EP1995771A4 - Appareil de traitement de substrat et procede de traitement de substrat - Google Patents

Appareil de traitement de substrat et procede de traitement de substrat

Info

Publication number
EP1995771A4
EP1995771A4 EP07737881A EP07737881A EP1995771A4 EP 1995771 A4 EP1995771 A4 EP 1995771A4 EP 07737881 A EP07737881 A EP 07737881A EP 07737881 A EP07737881 A EP 07737881A EP 1995771 A4 EP1995771 A4 EP 1995771A4
Authority
EP
European Patent Office
Prior art keywords
substrate processing
processing apparatus
processing method
substrate
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP07737881A
Other languages
German (de)
English (en)
Other versions
EP1995771A1 (fr
EP1995771B1 (fr
Inventor
Fumitoshi Oikawa
Shinji Kajita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of EP1995771A1 publication Critical patent/EP1995771A1/fr
Publication of EP1995771A4 publication Critical patent/EP1995771A4/fr
Application granted granted Critical
Publication of EP1995771B1 publication Critical patent/EP1995771B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0472—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP07737881A 2006-03-22 2007-03-06 Appareil de traitement de substrat et procede de traitement de substrat Active EP1995771B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006078822 2006-03-22
PCT/JP2007/054334 WO2007108315A1 (fr) 2006-03-22 2007-03-06 Appareil de traitement de substrat et procede de traitement de substrat

Publications (3)

Publication Number Publication Date
EP1995771A1 EP1995771A1 (fr) 2008-11-26
EP1995771A4 true EP1995771A4 (fr) 2011-12-21
EP1995771B1 EP1995771B1 (fr) 2013-02-13

Family

ID=38522348

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07737881A Active EP1995771B1 (fr) 2006-03-22 2007-03-06 Appareil de traitement de substrat et procede de traitement de substrat

Country Status (6)

Country Link
US (1) US8226771B2 (fr)
EP (1) EP1995771B1 (fr)
JP (1) JPWO2007108315A1 (fr)
KR (1) KR101277614B1 (fr)
TW (1) TWI397116B (fr)
WO (1) WO2007108315A1 (fr)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009238896A (ja) * 2008-03-26 2009-10-15 Renesas Technology Corp 半導体集積回路装置の製造方法
US8317934B2 (en) * 2009-05-13 2012-11-27 Lam Research Corporation Multi-stage substrate cleaning method and apparatus
JP5535687B2 (ja) * 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置
JP5712061B2 (ja) 2011-06-16 2015-05-07 株式会社荏原製作所 基板処理方法及び基板処理ユニット
JP6133120B2 (ja) 2012-05-17 2017-05-24 株式会社荏原製作所 基板洗浄装置
JP6250924B2 (ja) * 2012-10-02 2017-12-20 株式会社荏原製作所 基板洗浄装置および研磨装置
JP6295023B2 (ja) 2012-10-03 2018-03-14 株式会社荏原製作所 基板洗浄装置、基板洗浄方法、および研磨装置
JP2014165349A (ja) * 2013-02-26 2014-09-08 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
KR102096945B1 (ko) * 2013-06-11 2020-04-07 세메스 주식회사 기판처리장치 및 방법
US10293462B2 (en) * 2013-07-23 2019-05-21 Taiwan Semiconductor Manufacturing Company, Ltd. Pad conditioner and method of reconditioning planarization pad
JP2015037147A (ja) * 2013-08-15 2015-02-23 株式会社ディスコ 洗浄装置及び洗浄方法
US20150107619A1 (en) * 2013-10-22 2015-04-23 Taiwan Semiconductor Manufacturing Company Limited Wafer particle removal
JP6401021B2 (ja) * 2014-11-18 2018-10-03 株式会社荏原製作所 基板洗浄装置、基板処理装置、および基板洗浄方法
JP6367763B2 (ja) 2015-06-22 2018-08-01 株式会社荏原製作所 ウェーハ乾燥装置およびウェーハ乾燥方法
CN206541804U (zh) 2016-05-03 2017-10-03 K.C.科技股份有限公司 基板处理系统
TWI706433B (zh) * 2016-07-12 2020-10-01 大陸商盛美半導體設備（上海）股份有限公司 用於清洗和乾燥積體電路基板的方法和裝置
JP6842859B2 (ja) * 2016-08-12 2021-03-17 株式会社荏原製作所 ドレッシング装置、研磨装置、ホルダー、ハウジング及びドレッシング方法
JP6732382B2 (ja) * 2016-10-12 2020-07-29 株式会社ディスコ 加工装置及び被加工物の加工方法
JP6863114B2 (ja) * 2017-06-16 2021-04-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
US10460926B2 (en) * 2017-11-17 2019-10-29 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for chemical mechanical polishing process
JP7437499B2 (ja) * 2019-11-01 2024-02-22 エーシーエム リサーチ （シャンハイ） インコーポレーテッド 基板の洗浄方法及び洗浄装置
CN110911314A (zh) * 2019-11-29 2020-03-24 河海大学常州校区 一种硅片表面研磨装置
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
CN115763318A (zh) * 2022-11-30 2023-03-07 西安奕斯伟材料科技有限公司 硅片清洗方法及设备
US12525468B2 (en) 2022-12-30 2026-01-13 Applied Materials, Inc. Integrated clean and dry module for cleaning a substrate
US20250319570A1 (en) * 2024-04-11 2025-10-16 Applied Materials, Inc. Contact cleaning units in cmp polisher

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005015627A1 (fr) * 2003-08-07 2005-02-17 Ebara Corporation Dispositif de traitement de substrat, procede de traitement de substrat, et dispositif de maintien de substrat

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3332831B2 (ja) * 1996-11-29 2002-10-07 キヤノン株式会社 半導体装置の製造方法
JP4079205B2 (ja) * 2000-08-29 2008-04-23 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法
JP3865602B2 (ja) * 2001-06-18 2007-01-10 大日本スクリーン製造株式会社 基板洗浄装置
JP2003022993A (ja) 2001-07-05 2003-01-24 Sony Corp 基板洗浄方法
JP3960516B2 (ja) * 2001-11-27 2007-08-15 株式会社荏原製作所 基板処理装置
JP4197103B2 (ja) 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
JP4187540B2 (ja) 2003-01-31 2008-11-26 大日本スクリーン製造株式会社 基板処理方法
JP4687043B2 (ja) 2004-09-10 2011-05-25 富士ゼロックス株式会社 定着装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005015627A1 (fr) * 2003-08-07 2005-02-17 Ebara Corporation Dispositif de traitement de substrat, procede de traitement de substrat, et dispositif de maintien de substrat

Also Published As

Publication number Publication date
US8226771B2 (en) 2012-07-24
KR20080113079A (ko) 2008-12-26
US20090301518A1 (en) 2009-12-10
EP1995771A1 (fr) 2008-11-26
KR101277614B1 (ko) 2013-06-21
JPWO2007108315A1 (ja) 2009-08-06
EP1995771B1 (fr) 2013-02-13
WO2007108315A1 (fr) 2007-09-27
TWI397116B (zh) 2013-05-21
TW200741836A (en) 2007-11-01

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