EP2009667A1 - Procede de fabrication de panneau de scellement et ecran plasma - Google Patents
Procede de fabrication de panneau de scellement et ecran plasma Download PDFInfo
- Publication number
- EP2009667A1 EP2009667A1 EP07740997A EP07740997A EP2009667A1 EP 2009667 A1 EP2009667 A1 EP 2009667A1 EP 07740997 A EP07740997 A EP 07740997A EP 07740997 A EP07740997 A EP 07740997A EP 2009667 A1 EP2009667 A1 EP 2009667A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- sealing material
- sealing
- substrates
- plasma display
- display panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000007789 sealing Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims description 16
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 claims abstract description 107
- 239000003566 sealing material Substances 0.000 claims abstract description 91
- 239000000463 material Substances 0.000 claims abstract description 50
- 239000012535 impurity Substances 0.000 claims abstract description 45
- 239000011347 resin Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 238000005192 partition Methods 0.000 claims description 28
- 238000001179 sorption measurement Methods 0.000 claims description 22
- 239000011521 glass Substances 0.000 claims description 9
- 239000011230 binding agent Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 72
- 230000032683 aging Effects 0.000 description 19
- 230000001681 protective effect Effects 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 8
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 239000011358 absorbing material Substances 0.000 description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000007872 degassing Methods 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 229910052681 coesite Inorganic materials 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229910002593 Fe-Ti Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000002772 conduction electron Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/48—Sealing, e.g. seals specially adapted for leading-in conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/26—Sealing together parts of vessels
- H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
- H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/52—Means for absorbing or adsorbing the gas mixture, e.g. by gettering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/38—Exhausting, degassing, filling, or cleaning vessels
- H01J9/39—Degassing vessels
Definitions
- the present invention relates to a sealing panel and a method for producing a plasma display panel.
- a plasma display panel is provided with a front substrate on which a sustain electrode and a scanning electrode are formed and a rear substrate on which an address electrode and a fluorescent substance are formed. Both of these substrates are fastened by a sealing material arranged at the peripheral edge and a discharge gas is sealed between the substrates. When voltage is applied across these electrodes, the discharge gas is plasmized to emit ultraviolet light. The ultraviolet light is made incident to a fluorescent substance, thereby exciting the fluorescent substance to emit visible light.
- Patent Document 1 Japanese Unexamined Patent Application, First Publication No. 2002-75197 .
- an impurity gas such as water or carbon dioxide gas
- an impurity gas may be released from the resin material into the panel.
- an impurity gas may be released into the panel during sealing of the panel.
- an impurity gas may make an intrusion into the panel through the sealing material from outside.
- the resin material may be decomposed to release an impurity gas (CH-based gas) into the panel.
- the present invention has been made to solve the above problem, and has an object of providing a sealing panel capable of suppressing a rise in discharge voltage and a method for producing a plasma display panel.
- the sealing panel according to the present invention is a sealing panel which includes: a sealing material which contains a resin material and is disposed on the whole periphery in a part between a pair of substrates; and a discharge gas which is sealed between the pair of substrates with the sealing material, an adsorption material which adsorbs an impurity gas released from the sealing material and an impurity gas passing through the sealing material, is formed continuously or intermittently along the inner periphery of the sealing material. It may be arranged such that the sealing material is a mixture of a glass material with a resin material as a binder.
- an impurity gas released from the sealing material and an impurity gas that passes through the sealing material can be adsorbed by an adsorption material, thus making it possible to suppress a decrease of the purity of a discharge gas sealed between the pair of substrates and also making it possible to prevent an impurity gas from being adsorbed on the surface of the substrate. Therefore, it is possible to suppress a rise in discharge voltage. In addition, it is possible to reduce the amount of time needed to conduct an initial aging treatment or eliminate the necessity of conducting the initial aging treatment.
- the adsorption materials are provided on a plurality of peripheries in a concentric manner.
- an impurity gas can be reliably adsorbed.
- it may be arranged such that some of the adsorption materials among the adsorption materials provided on a plurality of peripheries are loaded on one of a substrate of the pair the substrates; and the remaining adsorption materials among the adsorption materials installed on a plurality of peripheries are loaded on the other substrate of the pair of the substrates.
- the impurity gas intrudes along a longer channel and also adsorption materials are arranged along the channel, thus making it possible to improve the adsorption efficiency of the impurity gas.
- an ultraviolet shielding wall which prevents ultraviolet light generated inside the sealing panel from being incident to the sealing material is formed continuously along the inner periphery of the sealing material. According to the above constitution, it is possible to prevent ultraviolet light generated inside the sealing panel from being incident to the sealing material. It is, thereby, possible to suppress the release of an impurity gas from the sealing material and suppress a rise in discharge voltage.
- It may be arranged such that the leading end of the ultraviolet shielding wall installed upright on a substrate of the pair of substrates is in contact with the other substrate of the pair of substrates. According to the above constitution, it is possible to block an impurity gas released from the sealing material and an impurity gas intruding through the sealing material by the ultraviolet shielding wall and thereby suppress a decrease of the purity of a discharge gas.
- the adsorption materials are arranged between the sealing material and the ultraviolet shielding wall. According to the above constitution, the adsorption materials can be used to securely adsorb an impurity gas blocked by the ultraviolet shielding wall.
- the sealing panel is a plasma display panel; and the ultraviolet shielding wall is constituted of the same material as that of a partition placed between pixels of the plasma display panel.
- a method for producing the plasma display panel according to the present invention is a method for producing a plasma display panel which is provided with: a sealing material containing a resin material arranged on the whole periphery in a pair of substrates; and a discharge gas filled between the pair of substrates sealed with the sealing material, the method including: forming an ultraviolet shielding wall for preventing ultraviolet light generated inside the plasma display panel from being incident to the sealing material simultaneously with a partition placed between pixels of the plasma display panel.
- a partition of the plasma display panel is to prevent an erroneous discharge between adjacent pixels and formed to have a height equal to a clearance of a pair of substrates.
- the partition is formed at the same time as the ultraviolet shielding wall, thus making it possible to form the ultraviolet shielding wall with a height which is equal to a clearance of the pair of substrates.
- the sealing panel and the method for producing the plasma display panel of the present invention it is possible to suppress a decrease of the purity of a discharge gas sealed between the pair of substrates. Further, an impurity gas can be prevented from being adsorbed on the surface of the substrate. Therefore, it is possible to suppress a rise in discharge voltage. In addition, it is possible to reduce the aging treatment time or eliminate the initial aging treatment.
- the scale of each member is adequately changed so that it can be drawn in a recognizable dimension.
- the "inner face" of a substrate shall be the surface facing a surface of the other substrate which is paired with the substrate.
- Fig. 1 is an exploded perspective view of the three-electrode AC-type plasma display panel.
- the plasma display panel (hereinafter, abbreviated as "PDP") 100 is provided with a rear substrate 1 and a front substrate 2 which are arranged so as to be opposed to each other and a plurality of discharge chambers 16 which are formed between the substrates 1 and 2.
- Address electrodes 11 are formed on the inner face of the rear substrate 1 at predetermined intervals in a striped manner.
- a dielectric layer 19 is formed so as to cover the address electrodes 11.
- a partition (rib) 15 is formed in parallel with the address electrodes 11 on the upper face of the dielectric layer 19 between adjacent address electrodes 11.
- a fluorescent substance 17 is placed on the upper face of the dielectric layer 19 between adjacent partitions 15 and on the side face of the partition 15. The fluorescent substance 17 emits any one of red, green and blue fluorescence.
- a display electrode 12 (scanning electrode 12a and sustain electrode 12b) is formed on the inner face of the front substrate 2 at predetermined intervals in a striped manner.
- the display electrode 12 is constituted of a transparent conductive material such as ITO and arranged in a direction orthogonal to the address electrode 11.
- the intersecting point of the address electrode 11 and the display electrode 12 is given as a pixel of PDP 100.
- a dielectric layer 13 is formed so as to cover the display electrode 12, and a protective film 14 is formed so as to cover the dielectric layer 13.
- This protective film 14 protects the dielectric layer 13 from positive ions generated by plasmizing a discharge gas.
- This film is constituted of oxides of alkali earth metals such as MgO and SrO.
- the above-described rear substrate 1 and the front substrate 2 are laminated together to form discharge chambers 16 between the adjacent partitions 15.
- a discharge gas such as a mixed gas ofNe and Xe is sealed inside the discharge chambers 16.
- direct-current voltage is applied across the address electrode 11 and the scanning electrode 12a to cause a counter discharge.
- alternative-current voltage is applied across the scanning electrode 12a and the sustain electrode 12b to cause a surface discharge.
- the discharge gas sealed inside the discharge chambers 16 is plasmized, thereby irradiating vacuum ultraviolet light.
- the fluorescent substance 17 is excited by this ultraviolet light to emit visible light from the front substrate 2.
- Fig. 2 is a sectional view showing the peripheral edge portion of a plasma display panel.
- Projections 21 are formed at the peripheral edge of the rear substrate 1 in an architrave shape.
- a sealing material 20 containing a resin material is arranged between the leading end face of the projection 21 and the front substrate 2, thereby both substrates 1 and 2 are sealed.
- the sealing material 20 for example, thermo-setting resins such as epoxy resin and acrylic resin or ultraviolet light curing resins are employed.
- the sealing material 20 containing a resin material is employed, heating and cooling conditions are alleviated greatly during sealing of the panel, as compared with the case where a conventional sealing material composed of a low-melting point glass is employed.
- a sealing material may be employed which is obtained by mixing a low-melting point glass with a resin as a binder.
- impurity gases are released from the sealing material 20 containing a resin material.
- gases such as CO, H 2 and CH based gases are released from the sealing material 20 which is made up of epoxy resin or of acrylic resin.
- CO 2 , O 2 gas and others are released from the low-melting point glass, while H 2 O, CO 2 , CO gas and others are released from the acrylic resin.
- impurity gases such as H 2 O may intrude into a PDP from outside through the sealing material 20 after sealing.
- a getter (adsorption material) 22 which adsorbs an impurity gas is provided along the inner periphery of the sealing material 20.
- the getter 22 adsorbs water (H 2 O), oxygen (O 2 ) gas, carbon-based gases such as CO and CO 2 and others such as CH-based. hydrocarbon gas.
- H 2 O water
- O 2 oxygen
- carbon-based gases such as CO and CO 2 and others
- CH-based. hydrocarbon gas Specifically, SrO formed in a sheet to give the thickness of about 150 ⁇ m may be employed as the getter 22.
- active metals such as Ba, Ca or Sr formed to give the thickness of 5 to 10 ⁇ m may be employed as the getter 22.
- a Zr-V-Fe-Ti -based material may also be employed as the getter 22.
- Fig. 3A to Fig. 3C are plan views showing a plasma display panel equipped with a getter.
- the getter 22 is formed continuously along the inner whole periphery of the sealing material 20.
- it may be formed intermittently along the whole inner periphery of the sealing material 20.
- the getter 22 may be arranged on the surface of the rear substrate 1 on the inner side of the sealing material 20 or may be arranged on the surface of the front substrate 2.
- the thickness of the getter 22 may be thinner than that of the clearance between both the substrates 1 and 2 or may be equal to that of the clearance of the substrates 1 and 2.
- Fig. 4A and Fig. 4B are plan views showing a plasma display panel equipped with a plurality of getters.
- a plurality of getters 22a and 22b may be arranged along the inner periphery of the sealing material 20 in a concentric manner.
- a plurality of the getters 22a and 22b may be formed continuously as shown in Fig. 4A , or they may be formed intermittently as shown in Fig. 4B . Further, among these plurality of getters, some of them are formed continuously, while the remaining getters may be formed intermittently.
- an impurity gas can be reliably adsorbed.
- Fig. 4C is a sectional view taken along the A-A line in Fig. 4A .
- some of the getters 22a may be loaded on the rear substrate 1, while the remaining getters 22b may be loaded on the front substrate 2.
- an impurity gas intrudes along a longer channel and also the getters 22a and 22b are arranged along the channel, thus making it possible to improve the adsorption efficiency of the impurity gas.
- all the plurality of the getters 22a and 22b may be loaded on the rear substrate 1 or all of them may be loaded on the front substrate 2.
- an ultraviolet shielding wall 24 is continuously installed along the inner periphery of the above-described getter 22.
- the ultraviolet shielding wall 24 prevents ultraviolet light generated in the discharge chamber 16 from being incident to the sealing material 20 and formed to give about 1 mm in width by an ultraviolet absorbing material such as PbO ⁇ B 2 O 3 ⁇ SiO 2 .
- the ultraviolet shielding wall 24 may be installed upright on the rear substrate 1 or may be installed upright on the front substrate 2.
- the height of the ultraviolet shielding wall 24 is formed equal to the clearance between the pair of substrates 1 and 2.
- the leading end of the ultraviolet shielding wall 24 installed upright on the rear substrate 1 is firmly attached to the front substrate 2.
- the above getter 22 is placed between the sealing material 20 and the ultraviolet shielding wall 24.
- an impurity gas released from the sealing material 20 can be blocked by the ultraviolet shielding wall 24 and securely adsorbed by the getter 22.
- the ultraviolet shielding wall 24 is constituted of the same ultraviolet absorbing material as that of the partition 15 and installed upright on the rear substrate 1 on which the partition 15 is installed. Thereby, as will be described later, the ultraviolet shielding wall 24 is formed simultaneously as the partition 15, thus making it possible to simplify the production steps and reduce the production cost.
- the partition 15 of the PDP prevents an erroneous discharge between adjacent discharge chambers 16 and formed to have a height equal to the clearance between the rear substrate 1 and the front substrate 2.
- the ultraviolet shielding wall 24 can be formed to have a height equal to a clearance between both the substrates 1 and 2. Thereby, ultraviolet light generated at the discharge chamber 16 can be securely prevented from being incident to the sealing material 20.
- Fig. 5 is a flow chart showing a method for producing the plasma display panel according to the present embodiment.
- a display electrode 12 and a dielectric layer 13 are formed on the inner face of the front substrate 2 shown in Fig. 2 (step 32).
- an address electrode 11 and a dielectric layer 19 are formed on the inner face of the rear substrate 1 (step 42).
- a partition 15 and an ultraviolet shielding wall 24 are formed simultaneously on the surface of a dielectric layer 19 of the rear substrate 1 (step 44).
- a film of ultraviolet absorbing material is first formed on the inner face of the rear substrate 1. More specifically, an ultraviolet absorbing material in paste form is applied to give the thickness of about 200 ⁇ m by a printing method or the like and dried to form the film.
- a dry film resist (DFR) is laminated on the surface of the film.
- the DFR is exposed and developed to provide a pattern along the configurations of the partition 15 and the ultraviolet shielding wall 24.
- sandblasting is performed using the DFR pattern as a mask, thereby giving a pattern to the film according to the configuration of the partition 15 and the ultraviolet shielding wall 24.
- the DFR is peeled and removed.
- the rear substrate 1 is put into a kiln to bake the partition 15 and the ultraviolet shielding wall 24. Therefore, the partition 15 and the ultraviolet shielding wall 24 are formed on the inner face of the rear substrate 1.
- a DFR is laminated on the inner face of the rear substrate 1.
- the DFR is exposed and developed to give a pattern according to the configurations of the partition 15 and the ultraviolet shielding wall 24.
- sandblasting is performed using the DFR pattern as a mask, thereby digging down into the rear substrate 1 composed of an ultraviolet absorbing material such as glass to a depth of about 150 ⁇ m.
- the DFR is peeled and removed. Therefore, the partition 15 and the ultraviolet shielding wall 24 are formed directly on the inner face of the rear substrate 1.
- the address electrode 11 and others are formed. Note that it is possible to form the partition 15 and the ultraviolet shielding wall 24 simultaneously with a method other than the above-described method.
- the inner side of adjacent partitions is coated with a fluorescent substance 17.
- the sealing material 20 and the getter 22 are arranged on the whole periphery of the rear substrate 1 (step 46).
- the sealing material 20 is arranged by applying a sealing material in paste form.
- the sealing material is applied by a droplet discharge method such as a dispenser method and an inkjet method or by a printing method.
- the getter 22 is arranged by laminating a SrO material sheet having the width of about 3 mm to 10 mm and the thickness of about 150 ⁇ m.
- the SrO material sheet can be formed by procedures in which SrO powder is placed into a mold, formed under a pressure of 200 to 400kgf/cm2 and further baked at about 1,200°C for about 30 minutes in a N 2 atmosphere.
- the front substrate 2 and the rear substrate 1 are put into a vacuum integrated process machine 50 to conduct the following steps up to a sealing step without exposure of the substrates 1 and 2 to an atmosphere.
- the rear substrate 1 is heated in a vacuum, thereby performing degassing treatment of the sealing material 20 containing a resin material and exhaust treatment (step 48).
- the sealing material 20 can be degassed and the getter 22 can be activated by this heating.
- the front substrate 2 is heated in a vacuum, thereby performing degassing treatment of a dielectric layer 13 and the like (step 34).
- a protective film 14 is formed on the inner face of the front substrate 2 by an electron beam (EB) vapor deposition or the like (step 36).
- EB electron beam
- an SrO-based material such as (SrCa)O has been studied as a constituent of the protective film 14 in place of a conventional material of MgO.
- the SrO-based material is much higher in hygroscopicity than MgO and has a feature that the color is changed upon absorption of moisture.
- the vacuum integrated process machine 50 performs steps from a degassing step of the substrates 1 and 2 to a sealing step of the substrates 1 and 2 via a forming step of the protective film 14, thus making it possible to prevent the change in color and rise in discharge voltage resulting from the moisture absorption of the protective film 14.
- both the substrates 1 and 2 are sealed (step 52). More specifically, these substrates 1 and 2 are first put into a chamber, and a discharge gas is introduced into the chamber. Next, the substrates 1 and 2 are in alignment (positioned) and temporarily fastened. Next, electric voltage is applied across the substrates 1 and 2 to perform aging discharge. Further, a driving voltage is applied across the electrodes of these substrates 1 and 2 to conduct a light emission test. As a result, the rear substrate 1 or the front substrate 2 which is found to be abnormal is removed, and the substrates 1 and 2 which are confirmed to normally emit light are fastened with each other.
- the sealing material 20 is constituted of an ultraviolet light curing resin
- the sealing material is cured by irradiating ultraviolet light to the sealing material 20.
- the sealing material 20 is cured by heating the sealing material 20.
- the inventor of the present application performed a moisture absorption test to the PDP according to the above embodiment and a conventional PDP, by which any change in discharge voltage was measured.
- the PDP according to the present embodiment was, as shown in Fig. 2 , provided with the getter 22 and the ultraviolet shielding wall 24. Specifically, a sheet-like substance obtained by baking SrO in N 2 gas as the getter 22 was employed. Further, PbO ⁇ B 2 O 3 ⁇ SiO 2 , which was the same material as that of the partition 15, was employed as a constituent of the ultraviolet shielding wall 24, and the ultraviolet shielding wall 24 was formed simultaneously with the partition 15. It is noted that an ultraviolet light curing resin was employed as the sealing material 20.
- a film composed of SrO ⁇ 20 mol% CaO with the thickness of 8000 Angstroms was formed as the protective film 14 by EB vapor deposition.
- Ne-4% Xe gas was sealed as a discharge gas at 400 Torr.
- the conventional PDP was such that the getter 22 and the ultraviolet shielding wall 24 were removed from the PDP according to the present embodiment.
- Fig. 6A and Fig. 6B are graphs showing the results of the moisture absorption test of the PDPs. Specifically, Fig. 6A shows the results of the PDP according to the present embodiment, while Fig. 6B shows the results of the conventional PDP. It is noted that in the following graphs, a final cell turn on voltage means a driving voltage needed to start discharging all cells in a PDP which is composed of 300 cells arranged in two-dimensional matrix. Further, a first cell turn off voltage is a voltage at which the first cell is turned off when the driving voltage is gradually lowered from a state that all the cells are turned on.
- the inventor of the present application performed an aging test to the PDP according to the present embodiment and the conventional PDP, by which any change in discharge voltage was measured.
- a PDP in which a getter was removed was employed as the PDP according to the present embodiment.
- a PDP in which the ultraviolet shielding wall and the getter were removed was employed as the conventional PDP.
- the aging test was conducted by applying voltage to these PDPs for a long time at room temperature with a humidity of 50%, and the relationship between the aging time and the discharge sustain voltage was studied.
- Fig. 7A and 7B are graphs showing the results of the aging test of these PDPs. Specifically, Fig. 7A shows the results of the PDP according to the present embodiment, while Fig. 7B shows the results according to the conventional PDP.
- the discharge sustain voltage was increased with an increase in aging time and the final cell turn on voltage was increased by about 30V after 2000-hour of aging. This is considered to be due to the fact that ultraviolet light generated by discharge in the PDP kept entering a sealing material for a long time, by which a resin material contained in the sealing material decomposed and a CH-based impurity gas was released into the PDP, resulting in a decrease in purity of the discharge gas.
- the voltage was increased by less than 10V even after 2000-hour of aging. This is considered to be due to the fact that ultraviolet light generated by discharge in the PDP was absorbed by the ultraviolet shielding wall, thereby preventing an impurity gas from being released from the sealing material, resulting in a suppressed decrease of the purity of the discharge gas.
- the PDP according to the present embodiment is constituted so that getters are formed continuously or intermittently along the inner periphery of a sealing material.
- an impurity gas released from the sealing material or an impurity gas intruding through the sealing material are adsorbed by the getters, thus making it possible to suppress a decrease of the purity of a discharge gas sealed between a pair of substrates. Therefore, it is possible to suppress a rise of discharge voltage.
- an impurity gas can be adsorbed by the getters, it is possible to prevent the impurity gas from being adsorbed by a hygroscopic protective film.
- the PDP according to the present embodiment is constituted so as to have an ultraviolet light shielding wall formed continuously along the inner periphery of the sealing material. According to the above constitution, since ultraviolet light generated inside the sealing panel is absorbed by the ultraviolet shielding wall, the light is prevented from being incident to the sealing material. Thereby, it is possible to suppress the release of an impurity gas from the sealing material and suppress a rise of discharge voltage.
- the present invention is applied to a plasma display panel, but may be applied to a field emission display panel.
- the field emission display panel is such that electrons are emitted from an electron emitting source (emitter) arranged for every pixel into vacuum, and collided against a fluorescent substance, thereby attaining light emission.
- the field emission display panel includes a FED (Field Emission Display) equipped with a projection-like electron emitting element and a SED (Surface-Conduction Electron Emitter Display) equipped with a surface conductance-type electron emitting element.
- FED Field Emission Display
- SED Surface-Conduction Electron Emitter Display
- the present invention is applicable to a sealing panel and a method for producing a plasma display panel.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006107547A JP4787054B2 (ja) | 2006-04-10 | 2006-04-10 | 封着パネルおよびプラズマディスプレイパネルの製造方法 |
| PCT/JP2007/057561 WO2007119676A1 (fr) | 2006-04-10 | 2007-04-04 | Procede de fabrication de panneau de scellement et ecran plasma |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP2009667A1 true EP2009667A1 (fr) | 2008-12-31 |
| EP2009667A4 EP2009667A4 (fr) | 2011-03-02 |
| EP2009667B1 EP2009667B1 (fr) | 2012-06-13 |
Family
ID=38609435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP07740997A Ceased EP2009667B1 (fr) | 2006-04-10 | 2007-04-04 | Panneau d'étanchéité et procédé de fabrication d'un panneau d'affichage à plasma |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP2009667B1 (fr) |
| JP (1) | JP4787054B2 (fr) |
| KR (2) | KR20100116716A (fr) |
| CN (1) | CN101421813B (fr) |
| RU (1) | RU2395863C2 (fr) |
| WO (1) | WO2007119676A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11299422B2 (en) | 2016-09-30 | 2022-04-12 | Panasonic Intellectual Property Management Co., Ltd. | Method for producing insulating glass unit and method for producing glass window |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5173444B2 (ja) * | 2008-01-07 | 2013-04-03 | 株式会社アルバック | 封着パネルの製造方法及びそれを用いたプラズマディスプレイパネルの製造方法 |
| JP5173504B2 (ja) * | 2008-03-17 | 2013-04-03 | 株式会社アルバック | 封着パネルの製造方法及びそれを用いたプラズマディスプレイパネルの製造方法 |
| JP2012084480A (ja) * | 2010-10-14 | 2012-04-26 | Panasonic Corp | プラズマディスプレイパネル及びプラズマディスプレイパネルの製造方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1295366B1 (it) * | 1997-10-20 | 1999-05-12 | Getters Spa | Sistema getter per pannelli piatti al plasma impiegati come schermi |
| KR20000000549A (ko) * | 1998-06-01 | 2000-01-15 | 구자홍 | 가스방전표시장치의 게타구조 |
| JP4579487B2 (ja) * | 1998-09-14 | 2010-11-10 | パナソニック株式会社 | ガス放電パネルの製造方法 |
| JP3569458B2 (ja) * | 1999-03-26 | 2004-09-22 | パイオニア株式会社 | プラズマディスプレイパネル |
| FR2793950A1 (fr) * | 1999-05-21 | 2000-11-24 | Thomson Plasma | Procede de fabrication de composants sur substrats de verre devant etre scelles, tels que des ecrans d'affichage plats du type panneau a plasma |
| US6479944B2 (en) | 2000-07-25 | 2002-11-12 | Lg Electronics Inc. | Plasma display panel, fabrication apparatus for the same, and fabrication process thereof |
| RU2188463C1 (ru) * | 2000-12-05 | 2002-08-27 | Открытое акционерное общество "Научно-исследовательский институт газоразрядных приборов "Плазма" | Газоразрядная индикаторная панель переменного тока |
| RU2207634C2 (ru) * | 2000-12-05 | 2003-06-27 | Открытое акционерное общество "Научно-исследовательский институт газоразрядных приборов "Плазма" | Газоразрядная индикаторная панель |
| JP2002358892A (ja) * | 2001-05-30 | 2002-12-13 | Matsushita Electric Ind Co Ltd | ガス放電表示パネル及びその製造方法 |
| JP3962832B2 (ja) * | 2002-03-22 | 2007-08-22 | 株式会社日立プラズマパテントライセンシング | プラズマディスプレイパネル用基板構体の製造方法および製造装置 |
| JP2005005259A (ja) * | 2003-05-19 | 2005-01-06 | Matsushita Electric Ind Co Ltd | プラズマディスプレイパネル |
| TWI239548B (en) * | 2003-11-11 | 2005-09-11 | Au Optronics Corp | Plasma display panel |
| CN1545123A (zh) * | 2003-11-21 | 2004-11-10 | 友达光电股份有限公司 | 等离子体显示装置 |
| JP2005302586A (ja) * | 2004-04-14 | 2005-10-27 | Matsushita Electric Ind Co Ltd | プラズマディスプレイパネル |
| JP2005314136A (ja) * | 2004-04-27 | 2005-11-10 | Matsushita Electric Ind Co Ltd | 気密封止用封着材料およびガラスペースト組成物 |
| JPWO2006019032A1 (ja) * | 2004-08-17 | 2008-05-08 | 松下電器産業株式会社 | プラズマディスプレイパネルとその製造方法 |
| JPWO2006033380A1 (ja) * | 2004-09-24 | 2008-05-15 | 旭硝子株式会社 | 封着材組成物、それを用いた気密容器および電子部品のオーバーコートならびにそれらの製造方法 |
| JP4234662B2 (ja) | 2004-09-30 | 2009-03-04 | 株式会社東芝 | 電子機器およびそのデータ記録方法 |
| JP4176737B2 (ja) * | 2005-05-09 | 2008-11-05 | パイオニア株式会社 | プラズマディスプレイパネル |
-
2006
- 2006-04-10 JP JP2006107547A patent/JP4787054B2/ja not_active Expired - Fee Related
-
2007
- 2007-04-04 WO PCT/JP2007/057561 patent/WO2007119676A1/fr not_active Ceased
- 2007-04-04 EP EP07740997A patent/EP2009667B1/fr not_active Ceased
- 2007-04-04 KR KR1020107023382A patent/KR20100116716A/ko not_active Ceased
- 2007-04-04 RU RU2008139894/09A patent/RU2395863C2/ru not_active IP Right Cessation
- 2007-04-04 KR KR1020087024645A patent/KR101042036B1/ko not_active Expired - Fee Related
- 2007-04-04 CN CN2007800127176A patent/CN101421813B/zh not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11299422B2 (en) | 2016-09-30 | 2022-04-12 | Panasonic Intellectual Property Management Co., Ltd. | Method for producing insulating glass unit and method for producing glass window |
| EP3521255B1 (fr) * | 2016-09-30 | 2023-11-01 | Panasonic Intellectual Property Management Co., Ltd. | Procédé de fabrication d'un vitrage isolant et procédé de fabrication d'une fenêtre de verre |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20100116716A (ko) | 2010-11-01 |
| KR20080110612A (ko) | 2008-12-18 |
| EP2009667A4 (fr) | 2011-03-02 |
| WO2007119676A1 (fr) | 2007-10-25 |
| KR101042036B1 (ko) | 2011-06-16 |
| EP2009667B1 (fr) | 2012-06-13 |
| CN101421813B (zh) | 2012-05-30 |
| CN101421813A (zh) | 2009-04-29 |
| RU2395863C2 (ru) | 2010-07-27 |
| RU2008139894A (ru) | 2010-04-20 |
| JP2007280838A (ja) | 2007-10-25 |
| JP4787054B2 (ja) | 2011-10-05 |
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