EP1969606A1 - Mikro- und nanospitzen sowie verfahren zu deren herstellung - Google Patents
Mikro- und nanospitzen sowie verfahren zu deren herstellungInfo
- Publication number
- EP1969606A1 EP1969606A1 EP06841198A EP06841198A EP1969606A1 EP 1969606 A1 EP1969606 A1 EP 1969606A1 EP 06841198 A EP06841198 A EP 06841198A EP 06841198 A EP06841198 A EP 06841198A EP 1969606 A1 EP1969606 A1 EP 1969606A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- precursor material
- tips
- group
- irradiation
- main group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims description 57
- 239000002243 precursor Substances 0.000 claims abstract description 50
- 239000000463 material Substances 0.000 claims abstract description 42
- 239000011159 matrix material Substances 0.000 claims abstract description 22
- 230000000737 periodic effect Effects 0.000 claims abstract description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 6
- 125000000962 organic group Chemical group 0.000 claims abstract description 6
- 239000000126 substance Substances 0.000 claims description 18
- 230000012010 growth Effects 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 238000001994 activation Methods 0.000 claims description 11
- 230000004913 activation Effects 0.000 claims description 11
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 9
- 230000009471 action Effects 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 8
- 230000005670 electromagnetic radiation Effects 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 6
- 150000001252 acrylic acid derivatives Chemical group 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 150000003254 radicals Chemical class 0.000 claims description 4
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 4
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052790 beryllium Inorganic materials 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- 238000002425 crystallisation Methods 0.000 claims description 3
- 230000008025 crystallization Effects 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 239000000969 carrier Substances 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims description 2
- 238000005868 electrolysis reaction Methods 0.000 claims description 2
- 238000004049 embossing Methods 0.000 claims description 2
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 claims description 2
- 239000000446 fuel Substances 0.000 claims description 2
- RJMRIDVWCWSWFR-UHFFFAOYSA-N methyl(tripropoxy)silane Chemical compound CCCO[Si](C)(OCCC)OCCC RJMRIDVWCWSWFR-UHFFFAOYSA-N 0.000 claims description 2
- 238000005459 micromachining Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 claims description 2
- 229960003493 octyltriethoxysilane Drugs 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 claims description 2
- 238000007725 thermal activation Methods 0.000 claims description 2
- ALVYUZIFSCKIFP-UHFFFAOYSA-N triethoxy(2-methylpropyl)silane Chemical compound CCO[Si](CC(C)C)(OCC)OCC ALVYUZIFSCKIFP-UHFFFAOYSA-N 0.000 claims description 2
- IZRJPHXTEXTLHY-UHFFFAOYSA-N triethoxy(2-triethoxysilylethyl)silane Chemical compound CCO[Si](OCC)(OCC)CC[Si](OCC)(OCC)OCC IZRJPHXTEXTLHY-UHFFFAOYSA-N 0.000 claims description 2
- UBMUZYGBAGFCDF-UHFFFAOYSA-N trimethoxy(2-phenylethyl)silane Chemical compound CO[Si](OC)(OC)CCC1=CC=CC=C1 UBMUZYGBAGFCDF-UHFFFAOYSA-N 0.000 claims description 2
- JCGDCINCKDQXDX-UHFFFAOYSA-N trimethoxy(2-trimethoxysilylethyl)silane Chemical compound CO[Si](OC)(OC)CC[Si](OC)(OC)OC JCGDCINCKDQXDX-UHFFFAOYSA-N 0.000 claims description 2
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 230000007704 transition Effects 0.000 abstract 1
- 230000008569 process Effects 0.000 description 22
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 8
- 238000009826 distribution Methods 0.000 description 7
- 238000004626 scanning electron microscopy Methods 0.000 description 6
- 230000001133 acceleration Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 229910052711 selenium Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 229910052714 tellurium Inorganic materials 0.000 description 4
- 238000004630 atomic force microscopy Methods 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000004621 scanning probe microscopy Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000386 microscopy Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003631 wet chemical etching Methods 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- ADKPKEZZYOUGBZ-UHFFFAOYSA-N [C].[O].[Si] Chemical compound [C].[O].[Si] ADKPKEZZYOUGBZ-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001424 field-emission electron microscopy Methods 0.000 description 1
- -1 for example Chemical class 0.000 description 1
- CKHJYUSOUQDYEN-UHFFFAOYSA-N gallium(3+) Chemical compound [Ga+3] CKHJYUSOUQDYEN-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000004651 near-field scanning optical microscopy Methods 0.000 description 1
- 238000000399 optical microscopy Methods 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 230000036417 physical growth Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000004627 transmission electron microscopy Methods 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q70/00—General aspects of SPM probes, their manufacture or their related instrumentation, insofar as they are not specially adapted to a single SPM technique covered by group G01Q60/00
- G01Q70/16—Probe manufacture
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
- C03C17/30—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q70/00—General aspects of SPM probes, their manufacture or their related instrumentation, insofar as they are not specially adapted to a single SPM technique covered by group G01Q60/00
- G01Q70/08—Probe characteristics
- G01Q70/10—Shape or taper
- G01Q70/12—Nanotube tips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/30—Cold cathodes
- H01J2201/304—Field emission cathodes
- H01J2201/30446—Field emission cathodes characterised by the emitter material
- H01J2201/30453—Carbon types
- H01J2201/30469—Carbon nanotubes (CNTs)
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/298—Physical dimension
Definitions
- the present invention relates to a method for producing micro and nano tips and to the tips obtainable by such a method and their use in atomic force or optical near-field microscopy.
- microtips play an outstanding role as components in micro technology.
- nano-technology advances nano-peaks will become more and more important, although from today's perspective many application aspects can not be fully assessed.
- a field of application of micro- and nano-tips which is already well known today lies in the field of microscopy and in particular in particular with scanning probe microscopy (SPM), atomic force microscopy (AFM) or near-field optical microscopy (SNOM) scanning microscopy methods.
- SPM scanning probe microscopy
- AFM atomic force microscopy
- SNOM near-field optical microscopy
- micro and nano-tips are used as sensors with which to scan the samples to be examined. It is known that the tips are made with etching techniques developed in the semiconductor industry (M. -D. Weitze, The Atomic Force Microscope, GNT-Verlag 2003, p.
- a photosensitive photoresist is usually first applied to a substrate, exposed and developed. Subsequently, the free spaces are etched away by wet-chemical processes and the photoresist is removed again (W. Ehrfeld, Handbuch Mikrotechnik, 1st edition, Hanser Verlag 2002, p. 287 ff and p. 308 ff).
- EP 1 359 388 A1 discloses a method for producing sensor tips, in which a silicon substrate covered with a silicon oxide layer is used as the starting material.
- a silicon substrate covered with a silicon oxide layer is used as the starting material.
- a small opening in the oxide layer is produced by a lithographic process with subsequent wet-chemical etching.
- a pit is then formed by means of a further etching solution.
- silicon nitride is then introduced into the pit by deposition from the gas phase (PECVD, plasma enhanced chemical vapor deposition) and forms the tip required for the sensor.
- PECVD plasma enhanced chemical vapor deposition
- a needle-shaped tip for the purposes of this invention is any structure whose height is significantly greater than its diameter.
- the size ratio of height of the tip to diameter or transverse extent of the tip is at least 2, preferably at least 5, in particular at least 10 and particularly preferably at least 20. In one embodiment, the size ratio of height to diameter in a range of 10 to 1000.
- the term needle-shaped tip also encompasses those structures which are suitable, directly or indirectly, to be examined with one another. interact with the surface (functional micro- and nano-tips).
- the magnitude of the tips made in accordance with the invention is in the micron and / or nanometer range, i. their size is a maximum of 1000 microns.
- the tips preferably have a height of 1 nm to 1000 ⁇ m, in particular 30 nm to 20 ⁇ m, and a diameter of 40 nm to 100 ⁇ m, in particular 60 nm to 1 ⁇ m.
- the diameter may be smaller so that tips with a tip diameter in the atomic range (0.1 nm) are also included in the invention.
- a precursor material is brought into contact with a matrix and then energetically activated over a large area, the precursor material being an element other than carbon from the second to fifth main group which contains the sixth main group with an atomic number Z ⁇ 16 or a subgroup of the Periodic Table of the Elements and organic groups which are chemically bonded directly and / or via an element of the sixth main group to the respective element.
- a chemical growth process may be a sol-gel reaction.
- Process to act a polymerization or a crosslinking The molecules can be activated either directly (eg photolytically or pyrolytically via individual molecule groups or bonds) or indirectly (eg via photoinitiators or crosslinkers).
- physical growth refers to physical processes (eg, crystallization, molecular epitaxy, phase transformation, general surface or layer deposition) in which chemical transformations can take place, but these are not the actual growth processes.
- the precursor material is brought into contact with a matrix.
- Matrix in this context refers to any carrier substrate with a planar or curved surface.
- precursor and matrix are energetically activated together, ie exposed to a suitable energy source.
- the energy source induces a chemical growth process such as polymerization or crosslinking in the precursor material.
- the energetic activation takes place over a large area, ie uniformly and homogeneously over a wide range of the sample, and not in a location-selective manner, ie not restricted to a certain small area of the sample from which the tip structure is to be formed, for example by means of focusing a laser beam.
- the precursor material use is made of a compound which, in addition to organic groups, is a carbon-different element from the second to fifth main group, the sixth main group with an atomic number Z ⁇ 16 (S, Se, Te) or a subgroup of the Periodic Table of Elements, and preferably one element selected from the group consisting of Si, Al, Ti, Zr, Ca, Fe, V, Sn, Be, B, P and mixtures thereof.
- the organic groups are chemically bonded directly and / or preferably via an element of the sixth main group (O, S, Se, Te), more preferably via oxygen to the respective element and are preferably selected from the group consisting of hydrogen, alkyl, allyl, Aryl, hydroxyl and residues with photosensitive and / or thermosensitive groups such as Acrylates.
- the precursor material is preferably selected from the group consisting of tetraethyl orthosilicate (TEOS), tetramethyl orthosilicate (TMOS), tetrabutoxysilane, triethoxyphenylsilane, methyltripropoxysilane, 1,2-bis (trimethoxysilyl) ethane, 1,2-bis (triethoxysilyl) ethane, phenethyltrimethoxysilane, Isobutyltriethoxysilane, tris (2-methoxyethoxy) vinylsilane, octyltrimethoxysilane, phenyltriethoxysilane, octyltriethoxysilane, Al (O-iso-C 3 H 7 ) 3 , Ti (O-iso-C 3 H 7 ) 4 , Zr (OtC 4 H 9 ) 4 , Zr (O- .nC 4 H 9 ) 4 , Ca
- the precursor material must be able to adapt to the matrix serving as a support substrate.
- it is preferably liquid at room temperature. It can, however, too highly viscous, gelatinous or pasty precursor materials are used.
- the compound used as precursor is represented by the formula
- E an element other than carbon from the second to fifth main group, the sixth main group having an atomic number Z ⁇ 16 (S, Se, Te) or a subgroup of the Periodic Table of the Elements,
- A an element of the sixth main group of the Periodic Table (O, S, Se, Te), in particular oxygen,
- R 1 identical or different and is selected from the group consisting of hydrogen, alkyl, allyl, aryl, hydroxyl and radicals with photosensitive and / or thermosensitive groups such as acrylates,
- the element E is especially selected from the group consisting of Si, Al, Ti, Zr, Ca, Fe, V, Sn, Be, B and P.
- E is an element of the fourth main group of the periodic table and most preferred silicon.
- the organic radicals R 1 are preferably hydrogen, C 1 -C 8 -alkyl and in particular C 1 -C 4 -alkyl or hydroxyl.
- R 2 is preferably Ci-Cs-alkyl and especially Ci-Cj-alkyl.
- TEOS tetraethyl orthosilicate
- dopants or color centers can also be added to the precursor material.
- the added dopants may cause the physico-chemical inhomogeneities (e.g., local variations in optical adsorption coefficient, heat capacity, or thermal conductivity) required in the precursor material to positively affect the growth process of the tips.
- the added dopants can optimize the functional properties (electrical conductivity or optical transparency) and the mechanical properties (e.g., hardness, strength, roughness) of the illustrated micro and nano-tips.
- the energetic activation of the precursor material preferably takes place by thermal or photolytic activation. While photolytic activation is by irradiation, thermal activation may be by irradiation or heating.
- the precursor material is preferably irradiated with electromagnetic radiation of a wavelength up to maximum 1000 ⁇ m or irradiated with particle radiation of an energy up to a maximum of 1000 GeV.
- electromagnetic radiation of a wavelength up to maximum 1000 ⁇ m or irradiated with particle radiation of an energy up to a maximum of 1000 GeV.
- the precursor can be irradiated with both UV, VIS and IR radiation.
- the wavelength of the electromagnetic radiation used is in a range of 100 to 380 nm and more preferably in a range of 100 to 280 nm.
- the electromagnetic radiation used for the irradiation is emitted by a UV excimer laser with a pulse duration of at least 1 ns, preferably from 10 to 100 ns and particularly preferably 20 ns.
- the irradiation is carried out with a fluence of 1 to 1000 raJ / cm 2 per pulse.
- the irradiation is preferably carried out with a repetition rate of at least 0.01 Hz and a laser pulse number of 1 to 20,000.
- the precursor material according to the invention is preferably not transparent to the electromagnetic radiation used.
- the photochemical processes and in particular single-photon processes thus take place on the surface of the precursor material.
- the energy required to form the tips is provided by heating.
- a hot plate or a furnace is preferably used.
- the precursor material is heated to a temperature of 299 K to 2075 K and preferably to 368 K to 605 K.
- the process conditions of the method according to the invention are suitable for controlling the size of the peaks formed.
- the matrix used according to the invention with which the precursor material is brought into contact before the action of energy, serves as a support substrate for the precursor.
- the matrix represent a so-called master structure, which is usually produced with lithographic etching techniques and directly specifies the number, size and shape of the tips to be formed as a negative mold.
- the matrix used according to the invention has no recesses in which the tips are formed. Rather, the planar or curved surface of the matrix is flat.
- the matrix may be a capillary into which the precursor material is introduced.
- the introduction or the filling is usually carried out by capillary forces or by the application of a negative pressure.
- the capillary is made of glass.
- a capillary is used as the matrix in the process of the invention, it may, however, be closed off after the filling with the precursor even before the action of energy at both ends. Usually, this closing is effected in particular in glass capillaries by a melting at both ends. Furthermore, in the case of the energy input by irradiation, the capillary is preferably oriented vertically centered in relation to the through-beam of the irradiation, so that the energy input into the liquid becomes maximum.
- a planar support substrate to which the precursor material is applied may be used as the matrix.
- this planar carrier substrate is made of glass or it is a silicon wafer.
- this planar carrier substrate is after the coating of the planar carrier substrate with the precursor material, but before the action of energy another planar carrier placed on the provided with the precursor surface of the matrix. It is particularly preferred that, when using a planar carrier substrate, the energetic activation of the precursor material takes place by heating.
- the matrix and thus also the precursor material in contact with it, preferably remain stationary during the action of energy, i. they are not moved.
- the formed tips can be treated after the irradiation or heating with a vacuum.
- the level of the applied vacuum depends on the vapor pressure of the precursor used and is preferably such that the precursor material not cured by the action of energy as well as any readily volatile compounds can evaporate. If a capillary is used as a matrix, the application of a vacuum may involve unilateral, mechanical opening of the capillary, for example by impacting or breaking open, introducing the opened capillary into a vessel to be evacuated and then building up a vacuum in the vessel to be evacuated.
- the tips produced by the process according to the invention are preferably investigated by conventional characterization methods.
- the structure of the tips can be examined by scanning electron microscopy (SEM) and transmission electron microscopy (TEM).
- An analysis of the element-specific composition of the tips produced is possible by means of energy-dispersive X-ray analysis (EDX).
- EDX energy-dispersive X-ray analysis
- these characterization methods are carried out after the above-described vacuum treatment.
- the tips formed to complete the process may be separated from the non-spiked precursor material. This separation is preferably carried out with a high-energy radiation such as an electron beam or a focused gallium ion beam (Focused Ion Beam or FIB) under 30 kV high voltage.
- a mechanical separation is also possible, for example with an ultramicrotome, with which sample sections of 50 nm thickness can be achieved.
- needle-shaped tips can be made by:
- the invention relates to needle-shaped tips whose order of magnitude is in the micrometre and / or nanometer range and which are obtainable by the method of the present invention.
- the needle-shaped tips according to the invention have a spatially inhomogeneous element distribution.
- the term "spatially inhomogeneous element distribution” means that the maximum difference between the contents of an element selected from carbon or oxygen at different positions of the tip is at least 10% by weight and / or the maximum difference between the contents of an element having an atomic number Z ⁇ 11 at different positions of the tip is at least 5 wt .-% is.
- this spatially inhomogeneous element distribution is exclusively caused by the production method according to the invention and not by a subsequent treatment such as coating, doping or diffusion processes.
- the content of an element is determined by means of energy-dispersive X-ray spectrometry (EDX, with a resolution of 130 eV in the Mn-K ⁇ line) in a scanning electron microscope under 20 kV high voltage and with a silicon-lithium-EDX detector.
- EDX energy-dispersive X-ray spectrometry
- the element distribution of the tips is inhomogeneous in that the difference between the content of oxygen at the end of the tip and the content of oxygen at the bottom of the tip is at least 10% by weight.
- the tips of the invention have a cylindrical shape.
- the ends of the tips can be configured as spherical or conical. Edged structures such as pyramidal tips or cuboid shapes are rarely observed.
- the invention is directed to the use of tips according to the invention as a component in microtechnology.
- the tips can be used as a component in a microscope, the use as sensor tips in scanning probe microscopes such as atomic force microscopes or optical near-field microscopes is particularly preferred.
- the tips according to the invention can be used as microprobes for writing and reading out optical and magnetic data carriers, as embossing or master structures for molding or micromachining soft surfaces (eg pressing, stamping, scribing, drilling, creation of via-holes) , as microelectrodes for the emission of electron radiation (eg field electron microscopy) or for micro fuel cells or electrolysis cells, as crystallization points, as building components of microactuators (eg stationary or mobile spacers, active or passive filters) or for the construction of functional surfaces such as lotus-like surface structures for soil repellence and Reduction of adhesion or surface tension can be used.
- microactuators eg stationary or mobile spacers, active or passive filters
- TEOS tetraethyl orthosilicate
- a micrograph is shown in Figure 2 and shows a photograph of a single tip whose end is more spherical.
- the tips made in this variant had a rather conical shape of the tip end.
- FIG. 3 A top view of a tip made according to this variant is shown in FIG. 3.
- the tip was examined by means of EDX (Energy Dispersive X-ray Analysis, Mn-K ⁇ line, 130 eV resolution, 25 kV acceleration voltage).
- Number 1 indicates a point on the tip itself, i. on the end of the tip, number 2 is a spot on the side of the needle, number 3 is a point on the break zone, i. at the foot of the needle, and number 4 a spot on the flat, not to spiked surface.
- the element distribution at these four positions is shown in Table 1.
- the EDX measurements show a chemical non-stoichiometric composition of the material of the tip and thus a spatially inhomogeneous element distribution over the entire peak volume. These chemical inhomogeneities can be explained by a chemical growth process, which in turn can lead to physical inhomogeneities (eg different density). -
- a glass plate with dimensions of 1 cm ⁇ 1 cm and a thickness of less than 1 mm was uniformly coated by means of spin coating with the precursor tetraethyl orthosilicate (TEOS). Subsequently, another glass plate was placed on the coated surface.
- TEOS tetraethyl orthosilicate
- the coated glass slide was placed on a hot plate and heated to 473K for two hours. After exposure to heat, the glass plate was examined by scanning electron microscopy and the peaks formed were analytically characterized.
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Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005063127A DE102005063127B3 (de) | 2005-12-30 | 2005-12-30 | Mikro- und Nanospitzen sowie Verfahren zu deren Herstellung |
| PCT/EP2006/012588 WO2007079975A1 (de) | 2005-12-30 | 2006-12-28 | Mikro- und nanospitzen sowie verfahren zu deren herstellung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP1969606A1 true EP1969606A1 (de) | 2008-09-17 |
Family
ID=37781817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP06841198A Withdrawn EP1969606A1 (de) | 2005-12-30 | 2006-12-28 | Mikro- und nanospitzen sowie verfahren zu deren herstellung |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20090138996A1 (de) |
| EP (1) | EP1969606A1 (de) |
| DE (1) | DE102005063127B3 (de) |
| WO (1) | WO2007079975A1 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102021005684A1 (de) | 2021-11-16 | 2023-05-17 | Jörn Volkher Wochnowski | STED-Verfahren mit Hohllichtwellenleitern |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022004934A1 (de) | 2021-12-30 | 2023-07-06 | Jörn Volkher Wochnowski | Anwendungsmodifizierte Glasfaser- (Hohl)Lichtwellenleiter zum Beispiel mit durch Femtosekunden-Laser erzeugte(n) und bearbeitete(n) Schicht(en) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4879176A (en) * | 1987-03-16 | 1989-11-07 | Minnesota Mining And Manufacturing Company | Surface modification of semicrystalline polymers |
| JPH081382B2 (ja) * | 1990-10-31 | 1996-01-10 | インターナショナル・ビジネス・マシーンズ・コーポレイション | ナノメートル・スケールのプローブ及びその製造方法 |
| JP3613486B2 (ja) * | 1995-02-23 | 2005-01-26 | 大倉工業株式会社 | 炭化珪素ウイスカーの製造方法 |
| GB2330687B (en) * | 1997-10-22 | 1999-09-29 | Printable Field Emitters Ltd | Field emission devices |
| WO2000074107A2 (en) * | 1999-05-31 | 2000-12-07 | Evgeny Invievich Givargizov | Tip structures, devices on their basis, and methods for their preparation |
| US6632412B2 (en) * | 1999-12-01 | 2003-10-14 | Timo Peltola | Bioactive sol-gel derived silica fibers and methods for their preparation |
| IL134631A0 (en) * | 2000-02-20 | 2001-04-30 | Yeda Res & Dev | Constructive nanolithography |
| US6870312B2 (en) * | 2001-11-01 | 2005-03-22 | Massachusetts Institute Of Technology | Organic field emission device |
| WO2003087709A1 (en) * | 2002-04-05 | 2003-10-23 | Integrated Nanosystems, Inc. | Nanowire microscope probe tips |
| EP1359388B1 (de) * | 2002-05-03 | 2004-12-08 | Nanoworld AG | SPM-Sensor und Verfahren zu dessen Herstellung |
| KR20060058085A (ko) * | 2003-07-08 | 2006-05-29 | 큐나노 에이비 | 나노위스커를 통합하는 프로브 구조체, 그 제조 방법, 및나노위스커를 형성하는 방법 |
| US20050167646A1 (en) * | 2004-02-04 | 2005-08-04 | Yissum Research Development Company Of The Hebrew University Of Jerusalem | Nanosubstrate with conductive zone and method for its selective preparation |
-
2005
- 2005-12-30 DE DE102005063127A patent/DE102005063127B3/de not_active Expired - Fee Related
-
2006
- 2006-12-28 EP EP06841198A patent/EP1969606A1/de not_active Withdrawn
- 2006-12-28 WO PCT/EP2006/012588 patent/WO2007079975A1/de not_active Ceased
- 2006-12-28 US US12/159,706 patent/US20090138996A1/en not_active Abandoned
Non-Patent Citations (1)
| Title |
|---|
| See references of WO2007079975A1 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102021005684A1 (de) | 2021-11-16 | 2023-05-17 | Jörn Volkher Wochnowski | STED-Verfahren mit Hohllichtwellenleitern |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090138996A1 (en) | 2009-05-28 |
| DE102005063127B3 (de) | 2007-08-23 |
| WO2007079975A8 (de) | 2008-07-31 |
| WO2007079975A1 (de) | 2007-07-19 |
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