dosage to be respected, in the case of a drug.
• the chip 4 can still be used for the traceability and / or securing of the packaging.
• the film can be arranged such that, for example, the opening of the package can be detected by interrogating the chip, this opening having for example an electronic secondary device carried by the film, for example an electrical conductor, or having been detected by an aperture sensor.
• another subject of the invention is a packaging film, for example in the form of a heat-shrinkable sheath as illustrated in FIG. 8, which is for example packaged in roll and may carry a chip 4 which is for example as defined above or may be other, in particular be a conventional chip based on silicon.
• the packaging film 40 is for example a heat-shrinkable material or not.
• the chip may contain information relating to the object contained in the package.

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• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Life Sciences & Earth Sciences (AREA)
• Wood Science & Technology (AREA)
• Credit Cards Or The Like (AREA)
• Laminated Bodies (AREA)

Applications Claiming Priority (2)

Publications (1)

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Family Applications (1)

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• 2005
  • 2005-12-15 FR FR0553901A patent/FR2895118B1/fr not_active Expired - Fee Related
• 2006
  • 2006-12-06 RU RU2008130133A patent/RU2429975C2/ru not_active IP Right Cessation
  • 2006-12-06 EP EP06842098A patent/EP1960193A2/de not_active Withdrawn
  • 2006-12-06 WO PCT/FR2006/051287 patent/WO2007071866A2/fr not_active Ceased
  • 2006-12-06 CA CA 2633154 patent/CA2633154A1/fr not_active Abandoned
  • 2006-12-06 BR BRPI0619945-3A patent/BRPI0619945A2/pt not_active IP Right Cessation
• 2008
  • 2008-06-16 US US12/213,164 patent/US20090087651A1/en not_active Abandoned

Non-Patent Citations (1)

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