EP1967597A2 - Conducteur en béryllium-cuivre - Google Patents

Conducteur en béryllium-cuivre Download PDF

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Publication number
EP1967597A2
EP1967597A2 EP08151504A EP08151504A EP1967597A2 EP 1967597 A2 EP1967597 A2 EP 1967597A2 EP 08151504 A EP08151504 A EP 08151504A EP 08151504 A EP08151504 A EP 08151504A EP 1967597 A2 EP1967597 A2 EP 1967597A2
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EP
European Patent Office
Prior art keywords
wire
beryllium
nickel
base alloy
copper base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08151504A
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German (de)
English (en)
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EP1967597A3 (fr
Inventor
Joseph Saleh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fisk Alloy Wire Inc
Original Assignee
Fisk Alloy Wire Inc
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Filing date
Publication date
Application filed by Fisk Alloy Wire Inc filed Critical Fisk Alloy Wire Inc
Publication of EP1967597A2 publication Critical patent/EP1967597A2/fr
Publication of EP1967597A3 publication Critical patent/EP1967597A3/fr
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Definitions

  • the present invention relates to an electrical conductor formed from a beryllium-copper alloy which can be formed into a single end or stranded wire.
  • Alloy C17510 is a high conductivity Be-Cu alloy used both as an electronic connector and an electrical conductor.
  • U.S. patent numbers 4,594,116 ; 4,727,002 ; and 4,838,959 describe the process and the resultant properties obtained for an electrical conductor using this alloy. The aim is to obtain a product having 95 ksi tensile strength and 60% IACS electrical conductivity.
  • the described process consists of deforming a solution annealed wire greater than 99% cross sectional area followed by over-aging. This process is different than what is normally utilized for this alloy where the material is aged directly after solution treatment (AT or TF00 temper) or after deforming 60% (HT or TH04 temper) to obtain maximum tensile strength.
  • This aging treatment for a conductor is designed to provide a higher electrical conductivity at the cost of tensile strength.
  • the main attributes of a conductor are its electrical conductivity and tensile strength. These two characteristics are often conflicting. Attempts to increase one result in reduction of the other. It is quite beneficial to conceive of methods to increase conductivity without sacrificing the strength of the conductor.
  • Alloy C17510 in conductor applications is typically supplied with silver plating.
  • the higher aging temperature required to age this wire at finish can result in a yellow discoloration.
  • This discoloration is an unacceptable condition which requires great care to prevent and when ensued is cause for rejection of the conductor. It would be quite beneficial to conceive a method to avoid this discoloration.
  • the present invention discloses a new alloy composition to improve electrical conductivity of C 17510 and improve surface brightness of the silver plated product following final heat treatment.
  • an age hardened wire for use as an electrical conductor.
  • the wire is formed from a copper base alloy consisting of from 1.25 to 3.6 wt% nickel, from 0.25 to 0.45 beryllium, and the balance copper and impurities which do not affect the properties of said alloy.
  • the nickel and beryllium are present in the copper base alloy in a ratio of nickel to beryllium from 5.0 to 8.0.
  • the wire is in a cold worked and aged hardened condition so as to have an electrical conductivity of at least about 60% IACS.
  • a process for forming an age hardened wire for use as an electrical conductor broadly comprises the steps of providing a copper base alloy material consisting of from 1.25 to 3.6 wt% nickel, from 0.25 to 0.45 beryllium, and the balance copper and impurities which do not affect the properties of said alloy, said nickel and beryllium being present in said copper base alloy in a ratio of nickel to beryllium from 5.0 to 8.0, cold working said material in a single step; and age hardening said cold worked material in a single step to form a wire in a cold worked and aged hardened condition having an electrical conductivity of at least about 60% IACS.
  • Fig. 1 is a graph showing tensile strength versus electrical conductivity at 0.0320" diameter aged 725-975°F;
  • Fig. 2 is a graph showing tensile strength versus electrical conductivity at 0.0177" diameter aged 725-975°F;
  • Fig. 3 is a graph showing tensile strength versus electrical conductivity at 0.004" diameter aged 725-975°F;
  • Fig. 4 is a graph showing tensile strength versus conductivity for improved C17510 aged 3 hours at 725-975°F;
  • Fig. 5 is a graph showing tensile strength vs. electrical conductivity for Std. C 17510 aged 3 hours at 725-975°F.
  • CDA Copper Development Association
  • Table 1 The Copper Development Association (CDA) nominal composition of alloy C17510 is listed in Table 1. This is a broad range of chemistry and if utilized allows for a wide range of properties.
  • the alloy is normally cast with a nominal composition of about 0.35% Be and 1.6% Ni or a Ni/Be ratio of 4.6.
  • the alloy utilized in the above mentioned patents is similar to this chemistry having 0.38% Be and 1.66% Ni, a Ni/Be ratio of 4.4. If the broad range of chemistry listed for the alloy is utilized the Ni/Be range will vary from 2.3 to 11. Table 1.
  • High conductivity Be-Cu alloy C17510 contains a small amount of Be and a relatively larger amount of Ni. Ni readily reacts with Be forming beryllides. Ni beryllides mainly work as a grain refiner. Upon heat treatment (aging) of the normal chemistry of C17510, only a portion of the Be is combined with Ni to form beryllide leaving excess Be in elemental form. The free Be left in the copper matrix reduces electrical conductivity without substantially increasing strength of the alloy. Additionally, during the aging treatment the free Be can easily diffuse through silver plating to the surface of the wire causing a yellow discoloration. This discoloration is an unacceptable feature of the silver plated material.
  • Ni/Be ratio in this alloy was found to increase the electrical conductivity of the alloy by reducing the remaining elemental beryllium.
  • the improved alloy chemistry is defined by the ratio of Ni/Be to form nickel beryllide. Excess Ni beyond the amount needed to combine with Be will also reduce electrical conductivity of the alloy.
  • Binary Ni-Be system shows two nickel beryllides, BeNi ( ⁇ ) and Be 25 Ni 5 ( ⁇ ). BeNi is the beryllide forming in C 17510.
  • Ni/Be weight ratio to form BeNi is 6.5.
  • the range of Ni/Be with the permitted range of chemistry for C17510 is 2.3 to 11, with the typical ratio of 4.6.
  • the Ni/Be weight ratio is close to 6.5, the stoichiometric ratio for NiBe.
  • the Ni/Be weight ratio can be in the range of from 5.0 to 8.0, but is preferably from 5.5 to 7.5, and most preferably from 6.0 to 7.0.
  • the Be content of the alloy may be from 0.25 to 0.45 percent by weight and the nickel of the alloy content may be from 1.25 to 3.6 percent by weight.
  • the alloy may have intentional or unintentional impurities which do not adversely affect properties of the alloy in particular electrical conductivity, such as up to 0.10 wt% iron, up to 0.30 wt% cobalt, up to 0.20 wt% silicon, and up to 0.20 wt% aluminum.
  • the alloy may be solution treated, cold worked and aged to provide electrical conductivity of at least 70% IACS with a tensile strength of at least 95 ksi.
  • the alloy may also be solution treated, cold worked and aged to provide an electrical conductivity of at least 60% IACS and a tensile strength of at least 105 ksi.
  • Typical solution treatment for the alloys is 1600°F to 1750°F for 15 minutes to 2 hours followed by the quench.
  • the cold working may be performed in a single step using any suitable working device known in the art such as a drawing die.
  • the cold working step should reduce the original dimension of the copper alloy material by an amount within the range of from at least 60% to 95%, preferably from 66% to 88%.
  • the material may be age hardened at a temperature in the range of from 725°F to 925°F for a time period of up to 5.0 hours.
  • the alloy can be silver plated using any suitable plating treatment known in the art.
  • silver plating it is meant that the silver plating can be a plating of pure silver or a silver alloy.
  • One of the advantages to the present invention is that the resulting material does not discolor upon final heat treatment.
  • a sample of alloy C 17510 was obtained with the Ni/Be weight ratio of 6.0. Chemistry of this alloy is listed in Table 2. Table 2. Chemical composition for Improved C17510 Be, % Ni, % Cu 0.32 1.93 Balance
  • the two alloys shown in Tables 2 and 3 were plated with silver and drawn to 38 AWG (0.004" diameter).
  • the silver plating thickness at 38 AWG was 40 micro-inches. This is the silver plating thickness required for most conductors.
  • unilay stranded conductors consisting of 19 ends were made. This is a common conductor construction.
  • the two conductors were heat treated to provide a minimum of 6% elongation as required by such conductors. Annealing was conducted in a typical box furnace under protective atmosphere of nitrogen. Following this heat treatment the conductor manufactured with the improved chemistry was bright with silver color. In contrast, the conductor with the standard chemistry was discolored showing an unacceptable yellow hue.
  • wires of example 1 having the chemistries shown in Tables 2 and 3 were drawn in three steps to 38 AWG (0.004" in diameter), a typical conductor diameter. As expected, both alloys showed good drawability and could be easily drawn to greater than 99% reduction in area. Properties of the as-drawn wires as a function of cold reduction are listed in Table 6. Table 6.
  • the standard chemistry shows a higher work hardening rate but at a lower electrical conductivity. At the highest cold reduction of 99.3% (38 AWG) tensile strength for the standard chemistry is about 10 ksi higher than that of improved C 17510
  • Figures 1 - 3 show that in the region of interest, i.e., electrical conductivity greater than 60% IACS the improved chemistry has a greater electrical conductivity at equivalent tensile strength, or conversely has a higher tensile strength at the same electrical conductivity.
  • the improved electrical conductivity is about 10% IACS, a substantial improvement. This clearly shows that the improved C 17510 is a preferred chemistry in conductor applications. As figures 1 - 3 show, in all cases above 60% IACS improved C17510 has a superior combination of properties indicating that improved C 17510 is the preferred chemistry for this application.
  • the beryllium-copper conductor of the present invention provides an increased electrical conductivity and bright annealing with silver plating.
  • the conductor of the present invention may take the form of a single end wire or a stranded wire.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Metal Extraction Processes (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
EP08151504A 2007-02-27 2008-02-15 Conducteur en béryllium-cuivre Withdrawn EP1967597A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US90378807P 2007-02-27 2007-02-27
US12/069,287 US20080202643A1 (en) 2007-02-27 2008-02-08 Beryllium-copper conductor

Publications (2)

Publication Number Publication Date
EP1967597A2 true EP1967597A2 (fr) 2008-09-10
EP1967597A3 EP1967597A3 (fr) 2012-04-11

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ID=41078094

Family Applications (1)

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EP08151504A Withdrawn EP1967597A3 (fr) 2007-02-27 2008-02-15 Conducteur en béryllium-cuivre

Country Status (2)

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US (1) US20080202643A1 (fr)
EP (1) EP1967597A3 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104692075A (zh) * 2013-12-03 2015-06-10 贝扬斯技术公司 具有微丝传感器的传送带裂口探测系统

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110629140B (zh) * 2019-10-14 2021-05-07 江苏泰祥电线电缆有限公司 一种高强度合金铜导体退火装置
CN118155939B (zh) * 2024-04-01 2025-05-06 江西成稳科技股份有限公司 一种高强度合金导线、拖链电缆及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4594116A (en) 1984-07-30 1986-06-10 Hudson Wire Company Method for manufacturing high strength copper alloy wire
US4727002A (en) 1984-07-30 1988-02-23 Hudson Wire Company High strength copper alloy wire
US4838959A (en) 1984-07-30 1989-06-13 Hudson International Conductors Method for manufacturing high strength copper alloy wire

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2289593A (en) * 1940-08-03 1942-07-14 Charles B Sawyer Alloy
US4179314A (en) * 1978-12-11 1979-12-18 Kawecki Berylco Industries, Inc. Treatment of beryllium-copper alloy and articles made therefrom
US4533412A (en) * 1982-09-30 1985-08-06 Fdx Patents Holding Company, N.V. Thermal-mechanical treatment for copper alloys
US4657601A (en) * 1983-11-10 1987-04-14 Brush Wellman Inc. Thermomechanical processing of beryllium-copper alloys
US4551187A (en) * 1984-06-08 1985-11-05 Brush Wellman Inc. Copper alloy
US4692192A (en) * 1984-10-30 1987-09-08 Ngk Insulators, Ltd. Electroconductive spring material
JPS62199743A (ja) * 1986-02-27 1987-09-03 Ngk Insulators Ltd 高強度銅基合金及びその製造方法
EP0271991B1 (fr) * 1986-11-13 1991-10-02 Ngk Insulators, Ltd. Fabrication d'alliages cuivre-béryllium
JPH01165736A (ja) * 1987-12-21 1989-06-29 Dowa Mining Co Ltd ワイヤーハーネスのターミナル用銅合金およびその製造法
JPH083141B2 (ja) * 1989-10-27 1996-01-17 日本碍子株式会社 ベリリウム銅合金部材の製造法
US6059905A (en) * 1993-08-26 2000-05-09 Ngk Metals Corporation Process for treating a copper-beryllium alloy
JP3062435B2 (ja) * 1995-11-10 2000-07-10 日本碍子株式会社 フレキシブル基板並びにそれに用いるＢｅ−Ｃｕ合金箔およびその製造方法
JPH10296398A (ja) * 1997-04-24 1998-11-10 Ngk Insulators Ltd コイル用ワイヤおよびその製造方法
DE602006002573D1 (de) * 2005-09-09 2008-10-16 Ngk Insulators Ltd Kupfer Legierungblech mit Nickel und Beryllium und Verfahren zur Herstellung derselben

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4594116A (en) 1984-07-30 1986-06-10 Hudson Wire Company Method for manufacturing high strength copper alloy wire
US4727002A (en) 1984-07-30 1988-02-23 Hudson Wire Company High strength copper alloy wire
US4838959A (en) 1984-07-30 1989-06-13 Hudson International Conductors Method for manufacturing high strength copper alloy wire

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104692075A (zh) * 2013-12-03 2015-06-10 贝扬斯技术公司 具有微丝传感器的传送带裂口探测系统
CN104692075B (zh) * 2013-12-03 2018-09-14 康迪泰克美国有限公司 具有微丝传感器的传送带裂口探测系统

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Publication number Publication date
EP1967597A3 (fr) 2012-04-11
US20080202643A1 (en) 2008-08-28

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