EP1966078A1 - VERFAHREN ZUM VERSCHLIEßEN EINER ÖFFNUNG - Google Patents
VERFAHREN ZUM VERSCHLIEßEN EINER ÖFFNUNGInfo
- Publication number
- EP1966078A1 EP1966078A1 EP06830110A EP06830110A EP1966078A1 EP 1966078 A1 EP1966078 A1 EP 1966078A1 EP 06830110 A EP06830110 A EP 06830110A EP 06830110 A EP06830110 A EP 06830110A EP 1966078 A1 EP1966078 A1 EP 1966078A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- cavity
- closure material
- opening
- substrate
- fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000000034 method Methods 0.000 title claims description 37
- 238000007789 sealing Methods 0.000 title description 3
- 239000012530 fluid Substances 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000000203 mixture Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 57
- 238000000576 coating method Methods 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 10
- 238000009736 wetting Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000005019 vapor deposition process Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 description 9
- 239000003566 sealing material Substances 0.000 description 7
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000013017 mechanical damping Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
- B81C1/00293—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0145—Hermetically sealing an opening in the lid
Definitions
- a wetting layer is formed on the substrate at least in an environment of the opening.
- the wetting layer according to the invention advantageously favors the accumulation of sealing material around and on the opening.
- a metallosis may be provided as a wetting surface for a solder around the opening.
- FIGS. 1A to 1D show a schematic sectional view of an integrated component according to a first embodiment of the present invention
- FIGS. 2A to 2D show a schematic sectional view of an integrated component according to a second embodiment of the present invention.
- a fluid 24 is introduced into the cavity 20 of the substrate 2.
- Both the composition and the pressure of the fluid 24 are selected so that the fluid 24 enclosed in the cavity 20 does not damage the mechanical structure 21 or its coating and advantageously adjust the mechanical properties of the mechanical system 21 in the desired manner.
- the fluid 24 may prevent diffusion of harmful substances into the cavity 20.
- the sealing material is liquefied, which then collects preferably at the locations of the wetting layer 26 and forms a cap over the openings 22.
- the solidified closure material 28 thus forms tight closure caps 29, as shown in FIG. 2D.
- the melting of the sealing material 28 allows for the utmost independence of the pressure and composition of the fluid 24.
- FIG. 3A shows a further integrated component in a substrate 3 with a mechanical structure 31 which is arranged in a cavity 30.
- the cavity 30 is accessible via openings 32 with inner walls 332.
- Both a surface 330 of the cavity 30 and a surface 331 of the mechanical structure 31 are coated with a non-stick coating 33.
- a fluid 34 is introduced into the cavity 30.
- local melting such as by a laser beam
- a previously applied closure material or an upper part of the substrate 3 is liquefied and closes off by openings 39, the openings 32, as shown in Fig. 3B.
- the closure material can be formed by the substrate 3 in this embodiment.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005060870A DE102005060870A1 (de) | 2005-12-20 | 2005-12-20 | Verfahren zum Verschließen einer Öffnung |
| PCT/EP2006/068869 WO2007071523A1 (de) | 2005-12-20 | 2006-11-24 | VERFAHREN ZUM VERSCHLIEßEN EINER ÖFFNUNG |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1966078A1 true EP1966078A1 (de) | 2008-09-10 |
Family
ID=37944851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP06830110A Ceased EP1966078A1 (de) | 2005-12-20 | 2006-11-24 | VERFAHREN ZUM VERSCHLIEßEN EINER ÖFFNUNG |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8304845B2 (de) |
| EP (1) | EP1966078A1 (de) |
| JP (1) | JP2009520371A (de) |
| DE (1) | DE102005060870A1 (de) |
| WO (1) | WO2007071523A1 (de) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0801170D0 (en) * | 2008-01-23 | 2008-02-27 | Univ Heriot Watt | A self-diagnosis and self-sealing method for leakage from storage reservoirs |
| GB0804566D0 (en) * | 2008-03-12 | 2008-04-16 | Brinker Technology Ltd | Method for sealing a leak in a vessel or duct |
| CN104043490A (zh) | 2008-07-25 | 2014-09-17 | 弗卢丁公司 | 用于制造集成流体芯片的方法和系统 |
| FR2941561B1 (fr) | 2009-01-28 | 2011-05-13 | Commissariat Energie Atomique | Procede de fermeture de cavite pour au moins un dispositif microelectronique |
| US20130119489A1 (en) * | 2011-11-11 | 2013-05-16 | Qualcomm Incorporated | Method and apparatus for wafer-level solder hermetic seal encapsulation of mems devices |
| DE102013102213B4 (de) * | 2013-03-06 | 2020-01-02 | Snaptrack, Inc. | Miniaturisiertes Bauelement mit Dünnschichtabdeckung und Verfahren zur Herstellung |
| US9284182B1 (en) * | 2013-08-20 | 2016-03-15 | Qualtre, Inc. | MEMS devices anti-stiction coating and encapsulant having opposing water resitive characteristics |
| DE102014202801B4 (de) * | 2014-02-17 | 2023-08-24 | Robert Bosch Gmbh | Verfahren zum Herstellen eines mikromechanischen Bauelements |
| DE102015220893B4 (de) * | 2015-10-26 | 2025-08-21 | Robert Bosch Gmbh | Strukturen zur Reduzierung und Vermeidung von Stress und Spannungen beim Bearbeiten von Silizium mittels Aufschmelzen durch einen Laser |
| DE102015224499A1 (de) * | 2015-12-08 | 2017-06-08 | Robert Bosch Gmbh | Spannungsreduzierung beim Laserwiederverschluss durch Temperaturerhöhung |
| DE102015224483B4 (de) * | 2015-12-08 | 2026-03-05 | Robert Bosch Gmbh | Gezielte Steuerung des Absorptionsverhaltens beim Laserwiederverschluss |
| DE102015224481A1 (de) * | 2015-12-08 | 2017-06-08 | Robert Bosch Gmbh | Laser-Reseal mit verschiedenen Kappenmaterialien |
| DE102015224519A1 (de) | 2015-12-08 | 2017-06-08 | Robert Bosch Gmbh | MEMS-Bauteil mit zwei unterschiedlichen Innendrücken |
| DE102015224520A1 (de) * | 2015-12-08 | 2017-06-08 | Robert Bosch Gmbh | Laserverschluss mit spezieller Membranstruktur |
| DE102015224533A1 (de) * | 2015-12-08 | 2017-06-08 | Robert Bosch Gmbh | Reaktives Verschlussgas zur gezielten Anpassung des Kaverneninnendruckes |
| DE102015224506A1 (de) * | 2015-12-08 | 2017-06-08 | Robert Bosch Gmbh | Sensorelement mit laseraktiviertem Gettermaterial |
| DE102015224487A1 (de) * | 2015-12-08 | 2017-06-08 | Robert Bosch Gmbh | Laser-Reseal mit Zusatzschicht und Legierungsbildung |
| DE102015224538A1 (de) * | 2015-12-08 | 2017-06-08 | Robert Bosch Gmbh | Laser-Wiederverschluss mit lokaler Begrenzung |
| DE102017125140B4 (de) | 2017-10-26 | 2021-06-10 | Infineon Technologies Ag | Verfahren zum Herstellen eines hermetisch abgedichteten Gehäuses mit einem Halbleiterbauteil |
| DE102018201358A1 (de) * | 2018-01-30 | 2019-08-01 | Robert Bosch Gmbh | Verfahren zum Verschließen von Öffnungen in einer flexiblen Membran eines MEMS-Elements |
| DE102018222749A1 (de) * | 2018-12-21 | 2020-06-25 | Robert Bosch Gmbh | Verfahren zum Verschließen von Zugängen in einem MEMS-Element |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4447757A (en) * | 1980-06-16 | 1984-05-08 | Sharp Kabushiki Kaisha | Structure of thin-film electroluminescent display panel sealed by glass substrates |
| DE10017422A1 (de) | 2000-04-07 | 2001-10-11 | Bosch Gmbh Robert | Mikromechanisches Bauelement und entsprechendes Herstellungverfahren |
| US6465280B1 (en) * | 2001-03-07 | 2002-10-15 | Analog Devices, Inc. | In-situ cap and method of fabricating same for an integrated circuit device |
| DE10200869A1 (de) | 2002-01-11 | 2003-07-31 | Infineon Technologies Ag | Verfahren zum Erzeugen einer Schutzabdeckung für ein Bauelement |
| AU2003286572A1 (en) * | 2002-10-23 | 2004-05-13 | Rutgers, The State University Of New Jersey | Processes for hermetically packaging wafer level microscopic structures |
| EP1433740A1 (de) * | 2002-12-24 | 2004-06-30 | Interuniversitair Microelektronica Centrum Vzw | Verfahren zum Verschliessen von Öffnungen in einem Film |
| US7514283B2 (en) * | 2003-03-20 | 2009-04-07 | Robert Bosch Gmbh | Method of fabricating electromechanical device having a controlled atmosphere |
| US6946728B2 (en) * | 2004-02-19 | 2005-09-20 | Hewlett-Packard Development Company, L.P. | System and methods for hermetic sealing of post media-filled MEMS package |
| US7159459B2 (en) * | 2005-01-06 | 2007-01-09 | Freescale Semiconductor, Inc. | Multiple microelectromechanical (MEM) devices formed on a single substrate and sealed at different pressures and method therefor |
-
2005
- 2005-12-20 DE DE102005060870A patent/DE102005060870A1/de not_active Ceased
-
2006
- 2006-11-24 EP EP06830110A patent/EP1966078A1/de not_active Ceased
- 2006-11-24 US US12/086,893 patent/US8304845B2/en active Active
- 2006-11-24 WO PCT/EP2006/068869 patent/WO2007071523A1/de not_active Ceased
- 2006-11-24 JP JP2008546328A patent/JP2009520371A/ja active Pending
Non-Patent Citations (1)
| Title |
|---|
| See references of WO2007071523A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102005060870A1 (de) | 2007-06-21 |
| US20090174148A1 (en) | 2009-07-09 |
| WO2007071523A1 (de) | 2007-06-28 |
| US8304845B2 (en) | 2012-11-06 |
| JP2009520371A (ja) | 2009-05-21 |
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Legal Events
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| 18R | Application refused |
Effective date: 20180123 |